1
NEC's GaAs MMIC DPDT SWITCHES
FOR 5 GHz BAND WIRELESS LAN UPG2024TQ
FEATURES
OPERATING FREQUENCY:
f = 4.8 to 5.85 GHz
LOW INSERTION LOSS:
LINS = 1.2 dB TYP. @ f = 4.8 to 5.85 GHz
HANDLING POWER:
Pin (0.1 dB) = +32 dBm TYP. @ f = 4.8 to 5.85 GHz
CONTROL VOLTAGE:
Vcont = +2.8 V/0 V TYP.
HIGH ISOLATION:
ISL (between TX and RX) = 30 dB TYP. @ f = 5.2 GHz
ISL (between ANT1/ANT2 and RX/TX) = 25 dB TYP. @ f = 5.2 GHz
INPUT/OUTPUT RETURN LOSS:
RLin/RLout = 20 dB TYP. @ f= 4.8 to 5.85 GHz
SWITCHING SPEED:
tSW = 20 ns TYP. @ tRISE/tFALL (10/90% RF)
HIGH-DENSITY SURFACE MOUNTING:
10-pin plastic TSON package (2.30 × 2.55 × 0.60 mm)
Pb FREE
DESCRIPTION
NEC's UPG2024TQ is a GaAs MMIC DPDT switch for
5 GHz band wireless LAN. Low insertion loss and high
handling power contribute to user's system design.
California Eastern Laboratories
APPLICATIONS
5 GHz Band Wireless LAN (IEEE802.11a)
DATA SHEET
PART NUMBER ORDER NUMBER PACKAGE MARKING SUPPLYING FORM
UPG2024TQ-E1-A UPG2024TQ-E1-A 10-pin plastic TSON
(Pb-Free)
2024 Embossed tape 8 mm wide
Pin 5, 6 face the perforation side of the tape
Qty 3 kpcs/reel
ORDERING INFORMATION
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: UPG2024TQ
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
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2
UPG2024TQ
PIN CONNECTIONS
2024
10 9 8 7 6
12345
(Top View)
6 7 8 9 10
54321
(Bottom View)
GND
PIN NO. PIN NAME
1 TX
2 Vcont1
3 Vcont2
4 GND
5 RX
6 ANT1
7 Vcont3
8 Vcont4
9 GND
10 ANT2
ABSOLUTE MAXIMUM RATINGS (TA = +25ºC, unless otherwise specified )
PARAMETER SYMBOL RATINGS UNIT
Control Voltage Vcont 6.0 to +6.0 Note 1 V
Input Power Pin +36 dBm
Total Power Dissipation Ptot 0.15 Note 2 W
Operating Ambient Temperature TA45 to +85 °C
Storage Temperature Tstg 65 to +150 °C
Notes 1. Within the condition of | Vcont1Vcont2 | 6.0 V
2. Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C
RECOMMENDED OPERATING RANGE (TA = +25ºC )
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Control Voltage (High) Vcont (H) 2.7 2.8 3.3 V
Control Voltage (Low) Vcont (L) 0.2 0 +0.2 V
Operating Frequency f 4.8 5.85 GHz
Operating Ambient Temperature TA40 +25 +85 °C
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UPG2024TQ
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont = 2.8 V/0 V, ZO = 50 Ω, DC block capacitor = 2 pF, each port, on the below TRUTH TABLE,
unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Insertion Loss LINS f = 4.9 GHz 1.2 1.5 dB
f = 5.2 GHz 1.2 1.5
f = 5.8 GHz 1.5 1.7
Isolation
(Between TX and RX)
ISL f = 4.9 GHz 20 25 dB
f = 5.2 GHz 25 30
f = 5.8 GHz 20 25
Input Return Loss RLin f = 4.9 GHz 10 20 dB
f = 5.2 GHz 10 20
f = 5.8 GHz 7 20
Output Return Loss RLout f = 4.9 GHz 10 20 dB
f = 5.2 GHz 10 20
f = 5.8 GHz 7 20
0.1 dB Gain Compression
Input Power
Pin (0.1 dB) f = 4.9 GHz 30 33 dBm
f = 5.2 GHz 30 32
f = 5.8 GHz 30 32
Switching Speed tSW tRISE/tFALL (10/90% RF) 20 ns
Control Current Icont 0.5 μA
Input 3rd Order Intercept Point IIP350 dBm
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont = 2.8 V/0 V, ZO = 50 Ω, DC block capacitor = 2 pF, each port, on the below TRUTH TABLE,
unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Isolation
(Between ANT1/ANT2 and RX/TX)
ISL f = 4.9 GHz 22 dB
f = 5.2 GHz 25
f = 5.8 GHz 21
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UPG2024TQ
TEST CIRCUIT
12345
10 9 8 7 6
Vcont1TX RX
GND
Cbypass Cbypass
CRF CRF
Vcont2
Vcont4ANT2 ANT1
GND
Cbypass Cbypass
CRF CRF
Vcont3
Remark CRF : 2 pF
Cbypass : 1 000 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
TRUTH TABLE
Vcont1 Vcont2 Vcont3 Vcont4 PASS
Low High High Low ANT1-RX
High Low Low High ANT2-TX
High Low High Low ANT1-TX
Low High Low High ANT2-RX
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UPG2024TQ
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
.
CRF
Cbypass
Cbypass
Cbypass
Cbypass
CRF
CRF CRF
USING THE NEC EVALUATION BOARD
SYMBOL FORM RATING PART NUMBER MANUFACTURER
CRF Chip Capacitor 2 pF GRM36CK020C50PB muRata
Cbypass Chip Capacitor 1 000 pF GRP033B11C102KD01E muRata
PC Terminal A2-2PA-2.54DSA Hirose
RF Connector 142-0721-821 Johnson
PWB RO4003 (t = 0.51 mm) Rogers
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UPG2024TQ
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont = 2.8 V/0 V, ZO = 50 Ω, DC block capacitor = 2 pF, using test fixture, unless otherwise specified)
Isolation ISL (dB)
Frequency f (GHz)
Isolation ISL (dB)
Frequency f (GHz)
Insertion Loss LINS (dB)
Frequency f (GHz)
Insertion Loss LINS (dB)
Frequency f (GHz)
0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.04.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-0.5
-1.0
-1.5
-2.0
-2.5
-3
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
Insertion Loss LINS (dB)
Frequency f (GHz)
TX-ANT1 INSERTION LOSS vs. FREQUENCY
(When TX-ANT1 is ON)
ANT1-RX INSERTION LOSS vs. FREQUENCY
(When ANT1-RX is ON)
TX-ANT2 INSERTION LOSS vs. FREQUENCY
(When TX-ANT2 is ON)
ANT2-RX INSERTION LOSS vs. FREQUENCY
(When ANT2-RX is ON)
RX-TX ISOLATION vs. FREQUENCY
(When ANT2-RX is ON)
TX-RX ISOLATION vs. FREQUENCY
(When TX-ANT1 is ON)
Insertion Loss LINS (dB)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
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UPG2024TQ
Input Return Loss RLin (dB)
Frequency f (GHz)
Output Return Loss RLout (dB)
Frequency f (GHz)
Input Return Loss RLin (dB)
Frequency f (GHz)
Output Return Loss RLout (dB)
Frequency f (GHz)
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
TX
-
ANT1 INPUT RETURN LOSS vs. FREQUENCY
(When TX-ANT1 is ON)
TX
-
ANT1 OUTPUT RETURN LOSS vs. FREQUENCY
(When TX-ANT1 is ON)
Input Return Loss RLin (dB)
Frequency f (GHz)
Output Return Loss RLout (dB)
Frequency f (GHz)
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
TX
-
ANT2 INPUT RETURN LOSS vs. FREQUENCY
(When TX-ANT2 is ON)
TX
-
ANT2 OUTPUT RETURN LOSS vs. FREQUENCY
(When TX-ANT2 is ON)
ANT1-RX INPUT RETURN LOSS vs. FREQUENCY
(When ANT1-RX is ON)
ANT1-RX OUTPUT RETURN LOSS vs. FREQUENCY
(When ANT1-RX is ON)
Remark The graphs indicate nominal characteristics.
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UPG2024TQ
Output Power Pout (dBm)
Input Power Pin (dBm)
4.9 GHz OUTPUT POWER vs. INPUT POWER
Input Return Loss RLin (dB)
Frequency f (GHz)
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
ANT2-RX INPUT RETURN LOSS vs. FREQUENCY
(When ANT2-RX is ON)
Output Return Loss RLout (dB)
Frequency f (GHz)
0
-10
-20
-30
-40
-50
4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0
ANT2-RX OUTPUT RETURN LOSS vs. FREQUENCY
(When ANT2-RX is ON)
Pin (0.1 dB) = +33.5 dBm
Output Power Pout (dBm)
Input Power Pin (dBm)
35
30
25
20
15
20 25 30 35 38 20 25 30 35 38
35
30
25
20
15
5.2 GHz OUTPUT POWER vs. INPUT POWER
Pin (0.1 dB) = +33.5 dBm
Output Power Pout (dBm)
Input Power Pin (dBm)
35
30
25
20
15
5.8 GHz OUTPUT POWER vs. INPUT POWER
20 25 30 35 38
Pin (0.1 dB) = +33.4 dBm
Remark The graphs indicate nominal characteristics.
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UPG2024TQ
PACKAGE DIMENSIONS
10-PIN PLASTIC TSON (UNIT:mm)
Remark ( ) : Reference value
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UPG2024TQ
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
SOLDERING METHOD SOLDERING CONDITIONS CONDITION SYMBOL
Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°C : 120±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (terminal temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
05/04/2005
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Telephone: (408) 919-2500
Facsimile:
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408
)
988-0279
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with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
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go into its products as of the date of disclosure of this information.
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per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A -AZ
Lead (Pb) < 1000 PPM Not Detected (*)
Mercury < 1000 PPM Not Detected
Cadmium < 100 PPM Not Detected
Hexavalent Chromium < 1000 PPM Not Detected
PBB < 1000 PPM Not Detected
PBDE < 1000 PPM Not Detected
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