DATA SHEET DESCRIPTION FEATURES D NEC's GaAs MMIC DPDT SWITCHES UPG2024TQ FOR 5 GHz BAND WIRELESS LAN NEC's UPG2024TQ is a GaAs MMIC DPDT switch for * OPERATING FREQUENCY: 5 GHz band wireless LAN. Low insertion loss and high UE f = 4.8 to 5.85 GHz handling power contribute to user's system design. * LOW INSERTION LOSS: LINS = 1.2 dB TYP. @ f = 4.8 to 5.85 GHz APPLICATIONS * HANDLING POWER: * 5 GHz Band Wireless LAN (IEEE802.11a) * CONTROL VOLTAGE: Vcont = +2.8 V/0 V TYP. * HIGH ISOLATION: ISL (between TX and RX) = 30 dB TYP. @ f = 5.2 GHz IN Pin (0.1 dB) = +32 dBm TYP. @ f = 4.8 to 5.85 GHz ISL (between ANT1/ANT2 and RX/TX) = 25 dB TYP. @ f = 5.2 GHz NT * INPUT/OUTPUT RETURN LOSS: RLin/RLout = 20 dB TYP. @ f= 4.8 to 5.85 GHz * SWITCHING SPEED: tSW = 20 ns TYP. @ tRISE/tFALL (10/90% RF) * HIGH-DENSITY SURFACE MOUNTING: SC O 10-pin plastic TSON package (2.30 x 2.55 x 0.60 mm) * Pb FREE ORDERING INFORMATION PART NUMBER ORDER NUMBER PACKAGE MARKING UPG2024TQ-E1-A UPG2024TQ-E1-A 10-pin plastic TSON (Pb-Free) 2024 SUPPLYING FORM * Embossed tape 8 mm wide * Pin 5, 6 face the perforation side of the tape * Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. DI Part number for sample order: UPG2024TQ Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories 1 UPG2024TQ PIN CONNECTIONS 8 7 6 6 2 3 4 8 9 TX 2 Vcont1 3 Vcont2 4 GND 5 RX 6 ANT1 7 Vcont3 10 GND 2024 1 7 PIN NAME 1 5 5 4 ABSOLUTE MAXIMUM RATINGS Input Power Total Power Dissipation Operating Ambient Temperature Storage Temperature 2 1 Vcont4 9 GND 10 ANT2 (TA = +25C, unless otherwise specified ) SYMBOL Vcont 8 RATINGS UNIT -6.0 to +6.0 Note 1 V +36 dBm Pin NT PARAMETER Control Voltage 3 UE 9 PIN NO. IN 10 (Bottom View) D (Top View) Ptot 0.15 Note 2 W TA -45 to +85 C Tstg -65 to +150 C Notes 1. Within the condition of | Vcont1-Vcont2 | 6.0 V SC O 2. Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB, TA = +85C RECOMMENDED OPERATING RANGE PARAMETER SYMBOL (TA = +25C ) MIN. TYP. MAX. UNIT Control Voltage (High) Vcont (H) 2.7 2.8 3.3 V Control Voltage (Low) Vcont (L) -0.2 0 +0.2 V Operating Frequency f 4.8 - 5.85 GHz TA -40 +25 +85 C DI Operating Ambient Temperature 2 UPG2024TQ ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont = 2.8 V/0 V, ZO = 50 , DC block capacitor = 2 pF, each port, on the below TRUTH TABLE, unless otherwise specified) Isolation LINS ISL (Between TX and RX) TEST CONDITIONS MIN. TYP. MAX. UNIT f = 4.9 GHz - 1.2 1.5 dB f = 5.2 GHz - 1.2 1.5 f = 5.8 GHz - 1.5 1.7 f = 4.9 GHz 20 f = 5.2 GHz 25 f = 5.8 GHz Input Return Loss RLin 20 f = 4.9 GHz f = 5.2 GHz f = 5.8 GHz Output Return Loss RLout f = 4.9 GHz f = 5.2 GHz f = 5.8 GHz Pin (0.1 dB) Input Power tSW Control Current Icont Input 3rd Order Intercept Point IIP3 f = 4.9 GHz - 30 - dB 25 - 10 20 - 20 - 7 20 - 10 20 - 10 20 - 7 20 - dB dB 30 33 - f = 5.2 GHz 30 32 - f = 5.8 GHz 30 32 - tRISE/tFALL (10/90% RF) - 20 - ns - 0.5 - A - 50 - dBm NT Switching Speed 25 10 IN 0.1 dB Gain Compression D Insertion Loss SYMBOL UE PARAMETER dBm STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, Vcont = 2.8 V/0 V, ZO = 50 , DC block capacitor = 2 pF, each port, on the below TRUTH TABLE, unless otherwise specified) SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT f = 4.9 GHz - 22 - dB f = 5.2 GHz - 25 - f = 5.8 GHz - 21 - SC O PARAMETER Isolation DI (Between ANT1/ANT2 and RX/TX) ISL 3 UPG2024TQ TEST CIRCUIT Vcont4 Vcont3 Cbypass ANT1 Cbypass CRF CRF GND 1 8 7 6 UE 9 IN 10 D ANT2 2 3 4 5 GND CRF NT CRF Cbypass Cbypass TX SC O Remark CRF : 2 pF Vcont1 Vcont2 RX Cbypass : 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. TRUTH TABLE Vcont2 Vcont3 Low High High Low High Low High Low ANT1-TX Low High Low High ANT2-RX DI Vcont1 Vcont4 PASS High Low ANT1-RX Low High ANT2-TX 4 UPG2024TQ ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD UE D . CRF Cbypass Cbypass Cbypass Cbypass CRF SC O NT CRF IN CRF DI USING THE NEC EVALUATION BOARD SYMBOL FORM RATING PART NUMBER MANUFACTURER CRF Chip Capacitor 2 pF GRM36CK020C50PB muRata Cbypass Chip Capacitor 1 000 pF GRP033B11C102KD01E muRata - PC Terminal - A2-2PA-2.54DSA Hirose - RF Connector - 142-0721-821 Johnson - PWB - RO4003 (t = 0.51 mm) Rogers 5 UPG2024TQ STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, Vcont = 2.8 V/0 V, ZO = 50 , DC block capacitor = 2 pF, using test fixture, unless otherwise specified) 0 0 -0.5 -0.5 -1.5 -2.0 -2.5 -3.0 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 -2.0 -2.5 IN Frequency f (GHz) ANT2-RX INSERTION LOSS vs. FREQUENCY (When ANT2-RX is ON) TX-ANT2 INSERTION LOSS vs. FREQUENCY (When TX-ANT2 is ON) 0 0 Insertion Loss LINS (dB) -0.5 -0.5 NT Insertion Loss LINS (dB) -1.5 -3.0 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) -1.0 -1.5 -2.0 -2.5 -1.0 -1.5 -2.0 SC O -2.5 -3.0 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 -3 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) Frequency f (GHz) RX-TX ISOLATION vs. FREQUENCY (When ANT2-RX is ON) TX-RX ISOLATION vs. FREQUENCY (When TX-ANT1 is ON) 0 -10 -10 Isolation ISL (dB) 0 -20 DI Isolation ISL (dB) -1.0 UE -1.0 D ANT1-RX INSERTION LOSS vs. FREQUENCY (When ANT1-RX is ON) Insertion Loss LINS (dB) Insertion Loss LINS (dB) TX-ANT1 INSERTION LOSS vs. FREQUENCY (When TX-ANT1 is ON) -30 -20 -30 -40 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 UPG2024TQ TX-ANT1 INPUT RETURN LOSS vs. FREQUENCY (When TX-ANT1 is ON) TX-ANT1 OUTPUT RETURN LOSS vs. FREQUENCY (When TX-ANT1 is ON) -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 -30 -40 Frequency f (GHz) TX-ANT2 OUTPUT RETURN LOSS vs. FREQUENCY (When TX-ANT2 is ON) IN TX-ANT2 INPUT RETURN LOSS vs. FREQUENCY (When TX-ANT2 is ON) 0 Output Return Loss RLout (dB) 0 -10 -10 NT Input Return Loss RLin (dB) -20 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 -20 -30 -40 SC O -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) Frequency f (GHz) ANT1-RX INPUT RETURN LOSS vs. FREQUENCY (When ANT1-RX is ON) ANT1-RX OUTPUT RETURN LOSS vs. FREQUENCY (When ANT1-RX is ON) 0 Output Return Loss RLout (dB) 0 -10 -20 -30 DI Input Return Loss RLin (dB) -10 UE -10 D 0 Output Return Loss RLout (dB) Input Return Loss RLin (dB) 0 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 7 UPG2024TQ ANT2-RX INPUT RETURN LOSS vs. FREQUENCY (When ANT2-RX is ON) ANT2-RX OUTPUT RETURN LOSS vs. FREQUENCY (When ANT2-RX is ON) 0 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 IN 5.2 GHz OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) 30 25 20 30 35 Pin (0.1 dB) = +33.5 dBm Input Power Pin (dBm) 35 30 DI 25 20 30 35 Pin (0.1 dB) = +33.4 dBm 20 25 30 38 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 8 35 Pin (0.1 dB) = +33.5 dBm Input Power Pin (dBm) 5.8 GHz OUTPUT POWER vs. INPUT POWER 25 25 15 20 38 SC O 25 30 NT Output Power Pout (dBm) -40 35 35 Output Power Pout (dBm) -30 Frequency f (GHz) 4.9 GHz OUTPUT POWER vs. INPUT POWER 15 20 -20 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) 15 20 -10 D -10 UE Output Return Loss RLout (dB) Input Return Loss RLin (dB) 0 38 UPG2024TQ PACKAGE DIMENSIONS (0.15) UE IN (0.60 MAX.) (1.70) DI SC O NT (0.125) (1.95) (0.95) 2.250.1 2.550.15 2.200.1 2.300.15 Remark ( ) : Reference value D (Bottom View) 0.180.05 (0.05) 0.400.05 (0.30) 10-PIN PLASTIC TSON (UNIT:mm) 9 (0.30) UPG2024TQ RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. SOLDERING METHOD SOLDERING CONDITIONS CONDITION SYMBOL Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 120C or below : 1 time : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 IN UE D Infrared Reflow DI SC O NT Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 05/04/2005 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 10 D 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 UE Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. IN CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Lead (Pb) Mercury Concentration Limit per RoHS (values are not yet fixed) NT Restricted Substance per RoHS < 1000 PPM Concentration contained in CEL devices -A Not Detected < 1000 PPM Not Detected < 100 PPM Not Detected < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected Cadmium SC O Hexavalent Chromium -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. DI Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL's liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability. 11