RC28F640P33TF60A - MICRON TECHNOLOGY

Datasheet Jul 2011

1Order Number: 208034-04

Numonyx

P33-65nm Flash Memory

128-Mbit, 64-Mbit Single Bit per Cell (SBC)

Datasheet

Product Features



High performance:

— 60ns initial access time for Easy BGA

— 70ns initial access time for TSOP

— 25ns 8-word asynchronous-page read

mode

— 52MHz with zero wait states, 17ns clock-to-

data output synchronous-burst read mode

— 4-, 8-, 16-, and continuous-word options

for burst mode

— 3.0V buffered programming at 1.8MByte/s

(Typ) using 256-word buffer

— Buffered Enhanced Factory Programming at

3.2MByte/s (typ) using 256-word buffer



Architecture:

— Asymmetrically-blocked architecture

— Four 32-KByte parameter blocks: top or

bottom configuration

— 128-KByte main blocks

— Blank Check to verify an erased block



Voltage and Power:

—V

(core) voltage: 2.3V – 3.6V

—V

CCQ

(I/O) voltage: 2.3V – 3.6V

— Standby current: 35μA(Typ) for 64-Mbit,

50μA(Typ) for 128-Mbit

— Continuous synchronous read current:

23mA (Typ) at 52 MHz



Security:

— One-Time Programmable Registers:

— 64 OTP bits, programmed with unique

information by Numonyx

— 2112 OTP bits, available for customer

programming

— Absolute write protection: V

= V

— Power-transition erase/program lockout

— Individual zero-latency block locking

— Individual block lock-down capability

— Password Access feature



Software:

— 20µs (Typ) program suspend

— 20µs (Typ) erase suspend

— Basic Command Set and Extended Function

Interface (EFI) Command Set compatible

— Common Flash Interface capable



Density and Packaging:

— 56-Lead TSOP package (128-Mbit, 64-Mbit)

— 64-Ball Easy BGA package (128-Mbit, 64-

Mbit)

— 16-bit wide data bus



Quality and Reliability:

—JESD47E Compliant

— Operating temperature: –40°C to +85°C

— Minimum 100,000 erase cycles per block

— 65nm process technology

Datasheet Jul 2011

2Order Number: 208034-04

Legal Lines and Dis claimers

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN NUMONYX'S TERMS AND

CONDITIONS OF SALE FOR SUCH PRODUCTS, NUMONYX ASSUMES NO LIABILITY WHATSOEVER, AND NUMONYX DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY, RELATING TO SALE AND/OR USE OF NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A

PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Numonyx

products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Numonyx may make changes to specifications and product descriptions at any time, without notice.

Numonyx, B.V. may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the

presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel

or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting

Numonyx's website at http://www.numonyx.com.

Numonyx, the Numonyx logo, and are trademarks or registered trademarks of Numonyx, B.V. or its subsidiaries in other countries.

*Other names and brands may be claimed as the property of others.

Datasheet Jul 2011

3Order Number: 208034-04

P33-65nm SBC

Contents

1.0 Functional Description............................................................................................... 5

1.1 Introduction ....................................................................................................... 5

1.2 Overview ...........................................................................................................5

1.3 Memory Maps ..................................................................................................... 6

2.0 Package Information ................................................................................................. 7

2.1 56-Lead TSOP..................................................................................................... 7

2.2 64-Ball Easy BGA Package .................................................................................... 8

3.0 Ballouts ................................................................................................................... 10

4.0 Signals .................................................................................................................... 12

5.0 Bus Operations ........................................................................................................ 14

5.1 Read ............................................................................................................... 14

5.2 Write ............................................................................................................... 14

5.3 Output Disable.................................................................................................. 15

5.4 Standby ........................................................................................................... 15

5.5 Reset............................................................................................................... 15

6.0 Command Set .......................................................................................................... 16

6.1 Device Command Codes ..................................................................................... 16

6.2 Device Command Bus Cycles .............................................................................. 18

7.0 Read Operation........................................................................................................ 20

7.1 Asynchronous Page-Mode Read ........................................................................... 20

7.2 Synchronous Burst-Mode Read............................................................................ 20

7.3 Read Device Identifier........................................................................................ 21

7.4 Read CFI.......................................................................................................... 21

8.0 Program Operation .................................................................................................. 22

8.1 Word Programming ........................................................................................... 22

8.2 Buffered Programming ....................................................................................... 22

8.3 Buffered Enhanced Factory Programming.............................................................. 23

8.4 Program Suspend .............................................................................................. 25

8.5 Program Resume............................................................................................... 26

8.6 Program Protection............................................................................................ 26

9.0 Erase Operation....................................................................................................... 27

9.1 Block Erase ...................................................................................................... 27

9.2 Blank Check ..................................................................................................... 27

9.3 Erase Suspend .................................................................................................. 28

9.4 Erase Resume................................................................................................... 28

9.5 Erase Protection ................................................................................................ 28

10.0 Security ................................................................................................................... 29

10.1 Block Locking.................................................................................................... 29

10.2 Selectable OTP Blocks ........................................................................................ 31

10.3 Password Access ............................................................................................... 31

11.0 Status Register........................................................................................................ 32

11.1 Read Configuration Register................................................................................ 33

11.2 One-Time Programmable (OTP) Registers ............................................................. 40

12.0 Power and Reset Specifications ............................................................................... 43

12.1 Power-Up and Power-Down................................................................................. 43

12.2 Reset Specifications........................................................................................... 43

P33-65nm

Datasheet Jul 2011

4Order Number: 208034-04

12.3 Power Supply Decoupling ....................................................................................44

13.0 Maximum Ratings and Operating Conditions ............................................................45

13.1 Absolute Maximum Ratings .................................................................................45

13.2 Operating Conditions..........................................................................................45

14.0 Electrical Specifications ...........................................................................................46

14.1 DC Current Characteristics ..................................................................................46

14.2 DC Voltage Characteristics ..................................................................................47

15.0 AC Characteristics ....................................................................................................48

15.1 AC Test Conditions.............................................................................................48

15.2 Capacitance ......................................................................................................49

15.3 AC Read Specifications .......................................................................................49

15.4 AC Write Specifications .......................................................................................54

15.5 Program and Erase Characteristics .......................................................................58

16.0 Ordering Information...............................................................................................59

A Supplemental Reference Information.......................................................................60

A.1 Common Flash Interface .....................................................................................60

A.2 Flowcharts ........................................................................................................72

A.3 Write State Machine ...........................................................................................81

B Conventions - Additional Documentation .................................................................85

B.1 Acronyms .........................................................................................................85

B.2 Definitions and Terms ........................................................................................85

C Revision History.......................................................................................................87

Datasheet Jul 2011

5Order Number:208034-04

P33-65nm SBC

1.0 Functional Description

1.1 Introduction

This document provides information about the Numonyx

P33-65nm Single

Bit per Cell (SBC) Flash Memory and describes its features, operations, and

specifications.

P33-65nm SBC device is offered in 64-Mbit and 128-Mbit densities. Benefits include

high-speed interface NOR device, and support for code and data storage. Features

include high-performance synchronous-burst read mode, a dramatical improvement in

buffer program time through larger buffer size, fast asynchronous access times, low

power, flexible security options, and two industry-standard package choices.

P33-65nm SBC device is manufactured using 65nm process technology.

1.2 Overview

This family of devices provides high performance at low voltage on a 16-bit data bus.

Individually erasable memory blocks are sized for optimum code and data storage.

Upon initial power-up or return from reset, the device defaults to asynchronous page-

mode read. Configuring the RCR enables synchronous burst-mode reads. In

synchronous burst mode, output data is synchronized with a user-supplied clock signal.

A WAIT signal provides an easy CPU-to-flash memory synchronization.

In addition to the enhanced architecture and interface, the device incorporates

technology that enables fast factory program and erase operations. The device features

a 256-word buffer to enable optimum programming performance, which can improve

system programming throughput time significantly to 1.8MByte/s.

The P33-65nm SBC device supports read operations with VCC at 3.0V, and erase and

program operations with VPP at 3.0V or 9.0V. Buffered Enhanced Factory Programming

provides the fastest flash array programming performance with VPP at 9.0V, which

increases factory throughput. With VPP at 3.0V, VCC and VPP can be tied together for a

simple, ultra low power design. In addition to voltage flexibility, a dedicated VPP

connection provides complete data protection when VPP ≤ V

PPLK

The Command User Interface is the interface between the system processor and all

internal operations of the device. An internal Write State Machine automatically

executes the algorithms and timings necessary for block erase and program. A Status

An industry-standard command sequence invokes program and erase automation. Each

erase operation erases one block. The Erase Suspend feature allows system software to

pause an erase cycle to read or program data in another block. Program Suspend

allows system software to pause programming to read other locations. Data is

programmed in word increments (16 bits).

The one-time-programmable (OTP) Register allows unique flash device identification

that can be used to increase system security. The individual Block Lock feature provides

zero-latency block locking and unlocking. The P33-65nm SBC device adds enhanced

protection via Password Access Mode which allows user to protect write and/or read

access to the defined blocks. In addition, the P33-65nm SBC device could also provide

the full-device OTP permanent lock feature.

P33-65nm

Datasheet Jul 2011

6Order Number: 208034-04

1.3 Memory Maps

Figure 1: P33-65nm Memory Map (64-Mbit and 128-Mbit Densities)

16- Kword Block

64- Kword Block

16- Kword Block

Bottom Boot

Word Wide (x16) Mode

7F0000 7FFFFF

000000 –003FFF

64- Kword Block

3F0000 3FFFFF

130

128-Mbit

A< 23: 1 > 128- Mbit

16- Kword Block

64- Kword Block

004000 –007FFF

008000 – 00BFFF

00C000– 00FFFF

010000 – 01FFFF

020000 – 02FFFF

16- Kword Block

Top Boot

Word Wide (x16) Mode

64- Kword Block

128

127

16- Kword Block

64- Kword Block

129

130

126

000000 –00FFFF

010000 –01FFFF

7F 0000

–

7F4000 –7F7000

7F8000 – 7FBFFF

7FC000

–

7FFFFF

7E0000

–

7EFFFF

64-Mbit

–

A<22:1> 64-Mbit

128-Mbit

A< 23: 1 > 128- Mbit

16- Kword Block

Top Boot

Word Wide (x16) Mode

64- Kword Block

16- Kword Block

64- Kword Block

000000 –00FFFF

010000 –01FFFF

3F0000 – 3F3FFF

3F4000 – 3F7FFF

3F8000 – 3FBFFF

3FC000 – 3FFFFF

3E0000 – 3EFFFF

A<22:1> 64-Mbit

64-Mbit

7F3FFF

Datasheet Jul 2011

7Order Number:208034-04

P33-65nm SBC

2.0 Package Information

2.1 56-Lead TSOP

Figure 2: TSOP Mechanical Specifications

Table 1: TSOP Package Dimensions (Sheet 1 of 2)

Product Information Symbol

Millimeters Inches

Min Nom Max Min Nom Max

Package Height A - - 1.200 - - 0.047

Standoff A10.050 - - 0.002 - -

Package Body Thickness A20.965 0.995 1.025 0.038 0.039 0.040

Lead Width(4) b 0.170 0.220 0.270 0.0067 0.0087 0.0106

Lead Thickness C 0.100 0.150 0.200 0.004 0.006 0.008

Package Body Length D118.200 18.400 18.600 0.717 0.724 0.732

Package Body Width E 13.800 14.000 14.200 0.543 0.551 0.559

Lead Pitch e - 0.500 - - 0.0197 -

Terminal Dimension D 19.800 20.00 20.200 0.780 0.787 0.795

Lead Tip Length L 0.500 0.600 0.700 0.020 0.024 0.028

Detail A

Pin 1

Detail B

See Detail A

See Detail B

Seating

Plane

See Note 2

See Notes 1 and 3

P33-65nm

Datasheet Jul 2011

8Order Number: 208034-04

2.2 64-Ball Easy BGA Package

Lead Count N - 56 - - 56 -

Lead Tip Angle θ0° 3° 5° 0° 3° 5°

Seating Plane Coplanarity Y - - 0.100 - - 0.004

Lead to Package Offset Z 0.150 0.250 0.350 0.006 0.010 0.014

Notes:

1. One dimple on package denotes Pin 1.

2. If two dimples, then the larger dimple denotes Pin 1.

3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark.

4. For legacy lead width, 0.10mm(Min), 0.15mm(Typ) and 0.20mm(Max).

Table 1: TSOP Package Dimensions (Sheet 2 of 2)

Product Information Symbol

Millimeters Inches

Min Nom Max Min Nom Max

Figure 3: Easy BGA Mechanical Specifications (8x10x1.2 mm)

Seating

Plane

Top View - Ball side down Bottom View - Ball Side Up

Ball A1

Corner

Note: Drawing not to scale

876543 2187654321

Ball A1

Corner

Datasheet Jul 2011

9Order Number:208034-04

P33-65nm SBC

Table 2: Easy BGA Package Dimensions

Product Information Symbol

Millimeters Inches

Min Nom Max Min Nom Max

Package Height A - - 1.200 - - 0.0472

Ball Height A1 0.250 - - 0.0098 - -

Package Body Thickness A2 - 0.780 - - 0.0307 -

Ball (Lead) Width b 0.310 0.410 0.510 0.0120 0.0160 0.0200

Package Body Width D 9.900 10.000 10.100 0.3898 0.3937 0.3976

Package Body Length E 7.900 8.000 8.100 0.3110 0.3149 0.3189

Pitch [e] - 1.000 - - 0.0394 -

Ball (Lead) Count N - 64 - - 64 -

Seating Plane Coplanarity Y - - 0.100 - - 0.0039

Corner to Ball A1 Distance Along D S1 1.400 1.500 1.600 0.0551 0.0591 0.0630

Corner to Ball A1 Distance Along E S2 0.400 0.500 0.600 0.0157 0.0197 0.0236

Note: Daisy Chain Evaluation Unit information is at Numonyx™ Flash Memory Packaging Technology http://

developer.numonyx.com/design/flash/packtech.

P33-65nm

Datasheet Jul 2011

10 Order Number: 208034-04

3.0 Ballouts

Notes:

1. A1 is the least significant address bit.

2. A23 is valid for 128-Mbit densities; otherwise, it is a no connect (NC).

3. A22 is valid for 64-Mbit densities and above; otherwise, it is a no connect (NC).

4. No Internal Connection on VCC Pin 13; it may be driven or floated. For legacy designs, pin can be tied to Vcc.

5. One dimple on package denotes Pin 1 which will always be in the upper left corner of the package, in reference to the

product mark.

Figure 4: 56-Lead TSOP Pinout (64-Mbit and 128-Mbit Densities)

56-Lead TSOP Pinout

14 mm x 20 mm

Top View

A14

A13

A12

A10

A11

A23

A21

VSS

A22

WP#

A20

WE#

A19

A18

RFU

VSS

RFU

WAIT

DQ15

DQ7

A17

DQ14

DQ13

DQ5

DQ6

DQ12

ADV#

CLK

DQ4

RST#

A16

DQ3

VPP

DQ10

VCCQ

DQ9

DQ2

DQ1

DQ0

VCC

DQ8

OE#

CE#

VSS

A15

DQ11

Datasheet Jul 2011

11 Order Number:208034-04

P33-65nm SBC

Notes:

1. A1 is the least significant address bit.

2. A23 is valid for 128-Mbit densities; otherwise, it is a no connect.

3. A22 is valid for 64-Mbit densities and above; otherwise, it is a no connect (NC).

4. One dimple on package denotes Pin 1 which will always be in the upper left corner of the package, in reference to the

product mark.

Figure 5: 64-Ball Easy BGA Ballout (64-Mbit and 128-Mbit Densities)

234567

Easy BGA

Top View- Ball side down

Easy BGA

Bottom View- Ball side up

8234

A2 VSS A9 A14CE# A19 RFURFU

RFU VSS VCC DQ13VSS DQ7 RFUVSS

A3 A7 A10 A15A12 A20 A21WP#

A4 A5 A11 VCCQRST# A16 A17VCCQ

RFUDQ8 DQ1 DQ9 DQ4DQ3 DQ15CLK

RFU OE#DQ0 DQ10 DQ12DQ11 WAITADV#

WE#A23 RFU DQ2 DQ5VCCQ DQ14DQ6

A1 A6 A8 A13VPP A18 A22VCC

A23

A4A5A11VCCQ RST#A16A17 VCCQ

A1A6A8A13 VPPA18A22 VCC

A3A7A10A15 A12A20A21 WP#

RFU DQ8DQ1DQ9DQ4 DQ3DQ15 CLK

RFUOE# DQ0DQ10DQ12 DQ11WAIT ADV#

WE# RFUDQ2DQ5 VCCQDQ14 DQ6

A2VSSA9A14 CE#A19RFU RFU

RFUVSSVCCDQ13 VSSDQ7RFU VSS

P33-65nm

Datasheet Jul 2011

12 Order Number: 208034-04

4.0 Signals

Table 3: TSOP and Easy BGA Signal Descriptions (Sheet 1 of 2)

Symbol Type Name and Function

A[MAX:1] Input

ADDRESS INPUTS: Device address inputs. 128-Mbit: A[23:1]; 64-Mbit: A[22:1].

WARNING: The active address pins unused in design should not be left float. Please tie them to

VCCQ or VSS according to specific design requirements.

DQ[15:0] Input/

Output

DATA INPUT/OUTPUTS: Inputs data and commands during write cycles; outputs data during

reads of memory, Status Register, OTP Register, and Read Configuration Register. Data balls float

when the CE# or OE# are deasserted. Data is internally latched during writes.

ADV# Input

ADDRESS VALID: Active low input. During synchronous read operations, addresses are latched on

the rising edge of ADV#, or on the next valid CLK edge with ADV# low, whichever occurs first.

In asynchronous mode, the address is latched when ADV# going high or continuously flows through

if ADV# is held low.

WARNING: Designs not using ADV# must tie it to VSS to allow addresses to flow through.

CE# Input

CHIP ENABLE: Active low input. CE# low selects the associated flash memory die. When asserted,

flash internal control logic, input buffers, decoders, and sense amplifiers are active. When

deasserted, the associated flash die is deselected, power is reduced to standby levels, data and

WAIT outputs are placed in high-Z state.

WARNING: All chip enables must be high when device is not in use.

CLK Input

CLOCK: Synchronizes the device with the system’s bus frequency in synchronous-read mode.

During synchronous read operations, addresses are latched on the rising edge of ADV#, or on the

next valid CLK edge with ADV# low, whichever occurs first.

WARNING: Designs not using CLK for synchronous read mode must tie it to VCCQ or VSS.

OE# Input OUTPUT ENABLE: Active low input. OE# low enables the device’s output data buffers during read

cycles. OE# high places the data outputs and WAIT in High-Z.

RST# Input

RESET: Active low input. RST# resets internal automation and inhibits write operations. This

provides data protection during power transitions. RST# high enables normal operation. Exit from

reset places the device in asynchronous read array mode.

WAIT Output

WAIT: Indicates data valid in synchronous array or non-array burst reads. RCR.10, (WT) determines

its polarity when asserted. WAIT’s active output is VOL or VOH when CE# and OE# are VIL. WAIT is

high-Z if CE# or OE# is VIH.

• In synchronous array or non-array read modes, WAIT indicates invalid data when asserted and

valid data when deasserted.

• In asynchronous page mode, and all write modes, WAIT is deasserted.

WE# Input WRITE ENABLE: Active low input. WE# controls writes to the device. Address and data are latched

on the rising edge of WE# or CE#, whichever occurs first.

WP# Input

WRITE PROTECT: Active low input. WP# low enables the lock-down mechanism. Blocks in lock-

down cannot be unlocked with the Unlock command. WP# high overrides the lock-down function

enabling blocks to be erased or programmed using software commands.

WARNING: Designs not using WP# for protection could tie it to VCCQ or VSS without additional

capacitor.

VPP Power/

Input

ERASE AND PROGRAM POWER: A valid voltage on this pin allows erasing or programming.

Memory contents cannot be altered when VPP ≤ VPPLK. Block erase and program at invalid VPP

voltages should not be attempted.

Set VPP = VPPL for in-system program and erase operations. To accommodate resistor or diode drops

from the system supply, the VIH level of VPP can be as low as VPPL min. VPP must remain above VPPL

min to perform in-system flash modification. VPP may be 0 V during read operations.

VPPH can be applied to main blocks for 1000 cycles maximum and to parameter blocks for 2500

cycles. VPP can be connected to 9 V for a cumulative total not to exceed 80 hours. Extended use of

this pin at 9 V may reduce block cycling capability.

VCC Power DEVICE CORE POWER SUPPLY: Core (logic) source voltage. Writes to the flash array are inhibited

when VCC ≤ VLKO. Operations at invalid VCC voltages should not be attempted.

VCCQ Power OUTPUT POWER SUPPLY: Output-driver source voltage.

VSS Power GROUND: Connect to system ground. Do not float any VSS connection.

Datasheet Jul 2011

13 Order Number:208034-04

P33-65nm SBC

RFU — RESERVED FOR FUTURE USE: Reserved by Numonyx for future device functionality and

enhancement. These should be treated in the same way as a Don’t Use (DU) signal.

DU — DON’T USE: Do not connect to any other signal, or power supply; must be left floating.

NC — NO CONNECT: No internal connection; can be driven or floated.

Table 3: TSOP and Easy BGA Signal Descriptions (Sheet 2 of 2)

Symbol Type Name and Function

P33-65nm

Datasheet Jul 2011

14 Order Number: 208034-04

5.0 Bus Operations

CE# low and RST# high enable device read operations. The device internally decodes

upper address inputs to determine the accessed block. ADV# low opens the internal

address latches. OE# low activates the outputs and gates selected data onto the I/O

bus.

In asynchronous mode, the address is latched when ADV# goes high or continuously

flows through if ADV# is held low. In synchronous mode, the address is latched by the

first of either the rising ADV# edge or the next valid CLK edge with ADV# low (WE#

and RST# must be V

; CE# must be V

Bus cycles to/from the P33-65nm SBC device conform to standard microprocessor bus

operations. Table 4, “Bus Operations Summary”summarizes the bus operations and the

logic levels that must be applied to the device control signal inputs.

5.1 Read

To perform a read operation, RST# and WE# must be deasserted while CE# and OE#

are asserted. CE# is the device-select control. When asserted, it enables the flash

memory device. OE# is the data-output control. When asserted, the addressed flash

memory data is driven onto the I/O bus.

5.2 Write

To perform a write operation, both CE# and WE# are asserted while RST# and OE# are

deasserted. During a write operation, address and data are latched on the rising edge

of WE# or CE#, whichever occurs first. Table 6, “Command Bus Cycles” on page 18

shows the bus cycle sequence for each of the supported device commands, while

Table 5, “Command Codes and Definitions” on page 16 describes each command. See

Section 15.0, “AC Characteristics” on page 48 for signal-timing details.

Note: Write operations with invalid VCC and/or VPP voltages can produce spurious results and

should not be attempted.

Table 4: Bus Operations Summary

Bus Operation RST# CLK ADV# CE# OE# WE# WAIT DQ[15:0] Notes

Read

Asynchronous VIH XL L L H

Deasserted

Output -

Synchronous VIH Running L L L H Driven Output -

Write VIH X L L H L High-Z Input 1

Output Disable VIH X X L H H High-Z High-Z 2

Standby VIH X X H X X High-Z High-Z 2

Reset VIL X X X X X High-Z High-Z 2,3,4

Notes:

1. Refer to the

Table 6, “Command Bus Cycles” on page 18

for valid DQ[15:0] during a write

operation.

2. X = Don’t Care (H or L).

3. RST# must be at VSS ± 0.2 V to meet the maximum specified power-down current.

4. Recommend to set CE# and WE# to VIH on 65nm device during power-on/reset to avoid invalid commands

written into flash accidently.

Datasheet Jul 2011

15 Order Number:208034-04

P33-65nm SBC

5.3 Output Disable

When OE# is deasserted, device outputs DQ[15:0] are disabled and placed in a high-

impedance (High-Z) state, WAIT is also placed in High-Z.

5.4 Standby

When CE# is deasserted the device is deselected and placed in standby, substantially

reducing power consumption. In standby, the data outputs are placed in High-Z,

independent of the level placed on OE#. Standby current, I

CCS

, is the average current

measured over any 5 ms time interval, 5 μs after CE# is deasserted. During standby,

average current is measured over the same time interval 5 μs after CE# is deasserted.

When the device is deselected (while CE# is deasserted) during a program or erase

operation, it continues to consume active power until the program or erase operation is

completed.

5.5 Reset

As with any automated device, it is important to assert RST# when the system is reset.

When the system comes out of reset, the system processor attempts to read from the

flash memory if it is the system boot device. If a CPU reset occurs with no flash

memory reset, improper CPU initialization may occur because the flash memory may

be providing status information rather than array data. Flash memory devices from

Numonyx allow proper CPU initialization following a system reset through the use of the

RST# input. RST# should be controlled by the same low-true reset signal that resets

the system CPU.

After initial power-up or reset, the device defaults to asynchronous Read Array mode,

and the Status Register is set to 0x80. Asserting RST# de-energizes all internal

circuits, and places the output drivers in High-Z. When RST# is asserted, the device

shuts down the operation in progress, a process which takes a minimum amount of

time to complete. When RST# has been deasserted, the device is reset to

asynchronous Read Array state.

Note: If RST# is asserted during a program or erase operation, the operation is terminated

and the memory contents at the aborted location (for a program) or block (for an

erase) are no longer valid, because the data may have been only partially written or

erased.

When returning from a reset (RST# deasserted), a minimum wait is required before the

initial read access outputs valid data. Also, a minimum delay is required after a reset

before a write cycle can be initiated. After this wake-up interval passes, normal

operation is restored. See Section 15.0, “AC Characteristics” on page 48 for details

about signal-timing.

P33-65nm

Datasheet Jul 2011

16 Order Number: 208034-04

6.0 Command Set

6.1 Device Command Codes

The flash Command User Interface (CUI) provides access to device read, write, and

erase operations. The CUI does not occupy an addressable memory location; it is part

of the internal logic which allows the flash device to be controlled. The Write State

Machine provides the management for its internal erase and program algorithms.

Commands are written to the CUI to control flash device operations. Ta b l e 5,

“Command Codes and Definitions” describes all valid command codes.

For operations that involve multiple command cycles, the possibility exists that the

subsequent command does not get issued in the proper sequence. When this happens,

the CUI sets Status Register bits SR[5,4] to indicate a command sequence error.

Some applications use illegal or invalid commands (like 0x00) accidentally or

intentionally with the device. An illegal or invalid command doesn't change the device

output state compared with the previous operation on 130nm device. But the output

will change to Read Status Register mode on 65nm device.

After an illegal or invalid command, software may attempt to read the device. If the

previous state is read array mode before an illegal command, software will expect to

read array data on 130nm device, such as 0xFFFF in an unprogrammed location. On

the 65nm device, software may not get the expected array data and instead the status

Please refer to the legal and valid commands/spec defined in the Datasheet, such as for

read mode, issue 0xFF to Read Array mode, 0x90 to Read Signature, 0x98 to Read CFI/

OTP array mode.

Table 5: Command Codes and Definitions (Sheet 1 of 3)

Mode Code Device Mode Description

Read

0xFF Read Array Places the device in Read Array mode. Array data is output on DQ[15:0].

0x70 Read Status

Places the device in Read Status Register mode. The device enters this mode

after a program or erase command is issued. SR data is output on DQ[7:0].

0x90

Read Device ID

or Configuration

Places device in Read Device Identifier mode. Subsequent reads output

manufacturer/device codes, Configuration Register data, Block Lock status,

or OTP Register data on DQ[15:0].

0x98 Read Query Places the device in Read Query mode. Subsequent reads output Common

Flash Interface information on DQ[7:0].

0x50 Clear Status

The WSM can only set SR error bits. The Clear Status Register command is

used to clear the SR error bits.

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Write

0x40 Word Program

Setup

First cycle of a 2-cycle programming command; prepares the CUI for a write

operation. On the next write cycle, the address and data are latched and the

WSM executes the programming algorithm at the addressed location. During

program operations, the device responds only to Read Status Register and

Program Suspend commands. CE# or OE# must be toggled to update the

Status Register in asynchronous read. CE# or ADV# must be toggled to

update the SR Data for synchronous Non-array reads. The Read Array

command must be issued to read array data after programming has finished.

0xE8 Buffered Program This command loads a variable number of words up to the buffer size of 256

words onto the program buffer.

0xD0 Buffered Program

Confirm

The confirm command is issued after the data streaming for writing into the

buffer is done. This instructs the WSM to perform the Buffered Program

algorithm, writing the data from the buffer to the flash memory array.

0x80 BEFP Setup

First cycle of a 2-cycle command; initiates the BEFP mode. The CUI then

waits for the BEFP Confirm command, 0xD0, that initiates the BEFP

algorithm. All other commands are ignored when BEFP mode begins.

0xD0 BEFP Confirm If the previous command was BEFP Setup (0x80), the CUI latches the

address and data, and prepares the device for BEFP mode.

Erase

0x20 Block Erase Setup

First cycle of a 2-cycle command; prepares the CUI for a block-erase

operation. The WSM performs the erase algorithm on the block addressed by

the Erase Confirm command. If the next command is not the Erase Confirm

(0xD0) command, the CUI sets Status Register bits SR [5,4], and places the

device in Read Status Register mode.

0xD0 Block Erase Confirm

If the first command was Block Erase Setup (0x20), the CUI latches the

address and data, and the WSM erases the addressed block. During block-

erase operations, the device responds only to Read Status Register and Erase

Suspend commands. CE# or OE# must be toggled to update the Status

SR Data for synchronous Non-array reads.

Suspend

0xB0 Program or Erase

Suspend

This command issued to any device address initiates a suspend of the

currently-executing program or block erase operation. The Status Register

indicates successful suspend operation by setting either SR.2 (program

suspended) or SR 6 (erase suspended), along with SR.7 (ready). The WSM

remains in the suspend mode regardless of control signal states (except for

RST# asserted).

0xD0 Suspend Resume This command issued to any device address resumes the suspended program

or block-erase operation.

Protection

0x60 Block lock Setup

First cycle of a 2-cycle command; prepares the CUI for block lock

configuration changes. If the next command is not Block Lock (0x01), Block

Unlock (0xD0), or Block Lock-Down (0x2F), the CUI sets SR.5 and SR.4,

indicating a command sequence error.

0x01 Block lock If the previous command was Block Lock Setup (0x60), the addressed block

is locked.

0xD0 Unlock Block

If the previous command was Block Lock Setup (0x60), the addressed block

is unlocked. If the addressed block is in a lock-down state, the operation has

no effect.

0x2F Lock-Down Block If the previous command was Block Lock Setup (0x60), the addressed block

is locked down.

0xC0 Protection program

setup

First cycle of a 2-cycle command; prepares the device for a OTP Register or

Lock Register program operation. The second cycle latches the register

address and data, and starts the programming algorithm to program data

into the OTP array.

Table 5: Command Codes and Definitions (Sheet 2 of 3)

Mode Code Device Mode Description

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6.2 Device Command Bus Cycles

Device operations are initiated by writing specific device commands to the CUI. See

Table 6, “Command Bus Cycles” on page 18. Several commands are used to modify

array data including Word Program and Block Erase commands. Writing either

command to the CUI initiates a sequence of internally-timed functions that culminate in

the completion of the requested task. However, the operation can be aborted by either

asserting RST# or by issuing an appropriate suspend command.

Configuration

0x60 Read Configuration

First cycle of a 2-cycle command; prepares the CUI for device read

configuration. If the Set Read Configuration Register command (0x03) is not

the next command, the CUI sets Status Register bits SR.5 and SR.4,

indicating a command sequence error.

0x03 Read Configuration

If the previous command was Read Configuration Register Setup (0x60), the

CUI latches the address and writes A[16:1]to the Read Configuration

access array data.

blank check

0xBC Blank Check First cycle of a 2-cycle command; initiates the Blank Check operation on a

main block.

0xD0 Blank Check

Confirm

Second cycle of blank check command sequence; it latches the block address

and executes blank check on the main array block.

other 0xEB Extended Function

Interface

This command is used in extended function interface. first cycle of a multiple-

cycle command second cycle is a Sub-Op-Code, the data written on third

cycle is one less than the word count; the allowable value on this cycle are 0

through 511. The subsequent cycles load data words into the program buffer

at a specified address until word count is achieved.

Table 5: Command Codes and Definitions (Sheet 3 of 3)

Mode Code Device Mode Description

Table 6: Command Bus Cycles (Sheet 1 of 2)

Mode Command Bus

Cycles

First Bus Cycle Second Bus Cycle

Oper Addr(1) Data(2) Oper Addr(1) Data(2)

Read

Read Array 1 Write DnA 0xFF - - -

Read Device

Identifier ≥ 2WriteDnA0x90ReadDBA + IA ID

Read CFI ≥ 2WriteDnA0x98ReadDBA + CFI-ACFI-D

Read Status Register 2 Write DnA 0x70 Read DnA SRD

Clear Status Register 1 Write DnA 0x50 - - -

Program

Word Program 2 Write WA 0x40 Write WA WD

Buffered Program(3) > 2 Write WA 0xE8 Write WA N - 1

Buffered Enhanced

Factory Program

(BEFP)(4) > 2 Write WA 0x80 Write WA 0xD0

Erase Block Erase 2 Write BA 0x20 Write BA 0xD0

Suspend

Program/Erase

Suspend 1WriteDnA0xB0- - -

Program/Erase

Resume 1WriteDnA0xD0- - -

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Protection

Lock Block 2 Write BA 0x60 Write BA 0x01

Unlock Block 2 Write BA 0x60 Write BA 0xD0

Lock-down Block 2 Write BA 0x60 Write BA 0x2F

Program OTP

Program Lock

Configuration

Program Read

Configuration

2 Write RCD 0x60 Write RCD 0x03

Others

Blank Check 2 Write BA 0xBC Write BA D0

Extended Function

Interface(5) >2 Write WA 0xEB Write WA Sub-Op

code

Notes:

1. First command cycle address should be the same as the operation’s target address.

DBA = Device Base Address

DnA = Address within the device.

IA = Identification code address offset.

CFI-A = Read CFI address offset.

WA = Word address of memory location to be written.

BA = Address within the block.

OTP-RA = OTP Register address.

LRA = Lock Register address.

RCD = Read Configuration Register data on A[16:1].

2. ID = Identifier data.

CFI-D = CFI data on DQ[15:0].

SRD = Status Register data.

WD = Word data.

N = Word count of data to be loaded into the write buffer.

OTP-D = OTP Register data.

LRD = Lock Register data.

3. The second cycle of the Buffered Program Command is the word count of the data to be loaded into the write buffer. This

is followed by up to 256 words of data.Then the confirm command (0xD0) is issued, triggering the array programming

operation.

4. The confirm command (0xD0) is followed by the buffer data.

5. The second cycle is a Sub-Op-Code, the data written on third cycle is N-1; 1≤ N ≤ 256. The subsequent cycles load data

words into the program buffer at a specified address until word count is achieved, after the data words are loaded, the

final cycle is the confirm cycle 0xD0).

Table 6: Command Bus Cycles (Sheet 2 of 2)

Mode Command Bus

Cycles

First Bus Cycle Second Bus Cycle

Oper Addr(1) Data(2) Oper Addr(1) Data(2)

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7.0 Read Operation

The device can be in any of four read states: Read Array, Read Identifier, Read Status

or Read Query. Upon power-up, or after a reset, the device defaults to Read Array

mode. To change the read state, the appropriate read command must be written to the

device (see Section 6.2, “Device Command Bus Cycles” on page 18). The following

sections describe read-mode operations in detail.

The device supports two read modes: asynchronous page mode and synchronous burst

mode. Asynchronous page mode is the default read mode after device power-up or a

reset. The RCR must be configured to enable synchronous burst reads of the flash

memory array (see Section 11.1, “Read Configuration Register” on page 33).

7.1 Asynchronous Page-Mode Read

Following a device power-up or reset, asynchronous page mode is the default read

mode and the device is set to Read Array mode. However, to perform array reads after

any other device operation (e.g. write operation), the Read Array command must be

issued in order to read from the flash memory array.

To perform an asynchronous page-mode read, an address is driven onto the address

bus, and CE# and ADV# are asserted. WE# and RST# must already have been

deasserted. WAIT is deasserted during asynchronous page mode. ADV# can be driven

high to latch the address, or it must be held low throughout the read cycle. CLK is not

used for asynchronous page-mode reads, and is ignored. If only asynchronous reads

are to be performed, CLK should be tied to a valid V

or V

level, WAIT signal can be

floated and ADV# must be tied to ground. Array data is driven onto DQ[15:0] after an

initial access time t

AVQV

delay. (see Section 15.0, “AC Characteristics” on page 48).

In asynchronous page mode, eight data words are “sensed” simultaneously from the

flash memory array and loaded into an internal page buffer. The buffer word

corresponding to the initial address on the Address bus is driven onto DQ[15:0] after

the initial access delay. The lowest four address bits determine which word of the

16-word page is output from the data buffer at any given time.

7.2 Synchronous Burst-Mode Read

To perform a synchronous burst-read, an initial address is driven onto the address bus,

and CE# and ADV# are asserted. WE# and RST# must already have been deasserted.

ADV# is asserted, and then deasserted to latch the address. Alternately, ADV# can

remain asserted throughout the burst access, in which case the address is latched on

the next valid CLK edge while ADV# is asserted.

During synchronous array and non-array read modes, the first word is output from the

data buffer on the next valid CLK edge after the initial access latency delay (see Section

11.1.2, “Latency Count (RCR[13:11])” on page 34). Subsequent data is output on valid

CLK edges following a minimum delay. However, for a synchronous non-array read, the

same word of data will be output on successive clock edges until the burst length

requirements are satisfied. Refer to the following waveforms for more detailed

information:

•Figure 20, “Synchronous Single-Word Array or Non-array Read Timing” on page 52

•Figure 21, “Continuous Burst Read, showing an Output Delay Timing” on page 53

•Figure 22, “Synchronous Burst-Mode Four-Word Read Timing” on page 53

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7.3 Read Device Identifier

The Read Device Identifier command instructs the device to output manufacturer code,

device identifier code, block-lock status, OTP Register data, or Read Configuration

issuing the Read Device Identifier command). Table 7, “Device Identifier Information”

on page 21 and Table 8, “Device ID codes” on page 21 show the address offsets and

data values for this device.

7.4 Read CFI

The Read CFI command instructs the device to output Common Flash Interface data

when read. See Section 6.1, “Device Command Codes” on page 16 for detail on issuing

the CFI Query command. Section A.1, “Common Flash Interface” on page 60 shows CFI

information and address offsets within the CFI database.

Table 7: Device Identifier Information

Item Address(1,2) Data

Manufacturer Code 0x00 0x89h

Device ID Code 0x01 ID (see

Ta b l e 8

)

Block Lock Configuration:

BBA + 0x02

Lock Bit:

• Block Is Unlocked DQ0 = 0b0

• Block Is Locked DQ0 = 0b1

• Block Is not Locked-Down DQ1 = 0b0

• Block Is Locked-Down DQ1 = 0b1

Read Configuration Register 0x05 RCR Contents

General Purpose Register(3) DBA + 0x07 GPR data

Lock Register 0 0x80 PR-LK0

64-bit Factory-Programmed OTP Register 0x81–0x84 Numonyx Factory OTP Register data

64-bit User-Programmable OTP Register 0x85–0x88 User OTP Register data

Lock Register 1 0x89 OTP Register lock data

128-bit User-Programmable OTP Registers 0x8A–0x109 User OTP Register data

Notes:

1. BBA = Block Base Address.

2. DBA = Device base Address, Numonyx reserves other configuration address locations.

3. In P33-65nm SBC, the GPR is used as read out register for Extended Function interface command.

Table 8: Device ID codes

ID Code Type Device Density

Device Identifier Codes

–T

(Top Parameter)

–B

(Bottom Parameter)

Device Code

64-Mbit 881D 8820

128-Mbit 881E 8821

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8.0 Program Operation

The device supports three programming methods: Word Programming (40h/10h),

Buffered Programming (E8h, D0h), and Buffered Enhanced Factory Programming (80h,

D0h). The following sections describe device programming in detail.

Successful programming requires the addressed block to be unlocked. If the block is

locked down, WP# must be deasserted and the block must be unlocked before

attempting to program the block. Attempting to program a locked block causes a

program error (SR.4 and SR.1 set) and termination of the operation. See Section 10.0,

“Security” on page 29 for details on locking and unlocking blocks.

8.1 Word Programming

Word programming operations are initiated by writing the Word Program Setup

command to the device. This is followed by a second write to the device with the

address and data to be programmed. The device outputs Status Register data when

read. See Figure 29, “Word Program Flowchart” on page 72. VPP must be above V

PPLK

and within the specified V

PPL

Min/Max values.

During programming, the WSM executes a sequence of internally-timed events that

program the desired data bits at the addressed location, and verifies that the bits are

sufficiently programmed. Programming the flash memory array changes “ones” to

“zeros”. Memory array bits that are zeros can be changed to ones only by erasing the

block.

The Status Register can be examined for programming progress and errors by reading

at any address. The device remains in the Read Status Register state until another

command is written to the device.

Status Register bit SR.7 indicates the programming status while the sequence

executes. Commands that can be issued to the device during programming are

Program Suspend, Read Status Register, Read Device Identifier, Read CFI, and Read

Array (this returns unknown data).

When programming has finished, Status Register bit SR.4 (when set) indicates a

programming failure. If SR.3 is set, the WSM could not perform the word programming

operation because VPP was outside of its acceptable limits. If SR.1 is set, the word

programming operation attempted to program a locked block, causing the operation to

abort.

Before issuing a new command, the Status Register contents should be examined and

then cleared using the Clear Status Register command. Any valid command can follow,

when word programming has completed.

8.2 Buffered Programming

The device features a 256-word buffer to enable optimum programming performance.

For Buffered Programming, data is first written to an on-chip write buffer. Then the

buffer data is programmed into the flash memory array in buffer-size increments. This

can improve system programming performance significantly over non-buffered

programming. (see Figure 32, “Buffer Program Flowchart” on page 75).

When the Buffered Programming Setup command is issued, Status Register information

is updated and reflects the availability of the buffer. SR.7 indicates buffer availability: if

set, the buffer is available; if cleared, the buffer is not available.

Note: The device defaults to output SR data after the Buffered Programming Setup Command

(E8h) is issued. CE# or OE# must be toggled to update Status Register. Don’t issue the

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Read SR command (70h), which would be interpreted by the internal state machines as

Buffer Word Count.

On the next write, a word count is written to the device at the buffer address. This tells

the device how many data words will be written to the buffer, up to the maximum size

of the buffer.

On the next write, a device start address is given along with the first data to be written

to the flash memory array. Subsequent writes provide additional device addresses and

data. All data addresses must lie within the start address plus the word count.

Optimum programming performance and lower power usage are obtained by aligning

the starting address at the beginning of a 256-word boundary (A[8:1] = 0x00).

Note: If a misaligned address range is issued during buffered programming, the program

region must also be within an 256-word aligned boundary.

After the last data is written to the buffer, the Buffered Programming Confirm command

must be issued to the original block address. The WSM begins to program buffer

contents to the flash memory array. If a command other than the Buffered

Programming Confirm command is written to the device, a command sequence error

occurs and SR[7,5,4] are set. If an error occurs while writing to the array, the device

stops programming, and SR[7,4] are set, indicating a programming failure.

When Buffered Programming has completed, additional buffer writes can be initiated by

issuing another Buffered Programming Setup command and repeating the buffered

program sequence. Buffered programming may be performed with VPP = V

PPL

or V

PPH

(See Section 13.2, “Operating Conditions” on page 45 for limitations when operating

the device with VPP = V

PPH

If an attempt is made to program past an erase-block boundary using the Buffered

Program command, the device aborts the operation. This generates a command

sequence error, and SR[5,4] are set.

If Buffered programming is attempted while VPP is below V

PPLK

, SR[4,3] are set. If any

errors are detected that have set Status Register bits, the Status Register should be

cleared using the Clear Status Register command.

8.3 Buffered Enhanced Factory Programming

Buffered Enhanced Factory Programing (BEFP) speeds up flash programming. The

enhanced programming algorithm used in BEFP eliminates traditional programming

elements that drive up overhead in device programmer systems. (see Figure 33, “BEFP

Flowchart” on page 76).

BEFP consists of three phases: Setup, Program/Verify, and Exit It uses a write buffer to

spread flash program performance across 256 data words. Verification occurs in the

same phase as programming to accurately program the flash memory cell to the

correct bit state.

A single two-cycle command sequence programs the entire block of data. This

enhancement eliminates three write cycles per buffer: two commands and the word

count for each set of 256 data words. Host programmer bus cycles fill the device’s write

buffer followed by a status check. SR.0 indicates when data from the buffer has been

programmed into sequential flash memory array locations.

Following the buffer-to-flash array programming sequence, the Write State Machine

(WSM) increments internal addressing to automatically select the next 256-word array

boundary. This aspect of BEFP saves host programming equipment the address-bus

setup overhead.

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With adequate continuity testing, programming equipment can rely on the WSM’s

internal verification to ensure that the device has programmed properly. This eliminates

the external post-program verification and its associated overhead.

8.3.1 BEFP Requirements and Considerations

Note: Word buffer boundaries in the array are determined by A[8:1] (0x00 through 0xFF); the alignment start point is A[8:1] =

0x00.

Notes:

1. Some degradation in performance may occur is this limit is exceeded, but the internal algorithm continues to work

properly.

2. If the internal address counter increments beyond the block’s maximum address, addressing wraps around to the

beginning of the block.

3. If the number of words is less than 256, remaining locations must be filled with 0xFFFF.

8.3.2 BEFP Setup Phase

After receiving the BEFP Setup and Confirm command sequence, Status Register bit

SR.7 (Ready) is cleared, indicating that the WSM is busy with BEFP algorithm startup. A

delay before checking SR.7 is required to allow the WSM enough time to perform all of

its setups and checks (Block-Lock status, VPP level, etc.). If an error is detected, SR.4

is set and BEFP operation terminates. If the block was found to be locked, SR.1 is also

set. SR.3 is set if the error occurred due to an incorrect VPP level.

Note: Reading from the device after the BEFP Setup and Confirm command sequence outputs

Status Register data. Do not issue the Read Status Register command; it will be

interpreted as data to be loaded into the buffer.

Table 9: BEFP Requirements

Parameter/Issue Requirement Notes

Case Temperature TC = 30

C ± 10°C -

VCC Nominal Vcc -

VPP Driven to VPPH -

Setup and Confirm Target block must be unlocked before issuing the BEFP Setup and Confirm commands. -

Programming

The first-word address (WA0) of the block to be programmed must be held constant

from the setup phase through all data streaming into the target block, until transition

to the exit phase is desired.

Buffer Alignment WA0 must align with the start of an array buffer boundary. 1

Table 10: BEFP Considerations

Parameter/Issue Requirement Notes

Cycling For optimum performance, cycling must be limited below 50 erase cycles per block. 1

Programming blocks BEFP programs one block at a time; all buffer data must fall within a single block. 2

Suspend BEFP cannot be suspended. -

Programming the flash

memory array Programming to the flash memory array can occur only when the buffer is full. 3

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8.3.3 BEFP Program/Verify Phase

After the BEFP Setup Phase has completed, the host programming system must check

SR[7,0] to determine the availability of the write buffer for data streaming. SR.7

cleared indicates the device is busy and the BEFP program/verify phase is activated.

SR.0 indicates the write buffer is available.

Two basic sequences repeat in this phase: loading of the write buffer, followed by buffer

data programming to the array. For BEFP, the count value for buffer loading is always

the maximum buffer size of 256 words. During the buffer-loading sequence, data is

stored to sequential buffer locations starting at address 0x00. Programming of the

buffer contents to the flash memory array starts as soon as the buffer is full. If the

number of words is less than 256, the remaining buffer locations must be filled with

0xFFFF.

Caution: The buffer must be completely filled for programming to occur. Supplying an

address outside of the current block's range during a buffer-fill sequence

causes the algorithm to exit immediately. Any data previously loaded into the

buffer during the fill cycle is not programmed into the array.

The starting address for data entry must be buffer size aligned, if not the BEFP

algorithm will be aborted and the program fails and (SR.4) flag will be set.

Data words from the write buffer are directed to sequential memory locations in the

flash memory array; programming continues from where the previous buffer sequence

ended. The host programming system must poll SR.0 to determine when the buffer

program sequence completes. SR.0 cleared indicates that all buffer data has been

transferred to the flash array; SR.0 set indicates that the buffer is not available yet for

the next fill cycle. The host system may check full status for errors at any time, but it is

only necessary on a block basis after BEFP exit. After the buffer fill cycle, no write

cycles should be issued to the device until SR.0 = 0 and the device is ready for the next

buffer fill.

Note: Any spurious writes are ignored after a buffer fill operation and when internal program

is proceeding.

The host programming system continues the BEFP algorithm by providing the next

group of data words to be written to the buffer. Alternatively, it can terminate this

phase by changing the block address to one outside of the current block’s range.

The Program/Verify phase concludes when the programmer writes to a different block

address; data supplied must be 0xFFFF. Upon Program/Verify phase completion, the

device enters the BEFP Exit phase.

8.3.4 BEFP Exit Phase

When SR.7 is set, the device has returned to normal operating conditions. A full status

check should be performed at this time to ensure the entire block programmed

successfully. When exiting the BEFP algorithm with a block address change, the read

mode will not change. After BEFP exit, any valid command can be issued to the device.

8.4 Program Suspend

Issuing the Program Suspend command while programming suspends the

programming operation. This allows data to be accessed from the device other than the

one being programmed. The Program Suspend command can be issued to any device

address. A program operation can be suspended to perform reads only. Additionally, a

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program operation that is running during an erase suspend can be suspended to

perform a read operation (see Figure 30, “Program Suspend/Resume Flowchart” on

page 73).

When a programming operation is executing, issuing the Program Suspend command

requests the WSM to suspend the programming algorithm at predetermined points. The

device continues to output Status Register data after the Program Suspend command is

issued. Programming is suspended when Status Register bits SR[7,2] are set. Suspend

latency is specified in Section 15.5, “Program and Erase Characteristics” on page 58.

To read data from the device, the Read Array command must be issued. Read Array,

Read Status Register, Read Device Identifier, Read CFI, and Program Resume are valid

commands during a program suspend.

During a program suspend, deasserting CE# places the device in standby, reducing

active current. VPP must remain at its programming level, and WP# must remain

unchanged while in program suspend. If RST# is asserted, the device is reset.

8.5 Program Resume

The Resume command instructs the device to continue programming, and

automatically clears Status Register bits SR[7,2]. This command can be written to any

address. If error bits are set, the Status Register should be cleared before issuing the

next instruction. RST# must remain deasserted (see Figure 30, “Program Suspend/

Resume Flowchart” on page 73).

8.6 Program Protection

When VPP = V

, absolute hardware write protection is provided for all device blocks. If

VPP is at or below V

PPLK

, programming operations halt and SR.3 is set indicating a VPP-

level error. Block Lock Registers are not affected by the voltage level on VPP; they may

still be programmed and read, even if VPP is less than V

PPLK

Figure 6: Example VPP Supply Connections

• Factory Programming with

= V

PPH

• Complete write/Erase Protection when

≤ V

PPLK

VCC

VPP

VCC

VPP

• Low Voltage and Factory Programming

• Low-voltage Programming only

• Logic Control of Device Protection

VCC

VPP

• Low Voltage Programming Only

• Full Device Protection Unavailable

VCC

VPP

≤ 10K Ω

PROT #

PPH

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9.0 Erase Operation

Flash erasing is performed on a block basis. An entire block is erased each time an

erase command sequence is issued, and only one block is erased at a time. When a

block is erased, all bits within that block read as logical ones. The following sections

describe block erase operations in detail.

9.1 Block Erase

Block erase operations are initiated by writing the Block Erase Setup command to the

address of the block to be erased (see Section 6.2, “Device Command Bus Cycles” on

page 18). Next, the Block Erase Confirm command is written to the address of the

block to be erased. If the device is placed in standby (CE# deasserted) during an erase

operation, the device completes the erase operation before entering standby. VPP must

be above V

PPLK

and the block must be unlocked (see Figure 34, “Block Erase Flowchart”

on page 77).

During a block erase, the WSM executes a sequence of internally-timed events that

conditions, erases, and verifies all bits within the block. Erasing the flash memory array

changes “zeros” to “ones”. Memory array bits that are ones can be changed to zeros

only by programming the block.

The Status Register can be examined for block erase progress and errors by reading

any address. The device remains in the Read Status Register state until another

command is written. SR.0 indicates whether the addressed block is erasing. Status

Status Register bit SR.7 indicates block erase status while the sequence executes.

When the erase operation has finished, Status Register bit SR.5 indicates an erase

failure if set. SR.3 set would indicate that the WSM could not perform the erase

operation because VPP was outside of its acceptable limits. SR.1 set indicates that the

erase operation attempted to erase a locked block, causing the operation to abort.

Before issuing a new command, the Status Register contents should be examined and

then cleared using the Clear Status Register command. Any valid command can follow

once the block erase operation has completed.

The Block Erase operation is aborted by performing a reset or powering down the

device. In this case, data integrity cannot be ensured, and it is recommended to erase

again the blocks aborted.

9.2 Blank Check

The Blank Check operation determines whether a specified main block is blank (i.e.

completely erased). Without Blank Check, Block Erase would be the only other way to

ensure a block is completely erased. so Blank Check can be used to determine whether

or not a prior erase operation was successful; this includes erase operations that may

have been interrupted by power loss.

Blank check can apply to only one block at a time, and no operations other than Status

erase etc). Suspend and resume operations are not supported during Blank Check, nor

is Blank Check supported during any suspended operations.

Blank Check operations are initiated by writing the Blank Check Setup command to the

block address. Next, the Check Confirm command is issued along with the same block

address. When a successful command sequence is entered, the device automatically

enters the Read Status State. The WSM then reads the entire specified block, and

determines whether any bit in the block is programmed or over-erased.

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Datasheet Jul 2011

28 Order Number: 208034-04

The Status Register can be examined for Blank Check progress and errors by reading

any address within the block being accessed. During a blank check operation, the

Status Register indicates a busy status (SR.7 = 0). Upon completion, the Status

any errors, and then cleared. If the Blank Check operation fails, which means the block

is not completely erased, the Status Register bit SR.5 will be set (“1”). CE# or OE#

toggle (during polling) updates the Status Register.

After examining the Status Register, it should be cleared by the Clear Status Register

command before issuing a new command. The device remains in Status Register Mode

until another command is written to the device. Any command can follow once the

Blank Check command is complete.

9.3 Erase Suspend

Issuing the Erase Suspend command while erasing suspends the block erase operation.

This allows data to be accessed from memory locations other than the one being

erased. The Erase Suspend command can be issued to any device address. A block

erase operation can be suspended to perform a word or buffer program operation, or a

read operation within any block except the block that is erase suspended (see

Figure 31, “Erase Suspend/Resume Flowchart” on page 74).

When a block erase operation is executing, issuing the Erase Suspend command

requests the WSM to suspend the erase algorithm at predetermined points. The device

continues to output Status Register data after the Erase Suspend command is issued.

Block erase is suspended when Status Register bits SR[7,6] are set. Suspend latency is

specified in Section 15.5, “Program and Erase Characteristics” on page 58.

To read data from the device (other than an erase-suspended block), the Read Array

command must be issued. During Erase Suspend, a Program command can be issued

to any block other than the erase-suspended block. Block erase cannot resume until

program operations initiated during erase suspend complete. Read Array, Read Status

during Erase Suspend. Additionally, Clear Status Register, Program, Program Suspend,

Block Lock, Block Unlock, and Block Lock-Down are valid commands during Erase

Suspend.

During an erase suspend, deasserting CE# places the device in standby, reducing

active current. VPP must remain at a valid level, and WP# must remain unchanged

while in erase suspend. If RST# is asserted, the device is reset.

9.4 Erase Resume

The Erase Resume command instructs the device to continue erasing, and

automatically clears SR[7,6]. This command can be written to any address. If Status

instruction. RST# must remain deasserted.

9.5 Erase Protection

When VPP = V

, absolute hardware erase protection is provided for all device blocks. If

VPP is at or below V

PPLK

, erase operations halt and SR.3 is set indicating a VPP-level

error.

Datasheet Jul 2011

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P33-65nm SBC

10.0 Security

The device features security modes used to protect the information stored in the flash

memory array. The following sections describe each security mode in detail.

10.1 Block Locking

Individual instant block locking is used to protect user code and/or data within the flash

memory array. All blocks power up in a locked state to protect array data from being

altered during power transitions. Any block can be locked or unlocked with no latency.

Locked blocks cannot be programmed or erased; they can only be read.

Software-controlled security is implemented using the Block Lock and Block Unlock

commands. Hardware-controlled security can be implemented using the Block Lock-

Down command along with asserting WP#. Also, VPP

data security can be used to

inhibit program and erase operations (see Section 8.6, “Program Protection” on

page 26 and Section 9.5, “Erase Protection” on page 28).

The P33-65nm SBC device also offers four pre-defined areas in the main array that can

be configured as One-Time Programmable (OTP) for the highest level of security. These

include the four 32 KB parameter blocks together as one and the three adjacent 128 KB

main blocks. This is available for top or bottom parameter devices.

10.1.1 Lock Block

To lock a block, issue the Lock Block Setup command. The next command must be the

Lock Block command issued to the desired block’s address (see Section 6.2, “Device

Command Bus Cycles” on page 18 and Figure 35, “Block Lock Operations Flowchart” on

page 78). If the Set Read Configuration Register command is issued after the Block

Lock Setup command, the device configures the RCR instead.

Block lock and unlock operations are not affected by the voltage level on VPP. The block

lock bits may be modified and/or read even if VPP is at or below V

PPLK

10.1.2 Unlock Block

The Unlock Block command is used to unlock blocks (see Section 6.2, “Device

Command Bus Cycles” on page 18). Unlocked blocks can be read, programmed, and

erased. Unlocked blocks return to a locked state when the device is reset or powered

down. If a block is in a lock-down state, WP# must be deasserted before it can be

unlocked (see Figure 7, “Block Locking State Diagram” on page 30).

10.1.3 Lock-Down Block

A locked or unlocked block can be locked-down by writing the Lock-Down Block

command sequence (see Section 6.2, “Device Command Bus Cycles” on page 18).

Blocks in a lock-down state cannot be programmed or erased; they can only be read.

However, unlike locked blocks, their locked state cannot be changed by software

commands alone. A locked-down block can only be unlocked by issuing the Unlock

Block command with WP# deasserted. To return an unlocked block to locked-down

state, a Lock-Down command must be issued prior to changing WP# to V

. Locked-

down blocks revert to the locked state upon reset or power up the device (see Figure 7,

“Block Locking State Diagram” on page 30).

P33-65nm

Datasheet Jul 2011

30 Order Number: 208034-04

10.1.4 Block Lock Status

The Read Device Identifier command is used to determine a block’s lock status (see

Section 7.3, “Read Device Identifier” on page 21). Data bits DQ[1:0] display the

addressed block’s lock status; DQ0 is the addressed block’s lock bit, while DQ1 is the

addressed block’s lock-down bit.

Note: LK: Lock Setup Command, 60h; LK/D0h: Unlock Command; LK/01h: Lock Command; LK/2Fh: Lock-Down Command.

10.1.5 Block Locking During Suspend

Block lock and unlock changes can be performed during an erase suspend. To change

block locking during an erase operation, first issue the Erase Suspend command.

Monitor the Status Register until SR.7 and SR.6 are set, indicating the device is

suspended and ready to accept another command.

Next, write the desired lock command sequence to a block, which changes the lock

state of that block. After completing block lock or unlock operations, resume the erase

operation using the Erase Resume command.

Note: A Lock Block Setup command followed by any command other than Lock Block, Unlock

Block, or Lock-Down Block produces a command sequence error and set Status

suspend, SR.4 and SR.5 remains set, even after the erase operation is resumed. Unless

the Status Register is cleared using the Clear Status Register command before

resuming the erase operation, possible erase errors may be masked by the command

sequence error.

Figure 7: Block Locking State Diagram

[000] [001]

[011]

[111]

[101]

[110]

[100]

LK/

D0h

LK/

01h

LK/

2Fh

LK/2Fh

LK/

D0h

LK/

01h or 2Fh

LK/

D0h

LK/

01h

LK/

2Fh LK/

2Fh

PGM/ERASE

ALLOW ED

PGM/ERASE

PREVENTED

WP# = V

= 0

WP# = V

= 1

Power-Up/

R eset D efault

Power-Up/

R eset D efault

Locked-down

is disabled by

WP# = V

V irtu al lo ck-

down

Any Lock

com m ands W P# toggle

WP# toggle

[010]

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31 Order Number:208034-04

P33-65nm SBC

If a block is locked or locked-down during an erase suspend of the same block, the lock

status bits change immediately. However, the erase operation completes when it is

resumed. Block lock operations cannot occur during a program suspend. See Appendix

A, “Write State Machine” on page 81, which shows valid commands during an erase

suspend.

10.2 Selectable OTP Blocks

Blocks from the main array may be optionally configured as OTP. Ask your local

Numonyx representative for details about any of these selectable OTP implementations.

10.3 Password Access

Password Access is a security enhancement offered on the P33-65nm device. This

feature protects information stored in main-array memory blocks by preventing content

alteration or reads until a valid 64-bit password is received. Password Access may be

combined with Non-Volatile Protection and/or Volatile Protection to create a multi-

tiered solution. Please contact your Numonyx Sales for further details concerning

Password Access.

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Datasheet Jul 2011

32 Order Number: 208034-04

11.0 Status Register

To read the Status Register, issue the Read Status Register command at any address.

Status Register information is available to which the Read Status Register, Word

Program, or Block Erase command was issued. SRD is automatically made available

following a Word Program, Block Erase, or Block Lock command sequence. Reads from

the device after any of these command sequences outputs the device’s status until

another valid command is written (e.g. the Read Array command).

The Status Register is read using single asynchronous-mode or synchronous burst

mode reads. SRD is output on DQ[7:0], while 0x00 is output on DQ[15:8]. In

asynchronous mode the falling edge of OE#, or CE# (whichever occurs first) updates

and latches the Status Register contents. However, when reading the Status Register in

synchronous burst mode, CE# or ADV# must be toggled to update SRD.

The Device Ready Status bit (SR.7) provides overall status of the device. SR[6:1]

present status and error information about the program, erase, suspend, VPP, and

block-locked operations.

Table 11: Status Register Description

Status Register (SR) Default Value = 0x80

Device Ready

Status

Erase

Suspend

Status 1

1. Always clear the Status Register before resuming erase operations afer an Erase Suspend command; this prevents ambiguity in

Status Register information. For example, if a command sequence error occurs during an erase suspend state, the Status

Register contains the command sequence error status (SR[7,5,4] set). When the erase operation resumes and finishes, possible

errors during the erase operation cannot be deteted via the Stauts Register because it contains the previous error status.

Erase/Blank

Check Status

Program

Status VPP Status

Program

Suspend

Status

Block-Locked

Status

BEFP Write

Status

DRS ESS ES PS VPPS PSS BLS BWS

76543210

Bit Name Description

7 Device Ready Status 0 = Device is busy; program or erase cycle in progress; SR.0 valid.

1 = Device is ready; SR[6:1] are valid.

6 Erase Suspend Status 0 = Erase suspend not in effect.

1 = Erase suspend in effect.

5Erase/Blank

Check Status

Command

Sequence

Error

SR.5 SR.4 Description

4Program

Status

Program or Erase operation successful.

Program error -operation aborted.

Erase or Blank Check error - operation aborted.

Command sequence error - command aborted.

3 VPP Status 0 = VPP within acceptable limits during program or erase operation.

1 = VPP < VPPLK during program or erase operation.

2 Program Suspend Status 0 = Program suspend not in effect.

1 = Program suspend in effect.

1Block-Locked Status 0 = Block not locked during program or erase.

1 = Block locked during program or erase; operation aborted.

0BEFP Write Status 2

2. BEFP mode is only valid in array.

After Buffered Enhanced Factory Programming (BEFP) data is loaded into the

buffer:

0 = BEFP complete.

1 = BEFP in-progress.

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P33-65nm SBC

11.0.1 Clear Status Register

The Clear Status Register command clears the Status Register. It functions independent

of VPP. The WSM sets and clears SR[7,6,2], but it sets bits SR[5:3,1] without clearing

them. The Status Register should be cleared before starting a command sequence to

avoid any ambiguity. A device reset also clears the Status Register.

11.1 Read Configuration Register

The RCR is used to select the read mode (synchronous or asynchronous), and it defines

the synchronous burst characteristics of the device. To modify RCR settings, use the

Configure Read Configuration Register command (see Section 6.2, “Device Command

Bus Cycles” on page 18).

RCR contents can be examined using the Read Device Identifier command, and then

reading from offset 0x05 (see Section 7.3, “Read Device Identifier” on page 21).

The RCR is shown in Ta b l e 1 2 . The following sections describe each RCR bit.

Table 12: Read Configuration Register Description (Sheet 1 of 2)

Read Configuration Register (RCR)

Read

Mode RES Latency Count WAIT

Polarity

Data

Output

Config

WAIT

Delay

Burst

Seq

CLK

Edge RES RES Burst

Wrap Burst Length

RM RLC[3:0] WP DOC WD BS CE R R BW BL[2:0]

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

Bit Name Description

15 Read Mode (RM) 0 = Synchronous burst-mode read

1 = Asynchronous page-mode read (default)

14 Reserved (R) Set to 0. This bit cannot be altered by customer.

13:11 Latency Count (LC[2:0])

000 =Code 0 reserved

001 =Code 1 reserved

010 =Code 2

011 =Code 3

100 =Code 4

101 =Code 5

110 =Code 6

111 =Code 7(default)

10 WAIT Polarity (WP) 0 =WAIT signal is active low

1 =WAIT signal is active high (default)

9Data Output Configuration

(DOC)

0 =Data held for a 1-clock data cycle

1 =Data held for a 2-clock data cycle (default)

8 WAIT Delay (WD) 0 =WAIT deasserted with valid data

1 =WAIT deasserted one data cycle before valid data (default)

7Burst Sequence (BS) 0 =Reserved

1 =Linear (default)

6Clock Edge (CE) 0 = Falling edge

1 = Rising edge (default)

P33-65nm

Datasheet Jul 2011

34 Order Number: 208034-04

11.1.1 Read Mode (RCR.15)

The Read Mode (RM) bit selects synchronous burst-mode or asynchronous page-mode

operation for the device. When the RM bit is set, asynchronous page mode is selected

(default). When RM is cleared, synchronous burst mode is selected.

11.1.2 Latency Count (RCR[13:11])

The Latency Count (LC) bits tell the device how many clock cycles must elapse from the

rising edge of ADV# (or from the first valid clock edge after ADV# is asserted) until the

first valid data word is driven onto DQ[15:0]. The input clock frequency is used to

determine this value and Figure 8 shows the data output latency for the different

settings of LC. The maximum Latency Count for P33 would be Code 4 based on the Max

clock frequency specification of 52 MHz, and there will be zero WAIT States when

bursting within the word line. Please also refer to Section 11.1.3, “End of Word Line

(EOWL) Considerations” on page 36 for more information on EOWL.

Refer to Table 13, “LC and Frequency Support” on page 35 for Latency Code Settings.

5:4 Reserved (R) Set to 0. This bit cannot be altered by customer.

3Burst Wrap (BW) 0 =Wrap; Burst accesses wrap within burst length set by BL[2:0]

1 =No Wrap; Burst accesses do not wrap within burst length (default)

2:0 Burst Length (BL[2:0])

001 =4-word burst

010 =8-word burst

011 =16-word burst

111 =Continuous-word burst (default)

(Other bit settings are reserved)

Table 12: Read Configuration Register Description (Sheet 2 of 2)

Datasheet Jul 2011

35 Order Number:208034-04

P33-65nm SBC

Figure 8: First-Access Latency Count

Table 13: LC and Frequency Support

Latency Count Settings Frequency Support (MHz)

3≤ 40

4≤ 52

Code 1

(Reserved

Code 6

Code 5

Code 4

Code 3

Code 2

Code 0 (Reserved)

Code 7

Vali d

Address

Valid

Output

Valid

Output

Valid

Output

Valid

Out put

Valid

Output

Valid

Out put

Valid

Out put

Valid

Output

Valid

Output

Valid

Output

Valid

Out put

Valid

Output

Valid

Out put

Valid

Out put

Valid

Output

Valid

Output

Valid

Out put

Valid

Output

Valid

Out put

Valid

Out put

Valid

Output

Valid

Out put

Valid

Output

Valid

Out put

Valid

Out put

Valid

Output

Valid

Output

Valid

Out put

Valid

Out put

Valid

Output

Valid

Out put

Valid

Out put

Valid

Output

Valid

Out put

Valid

Output

Valid

Output

Address [A]

ADV# [V]

15-0

[D/Q]

CLK [C]

15-0

[D/Q]

15-0

[D/Q]

15-0

[D/Q]

15-0

[D/Q]

15-0

[D/Q]

15-0

[D/Q]

15-0

[D/Q]

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Datasheet Jul 2011

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11.1.3 End of Word Line (EOWL) Considerations

End of Wordline (EOWL) WAIT states can result when the starting address of the burst

operation is not aligned to an 8-word boundary; that is, A[3:1] of start address does

not equal 0x0. Figure 10, “End of Wordline Timing Diagram” on page 36 illustrates the

end of wordline WAIT state(s), which occur after the first 8-word boundary is reached.

The number of data words and the number of WAIT states is summarized in Table 14,

“End of Wordline Data and WAIT state Comparison” on page 37for both P33-130nm

and P33-65nm SBC devices.

Figure 9: Example Latency Count Setting Using Code 3

CLK

CE#

ADV#

A[MAX:0]

D[15:0]

tData

Code 3

Address

Data

012

R103

High-Z

A[MAX:1]

Figure 10: End of Wordline Timing Diagram

A[Max:1]

ADV#

OE#

WAIT

DQ[15:0] Data Data Data

EOWL

CLK

Latency Count

Address

Datasheet Jul 2011

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P33-65nm SBC

Table 14: End of Wordline Data and WAIT state Comparison

11.1.4 WAIT Polarity (RCR.10)

The WAIT Polarity bit (WP), RCR.10 determines the asserted level (V

or V

) of WAIT.

When WP is set, WAIT is asserted high. When WP is cleared, WAIT is asserted low

(default). WAIT changes state on valid clock edges during active bus cycles (CE#

asserted, OE# asserted, RST# deasserted).

11.1.5 WAIT Signal Function

The WAIT signal indicates data valid when the device is operating in synchronous mode

(RCR.15=0). The WAIT signal is only “deasserted” when data is valid on the bus.

When the device is operating in synchronous non-array read mode, such as read

status, read ID, or read query. The WAIT signal is also “deasserted” when data is valid

on the bus.

WAIT behavior during synchronous non-array reads at the end of word line works

correctly only on the first data access.

When the device is operating in asynchronous page mode, asynchronous single word

read mode, and all write operations, WAIT is set to a deasserted state as determined

by RCR.10. See Figure 18, “Asynchronous Single-Word Read (ADV# Latch)” on

page 51, and Figure 19, “Asynchronous Page-Mode Read Timing” on page 52.

Latency Count P33-130nm P33-65nm

Data States WAIT States Data States WAIT States

1 Not Supported Not Supported Not Supported Not Supported

2 4 0 to 1 8 0 to 1

3 4 0 to 2 8 0 to 2

4 4 0 to 3 8 0 to 3

5 4 0 to 4 8 0 to 4

6 4 0 to 5 8 0 to 5

7 4 0 to 6 8 0 to 6

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Datasheet Jul 2011

38 Order Number: 208034-04

11.1.6 Data Output Configuration (RCR.9)

The Data Output Configuration (DOC) bit, RCR.9 determines whether a data word

remains valid on the data bus for one or two clock cycles. This period of time is called

the “data cycle”. When DOC is set, output data is held for two clocks (default). When

DOC is cleared, output data is held for one clock (see Figure 11, “Data Hold Timing” on

page 38). The processor’s data setup time and the flash memory’s clock-to-data output

delay should be considered when determining whether to hold output data for one or

two clocks. A method for determining the Data Hold configuration is shown below:

To set the device at one clock data hold for subsequent reads, the following condition

must be satisfied:

CHQV

(ns)

DATA

(ns)

≤

One CLK Period (ns)

DATA

= Data set up to Clock (defined by CPU)

For example, with a clock frequency of 40 MHz, the clock period is 25 ns. Assuming

CHQV

= 20 ns and t

DATA

= 4 ns. Applying these values to the formula above:

20 ns + 4 ns

≤

25 ns

The equation is satisfied and data will be available at every clock period with data hold

setting at one clock. If t

CHQV (ns) +

DATA

(ns) >

One CLK Period (ns), data hold setting of

2 clock periods must be used.

Table 15: WAIT Functionality Table

Condition WAIT Notes

CE# = ‘1’, OE# = ‘X’ or CE# = ‘0’, OE# = ‘1’ High-Z 1

CE# =’0’, OE# = ‘0’ Active 1

Synchronous Array Reads Active 1

Synchronous Non-Array Reads Active 1

All Asynchronous Reads Deasserted 1

All Writes High-Z 1,2

Notes:

1. Active: WAIT is asserted until data becomes valid, then deasserts.

2. When OE# = VIH during writes, WAIT = High-Z.

Figure 11: Data Hold Timing

Valid

Output

Valid

Output

Valid

Output

Valid

Output

Valid

Output

CLK [C]

D[15:0] [Q]

2 CLK

Data Hold

1 CLK

Data Hold

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P33-65nm SBC

11.1.7 WAIT Delay (RCR.8)

The WAIT Delay (WD) bit controls the WAIT assertion-delay behavior during

synchronous burst reads. WAIT can be asserted either during or one data cycle before

valid data is output on DQ[15:0]. When WD is set, WAIT is deasserted one data cycle

before valid data (default). When WD is cleared, WAIT is deasserted during valid data.

11.1.8 Burst Sequence (RCR.7)

The Burst Sequence (BS) bit selects linear-burst sequence (default). Only linear-burst

sequence is supported. Tab le 16 shows the synchronous burst sequence for all burst

lengths, as well as the effect of the Burst Wrap (BW) setting.

Table 16: Burst Sequence Word Ordering

Start

Addr.

(DEC)

Burst

Wrap

(RCR.3)

Burst Addressing Sequence (DEC)

4-Word Burst

(BL[2:0] = 0b001)

8-Word Burst

(BL[2:0] = 0b010)

16-Word Burst

(BL[2:0] = 0b011)

Continuous Burst

(BL[2:0] = 0b111)

0 0 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3-4…14-15 0-1-2-3-4-5-6-…

1 0 1-2-3-0 1-2-3-4-5-6-7-0 1-2-3-4-5…15-0 1-2-3-4-5-6-7-…

2 0 2-3-0-1 2-3-4-5-6-7-0-1 2-3-4-5-6…15-0-1 2-3-4-5-6-7-8-…

3 0 3-0-1-2 3-4-5-6-7-0-1-2 3-4-5-6-7…15-0-1-2 3-4-5-6-7-8-9-…

40 4-5-6-7-0-1-2-3 4-5-6-7-8…15-0-1-2-3 4-5-6-7-8-9-10…

50 5-6-7-0-1-2-3-4 5-6-7-8-9…15-0-1-2-3-

45-6-7-8-9-10-11…

60 6-7-0-1-2-3-4-5 6-7-8-9-10…15-0-1-2-

3-4-5 6-7-8-9-10-11-12-…

70 7-0-1-2-3-4-5-6 7-8-9-10…15-0-1-2-3-

4-5-6 7-8-9-10-11-12-13…

…

14 0 14-15-0-1-2…12-13 14-15-16-17-18-19-20-

…

15 0 15-0-1-2-3…13-14 15-16-17-18-19-20-21-

…

0 1 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3-4…14-15 0-1-2-3-4-5-6-…

1 1 1-2-3-4 1-2-3-4-5-6-7-8 1-2-3-4-5…15-16 1-2-3-4-5-6-7-…

2 1 2-3-4-5 2-3-4-5-6-7-8-9 2-3-4-5-6…16-17 2-3-4-5-6-7-8-…

3 1 3-4-5-6 3-4-5-6-7-8-9-10 3-4-5-6-7…17-18 3-4-5-6-7-8-9-…

41 4-5-6-7-8-9-10-11 4-5-6-7-8…18-19 4-5-6-7-8-9-10…

51 5-6-7-8-9-10-11-12 5-6-7-8-9…19-20 5-6-7-8-9-10-11…

61 6-7-8-9-10-11-12-13 6-7-8-9-10…20-21 6-7-8-9-10-11-12-…

71 7-8-9-10-11-12-13-14 7-8-9-10-11…21-22 7-8-9-10-11-12-13…

…

14 1 14-15-16-17-18…28-29 14-15-16-17-18-19-20-

…

15 1 15-16-17-18-19…29-30 15-16-17-18-19-20-21-

…

P33-65nm

Datasheet Jul 2011

40 Order Number: 208034-04

11.1.9 Clock Edge (RCR.6)

The Clock Edge (CE) bit selects either a rising (default) or falling clock edge for CLK.

This clock edge is used at the start of a burst cycle, to output synchronous data, and to

assert/deassert WAIT.

11.1.10 Burst Wrap (RCR.3)

The Burst Wrap (BW) bit determines whether 4, 8, or 16-word burst length accesses

wrap within the selected word-length boundaries or cross word-length boundaries.

When BW is set, burst wrapping does not occur (default). When BW is cleared, burst

wrapping occurs.

11.1.11 Burst Length (RCR[2:0])

The Burst Length bits (BL[2:0]) selects the linear burst length for all synchronous burst

reads of the flash memory array. The burst lengths are 4-word, 8-word, 16-word, and

continuous word.

Continuous burst accesses are linear only, and do not wrap within any word length

boundaries (see Table 16, “Burst Sequence Word Ordering” on page 39). When a burst

cycle begins, the device outputs synchronous burst data until it reaches the end of the

“burstable” address space.

11.2 One-Time Programmable (OTP) Registers

The device contains 17 OTP Registers that can be used to implement system security

measures and/or device identification. Each OTP Register can be individually locked.

The first 128-bit OTP Register is comprised of two 64-bit (8-word) segments. The lower

64-bit segment is pre-programmed at the Numonyx factory with a unique 64-bit

number. The other 64-bit segment, as well as the other sixteen 128-bit OTP Registers,

are blank. Users can program these registers as needed. Once programmed, users can

then lock the OTP Register(s) to prevent additional bit programming (see Figure 12,

“OTP Register Map” on page 41).

The OTP Registers contain OTP bits; when programmed, PR bits cannot be erased. Each

OTP Register can be accessed multiple times to program individual bits, as long as the

Each OTP Register has an associated Lock Register bit. When a Lock Register bit is

programmed, the associated OTP Register can only be read; it can no longer be

programmed. Additionally, because the Lock Register bits themselves are OTP, when

programmed, Lock Register bits cannot be erased. Therefore, when a OTP Register is

locked, it cannot be unlocked.

Datasheet Jul 2011

41 Order Number:208034-04

P33-65nm SBC

11.2.1 Reading the OTP Registers

The OTP Registers can be read from OTP-RA address. To read the OTP Register, first

issue the Read Device Identifier command at OTP-RA address to place the device in the

Read Device Identifier state (see Section 6.2, “Device Command Bus Cycles” on

page 18). Next, perform a read operation using the address offset corresponding to the

address offsets of the OTP Registers and Lock Registers. PR data is read 16 bits at a

time.

11.2.2 Programming the OTP Registers

To program any of the OTP Registers, first issue the Program OTP Register command at

the parameter’s base address plus the offset to the desired OTP Register (see Section

6.2, “Device Command Bus Cycles” on page 18). Next, write the desired OTP Register

data to the same OTP Register address (see Figure 12, “OTP Register Map” on

page 41).

Figure 12: OTP Register Map

0x89

Lock Register 1

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

0x102

0x109

0x8A

0x91

128-bit OTP Register 16

(User-Programmable)

128-bit OTP Register 1

(User-Programmable)

0x88

0x85

64-bit Segment

(User-Programmable)

0x84

0x81

0x80

Lock Register 0

64-bit Segment

(Factory-Programmed)

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

128-Bit OTP Register 0

P33-65nm

Datasheet Jul 2011

42 Order Number: 208034-04

The device programs the 64-bit and 128-bit user-programmable OTP Register data 16

bits at a time (see Figure 36, “OTP Register Programming Flowchart” on page 79).

Issuing the Program OTP Register command outside of the OTP Register’s address

space causes a program error (SR.4 set). Attempting to program a locked OTP Register

causes a program error (SR.4 set) and a lock error (SR.1 set).

Note: When programming the OTP bits in the OTP Registers for a Top Parameter Device, the

following upper address bits must also be driven properly: A[Max:17] driven high (V

11.2.3 Locking the OTP Registers

Each OTP Register can be locked by programming its respective lock bit in the Lock

issuing the Program Lock Register command, followed by the desired Lock Register

data (see Section 6.2, “Device Command Bus Cycles” on page 18). The physical

addresses of the Lock Registers are 0x80 for register 0 and 0x89 for register 1. These

addresses are used when programming the Lock Registers (see Table 7, “Device

Identifier Information” on page 21).

Bit 0 of Lock Register 0 is already programmed during the manufacturing process at the

“factory”, locking the lower, pre-programmed 64-bit region of the first 128-bit OTP

region of the first 128-bit OTP Register. When programming Bit 1 of Lock Register 0, all

other bits need to be left as ‘1’ such that the data programmed is 0xFFFD.

Lock Register 1 controls the locking of the upper sixteen 128-bit OTP Registers. Each of

the 16 bits of Lock Register 1 correspond to each of the upper sixteen 128-bit OTP

Registers. Programming a bit in Lock Register 1 locks the corresponding 128-bit OTP

Caution: After being locked, the OTP Registers cannot be unlocked.

Datasheet Jul 2011

43 Order Number:208034-04

P33-65nm SBC

12.0 Power and Reset Specifications

12.1 Power-Up and Power-Down

Power supply sequencing is not required if VPP is connected to VCC or VCCQ. Otherwise

VCC and VCCQ should attain their minimum operating voltage before applying VPP.

Power supply transitions should only occur when RST# is low. This protects the device

from accidental programming or erasure during power transitions.

12.2 Reset Specifications

Asserting RST# during a system reset is important with automated program/erase

devices because systems typically expect to read from flash memory when coming out

of reset. If a CPU reset occurs without a flash memory reset, proper CPU initialization

may not occur. This is because the flash memory may be providing status information,

instead of array data as expected. Connect RST# to the same active low reset signal

used for CPU initialization.

Also, because the device is disabled when RST# is asserted, it ignores its control inputs

during power-up/down. Invalid bus conditions are masked, providing a level of memory

protection.

Table 17: Power and Reset

Num Symbol Parameter Min Max Unit Notes

P1 tPLPH RST# pulse width low 100 - ns 1,2,3,4

P2 tPLRH

RST# low to device reset during erase - 25

µs

1,3,4,7

RST# low to device reset during program - 25 1,3,4,7

P3 tVCCPH VCC Power valid to RST# de-assertion (high) 60 - 1,4,5,6

Notes:

1. These specifications are valid for all device versions (packages and speeds).

2. The device may reset if tPLPH is < tPLPH Min, but this is not guaranteed.

3. Not applicable if RST# is tied to VCC.

4. Sampled, but not 100% tested.

5. When RST# is tied to the VCC supply, device will not be ready until tVCCPH after VCC ≥ VCCMIN.

6. When RST# is tied to the VCCQ supply, device will not be ready until tVCCPH after VCC ≥ VCCMIN.

7. Reset completes within tPLPH if RST# is asserted while no erase or program operation is executing.

P33-65nm

Datasheet Jul 2011

44 Order Number: 208034-04

12.3 Power Supply Decoupling

Flash memory devices require careful power supply de-coupling. Three basic power

supply current considerations are: 1) standby current levels; 2) active current levels;

and 3) transient peaks produced when CE# and OE# are asserted and deasserted.

When the device is accessed, many internal conditions change. Circuits within the

device enable charge-pumps, and internal logic states change at high speed. All of

these internal activities produce transient signals. Transient current magnitudes depend

on the device outputs’ capacitive and inductive loading. Two-line control and correct

de-coupling capacitor selection suppress transient voltage peaks.

Because Numonyx flash memory devices draw their power from VCC, VPP, and VCCQ,

each power connection should have a 0.1 µF ceramic capacitor to ground. High-

frequency, inherently low-inductance capacitors should be placed as close as possible

to package leads.

Additionally, for every eight devices used in the system, a 4.7 µF electrolytic capacitor

should be placed between power and ground close to the devices. The bulk capacitor is

meant to overcome voltage droop caused by PCB trace inductance.

Figure 13: Reset Operation Waveforms

(

A) Reset during

read mode

(B) Reset during

program or block erase

≤

program or block erase

≥

RST# [P]

Abort

Complete

Abort

Complete

(D) VCC Power-up to

RST# high

P1 R5

P2 R5

Datasheet Jul 2011

45 Order Number:208034-04

P33-65nm SBC

13.0 Maximum Ratings and Operating Conditions

13.1 Absolute Maximum Ratings

Warning: Stressing the device beyond the Absolute Maximum Ratings may cause permanent

damage. These are stress ratings only.

13.2 Operating Conditions

Note: Operation beyond the Operating Conditions is not recommended and extended

exposure beyond the Operating Conditions may affect device reliability.

Table 18: Absolute Maximum Ratings

Parameter Maximum Rating Notes

Temperature under bias –40 °C to +85 °C -

Storage temperature –65 °C to +125 °C -

Voltage on any input/output signal (except VCC, VPP and VCCQ) –2.0 V to +5.6 V 1

VPP voltage –2.0 V to +11.5 V 1,2

VCC voltage –2.0 V to +5.6 V 1

VCCQ voltage –2.0 V to +5.6 V 1

Output short circuit current 100 mA 3

Notes:

1. Voltages shown are specified with respect to VSS. During infrequent non-periodic transitions, the level may undershoot

to –2.0 V for periods less than 20 ns or overshoot to VCC + 2.0 V or VCCQ + 2.0 V for periods less than 20 ns.

2. Program/erase voltage is typically 2.3 V ~ 3.6 V. 9.0 V can be applied for 80 hours maximum total. 9.0 V program/erase

voltage may reduce block cycling capability.

3. Output shorted for no more than one second. No more than one output shorted at a time.

Table 19: Operating Conditions

Symbol Parameter Min Max Units Notes

TCOperating Temperature –40 +85 °C 1

VCC VCC Supply Voltage 2.3 3.6

VCCQ I/O Supply Voltage

CMOS inputs 2.3 3.6

TTL inputs 2.4 3.6

VPPL VPP Voltage Supply (Logic Level) 1.5 3.6

VPPH Buffered Enhanced Factory Programming VPP 8.5 9.5

tPPH Maximum VPP Hours VPP = VPPH -80Hours

Block

Erase

Cycles

Main and Parameter Blocks VPP = VPPL 100,000 -

CyclesMain Blocks VPP = VPPH - 1000

Parameter Blocks VPP = VPPH - 2500

Notes:

1. TC = Case Temperature.

2. In typical operation VPP program voltage is VPPL.

P33-65nm

Datasheet Jul 2011

46 Order Number: 208034-04

14.0 Electrical Specifications

14.1 DC Current Characteristics

Table 20: DC Current Characteristics (Sheet 1 of 2)

Sym Parameter

CMOS Inputs

(VCCQ =

2.3 V - 3.6 V)

TTL Inputs

(VCCQ =

2.4 V - 3.6 V) Unit Test Conditions Notes

Typ Max Typ Max

ILI Input Load Current - ±1 - ±2 µA

VCC = VCC Max

VCCQ = VCCQ Max

VIN = VCCQ or VSS 1,6

ILO

Output

Leakage

Current

DQ[15:0], WAIT - ±1 - ±10 µA

VCC = VCC Max

VCCQ = VCCQ Max

VIN = VCCQ or VSS

ICCS,

ICCD

VCC Standby,

Power-Down

64-Mbit 35 120 710 2000

µA

VCC = VCC Max

VCCQ = VCC Max

CE# =VCCQ

RST# = VCCQ (for ICCS)

RST# = VSS (for ICCD)

WP# = VIH

1,2

128-Mbit 55 120 710 2000

ICCR

Average

VCC

Read

Current

Asynchronous Single-

Word f = 5 MHz (1

CLK)

20 25 - - mA 8-Word Read

VCC = VCCMax

CE# = VIL

OE# = VIH

Inputs: VIL or

VIH

Page-Mode Read

f = 13 MHz (17 CLK) 12 16 - - mA 8-Word Read

Synchronous Burst

f = 52 MHz, LC=4

16 19 - - mA 4-Word Read

19 22 - - mA 8-Word Read

22 26 - - mA 16-Word

Read

23 28 - - mA Continuous

Read

ICCW,

ICCE

VCC Program Current,

VCC Erase Current

35 50 35 50

VPP = VPPL, Pgm/Ers in progress 1,3,5

26 33 26 33 VPP = VPPH, Pgm/Ers in

progress 1,3,5

ICCWS,

ICCES

VCC Program

Suspend Current,

VCC Erase

Suspend Current

64-Mbit 35 120 710 2000

µA CE# = VCCQ; suspend in

progress 1,3,4

128-Mbit 55 120 710 2000

IPPS,

IPPWS,

IPPES

VPP Standby Current,

VPP Program Suspend Current,

VPP Erase Suspend Current

0.2 5 0.2 5 µA VPP = VPPL, suspend in progress 1,3,7

IPPR VPP Read 2 15 2 15 µA VPP = VPPL 1,3

IPPW VPP Program Current

0.05 0.10 0.05 0.10

VPP = VPPL, program in progress

510510 VPP = V

PPH, program in progress

IPPE VPP Erase Current

0.05 0.10 0.05 0.10

VPP = VPPL, erase in progress

510510 VPP = V

PPH, erase in progress

Datasheet Jul 2011

47 Order Number:208034-04

P33-65nm SBC

14.2 DC Voltage Characteristics

IPPBC VPP Blank Check

0.05 0.10 0.05 0.10

VPP = VPPL 3

5 10 5 10 VPP = VPPH

Notes:

1. All currents are RMS unless noted. Typical values at typical VCC, TC = +25 °C.

2. ICCS is the average current measured over any 5 ms time interval 5 µs after CE# is deasserted.

3. Sampled, not 100% tested.

4. ICCES is specified with the device deselected. If device is read while in erase suspend, current is ICCES plus ICCR.

5. ICCW

, ICCE measured over typical or max times specified in

Section 15.5, “Program and Erase

Characteristics” on page 58

6. if VIN > VCC the input load current increases to 10µA max.

7. the IPPS, IPPWS, IPPES Will increase to 200µA when VPP/WP# is at VPPH.

Table 21: DC Voltage Characteristics

Sym Parameter

CMOS Inputs

(VCCQ = 2.3 V – 3.6 V)

TTL Inputs (1)

(VCCQ = 2.4 V – 3.6 V) Unit Test Conditions Notes

Min Max Min Max

VIL Input Low Voltage -0.5 0.4 -0.5 0.6 V -

VIH Input High Voltage VCCQ – 0.4 VCCQ + 0.5 2.0 VCCQ + 0.5 V -

VOL Output Low Voltage - 0.2 - 0.2 V

VCC = VCC Min

VCCQ = VCCQ Min

IOL = 100 µA

VOH Output High Voltage VCCQ – 0.2 - VCCQ – 0.2 - V

VCC = VCC Min

VCCQ = VCCQ Min

IOH = –100 µA

VPPLK VPP Lock-Out Voltage - 0.4 - 0.4 V - 3

VLKO VCC Lock Voltage 1.5 - 1.5 - V - -

VLKOQ VCCQ Lock Voltage 0.9 - 0.9 - V - -

VPPL

VPP Voltage Supply

(Logic Level) 1.5 3.6 1.5 3.6 V - -

VPPH

Buffered Enhanced

Factory Programming

VPP

8.5 9.5 8.5 9.5 V - -

Notes:

1. Synchronous read mode is not supported with TTL inputs.

2. VIL can undershoot to –0.4 V and VIH can overshoot to VCCQ + 0.4 V for durations of 20 ns or less.

3. VPP ≤ VPPLK inhibits erase and program operations. Do not use VPPL and VPPH

outside their valid ranges

Table 20: DC Current Characteristics (Sheet 2 of 2)

Sym Parameter

CMOS Inputs

(VCCQ =

2.3 V - 3.6 V)

TTL Inputs

(VCCQ =

2.4 V - 3.6 V) Unit Test Conditions Notes

Typ Max Typ Max

P33-65nm

Datasheet Jul 2011

48 Order Number: 208034-04

15.0 AC Characteristics

15.1 AC Test Conditions

Note: AC test inputs are driven at VCCQ for Logic "1" and 0 V for Logic "0." Input/output timing begins/ends at VCCQ/2. Input

rise and fall times (10% to 90%) < 5 ns. Worst-case speed occurs at VCC = VCCMin.

Notes:

1. See the following table for component values.

2. Test configuration component value for worst case speed conditions.

3. CL includes jig capacitance

Figure 14: AC Input/Output Reference Waveform

Figure 15: Transient Equivalent Testing Load Circuit

Table 22: Test Configuration Component Value for Worst Case Speed Conditions

Test Configuration CL (pF)

VCCQ Min Standard Test 30

Figure 16: Clock Input AC Waveform

IO_REF.WMF

Input V

CCQ

/2 V

CCQ

/2 Output

CCQ

Test Points

Device

Under Test Out

CLK [C]

R203R202

R201

Datasheet Jul 2011

49 Order Number:208034-04

P33-65nm SBC

15.2 Capacitance

15.3 AC Read Specifications

Table 23: Capacitance

Symbol Parameter Signals Min Typ Max Unit Condition Notes

CIN Input Capacitance

Address, Data,

CE#, WE#, OE#,

RST#, CLK,

ADV#, WP#

26 7 pF

Typ temp = 25 °C,

Max temp = 85 °C,

VCC = (0 V - 3.6 V),

VCCQ = (0 V - 3.6 V),

Discrete silicon die

1,2,3

COUT Output Capacitance Data, WAIT 2 4 5 pF

Notes:

1. Capacitance values are for a single die; for dual die, the capacitance values are doubled.

2. Sampled, not 100% tested.

3. Silicon die capacitance only, add 1 pF for discrete packages.

Table 24: AC Read Specifications - (Sheet 1 of 2)

Num Symbol Parameter Min Max Unit Notes

Asynchronous Specifications

R1 tAVAV Read cycle time

Easy BGA 60 - ns -

TSOP 70 - ns -

R2 tAVQV Address to output valid

Easy BGA - 60 ns -

TSOP 70 ns -

R3 tELQV CE# low to output valid

Easy BGA - 60 ns -

TSOP 70 ns -

R4 tGLQV OE# low to output valid - 25 ns 1,2

R5 tPHQV RST# high to output valid - 150 ns 1

R6 tELQX CE# low to output in low-Z 0 - ns 1,3

R7 tGLQX OE# low to output in low-Z 0 - ns 1,2,3

R8 tEHQZ CE# high to output in high-Z - 20 ns

1,3

R9 tGHQZ OE# high to output in high-Z - 15 ns

R10 tOH

Output hold from first occurring address, CE#, or OE#

change 0-ns

R11 tEHEL CE# pulse width high 17 - ns

R12 tELTV CE# low to WAIT valid - 17 ns

R13 tEHTZ CE# high to WAIT high-Z - 20 ns 1,3

R15 tGLTV OE# low to WAIT valid - 17 ns 1

R16 tGLTX OE# low to WAIT in low-Z 0 - ns

1,3

R17 tGHTZ OE# high to WAIT in high-Z - 20 ns

Latching Specifications

R101 tAVVH Address setup to ADV# high 10 - ns 1

R102 tELVH CE# low to ADV# high 10 - ns 1

R103 tVLQV ADV# low to output valid

Easy BGA - 60 ns 1

TSOP - 70 ns 1

P33-65nm

Datasheet Jul 2011

50 Order Number: 208034-04

R104 tVLVH ADV# pulse width low 10 - ns 1

R105 tVHVL ADV# pulse width high 10 - ns 1

R106 tVHAX Address hold from ADV# high 9 - ns 1,4

R108 tAPA Page address access - 25 ns

R111 tphvh RST# high to ADV# high 30 - ns

Clock Specifications

R200 f

CLK

CLK frequency

Easy BGA - 52 MHz

1,3,5,6

TSOP - 40 MHz

R201 t

CLK

CLK period

Easy BGA 19.2 - ns

TSOP 25 - ns

R202 t

CH/CL

CLK high/low time

Easy BGA 5 - ns

TSOP 9 - ns

R203 t

FCLK/RCLK

CLK fall/rise time 0.3 3 ns

Synchronous Specifications(5)

R301 tAVCH/L Address setup to CLK 9 - ns 1,6

R302 tVLCH/L ADV# low setup to CLK 9 - ns 1,6

R303 tELCH/L CE# low setup to CLK 9 - ns 1,6

R304 tCHQV / tCLQV CLK to output valid

Easy BGA - 17 ns 1,6

TSOP - 20 ns 1,6

R305 tCHQX Output hold from CLK

Easy BGA 3 - ns 1,6

TSOP 5 - ns 1,6

R306 tCHAX Address hold from CLK 10 - ns 1,4,6

R307 tCHTV CLK to WAIT valid

Easy BGA - 17 ns 1,6

TSOP - 20 ns 1,6

R311 tCHVL CLK Valid to ADV# Setup 3 - ns 1

R312 tCHTX WAIT Hold from CLK

Easy BGA 3 - ns 1,6

TSOP 5 - ns 1,6

Notes:

1. See

Figure 14, “AC Input/Output Reference Waveform” on page 48

for timing measurements and max

allowable input slew rate.

2. OE# may be delayed by up to tELQV – tGLQV after CE#’s falling edge without impact to tELQV.

3. Sampled, not 100% tested.

4. Address hold in synchronous burst read mode is tCHAX or tVHAX, whichever timing specification is satisfied first.

5. Synchronous burst read mode is not supported with TTL level inputs.

6. Applies only to subsequent synchronous reads.

Table 24: AC Read Specifications - (Sheet 2 of 2)

Num Symbol Parameter Min Max Unit Notes

Datasheet Jul 2011

51 Order Number:208034-04

P33-65nm SBC

Note: WAIT shown deasserted during asynchronous read mode (RCR.10=0, WAIT asserted low).

Note: WAIT shown deasserted during asynchronous read mode (RCR.10=0, WAIT asserted low)

Figure 17: Asynchronous Single-Word Read (ADV# Low)

Figure 18: Asynchronous Single-Word Read (ADV# Latch)

R17R15

R9R4

R8R3

Addre ss [A]

ADV#[V]

CE# [E]

OE# [G]

WAIT [T]

Data [D/Q]

RST# [P]

105

R1 0

R17R15

R9R4

R8R3

R1 0 6

R1 0 1

R2 R1

Address [A]

A[3:1][A]

ADV#[V]

CE# [E]

OE# [G]

WAIT [T]

Data [D/Q]

104R

P33-65nm

Datasheet Jul 2011

52 Order Number: 208034-04

Note: WAIT shown deasserted during asynchronous read mode (RCR.10=0, WAIT asserted low).

Notes:

1. WAIT is driven per OE# assertion during synchronous array or non-array read, and can be configured to assert either

during or one data cycle before valid data.

2. This diagram illustrates the case in which an n-word burst is initiated to the flash memory array and it is terminated by

CE# deassertion after the first word in the burst.

Figure 19: Asynchronous Page-Mode Read Timing

Valid Address

0 1 2 7

Q0 Q1 Q2 Q7

R108R108R108 R13R6

R9R4

R8R3

R106

R101

R105R105

R10R10R10R10

A[Max:4] [A]

A[3:1]

ADV# [V]

CE# [E]

OE# [G]

WAIT [T]

DATA [D/Q]

Figure 20: Synchronous Single-Word Array or Non-array Read Timing

R312

R305R304

R17R307R15

R9R7

R303

R102

R104

R106R101

R104

R105R105

R306R301

CLK [C]

ddress [A]

ADV# [V]

CE# [E]

OE# [G]

WAIT [T]

Data [D/Q]

Datasheet Jul 2011

53 Order Number:208034-04

P33-65nm SBC

Notes:

1. WAIT is driven per OE# assertion during synchronous array or non-array read, and can be configured to assert either

during or one data cycle before valid data.

2. At the end of Word Line; the delay incurred when a burst access crosses a 16-word boundary and the starting address is

not 4-word boundary aligned. See

Section 11.1.3, “End of Word Line (EOWL) Considerations” on

page 36

for more information.

Note: WAIT is driven per OE# assertion during synchronous array or non-array read. WAIT asserted during initial latency and

deasserted during valid data (RCR.10=0, WAIT asserted low).

Figure 21: Continuous Burst Read, showing an Output Delay Timing

Figure 22: Synchronous Burst-Mode Four-Word Read Timing

R305R305R305R305

R304

R312R30 7R15

R303

R102

R106

R105R105

R101

R304R304R304R306

R302

R301

CLK [C]

ddress [A]

ADV# [V]

CE# [E]

OE# [G]

WAIT [T]

Data [D/Q]

Q0 Q1 Q2 Q3

R307

R10

R304

R305R304

R17R15

R303

R106

R102

R105R105

R101

R306

R302

R301

CLK [C]

ddress [A]

ADV# [V]

CE# [E]

OE# [G]

WAIT [T]

Data [D/Q]

P33-65nm

Datasheet Jul 2011

54 Order Number: 208034-04

15.4 AC Write Specifications

Table 25: AC Write Specifications

Num Symbol Parameter Min Max Unit Notes

W1 tPHWL RST# high recovery to WE# low 150 - ns 1,2,3

W2 tELWL CE# setup to WE# low 0 - ns 1,2,3

W3 tWLWH WE# write pulse width low 50 - ns 1,2,4

W4 tDVWH Data setup to WE# high 50 - ns 1,2, 12

W5 tAVWH Address setup to WE# high 50 - ns

1,2

W6 tWHEH CE# hold from WE# high 0 - ns

W7 tWHDX Data hold from WE# high 0 - ns

W8 tWHAX Address hold from WE# high 0 - ns

W9 tWHWL WE# pulse width high 20 - ns 1,2,5

W10 tVPWH VPP setup to WE# high 200 - ns

1,2,3,7

W11 tQVVL VPP hold from Status read 0 - ns

W12 tQVBL WP# hold from Status read 0 - ns

1,2,3,7

W13 tBHWH WP# setup to WE# high 200 - ns

W14 tWHGL WE# high to OE# low 0 - ns 1,2,9

W16 tWHQV WE# high to read valid tAVQV + 35 - ns 1,2,3,6,10

Write to Asynchronous Read Specifications

W18 tWHAV WE# high to Address valid 0 - ns 1,2,3,6,8

Write to Synchronous Read Specifications

W19 tWHCH/L WE# high to Clock valid 19 - ns

1,2,3,6,10

W20 tWHVH WE# high to ADV# high 19 - ns

Write Specifications with Clock Active

W21 tVHWL ADV# high to WE# low - 20 ns

1,2,3,11

W22 tCHWL Clock high to WE# low - 20 ns

Notes:

1. Write timing characteristics during erase suspend are the same as write-only operations.

2. A write operation can be terminated with either CE# or WE#.

3. Sampled, not 100% tested.

4. Write pulse width low (tWLWH or tELEH) is defined from CE# or WE# low (whichever occurs last) to CE# or WE# high

(whichever occurs first). Hence, tWLWH = tELEH = tWLEH = tELWH.

5. Write pulse width high (tWHWL or tEHEL) is defined from CE# or WE# high (whichever occurs first) to CE# or WE# low

(whichever occurs last). Hence, tWHWL = tEHEL = tWHEL = tEHWL).

6. tWHVH or tWHCH/L must be met when transiting from a write cycle to a synchronous burst read.

7. VPP and WP# should be at a valid level until erase or program success is determined.

8. This specification is only applicable when transiting from a write cycle to an asynchronous read. See spec W19 and W20

for synchronous read.

9. When doing a Read Status operation following any command that alters the Status Register, W14 is 20 ns.

10. Add 10 ns if the write operations results in a RCR or block lock status change, for the subsequent read operation to

reflect this change.

11. These specs are required only when the device is in a synchronous mode and clock is active during address setup phase.

12. This specification must be complied with by customer’s writing timing. The result would be unpredictable if any violation

to this timing specification.

Datasheet Jul 2011

55 Order Number:208034-04

P33-65nm SBC

Note: WAIT deasserted during asynchronous read and during write. WAIT High-Z during write per OE# deasserted.

Figure 23: Write-to-Write Timing

Figure 24: Asynchronous Read-to-Write Timing

W7W4W7W4

W3W9 W3W9W3W3

W6W2W6W2

W8W8 W5W5

Address [A]

CE# [E]

WE# [W]

OE# [G]

Data [D/Q]

RST# [P]

Q D

W4R10

R17R15

W6W3W3W2

R9R4

R8R3

W8W5

Address [A]

CE# [E]

OE# [G]

WE# [W]

WAIT [T]

Data [D/Q]

RST# [P]

P33-65nm

Datasheet Jul 2011

56 Order Number: 208034-04

Note: WAIT shown deasserted and High-Z per OE# deassertion during write operation (RCR 10=0, WAIT asserted low). Clock is

ignored during write operation.

Figure 25: Write-to-Asynchronous Read Timing

Figure 26: Synchronous Read-to-Write Timing

D Q

W7W4

R17R15

W14

W18W3W3

R10W6W2

R1R1W8W5

Address [A]

ADV# [V]

CE# [E]

WE# [W]

OE# [G ]

WAIT [T]

Data [D/Q]

RST# [P]

Latency Count

Q D D

W7R305

R304

R312R307R16

W15

W22

W21

W9W3

W22

W21

W3W2

R11

R13

R11

R303

R104R104

R106

R102

R105R105

W18

R101

R306

R302

R301

CLK [C ]

Address [ A]

ADV# [V]

CE# [E]

OE# [G]

WE#[ W]

WAIT [T]

Data [ D/Q]

Datasheet Jul 2011

57 Order Number:208034-04

P33-65nm SBC

Note: WAIT shown deasserted and High-Z per OE# deassertion during write operation (RCR.10=0, WAIT asserted low).

Figure 27: Write-to-Synchronous Read Timing

Latency Count

D Q Q

R304

R305R304

R307R15

W20

W19

W18

W3W3

R11

R303

R11

R104

R106

R104

R306W8W5

R302

R301

CLK[C ]

Address [A]

ADV#[V]

CE# [ E]

WE# [W ]

OE# [G]

WAIT [T ]

Data [D /Q]

RST# [ P]

P33-65nm

Datasheet Jul 2011

58 Order Number: 208034-04

15.5 Program and Erase Characteristics

Table 26: Program and Erase Specifications

Num Symbol Parameter

VPPL VPPH

Unit Note

Min Typ Max Min Typ Max

Conventional Word Programming

W200 tPROG/W

Program

Time Single word - 40 175 - 40 175 µs 1

Buffered Programming

W250 tPROG/

Buffer

Program

Time

Aligned 16-Wd, BP time

(32 Words) - 70 200 - 70 200

µs 1

Aligned 32-Wd, BP time

(32 Word) - 85 200 - 85 200

one full buffer (256

Words) - 284 1280 - 160 800

Buffered Enhanced Factory Programming

W451 tBEFP/B Program

Single byte N/A N/A N/A - 0.31 -

µs

1,2

W452 tBEFP/Setup BEFP Setup N/A N/A N/A 10 - - 1

Erase and Suspend

W500 tERS/PB Erase Time

32-KByte Parameter - 0.4 2.5 - 0.4 2.5

W501 tERS/MB 128-KByte Main - 0.5 4.0 - 0.5 4.0

W600 tSUSP/P

Suspend

Latency

Program suspend - 20 25 - 20 25

µsW601 tSUSP/E Erase suspend - 20 25 - 20 25

W602 tERS/SUSP Erase to Suspend - 500 - - 500 - 1,3

blank check

W702 tBC/MB blank check Main Array Block - 3.2 - - 3.2 - ms -

Notes:

1. Typical values measured at TC = +25 °C and nominal voltages. Performance numbers are valid for all speed versions.

Excludes system overhead. Sampled, but not 100% tested.

2. Averaged over entire device.

3. W602 is the typical time between an initial block erase or erase resume command and the a subsequent erase suspend

command. Violating the specification repeatedly during any particular block erase may cause erase failures.

Datasheet Jul 2011

59 Order Number:208034-04

P33-65nm SBC

16.0 Ordering Information

Note: The last digit is randomly assigned to cover packing media and/or features or other specific configuration. For

further information on ordering products or for product part numbers, go to:

http://www.micron.com/partscatalog.html?categoryPath=products/nor_flash/parallel_nor_flash

Figure 28: Decoder for P33-65nm (SBC) Products

F 1 2 P 3 3 B8S 2J 8

Product Line Designator

28F = Numonyx

Flash Memory

Package Designator

JS = 56- Lead TSOP, lead-free

RC = 64-Ball Easy BGA, leaded

PC = 64 -Ball Easy BGA, lead-free

Device Density

128 = 128-Mbit

Product Family

P 33 = Numonyx

Flash Memory (P33)

= 2. 3– 3. 6V

CCQ

= 2. 3 – 3. 6 V

Device Details

65 nm lithography

Parameter Location

B = Bottom Parameter

T = Top Parameter

640 = 64 - Mbit

7 0

Speed

60ns

70ns

Device Features*

Table 27: Valid Combinations for Discrete Products

64-Mbit 128-Mbit

RC28F640P33TF60* RC28F128P33TF60*

RC28F640P33BF60* RC28F128P33BF60*

PC28F640P33TF60* PC28F128P33TF60*

PC28F640P33BF60* PC28F128P33BF60*

JS28F640P33TF70* JS28F128P33TF70*

JS28F640P33BF70* JS28F128P33BF70*

P33-65nm

Datasheet Jul 2011

60 Order Number: 208034-04

Appendix A Supplemental Reference Information

A.1 Common Flash Interface

The Common Flash Interface (CFI) is part of an overall specification for multiple

command-set and control-interface descriptions. This appendix describes the database

structure containing the data returned by a read operation after issuing the Read CFI

command (see Section 6.2, “Device Command Bus Cycles” on page 18). System

software can parse this database structure to obtain information about the flash device,

such as block size, density, bus width, and electrical specifications. The system

software will then know which command set(s) to use to properly perform flash writes,

block erases, reads and otherwise control the flash device.

A.1.1 Query Structure Output

The Query database allows system software to obtain information for controlling the

flash device. This section describes the device’s CFI-compliant interface that allows

access to Query data.

Query data are presented on the lowest-order data outputs (DQ

7-0

) only. The numerical

offset value is the address relative to the maximum bus width supported by the device.

On this family of devices, the Query table device starting address is a 10h, which is a

word address for x16 devices.

For a word-wide (x16) device, the first two Query-structure bytes, ASCII “Q” and “R,”

appear on the low byte at word addresses 10h and 11h. This CFI-compliant device

outputs 00h data on upper bytes. The device outputs ASCII “Q” in the low byte (DQ

7-0

)

and 00h in the high byte (DQ

15-8

At Query addresses containing two or more bytes of information, the least significant

data byte is presented at the lower address, and the most significant data byte is

presented at the higher address.

In all of the following tables, addresses and data are represented in hexadecimal

notation, so the “h” suffix has been dropped. In addition, since the upper byte of word-

wide devices is always “00h,” the leading “00” has been dropped from the table

notation and only the lower byte value is shown. Any x16 device outputs have 00h on

the upper byte in this mode.

Table 28: Summary of Query Structure Output as a Function of Device and Mode

Device Hex

Offset

Hex

Code

ASCII

alue

00010: 51 "Q"

Device Addresses 00011: 52 "R"

00012: 59 "Y"

Datasheet Jul 2011

61 Order Number:208034-04

P33-65nm SBC

Table 29: Example of Query Structure Output of x16 Devices

A.1.2 Query Structure Overview

The Query command causes the flash component to display the Common Flash Interface (CFI)

Query structure or database. Ta b l e 3 0 summarizes the structure sub-sections and address

locations.

Table 30: Query Structure

Note:

1. Refer to the Query Structure Output section and offset 28h for the detailed definition of offset address as a function of

device bus width and mode.

2. BA = Block Address beginning location (i.e., 08000h is block 1’s beginning location when the block size is 32-KWord).

3. Offset 15 defines “P” which points to the Primary Numonyx-specific Extended Query Table.

A.1.3 Read CFI Identification String

The Identification String provides verification that the component supports the

Common Flash Interface specification. It also indicates the specification version and

supported vendor-specified command set(s).

Offset Hex Code Value

AX-A1D15-D0

00010h 0051 “Q”

00011h 0052 “R”

00012h 0059 “Y”

00013h P_IDLO PrVendor ID#

00014h P_IDHI

00015h PLO PrVendor TblAdr

00016h PHI

00017h A_IDLO AltVendor ID#

00018h A_IDHI

... ... ...

00001-Fh Reserved Reserved for vendor-specific information

00010h CFI query identification string Command set ID and vendor data offset

0001Bh System interface information Device timing & voltage information

00027h Device geometry definition Flash device layout

(3)

Primary Numonyx-specific Extended Query Vendor-defined additional information specific

to the Primary Vendor Algorithm

P33-65nm

Datasheet Jul 2011

62 Order Number: 208034-04

Table 31: CFI Identification

Offset Length Description Add. Hex

Code Value

10h 3

Query-unique ASCII string “QRY”

10:

11:

12:

-51

-52

-59

“Q”

“R”

“Y”

13h 2

Primary vendor command set and control interface ID code.

16-bit ID code for vendor-specified algorithms

13:

14:

-01

-00

15h 2

Extended Query Table primary algorithm address

15:

16:

-0A

-01

17h 2

Alternate vendor command set and control interface ID code.

0000h means no second vendor-specified algorithm exists

17:

18:

-00

19h 2

Secondary algorithm Extended Query Table address.

0000h means none exists

19:

1A:

-00

Datasheet Jul 2011

63 Order Number:208034-04

P33-65nm SBC

Table 32: System Interface Information

Offset Length Description Add Hex

Code Value

1Bh 1

VCC logic supply minimum program/erase voltage

bits 0-3 BCD 100 mV

bits 4-7 BCD volts

1B: -23 2.3V

1Ch 1

VCC logic supply maximum program/erase voltage

bits 0-3 BCD 100 mV

bits 4-7 BCD volts

1C: -36 3.6V

1Dh 1

VPP [programming] supply minimum program/erase voltage

bits 0-3 BCD 100 mV

bits 4-7 HEX volts

1D: -85 8.5V

1Eh 1

VPP [programming] supply maximum program/erase voltage

bits 0-3 BCD 100 mV

bits 4-7 HEX volts

1E: -95 9.5V

1Fh 1 “n” such that typical single word program time-out = 2n

-sec 1F: -06 64

µs

20h 1 “n” such that typical full buffer write time-out = 2n

-sec 20: -09 512

µs

21h 1 “n” such that typical block erase time-out = 2n m-sec 21: -09 0.5s

22h 1 “n” such that typical full chip erase time-out = 2n m-sec 22: -00 NA

23h 1 “n” such that maximum word program time-out = 2n times

typical 23: -02 256

µs

24h 1 “n” such that maximum buffer write time-out = 2n times

typical 24: -02 2048

µs

25h 1 “n” such that maximum block erase time-out = 2n times

typical 25: -03 4s

26h 1 “n” such that maximum chip erase time-out = 2n times typical 26: -00 NA

P33-65nm

Datasheet Jul 2011

64 Order Number: 208034-04

A.1.4 Device Geometry Definition

Table 33: Device Geometry Definition

Offset Length Description Add Hex

Code Value

27h 1 “n” such that device size = 2n in number of bytes 27: See Table Below

28h 2

Flash device interface code assignment:

"n" such that n+1 specifies the bit field that represents the flash device width

capabilities as described in the table:

76543210

_ _ _ _ x64 x32 x16 x8 28: -01 x16

15 14 13 12 11 10 9 8

________29:-00

2Ah 2 “n” such that maximum number of bytes in write buffer = 2n2A: -09 512

2B: -00

2Ch 1

Number of erase block regions (x) within device:

1. x = 0 means no erase blocking; the device erases in bulk

2. x specifies the number of device regions with one or more contiguous

same-size erase blocks.

3. Symmetrically blocked partitions have one blocking region

2C: See Table Below

2D 4

Erase Block Region 1 Information

bits 0-15 = y, y+1 = number of identical-size erase blocks

bits 16-31 = z, region erase block(s) size are z x 256 bytes

2D:

See Table Below

2E:

2F:

30:

31h 4

Erase Block Region 2 Information

bits 0-15 = y, y+1 = number of identical-size erase blocks

bits 16-31 = z, region erase block(s) size are z x 256 bytes

31:

See Table Below

32:

33:

34:

35h 4 Reserved for future erase block region information

35:

See Table Below

36:

37:

38:

Address

64-Mbit 128-Mbit

Address

64-Mbit 128-Mbit

-B -T -B -T -B -T -B -T

27: -17 -17 -18 -18 30: -00 -02 -00 -02

28: -01 -01 -01 -01 31: -3E -03 -7E -03

29: -00 -00 -00 -00 32: -00 -00 -00 -00

2A -09 -09 -09 -09 33: -00 -80 -00 -80

2B -00 -00 -00 -00 34: -02 -00 -02 -00

2C: -02 -02 -02 -02 35: -00 -00 -00 -00

2D: -03 -3E -03 -7E 36: -00 -00 -00 -00

2E: -00 -00 -00 -00 37: -00 -00 -00 -00

2F: -80 -00 -80 -00 38: -00 -00 -00 -00

Datasheet Jul 2011

65 Order Number:208034-04

P33-65nm SBC

A.1.5 Numonyx-Specific Extended Query Table

Table 34: Primary Vendor-Specific Extended Query:

Offset

P=10Ah Length Description

(Optional flash features and commands) Add. Hex

Code Value

(P+0)h

3Primary extended query table

Unique ASCII string “PRI”

10A: -50 “P”

(P+1)h 10B: -52 “R”

(P+2)h 10C: -49 “I”

(P+3)h 1 Major version number, ASCII 10D: -31 “1”

(P+4)h 1 Minor version number, ASCII 10E: -35 “5”

(P+5)h 4 Optional feature and command support (1=yes, 0=no) 10F: -E6

(P+6)h bits 10-31 are reserved; undefined bits are “0”. If bit 31 110(1):-01

(P+7)h “1”then another 31 bit field of Optional features follows at 111: -00

(P+8)h the end of the bit-30 field. 112: -00

bit 0 Chip erase supported bit 0 = 0 No

bit 1 Suspend erase supported bit 1 = 1 Yes

bit 2 Suspend program supported bit 2 = 1 Yes

bit 3 Legacy lock/unlock supported bit 3 = 0 No

bit 4 Queued erase supported bit 4 = 0 No

bit 5 Instant individual block locking supported bit 5 = 1 Yes

bit 6 Protection bits supported bit 6 = 1 Yes

bit 7 Pagemode read supported bit 7 = 1 Yes

bit 8 Synchronous read supported

TSOP bit 8 = 0 No

BGA bit 8 = 1 Yes

bit 9 Simultaneous operations supported bit 9 = 0 No

bit 10 Extended Flash Array Blocks supported bit 10 = 0 No

bit 11 Permanent Block Locking of up to Full Main Array supported bit 11 = 0 No

bit 12 Permanent Block Locking of up to Partial Main Array supported bit 12 = 0 No

bit 30 CFI Link(s) to follow bit 30 = 0 No

bit 31 Another "Optional Features" field to follow bit 31 = 0 No

(P+9)h 1

Supported functions after suspend: read Array, Status, Query

Other supported operations are:

bits 1-7 reserved; undefined bits are “0”

113: -01

bit 0 Program supported after erase suspend bit 0 = 1 Yes

(P+A)h 2 Block Status Register mask 114: -03

(P+B)h bits 2-15 are Reserved; undefined bits are “0” 115: -00

bit 0 Block Lock-Bit Status Register active bit 0 = 1 Yes

bit 1 Block Lock-Down Bit Status active bit 1 = 1 Yes

bit 4 EFA Block Lock-Bit Status Register active bit 4 = 0 No

P33-65nm

Datasheet Jul 2011

66 Order Number: 208034-04

Note:

1. Address 0x110 for TSOP: -00; Address 0x110 for BGA: -01.

Table 35: OTP Register Information

bit 5 EFA Block Lock-Down Bit Status active bit 5 = 0 No

(P+C)h 1

VCC logic supply highest performance program/erase voltage

bits 0-3 BCD value in 100 mV

bits 4-7 BCD value in volts

116: -30 3.0V

(P+D)h 1

VPP optimum program/erase supply voltage

bits 0-3 BCD value in 100 mV

bits 4-7 HEX value in volts

117: -90 9.0V

Offset(1)

P=10Ah Length Description

(Optional flash features and commands) Add. Hex

Code Value

(P+E)h 1 Number of Protection register fields in JEDEC ID space.

“00h,” indicates that 256 protection fields are available 118: -02 2

(P+F)h

(P+10)h

(P+11)h

(P+12)h

Protection Field 1: Protection Description

This field describes user-available One Time Programmable

(OTP) Protection register bytes. Some are pre-programmed

with device-unique serial numbers. Others are user

programmable. Bits 0–15 point to the Protection register Lock

byte, the section’s first byte. The following bytes are factory

pre-programmed and user-programmable.

bits 0–7 = Lock/bytes Jedec-plane physical low address

bits 8–15 = Lock/bytes Jedec-plane physical high address

bits 16–23 = “n” such that 2n = factory pre-programmed bytes

bits 24–31 = “n” such that 2n = user programmable bytes

119:

11A:

11B:

11C:

-80

-00

-03

80h

00h

8 byte

(P+13)h

(P+14)h

(P+15)h

(P+16)h

(P+17)h

(P+18)h

(P+19)h

(P+1A)h

(P+1B)h

(P+1C)h

Protection Field 2: Protection Description

Bits 0–31 point to the Protection register physical Lock-word

address in the Jedec-plane.

Following bytes are factory or user-programmable.

11D:

11E:

11F:

120:

-89

-00

89h

00h

bits 32–39 = “n” such that n = factory pgm'd groups (low byte)

bits 40–47 = “n” such that n = factory pgm'd groups (high

byte)

bits 48–55 = “n” \ 2n = factory programmable bytes/group

121:

122:

123:

-00

bits 56–63 = “n” such that n = user pgm'd groups (low byte)

bits 64–71 = “n” such that n = user pgm'd groups (high byte)

bits 72–79 = “n” such that 2n = user programmable bytes/

group

124:

125:

126:

-10

-00

-04

Offset

P=10Ah Length Description

(Optional flash features and commands) Add. Hex

Code Value

Datasheet Jul 2011

67 Order Number:208034-04

P33-65nm SBC

Table 37: Partition and Erase Block Region Information

Table 36: Burst Read Information

Offset

P=10Ah Length Description

(Optional flash features and commands) Add. Hex

Code Value

(P+1D)h 1

Page Mode Read capability

bits 0-7 = “n” such that 2n HEX value represents the number

of read-page bytes. See offset 28h for device word width to

determine page-mode data output width. 00h indicates no

read page buffer.

127: -04 16 Byte

(P+1E)h 1 Number of synchronous mode read configuration fields that

follow. 00h indicates no burst capability. 128: -04 4

(P+1F)h 1

Synchronous mode read capability configuration 1

Bits 3-7 = Reserved

bits 0-2 “n” such that 2n+1 HEX value represents the

maximum number of continuous synchronous reads when

the device is configured for its maximum word width. A value

of 07h indicates that the device is capable of continuous

linear bursts that will output data until the internal burst

counter reaches the end of the device’s burstable address

space. This field’s 3-bit value can be written directly to the

Read Configuration Register bits 0-2 if the device is

configured for its maximum word width. See offset 28h for

word width to determine the burst data output width.

129: -01 4

(P+20)h 1 Synchronous mode read capability configuration 2 12A: -02 8

(P+21)h 1 Synchronous mode read capability configuration 3 12B: -03 16

(P+22)h 1 Synchronous mode read capability configuration 4 12C: -07 Cont

Offset

(1)

See table be low

P = 10Ah Description Address

Bottom Top (Optional flash features and commands) Len Bot Top

(P+23)h (P+23)h

112D:12D:Number of device hardw are-partition regions w ithin the device.

x = 0: a single hardw are partition device (no fields follow ).

x specifies the number of device partition regions containing

one or more contiguous erase block regions.

P33-65nm

Datasheet Jul 2011

68 Order Number: 208034-04

Table 38: Partition Region 1 Information (Sheet 1 of 2)

Off s e t

(1)

See table below

P = 10Ah Description Address

Bottom Top (Optional flash features and commands) Len Bot Top

(P+24)h (P+24)h Data size of this Parition Region Inf ormation f ield 2 12E: 12E

(P+25)h (P+25)h (# addressable locations, including this field) 12F 12F

(P+26)h (P+26)h Number of identical partitions w ithin the partition region 2 130: 130:

(P+27)h (P+27)h 131: 131:

(P+28)h (P+28)h 1 132: 132:

(P+29)h (P+29)h 1 133: 133:

(P+2A)h (P+2A)h 1 134: 134:

(P+2B)h (P+2B)h 1 135: 135:Types of erase block regions in this Partition Region.

x = 0 = no erase blocking; the Partition Region erases in bulk

x = number of erase block regions w / contiguous same-size

erase blocks. Symmetrically blocked partitions have one

blocking region. Partition size = (Type 1 blocks)x(Type 1

block sizes) + (Type 2 blocks)x(Type 2 block sizes) +…+

(Type n blocks)x(Type n block sizes)

Number of program or erase operations allow ed in a partition

bits 0–3 = number of simultaneous Program operations

bits 4–7 = number of simultaneous Erase operations

Simultaneous program or erase operations allow ed in other partitions w hile a

partition in this region is in Program mode

bits 0–3 = number of simultaneous Program operations

bits 4–7 = number of simultaneous Erase operations

Simultaneous program or erase operations allow ed in other partitions w hile a

partition in this region is in Erase mode

bits 0–3 = number of simultaneous Program operations

bits 4–7 = number of simultaneous Erase operations

Datasheet Jul 2011

69 Order Number:208034-04

P33-65nm SBC

Table 39: Partition Region 1 Information (Sheet 2 of 2)

Offset

(1)

See table below

P = 10Ah Description Address

Bottom Top (Optional flash features and commands) Len

Bot Top

(P+2C)h (P+2C)h Partition Region 1 Erase Block Type 1 Information 4 136: 136:

(P+2D)h (P+2D)h bits 0–15 = y, y+1 = # identical-size erase blks in a partition 137: 137:

(P+2E)h (P+2E)h bits 16–31 = z, region erase block(s) size are z x 256 bytes 138: 138:

(P+2F)h (P+2F)h 139: 139:

(P+30)h (P+30)h Partition 1 (Erase Block Type 1) 2 13A: 13A:

(P+31)h (P+31)h Block erase cycles x 1000 13B: 13B:

(P+32)h (P+32)h 1 13C: 13C:

(P+33)h (P+33)h 1 13D: 13D:

Partition Region 1 (Erase Block Type 1) Programming Region Inf ormation 6

(P+34)h (P+34)h bits 0–7 = x, 2^x = Programming Region aligned size (bytes) 13E: 13E:

(P+35)h (P+35)h bits 8–14 = Reserved; bit 15 = Legacy flash operation (ignore 0:7) 13F: 13F:

(P+36)h (P+36)h bits 16–23 = y = Control Mode valid size in bytes 140: 140:

(P+37)h (P+37)h bits 24-31 = Reserved 141: 141:

(P+38)h (P+38)h bits 32-39 = z = Control Mode invalid size in bytes 142: 142:

(P+39)h (P+39)h bits 40-46 = Reserved; bit 47 = Legacy flash operation (ignore 23:16 & 39:32) 143: 143:

(P+3A)h (P+3A)h Partition Region 1 Erase Block Type 2 Information 4 144: 144:

(P+3B)h (P+3B)h bits 0–15 = y, y+1 = # identical-size erase blks in a partition 145: 145:

(P+3C)h (P+3C)h bits 16–31 = z, region erase block(s) size are z x 256 bytes 146: 146:

(P+3D)h (P+3D)h 147: 147:

(P+3E)h (P+3E)h Partition 1 (Erase Block Type 2) 2 148: 148:

(P+3F)h (P+3F)h Block erase cycles x 1000 149: 149:

(P+40)h (P+40)h 1 14A: 14A:

(P+41)h (P+41)h 1 14B: 14B:

Partition Region 1 (Erase Block Type 2) Programming Region Inf ormation 6

(P+42)h (P+42)h bits 0–7 = x, 2^x = Programming Region aligned size (bytes) 14C: 14C:

(P+43)h (P+43)h bits 8–14 = Reserved; bit 15 = Legacy flash operation (ignore 0:7) 14D: 14D:

(P+44)h (P+44)h bits 16–23 = y = Control Mode valid size in bytes 14E: 14E:

(P+45)h (P+45)h bits 24-31 = Reserved 14F: 14F:

(P+46)h (P+46)h bits 32-39 = z = Control Mode invalid size in bytes 150: 150:

(P+47)h (P+47)h bits 40-46 = Reserved; bit 47 = Legacy flash operation (ignore 23:16 & 39:32) 151: 151:

Partition 1 (erase block Type 2) bits per cell; internal EDAC

bits 0–3 = bits per cell in erase region

bit 4 = internal EDAC used (1=yes, 0=no)

bits 5–7 = reserve for f uture use

Partition 1 (erase block Type 2) page mode and synchronous mode capabilities

defined in Table 10.

bit 0 = page-mode host reads permitted (1=yes, 0=no)

bit 1 = synchronous host reads permitted (1=yes, 0=no)

bit 2 = synchronous host w rites permitte

Partition 1 (erase block Type 1) page mode and synchronous mode capabilities

defined in Table 10.

bit 0 = page-mode host reads permitted (1=yes, 0=no)

bit 1 = synchronous host reads permitted (1=yes, 0=no)

bit 2 = synchronous host w rites permitted (1=yes, 0=no)

bits 3–7 = reserved for f uture use

Partition 1 (erase block Type 1) bits per cell; internal EDAC

bits 0–3 = bits per cell in erase region

bit 4 = internal EDAC used (1=yes, 0=no)

bits 5–7 = reserve for f uture use

P33-65nm

Datasheet Jul 2011

70 Order Number: 208034-04

Table 40: Partition and Erase Block Region Information

Add

64-Mbit 128-Mbit

-B -T -B -T

12D: -01 -01 -01 -01

12E: -24 -24 -24 -24

12F: -00 -00 -00 -00

130: -01 -01 -01 -01

131: -00 -00 -00 -00

132: -11 -11 -11 -11

133: -00 -00 -00 -00

134: -00 -00 -00 -00

135: -02 -02 -02 -02

136: -03 -3E -03 -7E

137: -00 -00 -00 -00

138: -80 -00 -80 -00

139: -00 -02 -00 -02

13A: -64 -64 -64 -64

13B: -00 -00 -00 -00

13C: -02 -02 -02 -02

13D: -03 -03 -03 -03

13E: -00 -00 -00 -00

13F: -80 -80 -80 -80

140: -00 -00 -00 -00

141: -00 -00 -00 -00

142 -00 -00 -00 -00

143: -80 -80 -80 -80

144: -3E -03 -7E -03

145: -00 -00 -00 -00

146: -00 -80 -00 -80

147: -02 -00 -02 -00

148: -64 -64 -64 -64

149: -00 -00 -00 -00

14A: -02 -02 -02 -02

14B: -03 -03 -03 -03

14C: -00 -00 -00 -00

14D: -80 -80 -80 -80

14E: -00 -00 -00 -00

14F: -00 -00 -00 -00

150: -00 -00 -00 -00

151: -80 -80 -80 -80

Datasheet Jul 2011

71 Order Number:208034-04

P33-65nm SBC

Table 41: CFI Link Information

Length Description

(Optional flash features and commands) Add. Hex

Code Value

CFI Link Field bit definitions

Bits 0-9 = Address offset (within 32Mbit segment) of referenced CFI table

Bits 10-27 = nth 32Mbit segment of referenced CFI table

Bits 28-30 = Memory Type

Bit 31 = Another CFI Link field immediately follows

152:

153:

154:

155:

-FF

CFI Link Field Quantity Subfield definitions

Bits 0-3 = Quantity field (n such that n+1 equals quantity)

Bit 4 = Table & Die relative location

Bit 5 = Link Field & Table relative location

Bits 6-7 = Reserved

156: -FF

P33-65nm

Datasheet Jul 2011

72 Order Number: 208034-04

A.2 Flowcharts

Figure 29: Word Program Flowchart

Start

Data Cycle

- Address = location to program

- Data = Data to program

Yes

D7 = '1'

End

No Suspend

Yes Errors

Yes

Error-Handler

User Defined Routine

Read Status Register

- Toggle CE# or OE# to update Status Register

- See Status Register Flowchart

Program Suspend

See Suspend/

Resume Flowchart

Command Cycle

-Issue Program Command

- Address = location to program

- Data = 0x40

Check Ready Status

- Read Status Register Command not required

- Perform read operation

- Read Ready Status on signal D7

Datasheet Jul 2011

73 Order Number:208034-04

P33-65nm SBC

Figure 30: Program Suspend/Resume Flowchart

Read Status

SR.7 =

SR.2 =

Read Array

Data

Program

Completed

Done

Reading

Program

Resumed

Read Array

Data

Yes

PROGRAM SUSPEND /RESUME PROCEDURE

Write Program

Resume

Dat a = D0 h

A ddr = S uspended bl ock ( B A)

Bus

Operation Command Comments

Write Program

Suspend

Dat a = B0h

A ddr = X

Standby

Check SR.7

1 = WSM ready

0 = WSM busy

Standby

Check SR.2

1 = P rogram suspended

0 = P rogram compl eted

Write Read

Array

Dat a = FF h

Addr = Block address to read (BA)

Read Read array data from block other than

the one being programmed

Read

Status register data

Initiate a read cycle to update Status

A ddr = S uspended bl ock ( B A)

PGM_SUS.WMF

Start

Write B0h

Any Address

Program Suspend

Read Status

Write 70 h

Write FFh

Any Address

Read Array

Write D0h

Any Address

Program Resume

Write FFh

Read Array

Write Read

Status

Dat a = 70h

Addr = Block to suspend (BA)

Write 70h

Any Address

Read Status

Any Address

P33-65nm

Datasheet Jul 2011

74 Order Number: 208034-04

Figure 31: Erase Suspend/Resume Flowchart

Erase

Completed

Read Array

Data

Rea d

Program

Loop

Read Array

Data

Start

Read Status

SR[7] =

SR[6] =

Erase

Resumed

(1 )

Read or

Program ?

Done

Write

Idle

Write

Erase

Suspend

Rea d Array

or Program

None

Erase

Resume

Data = 0 xB0

Addr = Any device address

Data = 0xFF or 0x40

Addr = Any address within the

suspended devi ce

Check SR[7]:

1 = WSM ready

0 = WSM busy

Check SR[6]:

1 = Erase suspended

0 = Erase completed

Data = 0 xD0

Addr = Any device address

Bus

Operation Command Comments

Read None Status Register data .

Addr = Any device address

Read or

Write None Read array or program data from / to

block other than the one being erased

ERASE SUSPEND / RESUME PROCEDURE

If the suspended par tition was placed in

Read Array mode or a Program Loop :

Write 0xB0,

Any device

address

(Erase Suspend)

Write 0x70,

Any device Address

(Read Status)

Write 0xD0,

Any Address

(Erase Resume)

Write 0x70,

Any device

Address

(Read Status)

Write 0xFF,

Any device

Address

(Read Array)

Write Read

Status

Data = 0 x70

Addr = Any device address

Yes

Write

Read

Status

Return devi ce to Status mode :

Data = 0x70

Addr = Any device Address

Note :

1. The t

ERS/SUSP

timing between the ini tial block erase or erase

resume command and a subsequent erase suspend command

should be followed .

Datasheet Jul 2011

75 Order Number:208034-04

P33-65nm SBC

Figure 32: Buffer Program Flowchart

Start

Get Next

Target Address

Issue Write to Buffer

Command E8h

Block Address

Read Status Register

Block Address

(note 7)

Is WSM Ready?

SR. 7 =

1 = Yes

Device

Supports Buffer

Writes?

Set Timeout or

Loop Counter

Timeout

or Count

Expired ?

Write Confirm D0h

Block Address

Another Buffered

Programming?

Yes

Write Buffer Data

Start Address

X = 0

Yes

0=No

Yes

Use Single Word

Programming

Abort Bufferred

Program?

X = N?

Write Buffer Data

Address within buffer range

X = X + 1

Write to another

Block Address

Buffered Program

Aborted

YesYes

Write Word Count

Block Address

Notes:

1. Word count values on DQ

-DQ

are loaded into the Count

2. The device outputs the Status Register when read.

3. Write Buffer contents will be programmed at the device start

address or destination flash address.

4. Align the start address on a Write Buffer boundary for

maximum programming performance (i.e., A

-A

of the start

address =0).

5. The device aborts the Buffered Program command if the

current address is outside the original block address.

6. The Status register indicates an “improper command

Sequence” if the Buffered Program command is aborted.

Follow this with a Clear Status Register command.

The device defaults to output SR data after the Buffered

Programming Setup Command (E8h) is issued. CE# or OE#

must be be toggled to update Status Register. Don’t issue the

Read SR command (70h), which would be interpreted by the

internalstate machine as Buffer Word Count.

8. Full status check can be done after all erase and write

sequences complete. Write FFh after the last operation to

reset the device to read array mode.

Bus

Operation

Standby

Read

Command

Write Write to

Buffer

Read

(Note 7)

Standby

Comments

Check SR.7

1 = WSM Ready

0 = WSM Busy

Status register Data

CE# and OE# low updates SR

Addr = Block Address

Dat a = E8H

Addr = Block Address

SR. 7 = Valid

Addr = Block Address

Check SR.7

1 = Device WSM is Busy

0 = Device WSM is Ready

Write Program

Confirm

Dat a = D0H

Addr = Block Address

Write

( Notes 1, 2)

Data = N- 1 = Word Count

N = 0 corresponds to count = 1

Addr = Block Address

Write

( Notes 3, 4)

Data = Write Buffer Data

Addr = Start Address

Write

( Notes 5, 6)

Data = Write Buffer Data

Addr = Addresswithin buffer rang

Suspend

Program

Loop

Read Status Register

SR. 7 =?

Full Status

Check if Desired

Program Complete

Suspend

Program

Yes

Clear Status Register

50h

Address within Device

Yes

P33-65nm

Datasheet Jul 2011

76 Order Number: 208034-04

Figure 33: BEFP Flowchart

SR Error Handler

(User-Defined)

BEFP

Setup

Delay

Yes (SR.7=0)

Issue BEFP Setup Cmd

(Data = 0x80)

Issue BEFP Confirm Cmd

(Data = 00D0h)

Read Status

No (SR.7=1)

Exit

Start

Yes (SR.0=0)

No (SR.0=1)

Write 0xFFFFh outside Block

No (SR.0=1)

Yes (SR.0=0)

Yes

Yes (SR.7=1)

No (SR.7=0)

Finish

Yes

BEFP Setup

Done ?

Full Status

errors

Read Status

Buffer Ready ?

Write Data Word to Buffer

Buffer Full ?

Read Status

Program

Done ?

Program

More Data ?

Program/Verify PhaseSetup Phase Exit Phase

A B

BEFP Exited ?

Read Status

Datasheet Jul 2011

77 Order Number:208034-04

P33-65nm SBC

Figure 34: Block Erase Flowchart

Start

Confirm Cycle

- Issue Confirm command

- Address = Block to be erased

- Data = Erase confirm (0xD0)

Errors

Yes

Error-Handler

User Defined Routine

Check Ready Status

- Read Status Register Command not required

- Perform read operation

- Read Ready Status on signal SR.7

Command Cycle

- Issue Erase command

- Address = Block to be erased

- Data = 0x20

Yes

SR.7 = '1'

End

No Suspend

Yes

Read Status Register

- Toggle CE# or OE# to update Status Register

- See Status Register Flowchart

Erase Suspend

See Suspend/

Resume Flowchart

P33-65nm

Datasheet Jul 2011

78 Order Number: 208034-04

Figure 35: Block Lock Operations Flowchart

Op tion al

Start

Write 60 h

Block Address

Write 90 h

Read Block Lock

Status

Locking

Change ?

Lock Change

Complete

Write 01 ,D0,2Fh

Block Address

Write FFh

Any Address

Yes

Write

( Optional)

Read

( Optional)

Standby

( Optional)

Write

Lock

Setup

Lock,

Unlock, or

Lockdown

Confirm

Read ID

Plane

Block Lock

Status

Read

Array

Data = 60h

Addr = Block to lock/unlock/lock-down (BA)

Data = 01h (Lock block)

D0h (Unlock block)

2Fh (Lockdown block)

Addr = Block to lock/unlock/lock-down (BA)

Data = 90h

Addr = Block address offset +2 (BA+2)

Block Lock status data

Addr = Block address offset +2 (BA+2)

Confirm locking change on DQ

, DQ

(See Block Locking State Transitions Table

for valid combinations.)

Data = FFh

Addr = Block address (BA)

Bus

Operation Command Comments

LOCKING OPERATIONS PROCEDURE

LOCK_OP.WMF

Lock Confirm

Lock Setup

Read ID Plane

Read Array

Datasheet Jul 2011

79 Order Number:208034-04

P33-65nm SBC

Figure 36: OTP Register Programming Flowchart

Start

Confirm Data

- Write OTP Address and Data

Yes

SR.7 = '1'

End

Read Status Register

- Toggle CE# or OE# to update Status Register

- See Status Register Flowchart

OTP Program Setup

- Write 0xC0

- OTP Address

Check Ready Status

- Read Status Register Command not required

- Perform read operation

- Read Ready Status on signal SR.7

P33-65nm

Datasheet Jul 2011

80 Order Number: 208034-04

Figure 37: Status Register Flowchart

Start

SR7 = '1'

SR2 = '1'

SR4 = '1'

SR3 = '1'

SR1 = '1'

Yes

SR6 = '1' Yes

SR5 = '1'

Program Suspend

See Suspend /Resume Flowchart

Erase Suspend

See Suspend /Resume Flowchart

Error

Command Sequence

Yes

Error

Erase Failure

Error

Program Failure

Error

PEN/PP

< V

PENLK/PPLK

Error

Block Locked

-Set by WSM

- Reset by user

- See Clear Status

- Set/Reset

by WSM

SR4 = '1' Yes

End

Command Cycle

-Issue Status Register Command

- Address = any device address

- Data = 0x70

Data Cycle

-Read Status Register SR[7:0]

Datasheet Jul 2011

81 Order Number:208034-04

P33-65nm SBC

A.3 Write State Machine

Show here are the command state transitions (Next State Table) based on incoming

commands. Only one partition can be actively programming or erasing at a time. Each

partition stays in its last read state (Read Array, Read Device ID, Read CFI or Read

Status Register) until a new command changes it. The next WSM state does not depend

on the partition’s output state.

Note: IS refers to Illegal State in the Next State Tables.

Table 42: Next State Table for P3x-65nm (Sheet 1 of 3)

Command Input and Resulting Chip Next State(1)

Current Chip State

Array Read (3)

Word Pgm Setup (4,9)

BP Setup (8)

EFI Command Setup

Erase Setup (4,9)

BEFP Setup (6)

Confirm (7)

Pgm/Ers Suspend

Read Status

Clear SR (5)

Read ID/Query

Lock/RCR/ECR Setup

Blank Check

OTP Setup

Lock Blk Confirm (7)

Lock-down Blk Confirm (7)

Write ECR/RCR Confirm (7)

Block Address Change

Other Commands (2)

WSM Operation Completes

(FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) (90h,

98h) (60h) (BCh) (C0h) (01h) (2Fh) (03h,

04h) other

Ready

Program

Setup

BP Setup

EFI

Setup

Erase

Setup

BEFP

Setup

Ready

Lock/RCR

/ECR Setup

Setup

OTP

Setup

Ready

N/A

Ready

N/A

Lock/RCR/ECR Setup Ready (Lock

Error [Botch])

Ready (Unlock

Block)

Ready (Lock Error [Botch])

Ready

(Lock

Error

[Botc

h])

Ready

(Lock

Block

)

Ready

(Lock

down

Block

)

Ready

(Set

CR)

N/A Ready (Lock Error

[Botch]) N/A

OTP

Setup OTP Busy OTP Busy N/A OTP Busy N/A

Busy OTP

Busy

IS in

OTP

Busy

OTP Busy IS in OTP

Busy OTP Busy Illegal State in OTP

Busy OTP Busy N/A OTP Busy Ready

IS in OTP Busy OTP Busy OTP Busy

Word

Program

Setup Word Program Busy N/A Pgm Busy N/A

Busy Pgm

Busy

IS in

Pgm

Busy

Pgm Busy IS in Pgm

Busy

Pgm

Busy

Pgm

Susp Word Pgm Busy IS in Word Pgm

Busy Word Pgm Busy N/A Pgm Busy Ready

IS in Pgm Busy Word Pgm Busy

Suspend Pgm

Susp

IS in

Pgm

Susp

Pgm

Suspend

IS in Pgm

Susp

Pgm

Busy Pgm Susp

Pgm

Susp

(Er

bits

clear)

Word

Pgm

Susp

Illegal State in Pgm

Suspend

Word Program

Suspend N/A Word Pgm Susp

N/A

IS in Pgm

Suspend Word Program Suspend

EFI

EFI Setup Sub-function Setup

N/A

Sub-function

Setup Sub-op-code Load 1

Sub-op-code

Load 1 Sub-function Load 2 if word count >0, else Sub-function confirm

Sub-function

Load 2 Sub-function Confirm if data load in program buffer is complete, ELSE Sub-function Load 2

Sub-function

Confirm Ready (Error [Botch]) S-fn

Busy Ready (Error [Botch])

Sub-function

Busy

S-fn

Busy

IS in

S-fn

Busy

S-fn Busy Illegal State

in S-fn Busy

S-fn

Busy

S-fn

Susp S-fn Busy IS in S-fn Busy S-fn Busy S-fn Busy

Ready

IS in Sub-

function Busy Sub-function Busy

Sub-function

Susp

S-fn

Susp

IS in

S-fn

Susp

Sub-function Illegal State

in S-fn Busy

S-fn

Busy

S-fn

Suspend

S-fn

Susp

(Er

bits

clear)

S-fn

Susp IS in S-fn Susp S-fn Suspend N/A S-fn Susp N/A

IS in S-fn Susp Sub-function Suspend

P33-65nm

Datasheet Jul 2011

82 Order Number: 208034-04

Buffer

Pgm

(BP)

Setup BP Load 1

N/A

BP Load 1

(8)

BP Load 2 if word count >0, else BP confirm

BP Load 2

(8)

BP Confirm if data load in program buffer is complete, ELSE BP load 2

Ready

(Error

[Botc

h])

BP Confirm if data

load in program

buffer is

complete, else BP

load 2

BP Confirm Ready (Error [Botch]) BP

Busy Ready (Error [Botch])

BP Busy BP

Busy

IS in

Busy

BP Busy Illegal State

in BP Busy

Busy

Susp BP Busy IS in BP Busy BP Busy BP Busy Ready

IS in BP Busy BP Busy

BP Susp BP

Susp

IS in

Susp

BP Suspend Illegal State

in BP Busy

Busy BP Suspend

Susp

(Er

bits

clear)

Susp IS in BP Susp BP Suspend N/A BP Susp N/A

IS in BP Susp BP Suspend

Erase

Setup Ready (Error [Botch]) Erase

Busy Ready (Error [Botch]) N/A Ready (Err

Botch0])

N/A

Busy Erase

Busy

IS in

Erase

Busy

Erase Busy IS in Erase

Busy

Erase

Busy

Erase

Susp Erase Busy IS in Erase Busy Erase Busy N/A Ers Busy

IS in Erase Busy Erase Busy Ready

Suspend Erase

Susp

Word

Pgm

Setup

Erase

Susp

Setup

Erase

Susp

EFI

Setup

Erase

Susp

IS in Erase

Suspend

Erase

Busy

Erase

Suspend

Erase

Susp

(Er

bits

clear)

Erase

Susp

Lock/

RCR/

ECR

Setup

Erase

Susp

Erase

Susp

IS in

Erase

Susp

Erase Suspend N/A Erase Susp N/A

IS in Erase Susp Erase Suspend

Word

Pgm in

Erase

Suspend

Setup Word Pgm busy in Erase Suspend

N/A

Word Pgm Busy in

Ers Suspend

N/A

Busy

Word

Pgm

busy

Erase

Susp

IS in

Pgm

busy

in Ers

Susp

Word Pgm

busy in

Erase Susp

IS in Word

Pgm busy in

Ers Susp

Word

Pgm

busy

Erase

Susp

Word

Pgm

Susp

in Ers

Susp

Word Pgm busy in

Erase Susp

IS in Word Pgm

busy in Ers Susp

Word Pgm busy in

Erase Susp

Erase

Susp

Illegal state(IS)

in Pgm busy in

Erase Suspend

Word Pgm busy in Erase Suspend

IS in

Ers

Susp

Suspend

Word

Pgm

susp

in Ers

susp

iS in

pgm

susp

in Ers

Susp

Word Pgm

susp in Ers

susp

iS in pgm

susp in Ers

Susp

Word

Pgm

busy

Erase

Susp

Word

Pgm

susp

in Ers

susp

Word

Pgm

susp

in Ers

susp

Word

Pgm

Susp

in Ers

Susp

(Er

bits

clear)

Word

Pgm

susp

in Ers

susp

iS in Word Pgm

susp in Ers Susp

Word Pgm susp in

Ers susp N/A

N/A

Illegal State in

Word Program

Suspend in Erase

Suspend

Word Pgm busy in Erase Suspend

BP in

Erase

Suspend

Setup BP Load 1 in Erase Suspend

N/A

BP Load 1

(8)

BP Load 2 in Erase Suspend if word count >0, else BP confirm

BP Load 2

(8)

BP Confirming Erase Suspend if data load in program buffer is complete, ELSE BP load 2 in Erase Suspend

Ers

Susp

(Error

[Botc

h])

BP Confirm in

Erase Suspend

when count=0,

ELSE BP load 2

BP Confirm Erase Suspend (Error [BotchBP])

Busy

in Ers

Susp

Erase Susp (Error [Botch BP])

BP Busy

Busy

in Ers

Susp

IS in

Busy

in Ers

Susp

BP Busy in

Erase Susp

Illegal State

in BP Busy in

Ers Susp

Susp

in Ers

Susp

BP Busy in Ers Susp IS in BP Busy in

Erase Suspend BP Busy in Ers Susp N/A BP Busy in Ers

Susp

Erase

Susp

IS in BP Busy BP Busy in Erase Suspend

IS in

Ers

Susp

BP Susp

Susp

in Ers

Susp

IS in

Susp

in Ers

Susp

BP Suspend

in Erase

Suspend

Illegal State

in BP Busy in

Ers Susp

Busy

in Ers

Susp

BP Susp in

Ers Susp

Susp

in Ers

Susp

(Er

bits

clear)

Susp

in Ers

Susp

IS in BP Busy in

Erase Suspend BP Susp in Ers Susp N/A BP Susp in Ers

Susp N/A

IS in BP Suspend BP Suspend in Erase Suspend

Table 42: Next State Table for P3x-65nm (Sheet 2 of 3)

Command Input and Resulting Chip Next State(1)

Current Chip State

Array Read (3)

Word Pgm Setup (4,9)

BP Setup (8)

EFI Command Setup

Erase Setup (4,9)

BEFP Setup (6)

Confirm (7)

Pgm/Ers Suspend

Read Status

Clear SR (5)

Read ID/Query

Lock/RCR/ECR Setup

Blank Check

OTP Setup

Lock Blk Confirm (7)

Lock-down Blk Confirm (7)

Write ECR/RCR Confirm (7)

Block Address Change

Other Commands (2)

WSM Operation Completes

(FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) (90h,

98h) (60h) (BCh) (C0h) (01h) (2Fh) (03h,

04h) other

Datasheet Jul 2011

83 Order Number:208034-04

P33-65nm SBC

EFI in

Erase

Suspend

EFI Setup Sub-function Setup in Erase Suspend

N/A

Sub-function

Setup Sub-op-code Load 1 in Erase Suspend

Sub-op-code

Load 1 Sub-function Load 2 in Erase Suspend if word count >0, else Sub-function confirm in Erase Suspend

Sub-function

Load 2 Sub-function Confirm in Erase Suspend if data load in program buffer is complete, ELSE Sub-function Load 2

Ers

Susp

(Error

[Botc

h])

Sub-function

Confirm if data

load in program

buffer is

complete, ELSE

Sub-function

Load 2

Sub-function

Confirm Erase Suspend (Error [Botch])

S-fn

Busy

in Ers

Susp

Erase Suspend (Error [Botch])

Sub-function

Busy

S-fn

Busy

in Ers

Susp

IS in

S-fn

Busy

in Ers

Susp

S-fn Busy in

Ers Suspend

Illegal State

in S-fn Busy

in Ers Susp

S-fn

Susp

in Ers

Susp

S-fn Busy in Ers

Susp

IS in S-fn Busy in

Ers Susp

S-fn Busy in Ers

Susp N/A S-fn Busy in Ers

Susp

Erase

Susp

IS in Sub-

function Busy Sub-function Busy in Ers Susp

IS in

Ers

Susp

Sub-function

Susp

S-fn

Susp

in Ers

Susp

IS in

S-fn

Susp

in Ers

Susp

S-fn

Suspend in

Ers Susp

Illegal State

in S-fn Busy

in Ers Susp

S-fn

Busy

in Ers

Susp

S-fn

Suspend in

Ers Susp

S-fn

Susp

in Ers

Susp

(Er

bits

clear)

S-fn

Susp

in Ers

Susp

IS in S-fn Susp in

Ers Susp

S-fn Suspend in Ers

Susp N/A S-fn Susp in Ers

Susp N/A

IS in Phase-1

Susp Sub-Function Suspend in Erase Suspend

Lock/RCR/ECR/Lock

EFA Block Setup in

Erase Suspend

Erase Suspend (Lock Error

[Botch])

Ers

Susp

(Un-

lock

Block

)

Ers Susp (Lock Error [Botch])

Ers

Susp

(Error

[Botc

h])

Ers

Susp

Blk

Lock

Ers

Susp

Blk

Lk-

Down

Ers

Susp

Set

N/A Ers Susp (Error

[Botch]) N/A

Blank

Check

Setup

Ready (Error [Botch])

Busy Ready (Error [Botch])

N/A

Ready (Error

[Botch]) N/A

Blank Check Busy BC

Busy

IS in

Busy

BC Busy IS in BC

Busy Blank Check Busy IS in BC Busy BC Busy

BC Busy Ready

IS in Blank Check

Busy

BP Busy

BEFP

Setup Ready (Error [Botch])

BEFP

Load

Data

Ready (Error [Botch]) N/A

BEFP Busy BEFP Program and Verify Busy (if Block Address given matches address given on BEFP Setup command). Commands

treated as data. (7) Ready BEFP Busy Ready

Table 42: Next State Table for P3x-65nm (Sheet 3 of 3)

Command Input and Resulting Chip Next State(1)

Current Chip State

Array Read (3)

Word Pgm Setup (4,9)

BP Setup (8)

EFI Command Setup

Erase Setup (4,9)

BEFP Setup (6)

Confirm (7)

Pgm/Ers Suspend

Read Status

Clear SR (5)

Read ID/Query

Lock/RCR/ECR Setup

Blank Check

OTP Setup

Lock Blk Confirm (7)

Lock-down Blk Confirm (7)

Write ECR/RCR Confirm (7)

Block Address Change

Other Commands (2)

WSM Operation Completes

(FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) (90h,

98h) (60h) (BCh) (C0h) (01h) (2Fh) (03h,

04h) other

P33-65nm

Datasheet Jul 2011

84 Order Number: 208034-04

Notes:

1. IS refers to Illegal State in the Next State Table.

2. “Illegal commands” include commands outside of the allowed command set.

3. The device defaults to "Read Array" on powerup.

4. If a “Read Array” is attempted when the device is busy, the result will be “garbage” data (we should not tell the user that

it will actually be Status Register data). The key point is that the output mux will be pointing to the “array”, but garbage

data will be output. “Read ID” and "Read Query" commands do the exact same thing in the device. The ID and Query data

are located at different locations in the address map.

5. The Clear Status command only clears the error bits in the Status Register if the device is not in the following modes:1.

WSM running (Pgm Busy, Erase Busy, Pgm Busy In Erase Suspend, OTP Busy, BEFP modes) 2. Suspend states (Erase

Suspend, Pgm Suspend, Pgm Suspend In Erase Suspend).

6. BEFP writes are only allowed when the Status Register bit #0 = 0 or else the data is ignored.

7. Confirm commands (Lock Block, Unlock Block, Lock-Down Block, Configuration Register and Blank Check) perform the

operation and then move to the Ready State.

8. Buffered programming will botch when a different block address (as compared to the address given on the first data write

cycle) is written during the BP Load1 and BP Load2 states.

9. All two cycle commands will be considered as a contiguous whole during device suspend states. Individual commands will

not be parsed separately. (I.e. If an erase set-up command is issued followed by a D0h command, the D0h command will

not resume the program operation. Issuing the erase set-up places the CUI in an “illegal state”. A subsequent command

will clear the “illegal state”, but the command will be otherwise ignored.

Table 43: Output Next State Table for P3x-65nm

Command Input to Chip and Resulting Output MUX Next State(1)

Current Chip State

Array Read (3)

Word Pgm Setup (4,9)

BP Setup (8)

EFI Command Setup

Erase Setup (4,9)

BEFP Setup (6)

Confirm (7)

Pgm/Ers Suspend

Read Status

Clear SR (5)

Read ID/Query

Lock/RCR/ECR Setup

Blank Check

OTP Setup

Lock Blk Confirm (7)

Lock-down Blk Confirm (7)

Write ECR/RCR Confirm (7)

Block Address Change

Other Commands (2)

WSM Operation Completes

(FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) (90h,

98h) (60h) (BCh) (C0h) (01h) (2Fh) (03h,

04h) other

BEFP Setup,

BEFP Pgm & Verify Busy,

Erase Setup,

OTP Setup,

BP Setup, Load 1, Load 2

BP Setup, Load1, Load 2 - in

Erase Susp.

BP Confirm

EFI Sub-function Confirm

Word Pgm Setup,

Word Pgm Setup in Erase

Susp,

BP Confirm in Erase Suspend,

EFI S-fn Confirm in Ers Susp,

Blank Check Setup,

Blank Check Busy

Status Read

Output MUX does not Change

Lock/RCR/ECR Setup,

Lock/RCR/ECR Setup in Erase

Susp

Status Read

Array

Read

EFI S-fn Setup, Ld 1, Ld 2

EFI S-fn Setup, Ld1, Ld 2 - in

Erase Susp.

Output MUX will not change

BP Busy

BP Busy in Erase Suspend

EFI Sub-function Busy

EFI Sub-fn Busy in Ers Susp

Word Program Busy,

Word Pgm Busy in Erase

Suspend,

OTP Busy

Erase Busy

Status Read

Ready,

Word Pgm Suspend,

BP Suspend,

Erase Suspend,

BP Suspend in Erase Suspend

Array Read

Status Read

Array Read

ID/Query Read

Status Read

Output MUX does

not Change

Status Read

Datasheet Jul 2011

85 Order Number:208034-04

P33-65nm SBC

Appendix B Conventions - Additional Documentation

B.1 Acronyms

B.2 Definitions and Terms

BEFP: Buffered Enhanced Factory Programming

CUI : Command User Interface

CFI : Common Flash Interface

EFI : Extended Function Interface

SBC : Single Bit per Cell

OTP : One-Time Programmable

PLR : one-time programmable Lock Register

PR : one-time programmable Register

RCR : Read Configuration Register

RFU : Reserved for Future Use

SR : Status Register

SRD Status Register Data

WSM Write State Machine

VCC : Signal or voltage connection

VCC : Signal or voltage level

h : Hexadecimal number suffix

0b : Binary number prefix

0x : hexadecimal number prefix

SR.4 : Denotes an individual register bit.

A[15:0] : Denotes a group of similarly named signals, such as address or data bus.

A5 : Denotes one element of a signal group membership, such as an individual address

bit.

Bit : Single Binary unit

Byte : Eight bits

Word : Two bytes, or sixteen bits

Kbit : 1024 bits

KByte : 1024 bytes

KWord : 1024 words

Mbit : 1,048,576 bits

MByte : 1,048,576 bytes

MWord : 1,048,576 words

K 1,000

M 1,000,000

3.0 V : VCC (core) and VCCQ (I/O) voltage range of 2.3 V – 3.6 V

9.0 V : VPP voltage range of 8.5 V – 9.5 V

P33-65nm

Datasheet Jul 2011

86 Order Number: 208034-04

Block : A group of bits, bytes, or words within the flash memory array that erase

simultaneously. The P33-65nm has two block sizes: 32 KByte and 128 KByte.

Main block : An array block that is usually used to store code and/or data. Main blocks are larger

than parameter blocks.

Parameter block : An array block that may be used to store frequently changing data or small system

parameters that traditionally would be stored in EEPROM.

Top parameter device : A device with its parameter blocks located at the highest physical address of its

memory map.

Bottom parameter device : A device with its parameter blocks located at the lowest physical address of its

memory map.

Datasheet Jul 2011

87 Order Number:208034-04

P33-65nm SBC

Appendix C Revision History

Date Revision Description

Jul 2009 01 Initial release.

Apr 2010 02

Update the buffered program performance, suspend latency, BEFP performance in

Ta b l e 2 6,

“Program and Erase Specifications” on page 58

Update the 40Mhz spec for TSOP package in

Table 24, “AC Read Specifications -” on

page 49

Add tDVWH timing comments in

Table 25, “AC Write Specifications” on page 54

Reflect the program performance in CFI in

Table 32, “System Interface Information”

on page 63

Jul 2010 03 Ordering information update.

Jul 2011 04

Update TSOP lead width “b” symbol.

Clarify CLK, WP#, WE# pin description.

Maximum rating note clarificaiton.

Update Table 14 EOWL of Latency count 2.

Update TSOP CFI on Burst read.

Add invalid commands clarifications on 65nm.

Add a note on reset in Bus Operation to avoid invalid commands.

Update Micron Part catalog link.

Correct some other minor errors.

P33-65nm

Datasheet Jul 2011

88 Order Number: 208034-04