Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 LMZ21701 1-A Nano Module With 17-V Maximum Input Voltage 1 Features 2 Applications * * * * * * * * * * * * * * * * * * 1 Integrated Inductor Miniature 3.5 mm x 3.5 mm x 1.75 mm Package 35-mm Solution Size (Single Sided) -40C to 125C Junction Temperature Range Adjustable Output Voltage Integrated Compensation Adjustable Soft-Start Function Starts into Prebiased Loads Power Good and Enable Pins Seamless Transition to Power-Save Mode Up to 1000 mA Output Current Input Voltage Range 3 V to 17 V Output Voltage Range 0.9 V to 6 V Efficiency up to 95 % 1.5-A Shutdown Current 17-A Quiescent Current Create a Custom Design Using the LMZ21701 With WEBENCH(R) Power Designer * * Point-of-Load Conversions from 3.3 V, 5 V, or 12 V Input Voltage Space Constrained Applications LDO Replacement 3 Description The LMZ21701 nano module is an easy-to-use stepdown DC/DC solution capable of driving up to 1000mA load in space-constrained applications. Only an input capacitor, an output capacitor, a soft-start capacitor, and two resistors are required for basic operation. Device Information(1) PART NUMBER LMZ21701 PACKAGE SIP (8) BODY SIZE (NOM) 3.50 mm x 3.50 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. space space space Simplified Schematic VIN Efficiency for VIN = 12 V VOUT VIN VOUT EN PG 100 90 80 LMZ21701 SS COUT VOS RFBT CSS GND FB RFBB 70 Efficiency (%) CIN 60 50 40 30 VOUT = 1.2 V VOUT = 1.8 V VOUT = 2.5 V VOUT = 3.3 V VOUT = 5 V 20 10 0 0.0001 0.001 0.01 Output Current (A) 0.1 1 D023 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 7.2 7.3 7.4 7.5 Overview ................................................................... 8 Functional Block Diagram ......................................... 9 Package Construction ............................................... 9 Feature Description................................................. 11 Device Functional Modes........................................ 12 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application ................................................. 13 8.3 Do's and Don'ts ...................................................... 26 9 Power Supply Recommendations...................... 26 9.1 Voltage Range ........................................................ 26 9.2 Current Capability ................................................... 26 9.3 Input Connection .................................................... 26 10 Layout................................................................... 27 10.1 Layout Guidelines ................................................. 27 10.2 Layout Example .................................................... 28 11 Device and Documentation Support ................. 31 11.1 11.2 11.3 11.4 Device Support .................................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 31 31 31 31 12 Mechanical, Packaging, and Orderable Information ........................................................... 31 12.1 Tape and Reel Information ................................... 32 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (#IMPLIED) to Revision E Page * Added links for Webench and top navigator icon for TI reference design; deleted Simple Switcher branding .................... 1 * Changed Handling Ratings to ESD Ratings .......................................................................................................................... 4 Changes from Revision C (October 2014) to Revision D Page * Changed from product Preview to Production Data .............................................................................................................. 1 * Changed to Final Limits ......................................................................................................................................................... 5 Changes from Revision B (August 2014) to Revision C * Added Device Information and Handling Rating tables, Feature Description, Application and Implementation Layout Device and Documentation Support and Mechanical, Packaging, and Orderable Information, moved some curves to Application Curves ................................................................................................................................................................. 1 Changes from Revision A (October 2013) to Revision B * 2 Page Updated datasheet to new TI standards ................................................................................................................................ 1 Changes from Original (August 2012) to Revision A * Page Page Changed Description .............................................................................................................................................................. 1 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 5 Pin Configuration and Functions Figure 1. LMZ21701 in the SIL0008E Package SIL Package 8-Pin SIP Top View TOP SS 1 FB 2 PG 3 VOUT 4 PAD (GND) PAD (GND) 8 VIN 7 EN 6 VOS 5 GND Pin Functions PIN NAME NO. I/O DESCRIPTION SS 1 I Soft-start pin. An external capacitor connected to this pin sets the internal voltage reference ramp time. It can be used for tracking and sequencing. FB 2 I Voltage feedback. Connect resistive voltage divider to this pin to set the output voltage. PG 3 O Output power good (High = VOUT ready, Low = VOUT below nominal regulation); open drain (requires pull-up resistor; goes low impedance when EN is low). VOUT 4 O Output Voltage. Connected to one terminal of the integrated inductor. Connect output filter capacitor between VOUT and PGND. GND 5 I Ground for the power MOSFETs and gate-drive circuitry. VOS 6 I Output voltage sense pin and connection for the control loop circuitry. EN 7 I Enable input (High = enabled, Low = disabled). Internal pull down resistor keeps logic level low if pin is left floating. VIN 8 I Supply voltage for control circuitry and power stage. PAD Electrically connected to GND. Must be soldered to a ground copper plane to achieve appropriate power dissipation and mechanical reliability. Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 3 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX VIN -0.3 20 V EN, SS -0.3 VIN +0.3 V w/ 20 V maximum V FB, PG, VOS -0.3 7 V 10 mA -40 125 C 260 C 150 C PG sink current Junction temperature, TJ-MAX Maximum lead temperature -65 Storage temperature, Tstg (1) (2) UNIT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) 500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) (1) Input voltage Output voltage Recommended load current Junction temperature, TJ (1) MIN MAX 3 17 UNIT V 0.9 6 V 0 1000 mA -40 125 C Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see the Electrical Characteristics section. 6.4 Thermal Information LMZ21701 THERMAL METRIC (1) SIL (SIP) UNIT 8 PINS RJA Junction-to-ambient thermal resistance (2) 42.6 C/W RJC(top) Junction-to-case (top) thermal resistance 20.8 C/W RJB Junction-to-board thermal resistance 9.4 C/W JT Junction-to-top characterization parameter 1.5 C/W JB Junction-to-board characterization parameter 9.3 C/W RJC(bot) Junction-to-case (bottom) thermal resistance 1.8 C/W (1) (2) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Junction-to-ambient thermal resistance (RJA) is based on 4-layer board thermal measurements, performed under the conditions and guidelines set forth in the JEDEC standards JESD51-1 to JESD51-11. RJA varies with PCB copper area, power dissipation, and airflow. Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 6.5 Electrical Characteristics (1) Limits apply over the recommended operating junction temperature (TJ) range of -40C to +125C, unless otherwise stated. Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12 V. TYP (2) MAX (1) EN = high, IOUT = 0 mA, TJ = -40C to 85C device not switching 17 25 A EN = high, IOUT = 0 mA, TJ = -40C to 125C device not switching 17 28 A EN = low, TJ = -40C to 85C 1.5 4 A EN = low, TJ = -40C to 125C 1.5 5 A 2.8 2.9 3 V 0.125 0.18 0.26 V PARAMETER TEST CONDITIONS MIN (1) UNIT SYSTEM PARAMETERS IQ Operating quiescent current ISD Shutdown current VINUVLO Input under voltage lock out rising threshold VINUVLO-HYS Input under voltage lock out hysteresis TSD Thermal shutdown TSD-HYST Thermal shutdown hysteresis Rising Threshold 160 C 30 C CONTROL VIH, ENABLE Enable logic HIGH voltage 0.9 VIL, ENABLE Enable logic LOW voltage ILKG Input leakage current EN = VIN or GND VTH_PG Power Good threshold voltage Rising (% VOUT) Falling (% VOUT) V 0.3 V 0.01 1 A 92% 95% 98% 87% 90% 93% VOL_PG Power Good output low voltage IPG = -2 mA 0.07 0.3 V ILKG_PG Power Good leakage current VPG = 1.8 V 1 400 nA ISS Softstart Pin source current 2.84 3.2 A 2.5 POWER STAGE RDS(ON) High-Side MOSFET ON Resistance VIN 6 V 82 VIN = 3 V 120 Low-Side MOSFET ON Resistance VIN 6 V 40 VIN = 3 V 50 m m L Integrated power inductor value 2.2 H DCR Integrated power inductor DC resistance 92 m ICL-HS High-Side MOSFET Current Limit TA = 25C ICL-LS Low-Side MOSFET Current Limit TA = 25C 1.2 A ICL-DC Output (DC) current limit VOUT = 5 V, TA = 85C 1.3 A (1) (2) 1.4 1.8 2.2 A Min and Max limits are 100% production tested at 25C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate National's Average Outgoing Quality Level (AOQL). Typical numbers are at 25C and represent the most likely parametric norm. Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 5 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com Electrical Characteristics(1) (continued) Limits apply over the recommended operating junction temperature (TJ) range of -40C to +125C, unless otherwise stated. Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12 V. PARAMETER TEST CONDITIONS MIN (1) TYP (2) MAX (1) 0.7869 0.803 0.8191 V 1 100 nA UNIT OUTPUT VREF Internal reference voltage IFB Feedback pin leakage current VFB = 0.8 V VOUT Light load initial voltage accuracy Power save mode, COUT = 22 F, TA = -40C to 85C, 1% FB Resistors VOUT Load regulation VOUT = 3.3 V PWM mode operation 0.05% /A VOUT Line regulation 3 V VIN 17 V, VOUT= 3.3 V, IOUT = 1000 mA PWM mode operation 0.02% /V -2.3% 2.8% SYSTEM CHARACTERISTICS 6 Full Load Efficiency VOUT = 3.3 V, IOUT = 1000 mA 93% Light Load Efficiency VOUT = 3.3 V, IOUT = 1 mA 72% Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 6.6 Typical Characteristics Unless otherwise specified the following conditions apply: VIN = 12 V, TA = 25C 0.7 2-LAYER 70 m (2 oz) Cu 4-LAYER 70 m (2 oz) Cu 90 VIN = 3.3 V VIN = 5 V VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 0.6 80 Power Dissipation (W) Thermal Resistance J-A (C/W) 100 70 60 50 40 0.5 0.4 0.3 0.2 0.1 30 20 0 0 5 10 Copper Area (cm2) 15 20 0 0.1 0.2 0.3 D012 VOUT = 1.2 V Figure 2. Package Thermal Resistance vs. Board Copper Area 0.4 0.5 0.6 Load Current (A) 0.7 0.8 0.9 1 005 TA = 85C Figure 3. Power Dissipation 0.7 0.7 VIN = 3.3 V VIN = 5 V VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 0.5 VIN = 3.3 V VIN = 5 V VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 0.6 Power Dissipation (W) Power Dissipation (W) 0.6 0.4 0.3 0.2 0.1 0.5 0.4 0.3 0.2 0.1 0 0 0 0.1 0.2 0.3 VOUT = 1.8 V 0.4 0.5 0.6 Load Current (A) 0.7 0.8 0.9 1 0 0.1 0.2 TA = 85C VOUT = 2.5 V Figure 4. Power Dissipation 0.4 0.5 0.6 Load Current (A) 0.7 0.8 0.9 1 D007 TA = 85C Figure 5. Power Dissipation 0.7 0.7 VIN = 5 V VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 0.5 VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 0.6 Power Dissipation (W) 0.6 Power Dissipation (W) 0.3 D006 0.4 0.3 0.2 0.5 0.4 0.3 0.2 0.1 0.1 0 0 0 0.1 0.2 VOUT = 3.3 V 0.3 0.4 0.5 0.6 Load Current (A) 0.7 0.8 TA = 85C 0.9 1 0 0.1 0.2 D008 VOUT = 5.0 V Figure 6. Power Dissipation 0.3 0.4 0.5 0.6 Load Current (A) 0.7 0.8 0.9 1 D009 TA = 85C Figure 7. Power Dissipation Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 7 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com Typical Characteristics (continued) Unless otherwise specified the following conditions apply: VIN = 12 V, TA = 25C 6 4 IOUT = 0.25 A IOUT = 0.5 A IOUT = 1 A IOUT = 0.25 A IOUT = 0.5 A IOUT = 1 A 3.6 Output Voltage (V) Output Voltage (V) 5.5 3.8 5 4.5 4 3.4 3.2 3 2.8 2.6 2.4 3.5 2.2 3 2 3 3.5 VOUT = 5.0 V 4 4.5 5 Input Voltage (V) 5.5 6 3 3.1 3.2 TA = 85C 3.4 3.5 3.6 Input Voltage (V) VOUT = 3.3 V Figure 8. Dropout 3.7 3.8 3.9 4 D010 TA = 85C Figure 9. Dropout 80 100 Evaluation Board EN 55022 Class B Limit EN 55022 Class A Limit 70 Peak Emissions Quasi Peak Limit Average Limit 90 Conducted Emissions (dBV) Radiated Emissions (dBV/m) 3.3 D011 60 50 40 30 20 10 80 70 60 50 40 30 20 10 0 0 200 VIN= 12 V 400 600 Frequency (MHz) 800 1000 0 0.1 1 VOUT = 3.3 V IOUT = 1 A 10 Frequency (MHz) D004 VIN= 12 V Lf = 2.2 H Figure 10. Radiated EMI on EVM VOUT = 3.3 V Cf = 1.0 F 100 D003 IOUT = 1 A Figure 11. Conducted EMI on EVM 7 Detailed Description 7.1 Overview The LMZ21701 Nano Module is an easy-to-use step-down DC/DC solution capable of driving up to 1000 mA load in space-constrained applications. Only an input capacitor, an output capacitor, a softstart capacitor, and two resistors are required for basic operation. The Nano Module comes in 8-pin DFN footprint package with an integrated inductor. The LMZ21701 architecture is based on DCS-ControlTM (Direct Control with Seamless Transition into Power Save Mode). This architecture combines the fast transient response and stability of hysteretic type converters along with the accurate DC output regulation of voltage mode and current mode regulators. The LMZ21701 architecture uses pulse width modulation (PWM) mode for medium and heavy load requirements and Power Save Mode (PSM) at light loads for high efficiency. In PWM mode the switching frequency is controlled over the input voltage range. The value depends on the output voltage setting and is typically reduced at low output voltages to achieve higher efficiency. In PSM the switching frequency decreases linearly with the load current. Since the architecture of the device supports both operation modes (PWM and PSM) in a single circuit building block, the transition between the modes of operation is seamless with minimal effect on the output voltage. 8 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 7.2 Functional Block Diagram HIGH SIDE SWITCH INDUCTOR VIN VOUT 2.2H LDO BYPASS 5V LDO UVLO HIGH SIDE CURRENT LIMIT HIGH SIDE DRIVER WITH INTERNAL BOOTSTRAP LOW SIDE DRIVER EN 400kY CONTROL LOGIC THERMAL SHUTDOWN SS PG LOW SIDE SWITCH LOW SIDE CURRENT LIMIT ZERO CURRENT DETECT SOFTSTART CURRENT AND TRACKING VOS DIRECT CONTROL & COMPENSATION tON TIMER 6.6V CLAMP 25pF CFF + GND FB + COMPARATOR ERROR AMPLIFIER VREF + - 7.3 Package Construction In order to achieve a small solution size the LMZ21701 Nano Module comes in an innovative MicroSiPTM package. The construction consists of a synchronous buck converter IC embedded inside an FR-4 laminate substrate, with a power inductor mounted on top of the substrate material. See Figure 12 and Figure 13 below. The bottom (landing pads) of the package resemble a typical 8-pin DFN package. See the Mechanical drawings at the end of the datasheet for details on the recommended landing pattern and solder paste stencil information. Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 9 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com Package Construction (continued) Figure 12. LMZ21701 in the SIL0008E Package INDUCTOR FR-4 LAMINATE SUBSTRATE BOTTOM COPPER PATTERN EMBEDDED BUCK IC Figure 13. LMZ21701 Package Construction Cross Section (Illustration Only, Not to Scale) 10 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 7.4 Feature Description 7.4.1 Input Undervoltage Lockout The LMZ21701 features input undervoltage lockout (UVLO) circuit. It monitors the input voltage level and prevents the device from switching the power MOSFETs if VIN is not high enough. The typical VIN UVLO rising threshold is 2.9 V with 180 mV of hysteresis. 7.4.2 Enable Input (EN) The enable pin (EN) is weakly pulled down internally through a 400-k resistor to keep EN logic low when the pin is floating. The pull-down resistor is not connected when EN is set high. Once the voltage on the enable pin (EN) is set high the Nano Module will start operation. If EN is set low ( < 0.3 V ) the LMZ21701 will enter shutdown mode. The typical shutdown quiescent current is 1.5 A. 7.4.3 Soft Start and Tracking Function (SS) When EN is set high for device operation the LMZ21701 start switching after 50-s delay, and the output voltage starts rising. The VOUT rising slope is controlled by the external capacitor CSS connected to the softstart (SS) pin. The Nano Module has a 2.9 A constant current source internally connected to the SS pin to program the softstart time TSS: TSS = CSS x 1.25 V / 2.9 A (1) The soft-start capacitor voltage is reset to zero volts when EN is pulled low and when the thermal protection is active. If tracking function is desired, the SS pin can be used to track external voltage. If the applied external tracking voltage is between 100 mV and 1.2 V, the FB voltage will follow SS according to the following relationship: VFB = 0.64 x VSS (2) 7.4.4 Power Good Function (PG) The LMZ21701 features a power good function which can be used for sequencing of multiple rails. The PG pin is an open-drain output and requires a pull-up resistor RPG to VOUT (or any other external voltage less than 7 V). When the Nano Module is enabled and UVLO is satisfied, the power good function starts monitoring the output voltage. The PG pin is kept at logic low if the output has not reached the proper regulation voltage. Refer to the Electrical Characteristics table for the PG voltage thresholds. The PG pin can sink 2 mA of current which sets the minimum limit of the RPG resistance value: RPG-MIN= VPULL-UP / 2 mA (3) The PG pin goes low impedance if the device is disabled or the thermal protection is active. 7.4.5 Output Voltage Setting The output voltage of the LMZ21701 is set by a resistive divider from VOUT to GND, connected to the feedback (FB) pin. The output voltage can be set between 0.9 V and 6 V. The voltage at the FB pin is regulated to 0.8 V. The recommended minimum divider current is 2 A. This sets a maximum limit on the bottom feedback resistor RFBB. Its value must not exceed 400 k. The top feedback resistor RFBT can be calculated using the following formula: RFBT = RFBB x (VOUT/ 0.8 - 1) (4) 7.4.6 Output Current Limit and Output Short Circuit Protection The LMZ21701 has integrated protection against heavy loads and output short circuit events. Both, the high-side FET and low-side FET have current monitoring circuitry. If the current limit threshold of the high-side FET is reached , the high-side FET will be turned off and the low-side FET will be turned on to ramp down the inductor current. Once the current through the low-side FET has decreased below a safe level, the high-side device will be allowed to turn on again. The actual DC output current depends on the input voltage, output voltage, and switching frequency. Refer to the Application Curves section for more information. Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 11 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com Feature Description (continued) 7.4.7 Thermal Protection The nano module monitors its junction temperature (Tj) and shuts itself off if the it gets too hot. The thermal shutdown threshold for the junction is typically 160 C. Both, high-side and low-side FETs are turned off until the junction temperature has decreased under the hysteresis level, typically 30 C below the shutdown temperature. 7.5 Device Functional Modes 7.5.1 PWM Mode Operation The LMZ21701 operates in PWM mode when the output current is greater than half the inductor ripple current. The frequency variation in PWM mode is controlled and depends on the VIN and VOUT settings. Refer to the Application Curves section for switching frequency graphs for several typical output voltage settings. As the load current is decreased and the valley of the inductor current ripple reaches 0 A the device enters PSM operation to maintain high efficiency. 7.5.2 PSM Operation Once the load current decreases and the valley of the inductor current reaches 0 A, the LMZ21701 transitions to power save mode of operation. The device will remain in PSM as long as the inductor current is discontinuous. The switching frequency will decrease linearly with the load current. If VIN decreases to about 15 % above VOUT the device will not enter PSM and will maintain output regulation in PWM mode. 12 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LMZ21701 is a step down DC-to-DC converter. It is used to convert higher DC voltage to a regulated lower DC voltage with maximum load current of 1 A. The following design procedure can be used to select components for the LMZ21701. Alternatively, the WEBENCH(R) software can be used to select from a large database of components, run electrical simulations, and optimize the design for specific performance. Please go to webench.ti.com to access the WEBENCH(R) tool. 8.2 Typical Application For a quick start, the following component values can be used as a design starting point for several typical output voltage rails and 1 A of output load current. VOUT VIN VIN VOUT EN PG RPG LMZ21701 CIN COUT VOS SS RFBT CSS GND FB RFBB COMPONENT VALUES FOR VOUT=1.2V CIN 22F COUT 22F * 10V X7R or X5R CSS 3300pF * 10V X7R or X5R RFBT 41.2k 1% RFBB 82.5k 1% RPG 10k 1% * 25V X7R or X5R Figure 14. Typical Applications Circuit Figure 15. External Component Values ( VOUT = 1.2 V ) COMPONENT VALUES FOR VOUT=1.8V COMPONENT VALUES FOR VOUT=2.5V CIN X7R or X5R CIN 22F * 10V X7R or X5R COUT 22F * 10V X7R or X5R * 10V X7R or X5R CSS 3300pF * 10V X7R or X5R 1% RFBT 357k 1% 118k 1% RFBB 169k 1% 10k 1% RPG 10k 1% 22F COUT 22F CSS 3300pF RFBT 147k RFBB RPG * 25V * 25V X7R or X5R Figure 16. External Component Values ( VOUT = 1.8 V ) Figure 17. External Component Values ( VOUT = 2.5 V ) COMPONENT VALUES FOR VOUT=3.3V COMPONENT VALUES FOR VOUT=5.0V CIN X7R or X5R CIN 22F * 10V X7R or X5R COUT 22F * 10V X7R or X5R * 10V X7R or X5R CSS 3300pF * 10V X7R or X5R 1% RFBT 232k 1% 383k 1% RFBB 44.2k 1% 10k 1% RPG 10k 1% 22F COUT 22F CSS 3300pF RFBT 1.21M RFBB RPG * 25V Figure 18. External Component Values ( VOUT = 3.3 V ) * 25V X7R or X5R Figure 19. External Component Values ( VOUT = 5.0 V ) Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 13 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com Typical Application (continued) 8.2.1 Design Requirements The design procedure requires a few typical design parameters. See Table 1 below. Table 1. Design Parameters DESIGN PARAMETER VALUE Input Voltage (VIN) Range from 3.0 V to 17 V Output Voltage (VOUT) Range from 0.9 V to 6 V Output Current (IOUT) Up to 1000 mA Softstart time (TSS) Minimum of 0.5 ms recommended 8.2.2 Detailed Design Procedure 8.2.2.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the LMZ21701 device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. 8.2.2.2 Input Capacitor (CIN) Low ESR multi-layer ceramic capacitors (MLCC) are recommended for the input capacitor of the LMZ21701. Using a 10 F ceramic input capacitor in 0805 (2012 metric) case size with 25-V rating typically provides sufficient VIN bypass. Use of multiple capacitors can also be considered. Ceramic capacitors with X5R and X7R temperature characteristics are recommended. These provide an optimal balance between small size, cost, reliability, and performance for applications with limited space. The DC voltage bias characteristics of the capacitors must be considered when selecting the DC voltage rating and case size of these components. The effective capacitance of an MLCC is typically reduced by the DC voltage bias applied across its terminals. Selecting a part with larger capacitance, larger case size, or higher voltage rating can compensate for the capacitance loss due to the DC voltage bias effect. For example, a 10-F, X7R, 25-V rated capacitor used under 12-V DC bias may have approximately 8-F effective capacitance in a 1210 (3225 metric) case size and about 6 F in a 1206 (3216 metric) case size. As another example, a 10-F, X7R, 16-V rated capacitor in a 1210 (3225 metric) case size used at 12-V DC bias may have approximately 5.5 F effective capacitance. Check the capacitor specifications published by the manufacturer. 8.2.2.3 Output Capacitor (COUT) Similarly to the input capacitor, it is recommended to use low ESR multi-layer ceramic capacitors for COUT. Ceramic capacitors with X5R and X7R temperature characteristics are recommended. Use 10 F or larger value and consider the DC voltage bias characteristics of the capacitor when choosing the case size and voltage rating. For stability, the output capacitor should be in the 10 F - 200 F effective capacitance range. 14 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 8.2.2.4 Soft-start Capacitor (CSS) The softstart capacitor is chosen according to the desired softstart time. As described in the Softstart and Tracking Function section the softstart time TSS = CSS x 1.25 V / 2.9 A. A minimum CSS value of 1000 pF is required for monotonic VOUT ramp up. 8.2.2.5 Power Good Resistor (RPG) If the Power Good function is used, a pull up resistor RPG is necessary from the PG pin to an external pull-up voltage. The minimum RPG value is restricted by the pull down current capability of the internal pull down device. RPG-MIN= VPULL-UP / 2 mA (5) The maximum RPG value is based on the maximum PG leakage current and the minimum "logic high" level system requirements: RPG-MAX= (VPULL-UP - VLOGIC-HIGH) / ILKG_PG (6) 8.2.2.6 Feedback Resistors (RFBB and RFBT) The feedback resistors RFBB and RFBT set the desired output voltage. Choose RFBB less than 400 k and calculate the value for RFBT using the following formula: RFBT = RFBB x (VOUT/ 0.8 - 1) (7) Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 15 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com 8.2.3 Application Curves 8.2.3.1 VOUT = 1.2 V VOUT VIN VIN VOUT EN PG COMPONENT VALUES FOR VOUT=1.2V RPG LMZ21701 CIN SS COUT VOS RFBT CSS GND FB RFBB CIN 22F * 25V X7R or X5R COUT 22F * 10V X7R or X5R CSS 3300pF * 10V X7R or X5R RFBT 41.2k 1% RFBB 82.5k 1% RPG 10k 1% Figure 20. Typical Applications Circuit Figure 21. External Component Values (VOUT = 1.2 V) 100 0.6 VIN = 3 V VIN = 3.3 V VIN = 4.5 V VIN = 5 V VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 90 0.5 Power Dissipation (W) 80 Efficiency (%) 70 60 50 40 30 VIN = 3 V VIN = 3.3 V VIN = 4.5 V VIN = 5 V 20 10 0 0.0001 VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 0.4 0.3 0.2 0.1 0.0 0.0 0.001 0.01 Load Current (A) 0.1 0.1 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Load Current (A) D013 1.0 C001 Figure 23. Power Dissipation VOUT = 1.2 V Figure 22. Efficiency VOUT = 1.2 V ILOAD 500mA/Div PGOOD 1V/Div ILOAD 500mA/Div VOUT 500mV/Div VOUT 20mV/Div AC ENABLE 500mV/Div 1ms/Div 20MHz BW Figure 24. Load Transient VOUT = 1.2 V 16 1ms/Div 20MHz BW Submit Documentation Feedback Figure 25. Startup VOUT = 1.2 V Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 COUT1 = 22 F 10V 0805 X5R Taiyo Yuden MK212BJ226MG-T VOUT RIPPLE VOUT RIPPLE COUT = 22 F 10V 0805 X5R WITH 500MHz SCOPE BANDWIDTH COUT2 = 3x1000pF 0805 NP0 Johanson Dielectrics 500R15N102JV4T Taiyo Yuden MK212BJ226MG-T 50mV/Div 10mV/Div 1s/Div 20MHz BW Figure 26. 20 MHz Oscilloscope Bandwidth Output Voltage Ripple VOUT = 1.2 V 500MHz BW Figure 27. 500 MHz Oscilloscope Bandwidth, 3x1000 pF additional output capacitance Output Voltage Ripple and HF Noise VOUT = 1.2 V 1.8 VOUT=1.2V 2.0 1.5 1.0 0.5 TYPICAL DC CURRENT LIMIT (A) SWITCHING FREQUENCY (MHz) 2.5 0.0 1.6 1.4 1.2 1.0 0.8 0.6 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) 18 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) C001 Figure 28. Typical Switching Frequency at 1000 mA Load VOUT = 1.2 V 18 C001 Figure 29. Typical Current Limit VOUT = 1.2 V, TA = 85 C 1.206 1.2 1.202 VIN = 12 V VIN = 15 V VIN = 17 V 1.0 Output Current (A) VIN = 3 V VIN = 3.3 V VIN = 4.5 V VIN = 5 V 1.204 Output Voltage (V) 1s/Div 1.2 1.198 1.196 1.194 0.8 0.6 0.4 VIN = 3.3 V VIN = 5 V VIN = 12 V VIN = 17 V 0.2 1.192 0.0 1.19 0.0001 60 0.001 0.01 Load Current (A) 0.1 1 D014 Figure 30. Line and Load Regulation VOUT = 1.2 V 70 80 90 100 110 120 Ambient Temperature (C) 130 C001 Figure 31. Thermal Derating for JA = 47 C/W, VOUT = 1.2 V Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 17 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com 8.2.3.2 VOUT = 1.8 V VOUT VIN VIN VOUT EN PG COMPONENT VALUES FOR VOUT=1.8V RPG LMZ21701 CIN SS COUT VOS RFBT CSS GND FB RFBB CIN 22F COUT 22F * 10V X7R or X5R CSS 3300pF * 10V X7R or X5R RFBT 147k 1% RFBB 118k 1% RPG 10k 1% Figure 32. Typical Applications Circuit 0.6 VIN = 3 V VIN = 3.3 V VIN = 4.5 V VIN = 5 V VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 90 0.5 Power Dissipation (W) 80 Efficiency (%) 70 60 50 40 30 VIN = 3 V VIN = 3.3 V VIN = 4.5 V VIN = 5 V 10 0 0.0001 VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 0.4 0.3 0.2 0.1 0.0 0.0 0.001 0.01 Load Current (A) 0.1 X7R or X5R Figure 33. External Component Values (VOUT = 1.8 V) 100 20 * 25V 0.1 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Load Current (A) D015 1.0 C001 Figure 35. Power Dissipation VOUT = 1.8 V Figure 34. Efficiency VOUT = 1.8 V ILOAD 500mA/Div PGOOD 1V/Div ILOAD 500mA/Div VOUT 1V/Div VOUT 20mV/Div AC ENABLE 500mV/Div 1ms/Div 20MHz BW Figure 36. Load Transient VOUT = 1.8 V 18 1ms/Div 20MHz BW Submit Documentation Feedback Figure 37. Startup VOUT = 1.8 V Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 COUT1 = 22 F 10V 0805 X5R Taiyo Yuden MK212BJ226MG-T VOUT RIPPLE VOUT RIPPLE COUT = 22 F 10V 0805 X5R WITH 500MHz SCOPE BANDWIDTH COUT2 = 3x1000pF 0805 NP0 Johanson Dielectrics 500R15N102JV4T Taiyo Yuden MK212BJ226MG-T 10mV/Div 50mV/Div 1s/Div 20MHz BW Figure 38. 20 MHz Oscilloscope Bandwidth Output Voltage Ripple VOUT = 1.8 V 500MHz BW Figure 39. 500 MHz Oscilloscope Bandwidth, 3x1000 pF additional output capacitance Output Voltage Ripple and HF Noise VOUT = 1.8 V 1.8 VOUT=1.8V 2.0 1.5 1.0 0.5 TYPICAL DC CURRENT LIMIT (A) SWITCHING FREQUENCY (MHz) 2.5 0.0 1.6 1.4 1.2 1.0 0.8 0.6 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) 18 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) C001 Figure 40. Typical Switching Frequency at 1000 mA Load VOUT = 1.8 V 18 C001 Figure 41. Typical Current Limit VOUT = 1.8 V, TA = 85 C 1.81 1.2 1.806 VIN = 12 V VIN = 15 V VIN = 17 V 1.0 Output Current (A) VIN = 3 V VIN = 3.3 V VIN = 4.5 V VIN = 5 V 1.808 Output Voltage (V) 1s/Div 1.804 1.802 1.8 1.798 1.796 0.8 0.6 0.4 VIN = 3.3 V VIN = 5 V VIN = 12 V VIN = 17 V 0.2 1.794 1.792 0.0 1.79 0.0001 60 0.001 0.01 Load Current (A) 0.1 1 D016 Figure 42. Line and Load Regulation VOUT = 1.8 V 70 80 90 100 110 120 Ambient Temperature (C) 130 C001 Figure 43. Thermal Derating for JA= 47C/W VOUT = 1.8 V Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 19 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com 8.2.3.3 VOUT = 2.5 V VOUT VIN VIN VOUT EN PG COMPONENT VALUES FOR VOUT=2.5V RPG LMZ21701 CIN SS COUT VOS RFBT CSS GND FB RFBB CIN 22F COUT 22F * 10V X7R or X5R CSS 3300pF * 10V X7R or X5R RFBT 357k 1% RFBB 169k 1% RPG 10k 1% Figure 44. Typical Applications Circuit 0.6 VIN = 3.3 V VIN = 4.5 V VIN = 5 V VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 90 0.5 Power Dissipation (W) 80 Efficiency (%) 70 60 50 40 30 VIN = 3.3 V VIN = 4.5 V VIN = 5 V VIN = 9 V 10 0 0.0001 VIN = 12 V VIN = 15 V VIN = 17 V 0.4 0.3 0.2 0.1 0.0 0.0 0.001 0.01 Load Current (A) X7R or X5R Figure 45. External Component Values (VOUT = 2.5 V) 100 20 * 25V 0.1 0.1 1 D017 Figure 46. Efficiency VOUT = 2.5 V 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Load Current (A) 1.0 C001 Figure 47. Power Dissipation VOUT = 2.5 V ILOAD 500mA/Div PGOOD 2V/Div ILOAD 500mA/Div VOUT 1V/Div VOUT 20mV/Div AC ENABLE 500mV/Div 1ms/Div 20MHz BW 1ms/Div 20MHz BW Figure 48. Load Transient VOUT = 2.5 V 20 Submit Documentation Feedback Figure 49. Startup VOUT = 2.5 V Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 COUT1 = 22 F 10V 0805 X5R Taiyo Yuden MK212BJ226MG-T VOUT RIPPLE VOUT RIPPLE COUT = 22 F 10V 0805 X5R WITH 500MHz SCOPE BANDWIDTH COUT2 = 3x1000pF 0805 NP0 Johanson Dielectrics 500R15N102JV4T Taiyo Yuden MK212BJ226MG-T 10mV/Div 50mV/Div 1s/Div 20MHz BW Figure 50. 20MHz Oscilloscope Bandwidth Output Voltage Ripple VOUT = 2.5 V 500MHz BW Figure 51. 500 MHz Oscilloscope Bandwidth, 3x1000 pF additional output capacitance Output Voltage Ripple and HF Noise VOUT = 2.5 V 1.8 VOUT=2.5V 2.0 1.5 1.0 0.5 TYPICAL DC CURRENT LIMIT (A) SWITCHING FREQUENCY (MHz) 2.5 0.0 1.6 1.4 1.2 1.0 0.8 0.6 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) 18 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) C001 Figure 52. Typical Switching Frequency at 1000 mA Load VOUT = 2.5 V 18 C001 Figure 53. Typical Current Limit VOUT = 2.5 V, TA = 85 C 2.5 1.2 2.496 VIN = 12 V VIN = 15 V VIN = 17 V 1.0 Output Current (A) VIN = 3 V VIN = 3.3 V VIN = 4.5 V VIN = 5 V 2.498 Output Voltage (V) 1s/Div 2.494 2.492 2.49 2.488 2.486 0.8 0.6 0.4 VIN = 5 V VIN = 12 V VIN = 15 V VIN = 17 V 0.2 2.484 2.482 0.0 2.48 0.0001 60 0.001 0.01 Load Current (A) 0.1 1 D018 Figure 54. Line and Load Regulation VOUT = 2.5 V 70 80 90 100 110 120 Ambient Temperature (C) 130 C001 Figure 55. Thermal Derating for JA = 47 C/W, VOUT = 2.5 V Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 21 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com 8.2.3.4 VOUT = 3.3 V VOUT VIN VIN VOUT EN PG COMPONENT VALUES FOR VOUT=3.3V RPG LMZ21701 CIN SS COUT VOS RFBT CSS GND FB RFBB CIN 22F COUT 22F * 10V X7R or X5R CSS 3300pF * 10V X7R or X5R RFBT 1.21M 1% RFBB 383k 1% RPG 10k 1% Figure 56. Typical Applications Circuit 0.6 VIN = 4.5 V VIN = 5 V VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 90 0.5 Power Dissipation (W) 80 Efficiency (%) 70 60 50 40 30 VIN = 4.5 V VIN = 5 V VIN = 9 V 10 0 0.0001 0.4 0.3 0.2 0.1 VIN = 12 V VIN = 15 V VIN = 17 V 0.0 0.0 0.001 0.01 Load Current (A) 0.1 X7R or X5R Figure 57. External Component Values (VOUT = 3.3 V) 100 20 * 25V 0.1 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Load Current (A) D019 1.0 C001 Figure 59. Power Dissipation VOUT = 3.3 V Figure 58. Efficiency VOUT = 3.3 V ILOAD 500mA/Div VOUT 1V/Div ILOAD 500mA/Div PGOOD 2V/Div VOUT 20mV/Div AC ENABLE 500mV/Div 1ms/Div 20MHz BW 1ms/Div 20MHz BW Figure 60. Load Transient VOUT = 3.3 V 22 Submit Documentation Feedback Figure 61. Startup VOUT = 3.3 V Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 COUT1 = 22 F 10V 0805 X5R Taiyo Yuden MK212BJ226MG-T VOUT RIPPLE VOUT RIPPLE COUT = 22 F 10V 0805 X5R WITH 500MHz SCOPE BANDWIDTH COUT2 = 3x1000pF 0805 NP0 Johanson Dielectrics 500R15N102JV4T Taiyo Yuden MK212BJ226MG-T 10mV/Div 50mV/Div 1s/Div 20MHz BW Figure 62. 20 MHz Oscilloscope Bandwidth Output Voltage Ripple VOUT = 3.3 V 500MHz BW Figure 63. 500 MHz Oscilloscope Bandwidth, 3x1000 pF additional output capacitance Output Voltage Ripple and HF Noise VOUT = 3.3 V 1.8 VOUT=3.3V 2.0 1.5 1.0 0.5 TYPICAL DC CURRENT LIMIT (A) SWITCHING FREQUENCY (MHz) 2.5 0.0 1.6 1.4 1.2 1.0 0.8 0.6 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) 18 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) C001 Figure 64. Typical Switching Frequency at 1000 mA Load VOUT = 3.3 V 18 C001 Figure 65. Typical Current Limit VOUT = 3.3 V, TA = 85 C 3.316 1.2 VIN = 4.5 V VIN = 5 V VIN = 9 V 3.314 VIN = 12 V VIN = 15 V VIN = 17 V 1.0 Output Current (A) 3.312 Output Voltage (V) 1s/Div 3.31 3.308 3.306 3.304 0.8 0.6 0.4 VIN = 5 V VIN = 12 V VIN = 15 V VIN = 17 V 0.2 3.302 0.0 3.3 0.0001 60 0.001 0.01 Load Current (A) 0.1 1 D020 Figure 66. Line and Load Regulation VOUT = 3.3 V 70 80 90 100 110 120 Ambient Temperature (C) 130 C001 Figure 67. Thermal Derating for JA = 47 C/W, VOUT = 3.3 V Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 23 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com 8.2.3.5 VOUT = 5.0 V VOUT VIN VIN VOUT EN PG COMPONENT VALUES FOR VOUT=5.0V RPG LMZ21701 CIN SS COUT VOS RFBT CSS GND FB RFBB CIN 22F COUT 22F * 10V X7R or X5R CSS 3300pF * 10V X7R or X5R RFBT 232k 1% RFBB 44.2k 1% RPG 10k 1% Figure 68. Typical Applications Circuit 0.6 VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 90 0.5 Power Dissipation (W) 80 Efficiency (%) 70 60 50 40 30 VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 10 0 0.0001 0.4 0.3 0.2 0.1 0.0 0.0 0.001 0.01 Load Current (A) 0.1 X7R or X5R Figure 69. External Component Values (VOUT = 5.0 V) 100 20 * 25V 0.1 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Load Current (A) D021 1.0 C001 Figure 71. Power Dissipation VOUT = 5.0 V Figure 70. Efficiency VOUT = 5.0 V ILOAD 500mA/Div VOUT 2V/Div ILOAD 500mA/Div PGOOD 5V/Div VOUT 20mV/Div AC ENABLE 500mV/Div 1ms/Div 20MHz BW 1ms/Div 20MHz BW Figure 73. Startup VOUT = 5.0 V Figure 72. Load Transient VOUT = 5.0 V 24 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 COUT1 = 22 F 10V 0805 X5R Taiyo Yuden MK212BJ226MG-T VOUT RIPPLE VOUT RIPPLE COUT = 22 F 10V 0805 X5R WITH 500MHz SCOPE BANDWIDTH COUT2 = 3x1000pF 0805 NP0 Johanson Dielectrics 500R15N102JV4T Taiyo Yuden MK212BJ226MG-T 10mV/Div 50mV/Div 1s/Div 20MHz BW Figure 74. 20MHz Oscilloscope Bandwidth Output Voltage Ripple VOUT = 5.0 V 500MHz BW Figure 75. 500 MHz Oscilloscope Bandwidth, 3x1000 pF additional output capacitance Output Voltage Ripple and HF Noise VOUT = 5.0 V 1.8 2.0 1.5 1.0 0.5 VOUT=5.0V TYPICAL DC CURRENT LIMIT (A) SWITCHING FREQUENCY (MHz) 2.5 0.0 1.6 1.4 1.2 1.0 0.8 0.6 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) 18 0 2 4 6 8 10 12 14 16 INPUT VOLTAGE (V) C001 18 C001 Figure 76. Typical Switching Frequency at 1000 mA Load VOUT = 5 V Figure 77. Typical Current Limit VOUT = 5 V, TA = 85C 5.05 1.2 VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 5.04 5.035 1.0 Output Current (A) 5.045 Output Voltage (V) 1s/Div 5.03 5.025 5.02 5.015 5.01 5.005 0.8 0.6 0.4 VIN = 9 V VIN = 12 V VIN = 15 V VIN = 17 V 0.2 5 4.995 0.0 4.99 0.0001 60 0.001 0.01 Load Current (A) 0.1 1 D022 Figure 78. Line and Load Regulation VOUT = 5 V 70 80 90 100 110 120 Ambient Temperature (C) 130 C001 Figure 79. Thermal Derating for JA= 47 C/W, VOUT = 5 V Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 25 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com 8.3 Do's and Don'ts DO NOT exceed the Absolute Maximum Ratings. DO NOT exceed the Recommended Operating Conditions. DO NOT exceed the ESD Ratings. DO follow the Detailed Design Procedure. DO follow the PCB Layout Guidelines and Layout Example. DO follow the Power Supply Recommendations. DO visit the TI E2E Community Support Forum to have your questions answered and designs reviewed. 9 Power Supply Recommendations 9.1 Voltage Range The voltage of the input supply must not exceed the Absolute Maximum Ratings and the Recommended Operating Conditions of the LMZ21701. 9.2 Current Capability The input supply must be able to supply the required input current to the LMZ21701 converter. The required input current depends on the application's minimum required input voltage (VIN-MIN), the required output power (VOUT x IOUT-MAX), and the converter efficiency (). IIN = VOUT x IOUT-MAX / (VIN-MIN x ) For example, for a design with 10-V minimum input voltage, 5-V output, and 1-A maximum load, considering 90% conversion efficiency, the required input current is 0.556 A. 9.3 Input Connection Long input connection cables can cause issues with the normal operation of any buck converter. 9.3.1 Voltage Drops Using long input wires to connect the supply to the input of any converter adds impedance in series with the input supply. This impedance can cause a voltage drop at the VIN pin of the converter when the output of the converter is loaded. If the input voltage is near the minimum operating voltage, this added voltage drop can cause the converter to drop out or reset. If long wires are used during testing, it is recommended to add some bulk (for example, electrolytic) capacitance at the input of the converter. 9.3.2 Stability The added inductance of long input cables together with the ceramic (and low ESR) input capacitor can result in an under damped RLC network at the input of the Buck converter. This can cause oscillations on the input and instability. If long wires are used, it is recommended to add some electrolytic capacitance in parallel with the ceramic input capacitor. The electrolytic capacitor's ESR will improve the damping. Use an electrolytic capacitor with CELECTROLYTIC 4 x CCERAMIC and ESRELECTROLYTIC (LCABLE / CCERAMIC) For example, two cables (one for VIN and one for GND), each 1 meter (~3 ft) long with ~1-mm diameter (18 AWG), placed 1 cm (~0.4 in) apart will form a rectangular loop resulting in about 1.2 H of inductance. The inductance in this example can be decreased to almost half if the input wires are twisted. Based on a 22 F ceramic input capacitor, the recommended parallel CELECTROLYTIC is 88 F. Using a 100 F capacitor will be sufficient. The recommended ESRELECTROLYTIC 0.23 or larger, based on about 1.2 H of inductance and 22 F of ceramic input capacitance. See application note SNVA489C for more details on input filter design. 26 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 10 Layout 10.1 Layout Guidelines The PCB layout is critical for the proper operation of any DC/DC switching converter. Although using modules can simplify the PCB layout process, care should still be taken to minimize the inductance in the high di/dt loops and to protect sensitive nodes. The following guidelines should be followed when designing a board layout with the LMZ21701: 10.1.1 Minimize the High di/dt Loop Area The input capacitor, the VIN terminal, and the GND terminal of the LMZ21701 form a high di/dt loop. Place the input capacitor as close as possible to the VIN and GND terminals of the module IC. This minimizes the area of the high di/dt loop and results in lower inductance in the switching current path. Lower inductance in the switching current path translates to lower voltage spikes on the internal switch node and lower noise on the output voltage. Make the copper traces between the input capacitor and the VIN and GND terminals wide and short for better current handling and minimized parasitic inductance. 10.1.2 Protect the Sensitive Nodes in the Circuit The feedback node is a sensitive circuit which can pick up noise. Make the feedback node as small as possible. This can be achieved by placing the feedback divider as close as possible to the IC. Use thin traces to the feedback pin in order to minimize the parasitic capacitance to other nodes. The feedback network carries very small current and thick traces are not necessary. Another sensitive node to protect is the VOS pin. Use a thin and short trace from the VOUT terminal of the output capacitor to the VOS pin. The VOS pin is right next to the GND terminal. For very noisy systems, a small (0402 or 0201) 0.1 F capacitor can be placed from VOS to GND to filter high frequency noise on the VOS line. 10.1.3 Provide Thermal Path and Shielding Using the available layers in the PCB can help provide additional shielding and improved thermal performance. Large unbroken GND copper areas provide good thermal and return current paths. Flood unused PCB area with GND copper. Use thermal vias to connect the GND copper between layers. The required board area for proper thermal dissipation can be estimated using the power dissipation curves for the desired output voltage and the package thermal resistance vs. board area curve. Refer to the power dissipation graphs in the Typical Characteristics section. Using the power dissipation (PDISS) for the designed input and output voltage and the max operating ambient temperature TA for the application, estimate the required thermal resistance RJA with the following expression. RJA - REQUIRED (125C - TA) / PDISS (8) Then use Figure 80 to estimate the board copper area required to achieve the calculated thermal resistance. Thermal Resistance J-A (C/W) 100 2-LAYER 70 m (2 oz) Cu 4-LAYER 70 m (2 oz) Cu 90 80 70 60 50 40 30 20 0 5 10 Copper Area (cm2) 15 20 D012 Figure 80. Package Thermal Resistance vs. Board Copper Area Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 27 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com Layout Guidelines (continued) For example, for a design with 12-V input, 5-V output, and 1-A load the power dissipation according to Figure 7 is 0.53 W. For 85C ambient temperature, the RJA-REQUIRED is (125C - 85C) / 0.53 W, or 75C/W. Looking at Figure 80 the minimum copper area required to achieve this thermal resistance with a 4-layer board and 70 m (2 oz) copper is approximately 3 cm. 10.2 Layout Example The following example is for a 4-layer board. Layers 2 and 4 provide additional shielding and thermal path. If a 2layer board is used, apply the Layer 1 and Layer 3 copper patterns for the top and bottom layers, respectively. 28 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 GND VIAS TO MINIMIZE INDUCTANCE IN THE di/dt LOOP GND PLACE THE INPUT CAPACITOR AS CLOSE AS POSSIBLE TO THE MODULE VIN AND GND PINS VIN Layout Example (continued) VIN EN VOS GND GND SS FB PG VOUT LAYER 1 VOUT PLACE THE FEEDBACK DIVIDER AS CLOSE AS POSSIBLE TO THE MODULE TO KEEP THE FB NODE SMALL LAYER 2 UNBROKEN GND PLANE FOR THERMAL PERFORMANCE AND SHIELDING ENABLE CONNECTION VOS CONNECTION t KEEP AWAY FROM NOISE SOURCES LAYER 3 CONNECTION TO THE SOFTSTART CAPACITOR POWER GOOD FLAG CONNECTION UNBROKEN GND PLANE FOR THERMAL PERFORMANCE AND SHIELDING LAYER 4 Figure 81. Layout example Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 29 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com Layout Example (continued) 10.2.1 High Density Layout Example for Space Constrained Applications 10.2.1.1 35 mm Solution Size (Single Sided) The following layout example uses 0805 case size components for the input and output capacitors and 0402 case size components for the rest of the passives. LAYER 1 SS VIN FB EN LAYER 2 VIN PG VOS VOUT GND GND VOUT GND GND LAYER 3 LAYER 4 VOS VOUT Figure 82. 35 mm Solution Size (Single Sided) 30 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 11 Device and Documentation Support 11.1 Device Support Visit the TI E2E Community Support Forum to have your questions answered and designs reviewed. 11.1.1 Development Support 11.1.1.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the LMZ21701 device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. 11.2 Trademarks DCS-Control, MicroSiP are trademarks of Texas Instruments. WEBENCH is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.4 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 31 LMZ21701 SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 www.ti.com 12.1 Tape and Reel Information REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants 32 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant LMZ21701SILR uSiP SIL 8 3000 330.0 12.4 3.75 3.75 2.2 8.0 12.0 Q2 LMZ21701SILT uSiP SIL 8 250 178.0 13.2 3.75 3.75 2.2 8.0 12.0 Q2 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 LMZ21701 www.ti.com SNVS853E - AUGUST 2012 - REVISED AUGUST 2018 TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ21701SILR uSiP SIL 8 3000 383.0 353.0 58.0 LMZ21701SILT uSiP SIL 8 250 223.0 194.0 35.0 Submit Documentation Feedback Copyright (c) 2012-2018, Texas Instruments Incorporated Product Folder Links: LMZ21701 33 PACKAGE OPTION ADDENDUM www.ti.com 31-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LMZ21701SILR ACTIVE uSiP SIL 8 3000 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 125 TXN7203EC EA 7485 1701 1701 7485 EA LMZ21701SILT ACTIVE uSiP SIL 8 250 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 125 TXN7203EC EA 7485 1701 1701 7485 EA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 31-Aug-2018 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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