Data Sheet No. PD60208_A
IR2175(S)
Block Diagram
Packages
Product Summary
VOFFSET 600Vmax
IQBS 2mA
Vin +/-260mVmax
Gain temp.drift 20ppm/oC (typ.)
fo130kHz (typ.)
Overcurrent trip 2µsec (typ)
signal delay
Overcurrent trip level +/-260mV (typ.)
LINEAR CURRENT SENSING IC
8 Lead PDIP 8 Lead SOIC
Features
• Floating channel up to +600V
• Monolithic integration
• Linear current feedback through shunt resistor
• Direct digital PWM output for easy interface
• Low IQBS allows the boot strap power supply
• Independent fast overcurrent trip signal
• High common mode noise immunity
• Input overvoltage protection for IGBT short circuit
condition
• Open Drain outputs
Description
The IR2175 is a monolithic current sensing IC designed
for motor drive applications. It senses the motor phase
current through an external shunt resistor , converts from
analog to digital signal, and transfers the signal to the
low side. IR’s proprietary high voltage isolation tech-
nology is implemented to enable the high bandwidth
signal processing. The output format is discrete PWM
to eliminate need for the A/D input interface for the
IR2175. The dedicated overcurrent trip (OC) signal fa-
cilitates IGBT short circuit protection. The open-drain
outputs make easy for any interface from 3.3V to 15V . S
(Refer to Lead Assignments for cor-
rect pin configuration). This/These
diagram(s) show electrical connec-
tions only. Please refer to our Appli-
cation Notes and DesignTips for
proper circuit board layout.
VB
V+
VS
VCC
PO
COMIR2175
GND
15V
To Motor Phase
PWM Output
Up to 600V
OCOvercurrent
2
IR2175(S)
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Recommended Operating Conditions
The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended
conditions.
Note 1: Capacitors are required between VB and Vs when bootstrap power is used. The external power supply,
when used, is required between VB and Vs pins.
Symbol Definition Min. Max. Units
VBHigh side floating supply voltage VS +13.0 VS +20
VSHigh side floating supply offset voltage 0.3 600
VPO Digital PWM output voltage C OM VC C
VOC Overcurrent output voltage COM VCC
VCC Low side and logic fixed supply voltage 9.5 20
VIN Input voltage between VIN+ and VS-260 +260 mV
TAAmbient temperature -40 125 °C
V
Symbol Definition Min. Max. Units
VSHigh side offset voltage -0.3 600
VBS High side floating supply voltage -0.3 25
VCC Low side and logic fixed supply voltage -0.3 25
VIN Maximum input voltage between VIN+ and VS-5 5
VPO Digital PWM output voltage COM -0.3 VCC +0.3
VOC Overcurrent output voltage COM -0.3 VCC +0.3
dV/dt Allowable offset voltage slew rate — 5 0 V/ns
PDPackage power dissipation @ TA ≤ +25°C 8 lead SOIC — .625
8 lead PDIP — 1. 0
RthJA Thermal resistance, junction to ambient 8 lead SOIC — 2 0 0
8 lead PDIP — 1 25
TJJunction temperature — 15 0
TSStorage temperature -55 150
TLLead temperature (soldering, 10 seconds) — 300
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
V
°C/W
W
°C
3
IR2175(S)
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Note 1: ±10mV offset represents ±1.5% duty cycle fluctuation
Note 2: Gain = (full range of duty cycle in %) / (full input voltage range).
VIN Nominal input voltage range before saturation -260 — 260
VIN+ _ VS
VOC+ Overcurrent trip positive input voltage — 260 —
VOC- Overcurrent trip negative input voltage — -260 —
VOS Input offset voltage -1 0 0 10 VIN = 0V (Note 1)
∆VOS/∆TA Input offset voltage temperature drift — 25 — µV/oC
G Gain (duty cycle % per VIN) 155 160 165 %/ V max gain error=5%
(Note 2)
∆G/∆TA Gain temperature drift — 20 — ppm/oC
ILK Offset supply leakage current — — 50 µA VB = VS = 600V
IQBS Quiescent VBS supply current — 2 — VS = 0V
IQCC Quiescent VCC supply current — — 0. 5
LIN Linearity (duty cycle deviation from ideal linearity — 0.5 1 %
curve)
∆VLIN/∆TA Linearity temperature drift — .005 — %/oC
IOPO Digital PWM output sink current 20 — —
2——
IOCC OC output sink current 10 — —
1——
DC Electrical Characteristics
VCC = VBS = 15V, and TA = 25 o unless otherwise specified.
Symbol Definition Min. Typ. Max. Units Test Conditions
mA
mV
mA
VO = 1V
VO = 0.1V
VO = 1V
VO = 0.1V
Symbol Definition Min. Typ. Max. Units Test Conditions
Propagation delay characteristics
fo Carrier frequency output 95 130 165 kHz
∆f/∆TATemperature drift of carrier frequency — 500 — ppm/oC
Dmin Minimum duty — 9 — %
Dmax Maximum duty — 91 — % VIN+=+260mV
BW fo bandwidth — 15 — k Hz
PHS Phase shift at 1kHz — -10 — o
tdoc Propagation delay time of OC 1 2 —
twoc Low true pulse width of OC — 1. 5 —
AC Electrical Characteristics
VCC = VBS = 15V, and TA = 25o unless otherwise specified.
figure 1
VIN = 0 & 5V
VIN+=-260mV,
VIN+ = 100mVpk -pk
sine wave, gain=-3dB
VIN+ =100mVpk-pk
sine wave
µsec
4
IR2175(S)
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Application Hint:
T emperature drift of the output carrier frequency can be cancelled by measuring both a PWM period and the on-time
of PWM (Duty) at the same time. Since both periods vary in the same direction, computing the ratio between these
values at each PWM period gives consistent measurement of the current feedback over the temperature drift.
Vin+= -260mV
Vs = 0V
Vin+= +260mV
Vs = 0V
Duty=91%
Duty=9%
Carrier Frequency =
130kHz
PO
PO
Timing Waveforms
Figure 1 Output waveform
5
IR2175(S)
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Lead Assignment
Lead Definitions
Symbol Description
VCC Low side and logic supply voltage
COM Low side logic ground
VIN+ Positive sense input
VBHigh side supply
VSHigh side return
PO Digital PWM output
OC Overcurrent output (negative logic)
N.C. No connection
IR2175
8
7
6
4
3
2
1VCC
OC
PO
COM
NC
Vs
VIN+
VB
5
8 lead PDIP
IR2175S
8
7
6
4
3
2
1VCC
OC
PO
COM
NC
Vs
VIN+
VB
5
8 lead SOIC
6
IR2175(S)
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Data and specifications subject to change without notice. 4/8/2003
Case Outlines
01-6014
01-3003 01 (MS-001AB)
8 Lead PDIP
01-6027
01-0021 11 (MS-012AA)
8 Lead SOIC
87
5
65
D B
E
A
e
6X
H
0. 25 [. 010 ] A
6
4312
4 . OUTLINE CONFORMS T O JED EC OUT L INE MS-0 12 A A .
NOTES:
1. DI MENSI ONING & TOLERANCI NG PER ASME Y14.5M-1994.
2 . CONT ROLLING DIMENSION: MILLIMETER
3 . D IMENSIONS ARE SHOW N IN MILLIMET ERS [INCHES] .
7
K x 45°
8X L 8X c
y
FOOTPRINT
8X 0.72 [ . 02 8]
6. 46 [ . 2 55]
3X 1.27 [ . 05 0] 8X 1.78 [ . 07 0]
5 D IMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
6 D IMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSI ONS NOT T O EXCEED 0.25 [.010].
7 D IMENSION IS T HE L ENGT H OF L EAD FOR SOLDER ING TO
A SUBSTRATE.
MOLD PROTRUSI ONS NOT T O EXCEED 0.15 [.006].
0. 25 [. 010 ] CAB
e1 A
A1
8X b
C
0. 10 [. 004 ]
e1
D
E
y
b
A
A1
H
K
L
.189
.1497
0°
.013
.050 BASIC
.0532
.0040
.2284
.0099
.016
.1968
.1574
8°
.020
.0688
.0098
.2440
.0196
.050
4.80
3.80
0.33
1.35
0.10
5.80
0.25
0.40
0°
1.27 BASIC
5.00
4.00
0.51
1.75
0.25
6.20
0.50
1.27
MIN MAX MILLIMETERSINC HE S MIN MAX
DIM
8°
e
c .0075 .0098 0.19 0.25
.025 BASI C 0.635 BASI C
