© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - LC03-3.3 Series
Description
Features
Applications
This LC03-3.3 series provides overvoltage protection for
applications such as 10/100/1000 BaseT Ethernet and
T3/E3 interfaces. This new protector combines the TVS
diode element with a diode rectifier bridge to provide both
longitudinal and differential protection in one package.
This design results in a capacitive loading characteristic
that is log-linear with respect to the signal voltage across
the device. This reduces intermodulation (IM) distortion
caused by a typical solid-state protection solution. The
application schematic provides the connection information
and the LC03-3.3 is rated for GR-1089, intra-building
transient immunity requirements for telecommunication
installations.
Pinout
Functional Block Diagram
• Lightning Protection, IEC
61000-4-5 2nd edition,
150A (t
p
=8/20µs)
• EFT, IEC 61000-4-4, 40A
(t
p
=5/50ns)
• Low insertion loss, log-
linear capacitance
• Low clamping voltage
• SOIC-8 surface mount
package (JEDEC MS-012)
• UL 94V-0 epoxy molding
• RoHS and Lead-free
compliant
• Moisture Sensitivity Level
(MSL-1)
• T1/E1 Line cards
• T3/E3 and DS3 Interfaces
• STS-1 Interfaces
• 10/100/1000 BaseT
Ethernet
SOIC-8 (Top View)
1
2
3
54
6
7
8
Pin 1 and 8
Pin 4 and 5
Pin 2, 3, 6,
and 7
Line out
Line out
Line in
Line in
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Application Example
This schematic shows a high-speed data interface
protection solution. The LC03-3.3BTG is compatible with
the intra-building surge requirements of Telcordia’s GR-
1089-CORE, and the Basic Level Recommendations of
ITU K.20 and K.21. The TeleLink fuse provides overcurrent
protection for the long term 50/60 Hz power fault events.
TeleLink (0461 1.25) LC03-3.3BTG
1
2
3
4
8
7
6
5
to chipset
(Ethernet PHY,
T3/E3 PHY
, etc.)
RoHS
Pb
GREEN
LC03-3.3 Series 3.3V 150A Diode Array
Additional Information
Samples
Resources
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - LC03-3.3 Series
SP03A-3.3
Absolute Maximum Ratings
Parameter Rating Units
Peak Pulse Current (8/20µs) 150 A
Peak Pulse Power (8/20µs) 3300 W
IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV
IEC 61000-4-2, Air Discharge, (Level 4) 30 kV
IEC 61000-4-5 (8/20µs) 150 A
Telcordia GR 1089 (Intra-Building) (2/10µs) 100 A
ITU K.20 (5/310µs) 40 A
Electrical Characteristics (TOP = 25°C)
Thermal Information
Parameter Rating Units
SOIC Package 170 °C/W
Operating Temperature Range –40 to 125 °C
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering
20-40s) (SOIC - Lead Tips Only)
260 °C
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Stand-Off Voltage VRWM IT≤1µA - - 3.3 V
Reverse Breakdown Voltage VBR IT= 2µA 3.3 - - V
Snap Back Voltage VSB IT= 50mA 3.3 - - V
Reverse Leakage Current IRVRWM= 3.3V, T= 25°C - - 1 µA
Clamping Voltage, Line-Ground VCIPP= 50A, tp=8/20 µs - - 13 V
Clamping Voltage, Line-Ground VCIPP= 100A, tp=8/20 µs - - 17 V
Dynamic Resistance, Line-Ground RDYN (VC2-VC1)/(IPP2-IPP1) - 0.15 - W
Clamping Voltage, Line-Line VCIPP= 50A, tp=8/20 µs - - 15 V
Clamping Voltage, Line-Line VCIPP= 100A, tp=8/20 µs - - 20 V
Dynamic Resistance , Line-Line RDYN (VC2-VC1)/(IPP2-IPP1) - 0.25 - W
Junction Capacitance Cj
Between I/O Pins and Ground
VR=0V, f= 1MHz - 9 12 pF
Between I/O Pins
VR=0V, f= 1MHz - 4.5 6 pF
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Figure 2: Current Derating Curve
Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - LC03-3.3 Series
Figure 4: Clamping Voltage vs. Peak Pulse Current
Figure 6: Forward Voltage vs. Forward Current
Figure 3: 8/20 µs Pulse Waveform
Figure 5: Capacitance vs. Reverse Voltage
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
Line to Ground
Line to Line
0
1
2
3
4
5
6
7
8
9
10
0.00.5 1.01.5 2.02.5 3.0
Capacitance (pF)
Bias Voltage (V)
Line to Line
Line to Ground
0
2
4
6
8
10
12
14
16
18
0102030405060708090100
Clamp Voltage-V
C
(V)
Peak Pulse Current-I
PP
(A)
0
1
2
3
4
5
6
7
0102030405060708090 100
Forward Current (A)
Forward Voltage (V)
Ground-to-Line
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - LC03-3.3 Series
SP03A-3.3
Part Numbering System
Product Characteristics
Ordering Information
Part Number Package Marking Min. Order Qty.
LC03-3.3BTG SOIC-8 LC03-3.3 2500
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
LC03 3.3 B T G
Series
Working
Voltage
Package
T= Tape & Reel
G= Green
–
B = SOIC
Part Marking System
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
Package SOIC-8
Pins 8
JEDEC MS-012
Millimetres Inches
Min Max Min Max
A1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
A2 1.25 1.65 0.050 0.065
B0.31 0.51 0.012 0.020
c0.17 0.25 0.007 0.010
D4.80 5.00 0.189 0.197
E5.80 6.20 0.228 0.244
E1 3.80 4.00 0.150 0.157
e1.27 BSC 0.050 BSC
L0.40 1.27 0.016 0.050
o
Recommended
Soldering Pad Outline
(Reference Only)
F
L
First Line: Part number
Second Line: Date code
F
L
LC03-3.3
XXXXXXXX
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Embossed Carrier Tape & Reel Specification — SOIC Package
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F5.4 5.6 0.213 0.22
P2 1.95 2.05 0.077 0.081
D1. 5 1. 6 0.059 0.063
D1 1.50 Min 0.059 Min
P0 3.9 4.1 0.154 0.161
10P0 40.0 ± 0.20 1.574 ± 0.008
W11. 9 12.1 0.468 0.476
P7. 9 8.1 0.311 0.319
A0 6.3 6.5 0.248 0.256
B0 5.1 5.3 0.2 0.209
K0 2 2.2 0.079 0.087
t0.30 ± 0.05 0.012 ± 0.002
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
