© Semiconductor Components Industries, LLC, 2011
July, 2011 − Rev. 5
1Publication Order Number:
MC74LCX139/D
MC74LCX139
Dual Low-Voltage CMOS
2-to-4 Decoder/Demultiplexer
With 5V−Tolerant Inputs
The MC74LCX139 is a high performance, 2−to−4 decoder/
demultiplexer operating from a 2.3 to 3.6 V supply. High impedance
TTL compatible inputs significantly reduce current loading to input
drivers while TTL compatible outputs offer improved switching noise
performance. A VI specification of 5.5 V allows MC74LCX139 inputs
to be safely driven from 5 V devices. The MC74LCX139 is suitable
for memory address decoding and other TTL level bus oriented
applications.
The MC74LCX139 high−speed 2−to−4 decoder/demultiplexer
accepts two binary weighted inputs (A0, A1) and, when enabled,
provides four mutually exclusive active−LOW outputs. The LCX139
features an active low Enable input. All outputs will be HIGH unless
En is LOW. The LCX139 can be used as an 8−output demultiplexer by
using one of the active−LOW Enable inputs as the data input and the
other Enable input as a strobe. The Enable inputs which are not used
must be permanently tied to ground.
Current drive capability is 24 mA at the outputs.
Features
•Designed for 2.3 to 3.6 V VCC Operation
•5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
•LVTTL Compatible
•LVCMOS Compatible
•24 mA Balanced Output Sink and Source Capability
•Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
•Latchup Performance Exceeds 500 mA
•ESD Performance:
♦Human Body Model >2000 V
♦Machine Model >200 V
•These Devices are Pb−Free and are RoHS Compliant
MARKING
DIAGRAMS
SOIC−16
D SUFFIX
CASE 751B
TSSOP−16
DT SUFFIX
CASE 948F
SOEIAJ−16
M SUFFIX
CASE 966
16
1
16
1
16
1
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
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A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G= Pb−Free Package
LCX139G
AWLYWW
LCX
139
ALYWG
G
74LCX139
ALYWG
16
1
16
16
1
1
(Note: Microdot may be in either location)
MC74LCX139
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2
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
Ea
A1a
A0a
GND
A1b
A0b
Eb
VCC
Y0a
Y1a
Y2a
Y3a
Y0b
Y1b
Y2b
Y3b
Figure 1. Pin Assignment
TRUTH TABLE
PIN NAMES
Function
Address Inputs
Enable Inputs
Outputs
Pins
A0n−A1n
En
Y0n−Y3n
Figure 2. IEC Logic Diagram
A0a
A1a
Ea
A0b
A1b
1
Eb
Y0a
Y1a
Y2a
Y3a
Y0b
Y1b
Y2b
Y3b
ACTIVE−LOW
OUTPUTS
ADDRESS
INPUTS
ACTIVE−LOW
OUTPUTS
3
2
ADDRESS
INPUTS 13
14
15
4
5
6
7
12
11
10
9
4
Figure 3. Logic Diagram
Y0a
Y1a
Y2a
Y3a
Y0b
Y1b
Y2b
Y3b
5
6
7
12
11
10
9
15
14
13
1
2
3
A1a
A0a
Ea
A1b
A0b
Eb
2
1
EN
X/Y
1
0
2
3
0
1
DMUX
1
0
2
3
G0
3
15
14
13
1
2
3
A1a
A0a
Ea
A1b
A0b
Eb
Y0a
Y1a
Y2a
Y3a
Y0b
Y1b
Y2b
Y3b
4
5
6
7
12
11
10
9
En
A0
A1
Y0
Y1
Y2
Y3
Figure 4. Expanded Logic Diagram
(1/2 of Device)
H = High Voltage Level;
L = Low Voltage Level;
Z = High Impedance State
Inputs Outputs
E A1 A0 Y0 Y1 Y2 Y3
H
L
L
L
L
X
L
L
H
H
X
L
H
L
H
H
L
H
H
H
H
H
L
H
H
H
H
H
L
H
H
H
H
H
L
MC74LCX139
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3
MAXIMUM RATINGS
Symbol Parameter Condition Value Units
VCC DC Supply Voltage −0.5 to +7.0 V
VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V
VODC Output Voltage Output in HIGH or LOW State. (Note 1) −0.5 ≤ VO ≤ VCC + 0.5 V
IIK DC Input Diode Current VI < GND −50 mA
IOK DC Output Diode Current VO < GND −50 mA
VO > VCC +50 mA
IODC Output Source/Sink Current ±50 mA
ICC DC Supply Current Per Supply Pin ±100 mA
IGND DC Ground Current Per Ground Pin ±100 mA
TSTG Storage Temperature Range −65 to +150 °C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Units
VCC Supply Voltage
Operating
Data Retention Only
2.0
1.5
2.3 to 3.3 3.6
3.6
V
VIInput Voltage 0 5.5 V
VOOutput Voltage (HIGH or LOW State) 0 VCC V
IOH HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
mA
IOL LOW Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
mA
TAOperating Free−Air Temperature −40 +85 °C
Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V
ORDERING INFORMATION
Device Package Shipping†
MC74LCX139DG SOIC−16
(Pb−Free)
48 Units / Rail
MC74LCX139DR2G SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LCX139DTG TSSOP−16* 96 Units / Rail
MC74LCX139DTR2G TSSOP−16* 2500 Tape & Reel
MC74LCX139MG SOEIAJ−16
(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
MC74LCX139
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4
DC ELECTRICAL CHARACTERISTICS
TA = −40°C to +85°C
Symbol Characteristic Condition Min Max Units
VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V
2.7 V ≤ VCC ≤ 3.6 V 2.0
VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V
2.7 V ≤ VCC ≤ 3.6 V 0.8
VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mAVCC −0.2 V
VCC = 2.3 V; IOH = −8 mA 1.7
VCC = 2.7 V; IOH = −12 mA 2.2
VCC = 3.0 V; IOH = −18 mA 2.4
VCC = 3.0 V; IOH = −24 mA 2.2
VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA0.2 V
VCC = 2.3 V; IOL = 8 mA 0.7
VCC = 2.7 V; IOL = 12 mA 0.4
VCC = 3.0 V; IOL = 16 mA 0.4
VCC = 3.0 V; IOL = 24 mA 0.55
IIInput Leakage Current 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5mA
ICC Quiescent Supply Current 2.3 ≤ VCC ≤ 3.6 V; VI = GND or VCC 10 mA
2.3 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V ±10
DICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS (tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W)
Symbol Parameter
Limits
Units
TA = −405C to +855C
VCC = 3.0 V to 3.6 V VCC = 2.7 V VCC = 2.3 V to 2.7 V
CL = 50 pF CL = 50 pF CL = 30pF
Min Max Min Max Min Max
tPLH
tPHL
Propagation Delay
A to Y
0.8
0.8
6.2
6.2
1.0
1.0
7.3
7.3
0.8
0.8
9.3
9.3
ns
tPLH
tPHL
Propagation Delay
E to Y
0.8
0.8
4.7
4.7
1.0
1.0
5.2
5.2
0.8
0.8
7.2
7.2
ns
tOSHL
tOSLH
Output−to−Output Skew (Note 3) 1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF
COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF
CPD Power Dissipation Capacitance 10MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF
MC74LCX139
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5
Figure 5. Waveform 1 Prop Delays
50%
tPHL
tPLH
VCC
GND
Y50% VCC
A
VCC
GND
tPHL tPLH
Y
E
50% VCC
50%
Figure 6. Waveform 2 Output Enable
PULSE
GENERATOR
RT
DUT
VCC
RL
CL
Figure 7. Test Circuit
CL = 50 pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
MC74LCX139
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6
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X 1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
89
8X
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7
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE B
ÇÇÇ
ÇÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.18 0.28 0.007 0.011
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
18
16 9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36 16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
MC74LCX139
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8
PACKAGE DIMENSIONS
SOEIAJ−16
M SUFFIX
CASE 966−01
ISSUE A
HE
A1
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 0.78 --- 0.031
A1
HE
Q1
LE
_10 _0
_10 _
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005) 0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MC74LCX139/D
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Phone: 81−3−5773−3850
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