UXD20K DC-26.5 GHz Programmable 1,2,4,8 Binary Prescaler Features * Wide Operating Range: DC-26.5 GHz * Low SSB Phase Noise: -153 dBc @ 10 kHz * Large Output Swings: 750 mV ppk/ side * Single-Ended and/or Differential Operation * Low power consumption: 430 mW * 4x4 ceramic leadless QFN package * 3 Dividers-in-One with Pass Through * DC-7 GHz Limit Amp Application The UXD20K can be used as a general purpose, fixed modulus prescaler in high frequency PLLs. The low phase noise of the divider makes it ideal for generating low jitter, synchronous clocks in telecom applications. Pad Metallization The QFN package pad metallization consists of a 500-1000 micro-inch Sn63 automated solder dip process. Description The UXD20K is a low noise DC to 26.5 GHz programmable prescaler featuring either divide by-1, divide-by-2, divide-by-4, or divide-by-8 division ratios. In the divide by 1 mode the UXD20K is also a limit amplifier. The device features differential inputs and outputs, adjustable output swing and high input sensitivity. The control inputs are CMOS and LVTTL compatible. The UXD20K is packaged in a 24 pin, 4 mm x 4 mm ceramic leadless surface mount package. Key Specifications (T = 25C): Vee = -3.3 V, Iee = 130 mA, Zo=50 Parameter Description Min Typ Max Fin (GHz) Input Frequency DC* - 26.5 Pin (dBm) Input Power -10 0 10 Pout (dBm) Output Power -5 5 - (dBc/Hz) SSB Phase Noise @10 kHz Offset - -153 - PDC (mW) DC Power Dissipation - 430 - jc (C/W) Junction-Case Thermal Resistance - 52 - * Low frequency limit dependent on input edge speed SMD-00091 Rev F Subject to Change Without Notice 1 of 9 UXD20K Frequency Divider Application Min/Max Single-Ended Input Power Input Sensitivity Window Binary Divide-by-2 Output Power, 3rd Harmonic & Input Feedthru UXD20K: SSB Phase Noise for Binary Divide-by-8 Configuration Input Freq = 7.8 GHz Gain S21 SMD-00091 Rev F Subject to Change Without Notice 2 of 9 UXD20K Limit Amplifier Application S-parameters S21 Pout vs. Frequency S-parameters S11, S22 S-parameters S12 Group Delay vs. Frequency Binary Divide-by-1 Configuration Input Freq = 5 GHz, 150mV/div -1V SMD-00091 Rev F Subject to Change Without Notice 3 of 9 UXD20K Functional Block Diagram Table 1: Pin Description Port Name Description Notes INP Prescaler Input, Positive Terminal CML signal levels INN Prescaler Input, Negative Terminal CML signal levels OUTP Prescaler Output, Positive Terminal Requires DC return path to VCC OUTN Prescaler Output, Negative Terminal Requires DC return path to VCC VADJ Output Amplitude Control Tie to VCC via resistor, refer to text for value SelA Divider Select Control Line Divider Select, See Table 1, defaults to logic 0 SelB Divider Select Control Line Divider Select, See Table 1, defaults to logic 0 Temp Temperature Diode Optional Temperature diode, refer to text VCC RF & DC Ground - VEE -3.3 V @ 130 mA Negative Supply Voltage Table 2: Divider Mode Select Logic Simplified Control Logic Schematic SelA SelB Mode DC Current 0 0 Divide-by-1 105 mA 1 0 Divide-by-8 130 mA 0 1 Divide-by-4 125 mA 1 1 Divide-by-2 120 mA Table 3: Control Voltages State Bias Condition Comment Low (logic 0) VEE @ 0 mA High (logic 1) VCC @ 1 mA Default condition (internally pulled low) SMD-00091 Rev F Subject to Change Without Notice 4 of 9 UXD20K Application Notes Divider Mode: The UXD20K supports four division ratios controlled by two select lines which are compatible with CMOS/LVTTL signaling levels. Table 1 lists the four states for the given logic levels on the SelA and SelB select lines. For any of the four modes, circuitry which is not used is automatically powered down to reduce power consumption. Divider Outputs: The equivalent circuit of the divider outputs is shown on the below. The outputs require a DC return path capable of handling ~35 mA per side. If DC coupling is employed, the DC resistance of the receiving circuits should be ~50 (or less) to VCC to prevent excessive common mode voltage from saturating the prescaler outputs. If AC coupling is used, the perfect embodiment is shown in figure 2. The discrete R/L/C elements should be resonance free up to the maximum frequency of operation for broadband applications. The output amplitude can be adjusted over a 1.5:1 range by one of the two methods The Vadj pin voltage can be set to VCC for maximum amplituded or VCC-1.3 V for an amplitude ~2/3 the max swing. Voltages between these two values will produce a linear change in output swing. Alternatively, users can use a 1k potentiometer or fixed resistor tied between Vadj and VCC. Resistor values approaching 0 ohms will lead to the maximum swing, while values approaching 1k will lead to the minimum output swing. Users who only need/want the maximum swing should simply tie Vadj to VCC. Equivalent Circuit of Output Buffer Recommended Circuit for AC Coupled Outputs Low Frequency Operation: Low frequency operation is limited by external bypass capacitors and the slew rate of the input clock. The next paragraph shows the calculations for the bypass capacitors. If DC coupled, the device operates down to DC for square-wave inputs. Sine-wave inputs are limited to ~50 MHz due to the 10 dBm max input power limitation. The values of the coupling capacitors for the high-speed inputs and outputs (I/O's) are determined by the lowest frequency the IC will be operated at. C>> 1 2**50*flowest For example to use the device below 30 kHz, coupling capacitors should be larger than 0.1uF. SMD-00091 Rev F Subject to Change Without Notice 5 of 9 UXD20K Diode Voltage vs Temp Temperature Diode: An optional on chip temperature diode is provided for users interested in evaluating the IC's temperature. A single resistor to VCC establishes a nominal current thru the diode. The voltage developed across the temperature pin (pin 8) referenced to VEE (pin 9) can then be used to indicate the surface temperature of the IC. The plot below was obtained by forcing a fixed current of 120uA thru the diode for an unbiased device at multiple temperatures and fitting a line to the data to allow extrapolation over a range of temperatures. Diode Voltage vs Temp, 1d = 120 A T=(0.84-Vd)/0.00133 Package Heatsink: The package backside provides the primary heat conduction path and should be attached to a good heatsink on the PC board to maximize performance. User PC boards should maximize the contact area to the package paddle and contain an array of vias to aid thermal conduction to either a backside heatsink or internal copper planes. IC Assembly: The device is designed to operate with either single-ended or differential inputs. Figures 4, 5 & 6 show the IC assembly diagrams for positive and negative supply voltages. In either case the supply should be capacitively bypassed to the ground to provide a good AC ground over the frequency range of interest. The backside of the chip should be connected to a good thermal heat sink. All RF I/O's are connected to VCC through on-chip termination resistors. This implies that when VCC is not DC grounded (as in the case of positive supply), the RF I/O's should be AC coupled through series capacitors unless the connecting circuit can generate the correct levels through level shifting. CML Logic Levels for DC Coupling (T = 25C): Assuming 50 Terminations at Inputs and Outputs Parameter Differential Minimum Typical Maximum { Logic Inputhigh Vcc Vcc Vcc Logic Inputlow Vcc - 0.05 V Vcc - 0.3 V Vcc - 1 V { Logic Inputhigh Vcc + 0.05 V Vcc + 0.3 V Vcc + 1 V Logic Inputlow Vcc - 0.05 V Vcc - 0.3 V Vcc - 1 V { Logic Inputhigh Vcc - 0.9 V Vcc - 0.6 V Vcc - 0.5 V Logic Inputlow Vcc - 1.3 V Vcc - 1.6 V Vcc - 1.7 V Input Single Output Differential & Single MM-PDS-0041 Rev A Subject to Change Without Notice 6 of 9 UXD20K Differential vs. Single-Ended: The UXD20K is fully differential to maximize signal-to-noise ratios for high-speed operation. High speed inputs are terminated to VCC with on-chip resistors (refer to functional block diagram for specific resistor values). The maximum DC voltage on any terminal must be limited to V max to prevent damaging the termination resistors with excessive current. Regardless of bias conditions, the following equation should be satisfied when driving the inputs differentially: I Vdm/2 + Vcm I < Vcc Vmax where Vdm is the differential input signal and Vcm is the common-mode voltage. In addition to the maximum input signal levels, single-ended operation imposes additional restrictions: the average DC value of the waveform at IC should be equal to VCC for single-ended operation. In practice, this is easily achieved with a single capacitor on the input acting as a DC block. The value of the capacitor should be large enough to pass the lowest frequencies of interest. Use the positive terminals for single-ended operation while terminating the negative terminal to VCC. Note that a potential oscillation mechanism exists if both inputs are static and have identical DC voltages; a small DC offset on either input is sufficient to prevent possible oscillations. Tying unused inputs directly to VCC shorts out the internal 50 bias resistor, imposing a DC offset sufficient to prevent oscillations. Driving the differential inputs with DC blocks, or driving the single-ended inputs without terminating unused inputs, is not recommended without taking additional steps to eliminate the potential oscillation issues. Positive Supply (AC Coupling) Biasing recommendations for positive supply with AC coupling applications MM-PDS-0041 Rev A Subject to Change Without Notice 7 of 9 UXD20K Negative Supply (DC Coupling) Biasing recommendations for negative supply with DC coupling applications Negative Supply (AC Coupling) Biasing recommendations for negative supply with AC coupling applications MM-PDS-0041 Rev A Subject to Change Without Notice 8 of 9 UXD20K UXD20K Physical Characteristics 18 19 20 21 22 23 24 1 17 2 16 3 15 4 14 5 13 12 11 10 9 8 7 6 Pkg size: 4.00 x 4.00 mm Pkg size tolerance: +/- 0.25 mm Pkg thickness: 1.05 +/- 0.1 mm Pad dimensions: 0.30 x 0.35 mm Center paddle: 2.5 x 2.5 mm JEDEC designator: MO-220 Bottom View Table 4: UXD20K Pin Definition Function Notes 1,3,5,6,7,13,15,17,19,20 (Vcc) RF and DC Ground 0 V (+3.3 V when using positive supply) 9,23,24 (Vee) Negative Supply Voltage Nominally -3.3 V (0 V when using positive supply) 2 (INP) Divider Input Positive Terminal of differential output 4 (INN) Divider Input Negative Terminal of differential output 8 (Temp) Temperature Diode IC Surface temperature, Refer to text 12,11,10 (NC) No Connect - 14 (VADJ) Output Amplitude Control Tie to VCC for max swing. Refer to text 16 (OUTP) Divider Output Positive Terminal of differential output 18 (OUTN) Divider Output Negative Terminal of differential output 21 (SelB) Divider Mode Divider Select Line, Refer to Table 1 22 (SelA) Divider Mode Divider Select Line, Refer to Table 1 Paddle Package Paddle Tie to heatsink, Refer to text. Tie to +3.3 V for positive supply and ground for negative supply. Table 5: Absolute Maximum Ratings Parameter Value Unit Supply Voltage (VCC-VEE) 4 V RF Input Power (INP, INN) 10 dBm Operating Temperature -40 to 85 C Storage Temperature -85 to 125 C Junction Temperature 125 C MM-PDS-0041 Rev A Subject to Change Without Notice The information contained herein is believed to be accurate and is provided "AS IS, WHERE IS", with all faults and the entire risk associated with its use being entirely with the user. Microsemi makes no representation with respect to the merchantability of the products or their suitability or fitness for any particular purpose or use. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. 9 of 9 UXD20K Information contained in this document is proprietary to Microsem. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Microsemi Corporate Headquarters Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor One Enterprise, Aliso Viejo CA 92656 USA and system solutions for communications, defense and security, aerospace, and industrial Within the USA: +1 (949) 380-6100 markets. Products include high-performance and radiation-hardened analog mixed-signal Sales: +1 (949) 380-6136 integrated circuits, FPGAs, SoCs, and ASICs; power management products; timing and Fax: +1 (949) 215-4996 synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif. and has approximately 3,400 employees globally. Learn more at www.microsemi.com. (c) 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. MM-PDS-0041 Rev A Subject to Change Without Notice 10 of 10