MC74VHC244 Octal Bus Buffer The MC74VHC244 is an advanced high speed CMOS octal bus buffer fabricated with silicon gate CMOS technology. The MC74VHC244 is a noninverting 3-state buffer, and has two active-low output enables. This device is designed to be used with 3-state memory address drivers, etc. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7 V, allowing the interface of 5 V systems to 3 V systems. * High Speed: tPD = 3.9 ns (Typ) at VCC = 5 V * Low Power Dissipation: ICC = 4 A (Max) at TA = 25C * High Noise Immunity: VNIH = VNIL = 28% VCC * Power Down Protection Provided on Inputs * Balanced Propagation Delays * Designed for 2 V to 5.5 V Operating Range * Low Noise: VOLP = 0.9 V (Max) * Pin and Function Compatible with Other Standard Logic Families * Latchup Performance Exceeds 300 mA * ESD Performance: HBM > 2000 V; Machine Model > 200 V * Chip Complexity: 136 FETs This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. A1 A2 A3 DATA INPUTS A4 B1 B2 B3 B4 OUTPUT ENABLES 2 18 4 16 6 14 8 12 11 9 13 7 15 5 17 3 http://onsemi.com DEVICE MARKING VHC244 AWLYYWW 20 1 DW SUFFIX 20-LEAD SOIC WIDE PACKAGE CASE 751D VHC 244 ALYW 20 1 DT SUFFIX 20-LEAD TSSOP PACKAGE CASE 948E 74VHC244 AWLYWW 20 1 M SUFFIX 20-LEAD SOIC EIAJ PACKAGE CASE 967 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week YA1 PIN ASSIGNMENT YA2 YA3 YA4 YB1 NONINVERTING OUTPUTS YB2 YB3 YB4 1 OEA 19 OEB OEA 1 20 VCC A1 2 19 OEB YB4 3 18 YA1 A2 4 17 B4 YB3 5 16 YA2 A3 6 15 B3 YB2 7 14 YA3 A4 8 13 B2 YB1 9 12 YA4 GND 10 11 B1 ORDERING INFORMATION See detailed ordering and shipping information in the Ordering Information Table on page 3 of this data sheet. Figure 1. LOGIC DIAGRAM Semiconductor Components Industries, LLC, 2001 December, 2001 - Rev. 5 1 Publication Order Number: MC74VHC244/D MC74VHC244 MAXIMUM RATINGS (Note 1) Value Unit VCC Symbol Positive DC Supply Voltage Parameter -0.5 to +7.0 V VIN Digital Input Voltage -0.5 to +7.0 V VOUT DC Output Voltage -0.5 to VCC +0.5 V IIK Input Diode Current -20 mA IOK Output Diode Current 20 mA IOUT DC Output Current, per Pin 25 mA ICC DC Supply Current, VCC and GND Pins 75 mA PD Power Dissipation in Still Air 500 450 mW TSTG Storage Temperature Range -65 to +150 C VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) >2000 >200 >2000 V ILATCH-UP Latch-Up Performance Above VCC and Below GND at 125C (Note 5) 300 mA JA Thermal Resistance, Junction to Ambient 96 128 C/W SOIC Package TSSOP SOIC Package TSSOP 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22-A114-A 3. Tested to EIA/JESD22-A115-A 4. Tested to JESD22-C101-A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit 2.0 5.5 V VCC DC Supply Voltage VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage 0 VCC V TA Operating Temperature Range, all Package Types -55 125 C tr, tf Input Rise or Fall Time 0 100 20 ns/V VCC = 3.3 V + 0.3 V VCC = 5.0 V + 0.5 V 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80 C 117.8 419,300 TJ = 90 C 1,032,200 90 TJ = 100 C 80 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 110 C Time, Years TJ = 120 C Time, Hours TJ = 130 C Junction Temperature C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES 1 1 10 100 1000 TIME, YEARS Figure 2. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 MC74VHC244 DC CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol VIH VIL VOH Parameter Condition (V) Minimum High-Level Input Voltage Maximum Low-Level Input Voltage Maximum High-Level Output Voltage Maximum Low-Level Output Voltage Min Typ Max Min Max -55C TA 125C Min 2.0 1.5 1.5 1.5 1.5 3.0 to 5.5 VCCX 0.7 VCCX 0.7 VCCX 0.7 VCCX 0.7 Max 2.0 0.5 0.5 0.5 VCCX 0.3 VCCX 0.3 VCCX 0.3 VIN = VIH or VIL IOH = -50 A VIN = VIH or VIL IOL = 50 A 2.0 3.0 4.5 1.9 2.9 4.4 3.0 4.5 2.58 3.94 2.0 3.0 4.5 VIN = VIH or VIL IOH = 4 mA IOH = 8 mA 2.0 3.0 4.5 0.0 0.0 0.0 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.8 2.34 3.66 Unit V 3.0 to 5.5 VIN = VIH or VIL IOH = -4 mA IOH = -8 mA VOL TA 85C TA = 25C V V 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 0.1 1.0 1.0 A IOZ Maximum 3-State Leakage Current VIN = VIH or VIL 5.5 0.25 2.5 2.5 A Maximum Quiescent Supply Current (per package) VIN = VCC or GND 5.5 4.0 40.0 40.0 A ICC VOUT = VCC or GND ORDERING INFORMATION Device FUNCTION TABLE Package Shipping MC74VHC244DW SOIC WIDE 38 Units/Rail OEA, OEB INPUTS A, B YA, YB MC74VHC244DWR2 SOIC WIDE 1000/Tape & Reel L L L MC74VHC244DT TSSOP 75 Units/Rail L H H MC74VHC244DTR2 TSSOP 2500/Tape & Reel H X Z MC74VHC244M SOIC EIAJ 1600 Units/Box MC74VHC244MEL SOIC EIAJ 2000/Tape & Reel http://onsemi.com 3 OUTPUTS MC74VHC244 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIII IIIIIIIII IIIIIII IIIII IIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIII IIIIIIIII IIIIIII IIIII IIIII II III III III III III III III II IIII IIIIIII IIIIIIIII IIIIIII IIIII IIIII IIII IIIIIII IIIIIIIII III III III III III III III II IIII IIIIIII IIIIIIIII III III III III III III III II IIII IIIIIII IIIIIIIII III III III III III III III II II IIII IIIIIII IIIIIIIII III III III III III III III IIII IIIIIII IIIIIIIII III III III III III III IIIII II IIII IIIIIII IIIIIIIII III III III III III III III IIII IIIIIII IIIIIIIII III III III III III III III II IIII IIIIIII IIIIIIIII III III III III III III III II II IIII IIIIIII IIIIIIIII III III III III III III III IIII IIIIIII IIIIIIIII III III III III III III III II II IIII IIIIIII IIIIIIIII III III III III III III III IIII IIIIIII IIIIIIIII III III III III III III III II IIII IIIIIII IIIIIIIII III III III III III III III II II IIII IIIIIII IIIIIIIII III III III III III III III IIII IIIIIII IIIIIIIII III III III III III III III II II IIII IIIIIII IIIIIIIII III III III III III III III IIII IIIIIII IIIIIIIII III III III III III III IIIII IIII IIIIIII IIIIIIIII III III III III III III III II IIII IIIIIII IIIIIIIII III III III III III III IIIII AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL tPZL, tPZH tPLZ, tPHZ tOSLH, tOSHL Parameter Min Test Conditions -55C TA 125C TA 85C TA = 25C Typ Max Min Max Min Max Unit ns Maximum Propagation Delay, A to YA or B to YB VCC = 3.3 0.3V CL = 15pF CL = 50pF 5.8 8.3 8.4 11.9 1.0 1.0 10.0 13.5 1.0 1.0 11.0 14.5 VCC = 5.0 0.5V CL = 15pF CL = 50pF 3.9 5.4 5.5 7.5 1.0 1.0 6.5 8.5 1.0 1.0 7.5 9.5 Output Enable Time OEA to YA or OEB to YB VCC = 3.3 0.3V RL = 1k CL = 15pF CL = 50pF 6.6 9.1 10.6 14.1 1.0 1.0 12.5 16.0 1.0 1.0 13.5 17.0 VCC = 5.0 0.5V RL = 1k CL = 15pF CL = 50pF 4.7 6.2 7.3 9.3 1.0 1.0 8.5 10.5 1.0 1.0 9.5 11.5 Output Disable Time OEA to YA or OEB to YB VCC = 3.3 0.3V RL = 1k CL = 50pF 10.3 14.0 1.0 16.0 1.0 17.0 VCC = 5.0 0.5V RL = 1k CL = 50pF 6.7 9.2 1.0 10.5 1.0 11.5 Output to Output Skew VCC = 3.3 0.3V (Note 6) CL = 50pF 1.5 1.5 1.5 VCC = 5.0 0.5V (Note 6) CL = 50pF 1.0 1.0 1.5 10 10 10 Cin Maximum Input Capacitance 4 Cout Maximum Three-State Output Capacitance (Output in High- Impedance State) 6 ns ns ns pF pF Typical @ 25C, VCC = 5.0V CPD 19 Power Dissipation Capacitance (Note 7) pF 6. Parameter guaranteed by design. tOSLH = |tPLHm - tPLHn|, tOSHL = |tPHLm - tPHLn|. 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC/8 (per bit). CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. NOISE CHARACTERISTICS (Input tr = tf = 3.0 ns, CL = 50pF, VCC = 5.0 V) TA = 25C Symbol Parameter Typ Max Unit VOLP Quiet Output Maximum Dynamic VOL 0.6 0.9 V VOLV Quiet Output Minimum Dynamic VOL - 0.6 - 0.9 V VIHD Minimum High Level Dynamic Input Voltage 3.5 V VILD Maximum Low Level Dynamic Input Voltage 1.5 V http://onsemi.com 4 MC74VHC244 SWITCHING WAVEFORMS A or B YA or YB VCC 50% tPLH tPHL OEA or OEB VCC 50% GND tPZL 50% VCC YA or YB 50% VCC tPZH tPHZ 50% VCC YA or YB Figure 3. GND tPLZ HIGH IMPEDANCE VOL +0.3V VOH -0.3V HIGH IMPEDANCE Figure 4. TEST CIRCUITS TEST POINT TEST POINT OUTPUT DEVICE UNDER TEST OUTPUT DEVICE UNDER TEST CL* *Includes all probe and jig capacitance 1 k CL* CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. *Includes all probe and jig capacitance Figure 5. Test Circuit Figure 6. Test Circuit INPUT Figure 7. Input Equivalent Circuit http://onsemi.com 5 MC74VHC244 OUTLINE DIMENSIONS DW SUFFIX SOIC CASE 751D-05 ISSUE F A 20 X 45 h 1 10 20X DIM A A1 B C D E e H h L B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 18X e SEATING PLANE A1 C T MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0 7 DT SUFFIX TSSOP CASE 948E-02 ISSUE A 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V S IIII IIII IIII K K1 11 J J1 B -U- L PIN 1 IDENT SECTION N-N 1 10 0.25 (0.010) N 0.15 (0.006) T U S M A -V- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N F DETAIL E -W- C D G H DETAIL E 0.100 (0.004) -T- SEATING PLANE http://onsemi.com 6 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 MC74VHC244 OUTLINE DIMENSIONS M SUFFIX SOIC EIAJ CASE 967-01 ISSUE O 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M L 10 DETAIL P Z D VIEW P e A c A1 b 0.13 (0.005) M 0.10 (0.004) http://onsemi.com 7 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 --0.032 MC74VHC244 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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