© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 4
1Publication Order Number:
CM1401−03/D
CM1401-03
4-Channel ESD/EMI Filter
Array Plus 4-Channel ESD
Array for USB
Product Description
The CM1401−03 is a multichannel array with four low−pass filter
+ ESD channels and four ESD−only channels. The CM1401−03
reduces EMI/RFI emissions on a data port and protects against ESD on
a USB port. Each EMI/RFI channel integrates a high quality pi−style
filter (C−R−C) that provides greater than 30 dB attenuation in the
800−2700 MHz range relative to the pass band attenuation. These
pi−style filters are bidirectional, controlling EMI both to and from a
data port connector.
The CM1401−03 provides a high−level of ESD protection on all
eight channels for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). The input pins safely
dissipate ESD strikes of ±15 kV, exceeding the maximum requirement
of the IEC 61000−4−2 international standard. Using the
MIL−STD−883 (Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for contact discharges to
greater than ±30 kV.
The CM1401−03 is particularly well suited for portable electronics
(e.g., cellular telephones, PDAs, notebook computers) because of its
small package footprint and low weight.
The CM1401−03 incorporates OptiGuardt coating for improved
reliability at assembly and comes in a space−saving, low−profile Chip
Scale Package with RoHS−compliant lead−free finishing.
Features
•Functionally and Pin−Compatible with CSPEMI307A Device
•OptiGuardt Coated for Improved Reliability at Assembly
•Four Channels of Combined EMI/RFI Filtering + ESD Protection
•Four Additional Channels of ESD−Only Protection
•40 dB Absolute Attenuation (Typical) at 1 GHz
•35 dB Attenuation (Typical) at 1 GHz Relative to Pass Band
•±15 kV ESD Protection on All Channels
(IEC 61000−4−2 Level 4, Contact Discharge)
•±30 kV ESD Protection on All Channels (HBM)
•15−Bump, 2.960 mm X 1.330 mm Footprint
•Chip Scale Package (CSP) Features Extremely Low Lead Inductance
for Optimum Filter and ESD Performance
•These Devices are Pb−Free and are RoHS Compliant
Applications
•EMI Filtering and ESD Protection for Both Data and
I/O Ports
•Outer Four Channels Provide ESD Protection for
USB Lines and Other I/O Port Applications
•Wireless Handsets
•Handheld PCs / PDAs
•MP3 Players
•Notebooks
•Desktop PCs
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
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CSP−15
(Pb−Free)
3500/Tape & ReelCM1401−03CP
N013 = CM1401−03CP
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
WLCSP15
CP SUFFIX
CASE 567BS
N013 MG
G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
CM1401−03
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2
BLOCK DIAGRAM
FILTER + ESDn*
GND
(Pins B1−B3)
*See Package/Pinout Diagram for expanded pin information.
100 W
FILTER + ESDn*
1 of 4 EMI/RFI + ESD Channels.
30 pF 30 pF 30 pF
1 of 4 ESD−only Channels
ESDn*
Table 1. PIN DESCRIPTIONS
15−bump CSP Package
Pin Name Description
A1 ESD_1 ESD Channel 1
A2 FILTER + ESD_1 Filter + ESD Channel 1
A3 FILTER + ESD_2 Filter + ESD Channel 2
A4 FILTER + ESD_3 Filter + ESD Channel 3
A5 FILTER + ESD_4 Filter + ESD Channel 4
A6 ESD_2 ESD Channel 2
B1−B3 GND Device Ground
C1 ESD_3 ESD Channel 3
C2 FILTER + ESD_1 Filter + ESD Channel 1
C3 FILTER + ESD_2 Filter + ESD Channel 2
C4 FILTER + ESD_3 Filter + ESD Channel 3
C5 FILTER + ESD_4 Filter + ESD Channel 4
C6 ESD_4 ESD Channel 4
PACKAGE / PINOUT DIAGRAMS
B2
Bottom View
(Bumps Up View)
C1
A1
A1
Top View
(Bumps Down View)
N013
CM1401−03
CSP Package
Orientation
Marking
+
123
A
B
C
ESD_3
456
Orientation
Marking
C2 C3 C4 C5 C6
A2 A3 A4 A5 A6
B1 B3
FILTER+ESD_2 FILTER+ESD_4
FILTER+ESD_3FILTER+ESD_1 ESD_4
GND GND GND
ESD_1 FILTER+ESD_2 FILTER+ESD_4
FILTER+ESD_3FILTER+ESD_1 ESD_2
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range –65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 600 mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range –40 to +85 °C
CM1401−03
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3
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol Parameter Conditions Min Typ Max Units
R Resistance 80 100 120 W
C Capacitance At 2.5 V DC 24 30 36 pF
TCR Temperature Coefficient of Resistance 1200 ppm/°C
TCC Temperature Coefficient of Capacitance At 2.5 V DC −300 ppm/°C
VDIODE Diode Voltage (reverse bias) IDIODE = 10 mA6.0 V
ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3 V 100 nA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
5.6
−1.5
6.8
–0.8
9.0
−0.4
V
VESD In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883,
Method 3015
b) Contact Discharge per IEC 61000−4−2
Level 4
(Note 2)
±30
±15
kV
VCL Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Notes 2 and 3)
+10
–5
V
fCCut−off Frequency
ZSOURCE = 50 W, ZLOAD = 50 W
R = 100 W, C = 30 pF
58
MHz
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping
voltage is measured at Pin C2.
CM1401−03
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4
PERFORMANCE INFORMATION
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (A2−C2 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3−C3 to GND B2)
CM1401−03
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5
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 3. Insertion Loss vs. Frequency (A4−C4 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A5−C5 to GND B2)
CM1401−03
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6
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, 50 W Environment)
Figure 5. Comparison of Filter Response Curves for CM1401−03CS with DC Bias
CM1401−03
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7
PERFORMANCE INFORMATION (Cont’d)
Figure 6. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5 VDC and 255C)
Figure 7. Resistance vs. Temperature
(normalized to resistance at 255C)
CM1401−03
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8
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition Non−Solder Mask defined pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball ±50 mm
Solder Ball Side Coplanarity ±20 mm
Maximum Dwell Time Above Liquidous (183°C) 60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 8. Recommended Non−Solder Mask Defined Pad Illustration
Figure 9. Lead−free (SnAgCu) Solder Ball Reflow Profile
CM1401−03
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PACKAGE DIMENSIONS
WLCSP15, 2.96x1.33
CASE 567BS−01
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
0.56
MILLIMETERS
A1
D2.96 BSC
E
b0.29 0.35
eD 0.50 BSC
0.65
ÈÈ
D
E
AB
PIN A1
REFERENCE
eD
A0.05 BC
0.03 C
0.05 C
15X b
456
C
B
A
0.05 C
A
A1
A2
C
0.21 0.27
1.33 BSC
eE 0.435 BSC
0.25
15X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
0.87
0.44
0.05 C
2X TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
eE
A2 0.40 REF
RECOMMENDED
A1
PACKAGE
OUTLINE
123 789
PITCH
eD/2
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
CM1401−03/D
OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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