Express-HL COM Express(R) Basic Size Type 6 Module with 4th Generation Intel(R) CoreTM and Celeron(R) Processors Features 4th Generation Intel(R) CoreTM and Celeron(R) Processors with Intel(R) QM87 and Intel(R) HM86 Express Chipset Up to 16GB Dual Channel DDR3L at 1600MHz Three DDI ports support 3 independent displays Seven PCIe x1, one PCIe x16 GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0 Supports Smart Embedded Management Agent (SEMA(R)) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System CPU 4th Generation Intel(R) CoreTM Processors (Mobile) - 22nm i7-4860EQ 1.8 GHz (3.2 GHz Turbo), 47W (4C/GT3) i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2) i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2) i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2) i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2) i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2) Celeron(R) 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) Celeron(R) 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) Supports: Intel(R) VT, Intel(R) TXT, Intel(R) SSE4.2, Intel(R) HT Technology, Intel(R) 64 Architecture, Execute Disable Bit, Intel(R) Turbo Boost Technology 2.0, Intel(R) AVX2, Intel(R) AES-NI, PCLMULQDQ Instruction, Intel(R) Secure Key and Intel(R) TSX. Note: Availability of the features may vary between processor SKUs. Memory Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual SODIMM socket Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel(R) AMT 9.0 support L3 Cache 6MB for i7-4700EQ, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E Expansion Busses PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4) 6 PCI Express x1 (AB): Lanes 0/1/2/3/4/5 1 PCI Express x1 (CD): Lane 6 LPC bus, SMBus (system) , I2C (user) Video GPU Feature Support Generation 7.5 graphics core architecture, supporting 3 independent and simultaneous display combinations of DisplayPort /HDMI / LVDS monitors Encode/transcode HD content Playback of high definition content including Blu-ray Disc Digital Display Interface DDI1 supporting DisplayPort / HDMI / DVI DDI2 supporting DisplayPort / HDMI / DVI DDI3 supporting DisplayPort / HDMI / DVI VGA Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) LVDS Single/dual channel 18/24-bit LVDS from eDP (two lanes) Audio Chipset Intel(R) HD Audio integrated in SOC Audio Codec Located on carrier Express-BASE6 (ALC886 standard supported) Ethernet Intel(R) MAC/PHY: I217LM (Enterprise SKU) with AMT 9.0 support Interface: 10/100/1000 GbE connection SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence debug support, AT/ ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control Debug Headers 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power Testpoints, Debug LEDs 60-pin XDP header for ICE debug of CPU/Chipset Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times. Specifications I/O Interfaces USB: 4x USB 3.0 (USB 0,1,2,3) 4x USB 2.0 (USB 4,5,6,7) SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) Serial: 2 UART ports COM1/2 with console redirection GPIO: 4 GPO and 4 GPI with interrupt Super I/O Supported on carrier if needed (standard support for W83627DHG-P) TPM Chipset: Atmel AT97SC3204 Type: TPM 1.2 Power Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V 5% Wide Input: ATX = 8.5~20 V / 5Vsb 5% or AT = 8.5~20V Management: ACPI 4.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving Mechanical and Environmental Form Factor: PICMG COM.0: Rev 2.1 Type 6 Dimension: Basic size: 125 mm x 95 mm Operating Temperature Standard: 0C to +60C Extreme RuggedTM: -40C to +85C (build option) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT tested Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times. Functional Diagram SODIMM 1333/1600 MHz 1~8 GB DDR3L th 4 Generation Intel(R) CoreTM i7/i5/i3 Processor SODIMM 1333/1600 MHz 1~8 GB DDR3L eDP - LVDS RTD2136R/N single / dual 18/24-bit LVDS eDP 2 lane Intel(R) Celeron(R) DDI 1 (port B) DP / HDMI / DVI / SDVO DDI 2 (port C) DP / HDMI / DVI DDI 3 (port D) DP / HDMI / DVI PCI Express x16 (Gen3) 2 x8 or 1 x8 + 2 x4 DMI FDI "Haswell" XDP 60-pin VGA 6x PCIe x1 (Gen2) (port 0~5) GbE i217LM PCIe x1 (port 7) 4x SATA3 (QM87) 2x SATA3 & 2x SATA2 (HM86) 8x USB 1.1/2.0 HD Audio UART0 NCT5104D Debug header Mobile Intel(R) QM87/HM86 Chipset 1x PCIe x1 (Gen2) (port 6) TPM Serial UART1 4x USB 3.0 upgrade (QM87) 2x USB 3.0 upgrade (HM86) ATMEL AT97SC3204 LPC bus 4x GP0 4x GPI SPI 0 BIOS GPIO PCA9535 SPI_CS0 SPI_CS1 SMBus GP I2C SPI 1 BIOS SEMA DDC I2C SPI_CS# SPI Sensor -40+85C Ordering Information Accessories Express-HL-i7-4860EQ COM Express(R) Basic Size Type 6 Module with Intel(R) CoreTM i74860EQ at 1.8 GHz with GT3 level graphics Express-HL-i7-4700EQ COM Express(R) Basic Size Type 6 Module with Intel(R) CoreTM i74700EQ at 2.4/1.7 GHz with GT2 level graphics Express-HL-i5-4400E COM Express(R) Basic Size Type 6 Module with Intel(R) CoreTM i54400E at 2.7 GHz with GT2 level graphics Express-HL-i3-4100E COM Express(R) Basic Size Type 6 Module with Intel(R) CoreTM i34100E at 2.4 GHz with GT2 level graphics Express-HL-i5-4402E COM Express(R) Basic Size Type 6 Module with Intel(R) CoreTM i54402E at 1.6 GHz with GT2 level graphics Express-HL-i3-4102E COM Express(R) Basic Size Type 6 Module with Intel(R) CoreTM i34102E at 1.6 GHz with GT2 level graphics Express-HL-2000E COM Express(R) Basic Size Type 6 Module with Celeron(R) 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) Express-HL-2002E COM Express(R) Basic Size Type 6 Module with Celeron(R) 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) Heat Spreaders HTS-HL-B Heatspreader for Express-HL with threaded standoffs for bottom mounting HTS-HL-BT Heatspreader for Express-HL with through hole standoffs for top mounting Passive Heatsinks THS-HL-BL Low profile heatsink for Express-HL with threaded standoffs for bottom mounting THS-HL-BT Low profile heatsink for Express-HL with through hole standoffs for top mounting THSH-HL-BL High profile heatsink for Express-HL with threaded standoffs for bottom mounting Active Heatsink THSF-HL-BL High profile heatsink with Fan for Express-HL with threaded standoffs for bottom mounting Note: Express-BL and Express-HL share the same thermal solution design Starter Kit COM Express Type 6 Starter Kit Plus COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Jan. 19, 2017. (c)2017 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ADLINK Technology: Express-HL-i7-4700EQ Express-HL-i3-4100E Starterkit-HL-i7-4700EQ/4G Express-HL-i5-4400E Express-HL-i54402E Express-HL-i3-4102E THSF-HL-BL THSH-HL-BL HTS-HL-B THS-HL-BLT THS-HL-BL HTS-HL-BT Express-HL-i7-4860EQ Express-HL-2002E Express-HL-2000E t2Express-HL-i5-4402E t2Express-HL-2002E t2Express-HL-2000E t2Express-HL-i5-4400E t2Express-HL-i3-4102E t2Express-HL-i7-4860EQ t2Express-HL-i74700EQ t2Express-HL-i3-4100E THSF-HL-BL_WT