Si5341/40 Rev D Data Sheet Low-Jitter, 10 or 4-Output, Any-Frequency, Any-Output Clock Generator KEY FEATURES The any-frequency, any-output Si5341/40 clock generators combine a wide-band PLL with proprietary MultiSynthTM fractional synthesizer technology to offer a versatile and high performance clock generator platform. This highly flexible architecture is capable of synthesizing a wide range of integer and non-integer related frequencies up to 1 GHz on 10 differential clock outputs while delivering sub-100 fs rms phase jitter performance with 0 ppm error. Each of the clock outputs can be assigned its own format and output voltage enabling the Si5341/40 to replace multiple clock ICs and oscillators with a single device making it a true "clock tree on a chip." The Si5341/40 can be quickly and easily configured using ClockBuilderPro software. Custom part numbers are automatically assigned using a ClockBuilder ProTM for fast, free, and easy factory pre-programming or the Si5341/40 can be programmed via I2C and SPI serial interfaces. * Generates any combination of output frequencies from any input frequency * Ultra-low jitter of 90 fs rms * Input frequency range: * External crystal: 25 to 54 MHz * Differential clock: 10 to 750 MHz * LVCMOS clock: 10 to 250 MHz * Output frequency range: * Differential: 100 Hz to 1028 MHz * LVCMOS: 100 Hz to 250 MHz * Highly configurable outputs compatible with LVDS, LVPECL, LVCMOS, CML, and HCSL with programmable signal amplitude * Si5341: 4 input, 10 output, 64-QFN 9x9 mm * Si5340: 4 input, 4 output, 44-QFN 7x7 mm Applications: * Clock tree generation replacing XOs, buffers, signal format translators * Any-frequency clock translation * Clocking for FPGAs, processors, memory * Ethernet switches/routers * OTN framers/mappers/processors * Test equipment and instrumentation * Broadcast video 25-54 MHz XTAL XA 4 Input Clocks XB OSC /INT IN1 /INT IN2 /INT PLL Zero Delay FB_IN I2C / SPI Status Monitor Control silabs.com | Smart. Connected. Energy-friendly. NVM OUT0 MultiSynth /INT OUT1 MultiSynth /INT OUT2 MultiSynth /INT OUT3 MultiSynth /INT OUT4 /INT OUT5 /INT OUT6 /INT OUT7 /INT OUT8 /INT OUT9 Up to 10 Output Clocks Si5341 Status Flags /INT /INT Si5340 IN0 MultiSynth Rev. 1.0 Si5341/40 Rev D Data Sheet Features List 1. Features List The Si5341/40 Rev D features are listed below: * Generates any combination of output frequencies from any input frequency * Ultra-low jitter of 90 fs rms * Input frequency range: * External crystal: 25 to 54 MHz * Differential clock: 10 to 750 MHz * LVCMOS clock: 10 to 250 MHz * Output frequency range: * Differential: 100 Hz to 1028 MHz * LVCMOS: 100 Hz to 250 MHz * Highly configurable outputs compatible with LVDS, LVPECL, LVCMOS, CML, and HCSL with programmable signal amplitude * Locks to gapped clock inputs * Optional zero delay mode * Glitchless on the fly output frequency changes silabs.com | Smart. Connected. Energy-friendly. * DCO mode: as low as 0.001 ppb steps * Core voltage * VDD: 1.8 V 5% * VDDA: 3.3 V 5% * Independent output clock supply pins * 3.3 V, 2.5 V, or 1.8 V * Serial interface: I2C or SPI * In-circuit programmable with non-volatile OTP memory * ClockBuilder Pro software simplifies device configuration * Si5341: 4 input, 10 output, 64-QFN 9x9 mm * Si5340: 4 input, 4 output, 44-QFN 7x7 mm * Temperature range: -40 to +85 C * Pb-free, RoHS-6 compliant Rev. 1.0 | 1 Si5341/40 Rev D Data Sheet Ordering Guide 2. Ordering Guide Table 2.1. Si5341/40 Ordering Guide Ordering Part Number (OPN) Number of Input/Output Clocks Output Clock Frequency Range (MHz) Frequency Synthesis Mode 0.0001 to 1028 MHz Integer and 0.0001 to 350 MHz Fractional Package Temperature Range Si5341 Si5341A-D-GM1, 2 Si5341B-D-GM1, 2 Si5341C-D-GM1, 2 4/10 Si5341D-D-GM1, 2 0.0001 to 1028 MHz 0.0001 to 350 MHz 64-QFN 9x9 mm -40 to 85 C Integer Only Si5340 Si5340A-D-GM1, 2 Si5340B-D-GM1, 2 Si5340C-D-GM1, 2 4/4 Si5340D-D-GM1, 2 0.0001 to 1028 MHz Integer and 0.0001 to 350 MHz Fractional 0.0001 to 1028 MHz 0.0001 to 350 MHz 44-QFN 7x7 mm -40 to 85 C Integer Only Si5341/40-D-EVB Si5341-D-EVB Si5340-D-EVB -- -- -- Evaluation Board -- Note: 1. Add an R at the end of the OPN to denote tape and reel ordering options. 2. Custom, factory pre-programmed devices are available. Ordering part numbers are assigned by Silicon Labs and the ClockBuilder Pro software utility. Custom part number format is: e.g., Si5341A-Dxxxxx-GM, where "xxxxx" is a unique numerical sequence representing the preprogrammed configuration. 3. See 3.9 Custom Factory Preprogrammed Devicesand 3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory Pre-Programmed Devices for important notes about specifying a preprogrammed device to use features or device register settings not yet available in CBPro. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 2 Si5341/40 Rev D Data Sheet Ordering Guide Si534fg-Rxxxxx-GM Timing product family f = Multi-PLL clock family member (7, 6) g = Device grade (A, B, C, D) Product Revision* Custom ordering part number (OPN) sequence ID** Package, ambient temperature range (QFN, -40 C to +85C) *See Ordering Guide table for current product revision ** 5 digits; assigned by ClockBuilder Pro Figure 2.1. Ordering Part Number Fields silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 3 Si5341/40 Rev D Data Sheet Functional Description 3. Functional Description The Si5340/41-D combines a wide band PLL with next generation MultiSynth technology to offer the industry's most versatile and high performance clock generator. The PLL locks to either an external crystal between XA/XB or to an external clock connected to XA/XB or IN0, 1, 2. A fractional or integer multiplier takes the selected input clock or cystal frequency up to a very high frequency that is then divided by the MultiSynth output stage to any frequency in the range of 100 Hz to 1 GHz on each output. The MultiSynth stage can divide by both integer and fractional values. The high-resolution fractional MultiSynth dividers enable true any-frequency input to anyfrequency on any of the outputs. The output drivers offer flexible output formats which are independently configurable on each of the outputs. This clock generator is fully configurable via its serial interface (I2C/SPI) and includes in-circuit programmable non-volatile memory. 3.1 Power-up and Initialization Once power is applied, the device begins an initialization period where it downloads default register values and configuration data from NVM and performs other initialization tasks. Communicating with the device through the serial interface is possible once this initialization period is complete. No clocks will be generated until the initialization is done. There are two types of resets available. A hard reset is functionally similar to a device power-up. All registers will be restored to the values stored in NVM, and all circuits will be restored to their initial state including the serial interface. A hard reset is initiated using the RSTb pin or by asserting the hard reset bit. A soft reset bypasses the NVM download. It is simply used to initiate register configuration changes. Power-Up Hard Reset bit asserted RSTb pin asserted NVM download Soft Reset bit asserted Initialization Serial interface ready Figure 3.1. Si5341 Power-Up and Initialization 3.2 Frequency Configuration The phase-locked loop is fully contained and does not require external loop filter components to operate. Its function is to phase lock to the selected input and provide a common reference to the MultiSynth high-performance fractional dividers. A crosspoint mux connects any of the MultiSynth divided frequencies to any of the outputs drivers. Additional output integer dividers provide further frequency division by an even integer from 2 to (2^25)-2. The frequency configuration of the device is programmed by setting the input dividers (P), the PLL feedback fractional divider (Mn/Md), the MultiSynth fractional dividers (Nn/Nd), and the output integer dividers (R). Silicon Labs's ClockBuilder Pro configuration utility determines the optimum divider values for any desired input and output frequency plan. 3.3 Inputs The Si5340/41-D requires either an external crystal at its XA/XB pins or an external clock at XA/XB or IN0, 1, 2. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 4 Si5341/40 Rev D Data Sheet Functional Description 3.3.1 XA/XB Clock and Crystal Input An internal crystal oscillator exists between pin XA and XB. When this oscillator is enabled, an external crystal connected across these pins will oscillate and provide a clock input to the PLL. A crystal frequency of 25 MHz can be used although crystals in the frequency range of 48 MHz to 54 MHz are recommended for best jitter performance. Frequency offsets due to CL mismatch can be adjusted using the frequency adjustment feature which allows frequency adjustments of 1000 ppm. The Si5340/41 Family Reference Manual provides additional information on PCB layout recommendations for the crystal to ensure optimum jitter performance. Refer to Table 5.12 Crystal Specifications on page 31 for crystal specifications. To achieve optimal jitter performance and minimize BOM cost, a crystal is recommended on the XA/XB reference input. A clock (e.g., XO) may be used in lieu of the crystal, but it will result in higher output jitter. See the Si5340/41 Reference Manual for more information. Selection between the external XTAL or input clock is controlled by register configuration. The internal crystal load capacitors (CL) are disabled in the input clock mode. Refer to Table 5.3 Input Clock Specifications on page 20 for the input clock requirements at XAXB. Both a single-ended or a differential input clock can be connected to the XA/XB pins as shown in the figure below. A PXAXB divider is available to accommodate external clock frequencies higher than 54 MHz. Differential Connection Single- ended XO Connection nc X1 nc X2 nc X1 nc X2 Note: 2. 0 Vpp_ se max 0. 1 uf 100 2xCL 0. 1 uf XA 100 OSC XA OSC XB 2xCL 0. 1 uf 2xCL XO with Clipped Sine Wave 0. 1 uf XB Output Si5341/40 2xCL Si5341/40 Note: 2. 5 Vpp diff max Crystal Connection Single-ended Connection nc X1 nc X2 CMOS Output Note: 2. 0 Vpp_ se max 0. 1 uf R1 X1 2xCL XA OSC XO VDD R1 R2 3. 3 V 523 ohms442 ohms 2. 5 V 475ohms 649 ohms 1. 8 V 158 ohms 866 ohms R2 0. 1 uf 0. 1 uf 2xCL XA XTAL OSC XB XB 2xCL Si5341/40 X2 2xCL Si5341/40 Figure 3.2. XAXB External Crystal and Clock Connections silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 5 Si5341/40 Rev D Data Sheet Functional Description 3.3.2 Input Clocks (IN0, IN1, IN2) A differential or single-ended clock can be applied at IN2, IN1, or IN0. The recommended input termination schemes are shown in the figure below. Standard AC Coupled Differential LVDS 50 INx Si5341/40 Standard 100 3.3V, 2.5V LVDS or CML INxb 50 Pulsed CMOS Standard AC Coupled Differential LVPECL 50 INx Si5341/40 Standard 100 INxb 50 3.3V, 2.5V LVPECL Pulsed CMOS Standard AC Coupled Single Ended 50 INx 3.3V, 2.5V, 1.8V LVCMOS Si5341/40 Standard INxb Pulsed CMOS Pulsed CMOS DC Coupled Single Ended R1 Si5341/40 50 3.3V, 2.5V, 1.8V LVCMOS VDD 1.8 V 2.5 V 3.3 V R1 (Ohm) R2 (Ohm) 324 665 511 475 634 365 INx R2 Standard INxb Pulsed CMOS Figure 3.3. Termination of Differential and LVCMOS Input Signals silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 6 Si5341/40 Rev D Data Sheet Functional Description 3.3.3 Input Selection (IN0, IN1, IN2, XA/XB) The active clock input is selected using the IN_SEL[1:0] pins or by register control. A register bit determines input selection as pin or register selectable. There are internal pull ups on the IN_SEL pins. Table 3.1. Manual Input Selection Using IN_SEL[1:0] Pins IN_SEL[1:0] Selected Input 0 0 IN0 0 1 IN1 1 0 IN2 1 1 XA/XB 3.4 Fault Monitoring The Si5340/41-D provides fault indicators which monitor loss of signal (LOS) of the inputs (IN0, IN1, IN2, XA/XB, FB_IN) and loss of lock (LOL) for the PLL as shown in the figure below. IN0 /P0 IN0b Si5341/40 LOS0 LOL IN1 IN1b IN2 IN2b /P1 LOS1 /P2 LOS2 PLL PD LPF / Mn Md LOSXAB FB_IN /Pfb LOSFB LOSXAB (Si5340) FB _INb OSC INTRb XB LOLb XA Figure 3.4. LOS and LOL Fault Monitors 3.4.1 Status Indicators The state of the status monitors are accessible by reading registers through the serial interface or with dedicated pin (LOLb). Each of the status indicator register bits has a corresponding sticky bit in a separate register location. Once a status bit is asserted its corresponding sticky bit (_FLG) will remain asserted until cleared. Writing a logic zero to a sticky register bit clears its state. 3.4.2 Interrupt Pin (INTRb) An interrupt pin (INTRb) indicates a change in state with any of the status registers. All status registers are maskable to prevent assertion of the interrupt pin. The state of the INTRb pin is reset by clearing the status registers. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 7 Si5341/40 Rev D Data Sheet Functional Description 3.5 Outputs The Si5341 supports 10 differential output drivers which can be independently configured as differential or LVCMOS. The Si5340 supports 4 output drivers independently configurable as differential or LVCMOS. 3.5.1 Output Signal Format The differential output amplitude and common mode voltage are both fully programmable and compatible with a wide variety of signal formats including LVDS and LVPECL. In addition to supporting differential signals, any of the outputs can be configured as LVCMOS (3.3 V, 2.5 V, or 1.8 V) drivers providing up to 20 single-ended outputs, or any combination of differential and single-ended outputs. 3.5.2 Differential Output Terminations The differential output drivers support both ac-coupled and dc-coupled terminations as shown in the figure below. DC Coupled LVDS AC Coupled LVDS/LVPECL VDDO = 3.3V , 2.5V , 1.8V VDDO = 3.3V , 2.5V , 1.8V OUTx 50 OUTx 100 OUTxb 100 OUTxb 50 50 50 Si 5341/40 AC Coupled LVPECL/CML AC Coupled HCSL VDD- 1.3V VDDRX VDDO = 3.3V, 2.5V, 1.8V VDDO = 3.3V , 2.5V R1 OUTx Internally self-biased Si 5341/40 50 OUTx Standard HCSL Receiver OUTxb 50 Si5341/40 50 R1 R2 R2 50 50 OUTxb 50 Si 5341/40 Option For VCM = 0.137 V VDDRX 3. 3 V 2. 5 V 1. 8 V R1 R2 442 ohms 56.2 ohms 332 ohms 59 ohms 243 ohms 63.4 ohms Figure 3.5. Supported Differential Output Terminations 3.5.3 Programmable Common Mode Voltage for Differential Outputs The common mode voltage (VCM) for the differential modes are programmable so that LVDS specifications can be met and for the best signal integrity with different supply voltages. When dc coupling the output driver it is essential that the receiver should have a relatively high common mode impedance so that the common mode current from the output driver is very small. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 8 Si5341/40 Rev D Data Sheet Functional Description 3.5.4 LVCMOS Output Terminations LVCMOS outputs are typically dc-coupled, as shown in the figure below. DC Coupled LVCMOS 3.3V , 2.5V , 1.8 V LVCMOS VDDO = 3.3V , 2.5V , 1.8V 50 OUTx Rs OUTxb 50 Rs Figure 3.6. LVCMOS Output Terminations 3.5.5 LVCMOS Output Impedance and Drive Strength Selection Each LVCMOS driver has a configurable output impedance. It is highly recommended that the minimum output impedance (strongest drive setting) is selected and a suitable series resistor (Rs) is chosen to match the trace impedance. Table 3.2. Nominal Output Impedance vs. OUTx_CMOS_DRV (register) VDDO CMOS_DRIVE_Selection OUTx_CMOS_DRV=1 OUTx_CMOS_DRV=2 OUTx_CMOS_DRV=3 3.3 V 38 30 22 2.5 V 43 35 24 1.8 V -- 46 31 Note: Refer to the Si5340/41 Family Reference Manual for more information on register settings. 3.5.6 LVCMOS Output Signal Swing The signal swing (VOL/VOH) of the LVCMOS output drivers is set by the voltage on the VDDO pins. Each output driver has its own VDDO pin allowing a unique output voltage swing for each of the LVCMOS drivers. 3.5.7 LVCMOS Output Polarity When a driver is configured as an LVCMOS output it generates a clock signal on both pins (OUTx and OUTxb). By default the clock on the OUTxb pin is generated with complementary polarity with the clock on the OUTx pin. The LVCMOS OUTx and OUTxb outputs can also be generated in phase. 3.5.8 Output Enable/Disable The OEb pin provides a convenient method of disabling or enabling the output drivers. When the OEb pin is held high all outputs will be disabled. When held low, the outputs will be enabled. Outputs in the enabled state can be individually disabled through register control. 3.5.9 Output Driver State When Disabled The disabled state of an output driver is configurable as: disable low or disable high. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 9 Si5341/40 Rev D Data Sheet Functional Description 3.5.10 Synchronous/Asynchronous Output Disable Feature Outputs can be configured to disable synchronously or asynchronously. The default state is synchronous output disable. In synchronous disable mode the output will wait until a clock period has completed before the driver is disabled. This prevents unwanted runt pulses from occurring when disabling an output. In asynchronous disable mode the output clock will disable immediately without waiting for the period to complete. 3.5.11 Output Delay Control (t0-t4) The Si5341/40 uses independent MultiSynth dividers (N0 - N4) to generate up to 5 unique frequencies to its 10 outputs through a crosspoint switch. By default all clocks are phase aligned. A delay path (t0 - t4) associated with each of these dividers is available for applications that need a specific output skew configuration. Each delay path is controlled by a register parameter call Nx_DELAY with a resolution of ~0.28 ps over a range of ~9.14 ns. This is useful for PCB trace length mismatch compensation. After the delay controls are configured, the soft reset bit SOFT_RST must be set high so that the output delay takes effect and the outputs are re-aligned. /N0 /N1 t0 t1 /N2 t2 /N3 t3 /N4 t4 /R0 VDDO0 OUT0 OUT0b /R1 VDDO1 OUT1 OUT1b /R2 VDDO2 OUT2 OUT2b /R3 VDDO3 OUT3 OUT3b /R4 VDDO4 OUT4 OUT4b /R5 VDDO5 OUT5 OUT5b /R6 VDDO6 OUT6 OUT6b /R7 VDDO7 OUT7 OUT7b /R8 VDDO8 OUT8 OUT8b /R9 VDDO9 OUT9 OUT9b Figure 3.7. Example of Independently Configurable Path Delays All delay values are restored to their NVM programmed values after power-up or after a hard reset. Delay default values can be written to the NVM allowing a custom delay offset configuration at power-up or after a hardware reset. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 10 Si5341/40 Rev D Data Sheet Functional Description 3.5.12 Zero Delay Mode A zero delay mode is available for applications that require fixed and consistent minimum delay between the selected input and outputs. The zero delay mode is configured by opening the internal feedback loop through software configuration and closing the loop externally as shown in the figure below. This helps to cancel out the internal delay introduced by the dividers, the crosspoint, the input, and the output drivers. Any one of the outputs can be fed back to the FB_IN pins, although using the output driver that achieves the shortest trace length will help to minimize the input-to-output delay. It is recommended to connect OUT9 (Si5341) or OUT3 (Si5340) to FB_IN for external feedback. The FB_IN input pins must be terminated and ac-coupled when zero delay mode is used. A differential external feedback path connection is necessary for best performance. VDDO0 OUT0 OUT0b Si5341 IN0 IN0b fIN VDDO1 OUT1 OUT1b / P0 IN1 IN1b IN2 IN2b / P1 VDDO2 OUT2 OUT2b / P2 VDDO3 OUT3 OUT3b IN_ SEL[1:0] FB_IN PD / FB_INb VDDO7 OUT7 OUT7b LPF /Pfb 100 fFB = fIN Zero Delay Mode MultiSynth & Dividers PLL Mn Md VDDO8 OUT8 OUT8b N / 9n N9d /R9 VDDO9 OUT9 OUT9b External Feedback Path Figure 3.8. Si5341 Zero Delay Mode Setup 3.5.13 Sync Pin (Synchronizing R Dividers) All the output R dividers are reset to the default NVM register state after a power-up or a hard reset. This ensures consistent and repeatable phase alignment across all output drivers to within 100 ps of the expected value from the NVM download. Resetting the device using the RSTb pin or asserting the hard reset bit will have the same result. The SYNCb pin provides another method of re-aligning the R dividers without resetting the device, however, the outputs will only align to within 50 ns when using the SYNCb pin. This pin is positive edge triggered. Asserting the sync register bit provides the same function as the SYNCb pin. A soft reset will align the outputs to within 100 ps of the expected value based upon the Nx_DELAY parameter. 3.5.14 Output Crosspoint The output crosspoint allows any of the N dividers to connect to any of the clock outputs. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 11 Si5341/40 Rev D Data Sheet Functional Description 3.5.15 Digitally Controlled Oscillator (DCO) Modes Each MultiSynth can be digitally controlled so that all outputs connected to the MultiSynth change frequency in real time without any transition glitches. There are two ways to control the MultiSynth to accomplish this task: * Use the Frequency Increment/Decrement Pins or register bits. * Write directly to the numerator of the MultiSynth divider. An output that is controlled as a DCO is useful for simple tasks such as frequency margining or CPU speed control. The output can also be used for more sophisticated tasks such as FIFO management by adjusting the frequency of the read or write clock to the FIFO or using the output as a variable Local Oscillator in a radio application. 3.5.15.1 DCO with Frequency Increment/Decrement Pins/Bits Each of the MultiSynth fractional dividers can be independently stepped up or down in predefined steps with a resolution as low as 0.001 ppb. Setting of the step size and control of the frequency increment or decrement is accomplished by setting the step size with the 44 bit Frequency Step Word (FSTEPW). When the FINC or FDEC pin or register bit is asserted the output frequency will increment or decrement respectively by the amount specified in the FSTEPW. 3.5.15.2 DCO with Direct Register Writes When a MultiSynth numerator and its corresponding update bit is written, the new numerator value will take effect and the output frequency will change without any glitches. The MultiSynth numerator and denominator terms can be left and right shifted so that the least significant bit of the numerator word represents the exact step resolution that is needed for your application. 3.6 Power Management Several unused functions can be powered down to minimize power consumption. Consult the Si5340/41 Family Reference Manual and ClockBuilder Pro configuration utility for details. 3.7 In-Circuit Programming The Si5341/40 is fully configurable using the serial interface (I2C or SPI). At power-up the device downloads its default register values from internal non-volatile memory (NVM). Application specific default configurations can be written into NVM allowing the device to generate specific clock frequencies at power-up. Writing default values to NVM is in-circuit programmable with normal operating power supply voltages applied to its VDD and VDDA pins. The NVM is two time writable. Once a new configuration has been written to NVM, the old configuration is no longer accessible. Refer to the Si5340/41 Family Reference Manual for a detailed procedure for writing registers to NVM. 3.8 Serial Interface Configuration and operation of the Si5341/40 is controlled by reading and writing registers using the I2C or SPI interface. The I2C_SEL pin selects I2C or SPI operation. Communication with both 3.3 V and 1.8 V host is supported. The SPI mode operates in either 4-wire or 3-wire. See the Si5340/41 Family Reference Manual for details. 3.9 Custom Factory Preprogrammed Devices For applications where a serial interface is not available for programming the device, custom pre-programmed parts can be ordered with a specific configuration written into NVM. A factory pre-programmed device will generate clocks at power-up. Custom, factory-preprogrammed devices are available. Use the ClockBuilder Pro custom part number wizard (www.silabs.com/clockbuilderpro) to quickly and easily request and generate a custom part number for your configuration. In less than three minutes, you will be able to generate a custom part number with a detailed data sheet addendum matching your design's configuration. Once you receive the confirmation email with the data sheet addendum, simply place an order with your local Silicon Labs sales representative. Samples of your pre-programmed device will ship to you typically within two weeks. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 12 Si5341/40 Rev D Data Sheet Functional Description 3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory Pre-Programmed Devices As with essentially all software utilities, ClockBuilder Pro is continuously updated and enhanced. By registering at http:// www.silabs.comand opting in for updates to software, you will be notified whenever changes are made and what the impact of those changes are. This update process will ultimately enable ClockBuilder Pro users to access all features and register setting values documented in this data sheet and the Si5341/40 Family Reference Manual. However, if you must enable or access a feature or register setting value so that the device starts up with this feature or a register setting, but the feature or register setting is NOT yet available in CBPro, you must contact a Silicon Labs applications engineer for assistance. An example of this type of feature or custom setting is the customizable amplitudes for the clock outputs. After careful review of your project file and custom requirements, a Silicon Labs applications engineer will email back your CBPro project file with your specific features and register settings enabled, using what is referred to as the manual "settings override" feature of CBPro. "Override" settings to match your request(s) will be listed in your design report file. Examples of setting "overrides" in a CBPro design report are shown below: Table 3.3. Setting Overrides Location Name Type Target Dec Value Hex Value 0128[6:4] OUT6_AMPL User OPN & EVB 5 5 Once you receive the updated design file, simply open it in CBPro. After you create a custom OPN, the device will begin operation after startup with the values in the NVM file, including the Silicon Labs-supplied override settings. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 13 Si5341/40 Rev D Data Sheet Functional Description End: Place sample order Start Do I need a pre-programmed device with a feature or setting which is unavailable in ClockBuilder Pro? No Configure device using CBPro Generate Custom OPN in CBPro Yes Contact Silicon Labs Technical Support to submit & review your non-standard configuration request & CBPro project file Receive updated CBPro project file from Silicon Labs with "Settings Override" Yes Load project file into CBPro and test Does the updated CBPro Project file match your requirements? Figure 3.9. Flowchart to Order Custom Parts with Features not Available in CBPro Note: Contact Silicon Labs Technical Support at www.silabs.com/support/Pages/default.aspx. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 14 Si5341/40 Rev D Data Sheet Register Map 4. Register Map The register map is divided into multiple pages where each page has 256 addressable registers. Page 0 contains frequently accessible registers such as alarm status, resets, device identification, etc. Other pages contain registers that need less frequent access such as frequency configuration, and general device settings. A high level map of the registers is shown in 4.2 High-Level Register Map. Refer to the Si5340/41 Family Reference Manual for a complete list of register descriptions and settings. 4.1 Addressing Scheme The device registers are accessible using a 16-bit address which consists of an 8-bit page address + 8-bit register address. By default the page address is set to 0x00. Changing to another page is accomplished by writing to the `Set Page Address' byte located at address 0x01 of each page. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 15 Si5341/40 Rev D Data Sheet Register Map 4.2 High-Level Register Map Table 4.1. High-Level Register Map 16-Bit Address Content 8-bit Page Address 8-bit Register Address Range 00 00 Revision IDs 01 Set Page Address 02-0A Device IDs 0B-15 Alarm Status 17-1B INTR Masks 1C Reset controls 2C-E1 Alarm Configuration E2-E4 NVM Controls FE Device Ready Status 01 Set Page Address 08-3A Output Driver Controls 41-42 Output Driver Disable Masks FE Device Ready Status 01 Set Page Address 02-05 XTAL Frequency Adjust 08-2F Input Divider (P) Settings 30 Input Divider (P) Update Bits 35-3D PLL Feedback Divider (M) Settings 3E PLL Feedback Divider (M) Update Bit 47-6A Output Divider (R) Settings 6B-72 User Scratch Pad Memory FE Device Ready Status 01 Set Page Address 02-37 MultiSynth Divider (N0-N4) Settings 0C MultiSynth Divider (N0) Update Bit 17 MultiSynth Divider (N1) Update Bit 22 MultiSynth Divider (N2) Update Bit 2D MultiSynth Divider (N3) Update Bit 38 MultiSynth Divider (N4) Update Bit 39-58 FINC/FDEC Settings N0-N4 59-62 Output Delay (Dt) Settings 63-94 Frequency Readback N0-N4 FE Device Ready Status 01 02 03 silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 16 Si5341/40 Rev D Data Sheet Register Map 16-Bit Address Content 8-bit Page Address 8-bit Register Address Range 04-08 00-FF Reserved 09 01 Set Page Address 49 Input Settings 1C Zero Delay Mode Settings 00-FF Reserved A0-FF silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 17 Si5341/40 Rev D Data Sheet Electrical Specifications 5. Electrical Specifications Table 5.1. Recommended Operating Conditions1 (VDD=1.8 V 5%, VDDA=3.3 V 5%, TA= -40 to 85C) Parameter Symbol Min Typ Max Units Ambient Temperature TA -40 25 85 C Junction Temperature TJMAX -- -- 125 C Core Supply Voltage VDD 1.71 1.80 1.89 V VDDA 3.14 3.30 3.47 V VDDO 3.14 3.30 3.47 V 2.37 2.50 2.62 V 1.71 1.80 1.89 V Output Driver Supply Voltage Note: 1. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltages and an operating temperature of 25 C unless otherwise noted. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 18 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.2. DC Characteristics (VDD=1.8V 5%, VDDA=3.3V 5%, VDDO=1.8V 5%, 2.5V 5%, or 3.3V 5%, TA= -40 to 85C) Parameter Core Supply Current1, 2 Output Buffer Supply Current Symbol Test Condition Min Typ Max Units IDD Si5340/41 -- 115 230 mA IDDA Si5340/41 -- 120 130 mA IDDOx LVPECL Output3 -- 22 26 mA -- 15 18 mA -- 22 30 mA -- 18 23 mA -- 12 16 mA Si5341 -- 880 1150 mW Si5340 -- 680 875 mW @ 156.25 MHz LVDS Output3 @ 156.25 MHz 3.3 V LVCMOS4 output @ 156.25 MHz 2.5 V LVCMOS4 output @ 156.25 MHz 1.8 V LVCMOS4 output @ 156.25 MHz Total Power Dissipation1, 5 Pd Note: 1. Si5341 test configuration: 7 x 2.5 V LVDS outputs enabled @ 156.25 MHz. Excludes power in termination resistors. 2. Si5340 test configuration: 4 x 2.5 V LVDS outputs enabled @ 156.25 MHz. Excludes power in termination resistors. 3. Differential outputs terminated into an ac-coupled 100 load. 4. LVCMOS outputs measured into a 6-inch 50 W PCB trace with 5 pF load. The LVCMOS outputs were set to OUTx_CMOS_DRV=3, which is the strongest driver setting. Refer to the Si5341/40 Family Reference Manual for more details on register settings. Differential Output Test Configuration I DDO OUT 50 I DDO 0. 1 uF 100 OUTb 50 LVCMOS Output Test Configuration 6 inch OUTa OUTb 50 5 pF 0. 1 uF 5. Detailed power consumption for any configuration can be estimated using ClockBuilderPro when an evaluation board (EVB) is not available. All EVBs support detailed current measurements for any configuration. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 19 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.3. Input Clock Specifications (VDD=1.8V 5%, VDDA=3.3V 5%, TA=-40 to 85C) Parameter Symbol Test Condition Min Typ Max Units Standard Input Buffer with Differential or Single-Ended - AC-Coupled (IN0/IN0b, IN1/IN1b, IN2/IN2b, FB_IN/FB_INb) Input Frequency Range fIN Differential 0.008 -- 750 MHz All Single-ended Signals 0.008 -- 250 MHz 100 -- 1800 mVpp_se 225 -- 1800 mVpp_se 100 -- 3600 mVpp_se (including LVCMOS) Input Voltage Swing1 VIN Differential AC-coupled fIN < 250 MHz Differential AC-coupled 250 MHz < fIN < 750 MHz Single-ended AC-coupled fIN < 250 MHz Slew Rate2, 3 SR 400 -- -- V/s Duty Cycle DC 40 -- 60 % Input Capacitance CIN -- 0.3 -- pF Input Resistance RIN -- 16 -- k Pulsed CMOS Input Buffer - DC Coupled (IN0, IN1, IN2)4 Input Frequency fIN 0.008 -- 250 MHz Input Voltage VIL -0.2 -- 0.4 V VIH 0.8 -- -- V Slew Rate2, 3 SR 400 -- -- V/s Duty Cycle DC Clock Input 40 -- 60 % Minimum Pulse Width PW Pulse Input 1.6 -- -- ns Input Resistance RIN -- 8 -- k Full operating range. Jitter performance may be reduced. 10 -- 200 MHz Range for best jitter. 48 -- 54 MHz VIN_SE 365 -- 2000 mVpp_se VIN_DIFF 365 -- 2500 mVpp_diff 400 -- -- V/s 40 -- 60 % REFCLK (Applied to XA/XB) Input Frequency Range Input Single-ended Voltage Swing Input Differential Voltage Swing fIN Slew Rate2, 3 SR Input Duty Cycle DC silabs.com | Smart. Connected. Energy-friendly. Imposed for best jitter performance Rev. 1.0 | 20 Si5341/40 Rev D Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Units Note: 1. Voltage swing is specified as single-ended mVpp. Vcm Vpp_se Vcm Vpp_se Vpp_diff = 2*Vpp_se 2. Imposed for jitter performance. 3. Pulsed CMOS mode is intended primarily for single-ended LVCMOS input clocks < 1 MHz, which must be dc-coupled because they have a duty cycle significantly less than 50%. A typical application example is a low frequency video frame sync pulse. Since the input thresholds (VIL, VIH) of this buffer are non-standard (0.4 and 0.8 V, respectively), refer to the input attenuator circuit for DC-coupled Pulsed LVCMOS in the Family Reference Manual. Otherwise, for standard LVCMOS input clocks, use the Standard AC-Coupled, Single-ended input mode. 4. DC-coupled CMOS Input Buffer selection is not supported in ClockBuilder Pro for new designs. For single-ended LVCMOS inputs to IN0,1,2 it is required to ac-couple into the differential input buffer. Table 5.4. Control Input Pin Specifications (VDD=1.8V 5%, VDDA=3.3V 5%, VDDS=3.3V 5%, 1.8V 5%, TA=-40 to 85C) Parameter Symbol Test Condition Min Typ Max Units Si5341 Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, SYNCb, A1, SCLK, A0/CSb, FINC, FDEC, SDA/SDIO) Input Voltage VIL -- -- 0.3xVDDIO1 V VIH 0.7xVDDIO1 -- -- V Input Capacitance CIN -- 2 -- pF Input Resistance RIN -- 20 -- kW Minimum Pulse Width TPW RSTb, SYNCb, FINC, and FDEC 100 -- -- ns Frequency Update Rate FUR FINC and FDEC -- -- 1 MHz Si5340 Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, A1, SCLK, A0/CSb, SDA/SDIO) Input Voltage VIL -- -- 0.3xVDDIO1 V VIH 0.7xVDDIO1 -- -- V Input Capacitance CIN -- 2 -- pF Input Resistance RIN -- 20 -- kW Minimum Pulse Width TPW 100 -- -- ns RSTb only Note: 1. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. Refer to the Family Reference Manual for more details on register settings. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 21 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.5. Differential Clock Output Specifications (VDD=1.8 V 5%, VDDA=3.3V 5%, VDDO=1.8 V 5%, 2.5 V 5%, or 3.3 V 5%, TA= -40 to 85C) Parameter Output Frequency Duty Cycle Output-Output Skew Symbol Test Condition Min Typ Max Units fOUT MultiSynth not used 0.0001 -- 720 MHz 733.33 -- 800.00 825 -- 1028 MultiSynth used 0.0001 -- 720 MHz fOUT < 400 MHz 48 -- 52 % 400 MHz < fOUT < 1028 MHz 45 -- 55 % Outputs on same MultiSynth -- -- 65 ps -- -- 90 ps DC TSKS Using Same MultiSynth Output-Output Skew (Measured at 712.5 MHz) TSKD Between MultiSynths Outputs from different MultiSynths (Measured at 712.5 MHz) OUT-OUTb Skew Output Voltage Swing1 Common Mode Voltage1, 2 TSK_OUT Measured from the positive to negative output pins -- 0 50 ps VOUT LVDS 350 430 510 mVpp_se LVPECL 640 750 900 LVDS 1.10 1.2 1.3 LVPECL 1.90 2.0 2.1 LVPECL 1.1 1.2 1.3 0.8 0.9 1.0 tR/tF -- 100 150 ps ZO -- 100 -- 10 kHz sinusoidal noise -- -101 -- dBc 100 kHz sinusoidal noise -- -96 -- 500 kHz sinusoidal noise -- -99 -- 1 MHz sinusoidal noise -- -97 -- Si5341 -- -72 -- dBc Si5340 -- -88 -- dBc VCM VDDO = 3.3 V VDDO = 2.5 V V LVDS VDDO = 1.8 V Rise and Fall Times Sub-LVDS (20% to 80%) Differential Output Impedance Power Supply Noise Rejection2 Output-Output Crosstalk3 PSRR XTALK silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 22 Si5341/40 Rev D Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Units Notes: 1. Output amplitude and common-mode settings are programmable through register settings and can be stored in NVM. Each output driver can be programmed independently. The maximum LVDS single-ended amplitude can be up to 110 mV higher than the TIA/EIA-644 maximum. Refer to the Si5341/40 Family Reference Manual for more suggested output settings. Not all combinations of voltage amplitude and common mode voltages settings are possible. OUTx Vcm Vpp_se Vcm Vpp_se Vpp_ diff = 2* Vpp_se OUTxb 2. Measured for 156.25 MHz carrier frequency. 100 mVpp sinewave noise added to VDDO = 3.3 V and noise spur amplitude measured. 3. Measured across two adjacent outputs, both in LVDS mode, with the victim running at 155.52 MHz and the aggressor at 156.25 MHz. Refer to application note, AN862: Optimizing Si534x Jitter Performance in Next Generation Internet Infrastructure Systems, guidance on crosstalk minimization. Table 5.6. LVCMOS Clock Output Specifications (VDD=1.8V 5%, VDDA=3.3V 5%, VDDO=1.8V 5%, 2.5V 5%, or 3.3V 5%, TA= -40 to 85C) Parameter Symbol Test Condition Min Typ Max Units 0.0001 -- 250 MHz fOUT < 100 MHz 48 -- 52 % 100 MHz < fOUT < 250 MHz 45 -- 55 Outputs on same MultiSynth. -- 30 140 ps -- -- V Output Frequency Duty Cycle Output-to-Output Skew DC TSK FOUT = 156.25 MHz Output Voltage High1, 2, 3 VOH VDDO = 3.3 V OUTx_CMOS_DRV=1 IOH = -10 mA VDDO x 0.85 OUTx_CMOS_DRV=2 IOH = -12 mA -- -- OUTx_CMOS_DRV=3 IOH = -17 mA -- -- -- -- VDDO = 2.5 V VDDO x 0.85 OUTx_CMOS_DRV=1 IOH = -6 mA OUTx_CMOS_DRV=2 IOH = -8 mA -- -- OUTx_CMOS_DRV=3 IOH = -11 mA -- -- -- -- -- -- V VDDO = 1.8 V OUTx_CMOS_DRV=2 IOH = -4 mA OUTx_CMOS_DRV=3 IOH = -5 mA silabs.com | Smart. Connected. Energy-friendly. VDDO x 0.85 V Rev. 1.0 | 23 Si5341/40 Rev D Data Sheet Electrical Specifications Parameter Symbol Output Voltage Low1, 2, 3 VOL Test Condition Min Typ Max Units VDDO x 0.15 V VDDO x 0.15 V VDDO x 0.15 V VDDO = 3.3 V OUTx_CMOS_DRV=1 IOL = 10 mA -- -- OUTx_CMOS_DRV=2 IOL = 12 mA -- -- OUTx_CMOS_DRV=3 IOL = 17 mA -- -- VDDO = 2.5 V OUTx_CMOS_DRV=1 IOL = 6 mA -- -- OUTx_CMOS_DRV=2 IOL = 8 mA -- -- OUTx_CMOS_DRV=3 IOL = 11 mA -- -- VDDO = 1.8 V LVCMOS Rise and Fall Times3 OUTx_CMOS_DRV=2 IOL = 4 mA -- -- OUTx_CMOS_DRV=3 IOL = 5 mA -- -- VDDO = 3.3V -- 400 600 ps VDDO = 2.5 V -- 450 600 ps VDDO = 1.8 V -- 550 750 ps tr/tf (20% to 80%) Notes: 1. Driver strength is a register programmable setting and stored in NVM. Options are OUTx_CMOS_DRV = 1, 2, 3. Refer to the Family Reference Manual for more details on register settings. 2. IOL/IOH is measured at VOL/VOH as shown in the dc test configuration. 3. A series termination resistor (Rs) is recommended to help match the source impedance to a 50 W PCB trace. A 5 pF capacitive load is assumed. The LVCMOS outputs were set to OUTx_CMOS_DRV = 3. AC Test Configuration DC Test Configuration Trace length 5 inches IOL/IOH 499 IDDO OUT Zs VOL/VOH DC Block 50 50 probe, scope 4.7 pF 56 OUTb 499 DC Block 50 probe, scope 50 4.7 pF silabs.com | Smart. Connected. Energy-friendly. 56 Rev. 1.0 | 24 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.7. Output Status Pin Specifications (VDD=1.8V 5%, VDDA=3.3V 5%, VDDS= 3.3V 5%, 1.8V 5%, TA= -40 to 85C) Parameter Symbol Test Condition Min Typ Max Units VOH IOH = -2 mA VDDIO2 x 0.85 -- -- V VOL IOL = 2 mA -- -- VDDIO2x 0.15 V VOH IOH = -2 mA VDDIO2 x 0.85 -- -- V VOL IOL = 2 mA -- -- VDDIO2 x 0.15 V VOH IOH = -2 mA VDDS x 0.85 -- -- V VOL IOL = 2 mA -- -- VDDSx 0.15 V Si5341/40 Status Output Pins (INTRb, SDA/SDIO)1 Output Voltage Si5341 Status Output Pins (LOLb) Output Voltage Si5340 Status Output Pins (LOLb, LOS_XAXBb) Output Voltage Notes: 1. The VOH specification does not apply to the open-drain SDA/SDIO output when the serial interface is in I2C mode or is unused with I2C_SEL pulled high. VOL remains valid in all cases. 2. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. Refer to the Family Reference Manual for more details on register settings. Table 5.8. Performance Characteristics (VDD=1.8V 5%, VDDA=3.3V 5%, TA= -40 to 85C) Parameter Min Typ Max Units FVCO 13.5 -- 14.4 GHz PLL Loop Bandwidth fBW -- 1.0 -- MHz Initial Start-Up Time tSTART Time from power-up to when the device generates clocks (Input Frequency >48 MHz) -- 30 45 ms tACQ fIN = 19.44 MHz 15 -- 150 ms tDELAY_frac fVCO = 14 GHz -- 0.28 -- ps tDELAY_int Delay is controlled by the MultiSynth -- 71.4 -- ps -- 9.14 -- ns -- -- 15 ms VCO Frequency Range PLL Lock Time1 Output Delay Adjustment Symbol tRANGE POR2 to Serial Interface Ready tRDY silabs.com | Smart. Connected. Energy-friendly. Test Condition Rev. 1.0 | 25 Si5341/40 Rev D Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Units Jitter Generation Locked to External Clock3 JGEN Integer Mode4 -- 140 180 fs rms -- 160 210 fs rms -- 110 -- fs pk-pk -- 180 -- fs pk -- 7400 -- fs pk-pk -- 6700 -- fs pk 12 kHz to 20 MHz Fractional/DCO Mode5 12 kHz to 20 MHz JPER JCC JPER JCC Jitter Generation Locked to External XTAL Derived from integrated phase noise N = 10,000 cycles Integer or Fractional Mode4, 5 . Measured in the time domain. Performance is limited by the noise floor of the equipment. XTAL Frequency = 48 MHz JGEN Integer Mode4 -- 90 140 fs rms -- 115 170 fs rms -- 110 -- fs pk-pk -- 180 -- fs pk -- 7400 -- fs pk-pk -- 6600 -- fs pk 115 140 fs rms 140 190 fs rms 12 kHz to 20 MHz Fractional/DCO Mode5 12 kHz to 20 MHz JPER JCC JPER JCC Derived from integrated phase noise N = 10, 000 cycles Integer or Fractional Mode.4, 5 Measured in the time domain. Performance is limited by the noise floor of the equipment. XTAL Frequency = 25 MHz JGEN Integer Mode4 12 kHz to 20 MHz Fractional Mode5 12 kHz to 20 MHz Notes: 1. PLL lock time is measured by first letting the PLL lock, then turning off the input clock, and then turning on the input clock. The time from the first edge of the input clock being re-applied until LOL de-asserts is the PLL lock time. 2. Measured as time from valid VDD and VDD33 rails (90% of their value) to when the serial interface is ready to respond to commands. Measured in SPI 4-wire mode, with SCLK @ 10 MHz. 3. Jitter generation test conditions fIN = 100 MHz, fOUT = 156.25 MHz LVPECL. 4. Integer mode assumes that the output dividers (Nn/Nd) are configured with an integer value. 5. Fractional and DCO modes assume that the output dividers (Nn/Nd) are configured with a fractional value and the feedback divider is integer. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 26 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.9. I2C Timing Specifications (SCL,SDA) Parameter Symbol Test Condition Standard Mode Fast Mode 100 kbps 400 kbps Min Max Min Max Units SCL Clock Frequency fSCL -- 100 -- 400 kHz Hold Time (Repeated) START Condition tHD:STA 4.0 -- 0.6 -- s Low Period of the SCL Clock tLOW 4.7 -- 1.3 -- s HIGH Period of the SCL Clock tHIGH 4.0 -- 0.6 -- s Set-up Time for a Repeated START Condition tSU:STA 4.7 -- 0.6 -- s Data Hold Time tHD:DAT 100 -- 100 -- ns Data Set-up Time tSU:DAT 250 -- 100 -- ns Rise Time of Both SDA and SCL Signals tr -- 1000 20 300 ns Fall Time of Both SDA and SCL Signals tf -- 300 -- 300 ns Set-up Time for STOP Condition tSU:STO 4.0 -- 0.6 -- s Bus Free Time between a STOP and START Condition tBUF 4.7 -- 1.3 -- s Data Valid Time tVD:DAT -- 3.45 -- 0.9 s Data Valid Acknowledge Time tVD:ACK -- 3.45 -- 0.9 s silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 27 Si5341/40 Rev D Data Sheet Electrical Specifications Figure 5.1. I2C Serial Port Timing Standard and Fast Modes silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 28 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.10. SPI Timing Specifications (4-Wire) (VDD=1.8V 5%, VDDA=3.3V 5%, TA= -40 to 85C) Parameter Symbol Min Typ Max Units SCLK Frequency fSPI -- -- 20 MHz SCLK Duty Cycle TDC 40 -- 60 % SCLK Period TC 50 -- -- ns Delay Time, SCLK Fall to SDO Active TD1 -- 12.5 18 ns Delay Time, SCLK Fall to SDO TD2 -- 10 15 ns Delay Time, CSb Rise to SDO Tri-State TD3 -- 10 15 ns Setup Time, CSb to SCLK TSU1 5 -- -- ns Hold Time, CSb to SCLK Rise TH1 5 -- -- ns Setup Time, SDI to SCLK Rise TSU2 5 -- -- ns Hold Time, SDI to SCLK Rise TH2 5 -- -- ns Delay Time Between Chip Selects (CSb) TCS 2 -- -- TC TSU1 TC TD1 SCLK TH1 CSb TSU2 TH2 TCS SDI TD2 TD3 SDO Figure 5.2. 4-Wire SPI Serial Interface Timing silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 29 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.11. SPI Timing Specifications (3-Wire) (VDD=1.8V 5%, VDDA=3.3V 5%, TA= -40 to 85C) Parameter Symbol Min Typ Max Units SCLK Frequency fSPI -- -- 20 MHz SCLK Duty Cycle TDC 40 -- 60 % SCLK Period TC 50 -- -- ns Delay Time, SCLK Fall to SDO Turn-on TD1 -- 12.5 20 ns Delay Time, SCLK Fall to SDO Next-bit TD2 -- 10 15 ns Delay Time, CSb Rise to SDO Tri-State TD3 -- 10 15 ns Setup Time, CSb to SCLK TSU1 5 -- -- ns Hold Time, CSb to SCLK Rise TH1 5 -- -- ns Setup Time, SDI to SCLK Rise TSU2 5 -- -- ns Hold Time, SDI to SCLK Rise TH2 5 -- -- ns Delay Time Between Chip Selects (CSb) TCS 2 -- -- TC T SU1 TC SCLK TD1 CSb TSU2 T H1 T D2 TH2 TCS SDIO TD3 Figure 5.3. 3-Wire SPI Serial Interface Timing silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 30 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.12. Crystal Specifications Parameter Crystal Frequency Range Symbol Test Condition Min Typ Max Units fXTAL Full operating range. Jitter performance may be reduced. 24.97 -- 54.06 MHz Range for best jitter. 48 -- 54 MHz Load Capacitance CL -- 8 -- pF Crystal Drive Level dL -- -- 200 W Equivalent Series Resistance Shunt Capacitance rESR CO Refer to the Si5341/40 Family Reference Manual to determine ESR and shunt capacitance. Note: 1. Refer to the Si5341/40 Family Reference Manual for recommended 48 to 54 MHz crystals. The Si5341/40 are designed to work with crystals that meet these specifications. Table 5.13. Thermal Characteristics Parameter Symbol Test Condition1 Value Units JA Still Air 22 C/W Air Flow 1 m/s 19.4 Air Flow 2 m/s 18.3 Si5341 - 64QFN Thermal Resistance Junction to Ambient Thermal Resistance JC 9.5 Thermal Resistance JB 9.4 Junction to Board JB 9.3 Thermal Resistance JT 0.2 Junction to Case Junction to Top Center Si5340 - 44QFN Thermal Resistance JA Junction to Ambient Thermal Resistance Still Air 22.3 Air Flow 1 m/s 19.4 Air Flow 2 m/s 18.4 JC 10.9 Thermal Resistance JB 9.3 Junction to Board JB 9.2 Thermal Resistance JT 0.23 C/W Junction to Case Junction to Top Center Note: 1. Based on PCB Dimension: 3 x 4.5 mm, PCB Land/Via under GND pad: 36, Number of Cu Layers: 4 silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 31 Si5341/40 Rev D Data Sheet Electrical Specifications Table 5.14. Absolute Maximum Ratings1, 2, 3, 4 Parameter Symbol Test Condition Value Units Storage Temperature Range TSTG -55 to +150 C DC Supply Voltage VDD -0.5 to 3.8 V VDDA -0.5 to 3.8 V VDDO5 -0.5 to 3.8 V Input Voltage Range Latch-up Tolerance VI1 IN0-IN2, FB_IN -0.85 to 3.8 V VI2 IN_SEL[1:0], RSTb, OEb, SYNCb, I2C_SEL, SDI, SCLK, A0/CSb, A1, SDA/SDIO, FINC/ FDEC -0.5 to 3.8 V VI3 XA/XB -0.5 to 2.7 V LU ESD Tolerance HBM Maximum Junction Temperature in Operation Soldering Temperature (Pb-free profile)5 Soldering Temperature Time at TPEAK JESD78 Compliant 100 pF, 1.5 k 2.0 kV TJCT 125 C TPEAK 260 C TP 20 to 40 sec (Pb-free profile)5 Notes: 1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. 64-QFN and 44-QFN packages are RoHS-6 compliant. 3. Moisture sensitivity level is MSL2. For more packaging information, go to the Silicon Labs RoHS information page. 4. The minimum voltage at these pins can be as low as -1.0 V when an AC input signal of 10 MHz or greater is applied. See Table 5.3 Input Clock Specifications on page 20 spec for single-ended AC-coupled fIN < 250 MHz. 5. The device is compliant with JEDEC J-STD-020. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 32 Si5341/40 Rev D Data Sheet Typical Application Schematic 6. Typical Application Schematic 161.1328125 MHz Buffer Buffer 2x 161.1328125 MHz LVDS 133.33 MHz 2x 133.33 MHz 1.8V LVCMOS Buffer Level Translator Delay Line 3x 125 MHz LVPECL 125 MHz Buffer Clock Generator Level Translator XA 4x 125 MHz 3.3V LVCMOS 200 MHz 2.5V LVCMOS 25 MHz XB "Traditional Discrete" Clock Tree One Si5341 replaces: 3x crystal oscillators (XO) 2x buffers 1x Clock Generator 2x level translators 1x delay line 1x 161.1328125 MHz LVDS 1x 161.1328125 MHz LVDS XA 2x 133.33 MHz 1.8V LVCMOS 25 MHz XB 1x 125 MHz LVPECL Si5341 1x 125 MHz LVPECL 1x 125 MHz LVPECL 2x 125 MHz 3.3V LVCMOS 2x 125 MHz 3.3V LVCMOS "Clock Tree On-a-Chip" 2x 200 MHz 2.5V LVCMOS 2x 200 MHz 2.5V LVCMOS Figure 6.1. Using the Si5341 to Replace a Traditional Clock Tree silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 33 Si5341/40 Rev D Data Sheet Detailed Block Diagrams VDD VDDA 7. Detailed Block Diagrams 3 Si5341 IN_ SEL[1:0] Clock Generator /P0 PD /P2 LPF / / PXAXB MultiSynth N / 0n t0 N0d XB 25-54 MHz XTAL OSC XA Zero Delay Mode N / 1n N1d t1 N2n N2d t2 N3n N3d t3 N4n N4d t4 / FB_IN /Pfb FB_ INb / I2C_ SEL SCLK SPI / I2 C NVM RSTb A0/CSb Status Monitors INTRb A1/ SDO / LO Lb SDA/ SDIO Mn Md /R2 VDDO2 OUT2 OUT2b /R3 VDDO3 OUT3 OUT3b /R4 VDDO4 OUT4 OUT4b /R5 VDDO5 OUT5 OUT5b /R6 VDDO6 OUT6 OUT6b /R7 VDDO7 OUT7 OUT7b /R8 VDDO8 OUT8 OUT8b /R9 VDDO9 OUT9 OUT9b Frequency Control FINC IN2b /R1 VDDO1 OUT1 OUT1b PLL /P1 IN2 VDDO0 OUT0 OUT0b OEb IN1 IN1b FDEC IN0b /R0 SYNCb IN0 Dividers/ Drivers Figure 7.1. Si5341 Block Diagram silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 34 Si5341/40 Rev D Data Sheet 4 VDDS VDDA VDD Detailed Block Diagrams 2 1 Si5340 Clock Generator /P XAXB XB 25-54 MHz XTAL OSC XA MultiSynth / Nn0 Nd0 t0 /R0 VDDO0 OUT0 OUT0b / Nn1 Nd1 t1 /R1 VDDO1 OUT1 OUT1b N / 2n N2d t2 /R2 VDDO2 OUT2 OUT2b N3n N3d t3 /R3 VDDO3 OUT3 OUT3b PLL IN0 IN0b IN1 IN1b IN2 IN2b Dividers/ Drivers /P0 /P1 LPF PD Md / Mn /P2 / IN_SEL[1:0] Zero Delay Mode OEb SCLK NVM A0/CSb A1/SDO I2C_SEL LOSXAB SDA/SDIO SPI/ I2 C Status Monitors LO Lb RSTb /Pfb I NT Rb FB_IN FB_INB Figure 7.2. Si5340 Detailed Block Diagram silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 35 Si5341/40 Rev D Data Sheet Typical Operating Characteristics 8. Typical Operating Characteristics Figure 8.1. Integer Mode--48 MHz Crystal, 625 MHz Output (2.5 V LVDS) silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 36 Si5341/40 Rev D Data Sheet Typical Operating Characteristics Figure 8.2. Integer Mode--48 MHz Crystal, 156.25 MHz Output (2.5 V LVDS) Figure 8.3. Fractional Mode--48 MHz Crystal, 155.52 MHz Output (2.5 V LVDS) silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 37 Si5341/40 Rev D Data Sheet Pin Descriptions 9. Pin Descriptions OUT3 OUT3b VDDO3 36 35 34 VDD I2C_SEL IN_SEL1 FB_IN VDD 41 38 FB_INb 42 39 IN0b IN0 VDDO7 49 43 OUT7b 50 44 VDDO8 OUT7 51 OUT8b Si 5340 44QFN Top View 52 53 RSVD 56 RSVD VDDO9 57 OUT8 OUT9 OUT9b 59 54 VDD 60 55 FB_IN 61 58 IN0 FB_INb 62 IN0b 63 64 Si 5341 64QFN Top View FINC 48 2 47 LOLb IN_ SEL0 3 46 VDD IN1 1 33 INTRb IN_ SEL1 4 45 OUT 6 IN1b 2 32 SYNCb 5 44 OUT6b IN_ SEL0 3 31 VDD OUT2 RSTb 6 43 VDDO6 4 30 OUT2b X1 7 42 OUT5 X1 XA 29 VDDO2 41 OUT5b 5 8 XA XB 40 VDDO 5 6 9 XB X2 VDDA 7 8 26 VDDS VDDA 9 25 OUT1 IN2 10 24 OUT1b IN2b 11 23 VDDO1 22 NC 32 VDD 21 31 OUT2 20 30 OUT2b 19 29 OUT0 VDD 28 OUT1 VDDO2 OUT0b 27 OUT1b 18 26 VDDO1 silabs.com | Smart. Connected. Energy-friendly. 17 25 23 OUT0b 24 22 VDDO0 OUT0 21 FDEC 20 VDDO 3 RSVD OUT3b 33 RSVD 34 16 19 15 A0/CSb IN2b SCLK 18 OUT3 17 35 A1/SDO 14 SDA/SDIO IN2 RSTb VDDO4 VDDO0 OUT4b 36 16 37 13 A0/CSb 12 VDDA 15 INTRb 14 OUT4 SCLK I2C_SEL 38 A1/SDO 39 11 13 10 12 X2 OEb GND Pad OEb SDA/ SDIO GND Pad 37 1 40 IN1 IN1b 28 LOS_XAXBb 27 LOLb Rev. 1.0 | 38 Si5341/40 Rev D Data Sheet Pin Descriptions Table 9.1. Pin Descriptions Pin Name Pin Number Pin Type1 Function Crystal and External Clock Input. These pins are used to connect an external crystal or an external clock. See 3.3.1 XA/XB Clock and Crystal Input and Figure 3.2 XAXB External Crystal and Clock Connections on page 5 for connection information. If IN_SEL[1:0] = 11b, then the XAXB input is selected. If the XAXB input is not used and powered down, then both inputs can be left unconnected. ClockBuilder Pro will power down an input that is set as "Unused". Si5341 Si5340 XA 8 5 I XB 9 6 I X1 7 4 I X2 10 7 I IN0 63 43 I IN0b 64 44 I IN1 1 1 I IN1b 2 2 I IN2 14 10 I IN2b 15 11 I FB_IN 61 41 I FB_INb 62 42 I Inputs silabs.com | Smart. Connected. Energy-friendly. XTAL Shield. Connect these pins directly to the XTAL ground pins. X1, X2, and the XTAL ground pins must not be connected to the PCB ground plane. DO NOT GROUND THE CRYSTAL GROUND PINS. Refer to the Si5341/40 Family Reference Manual for layout guidelines. These pins should be left disconnected when connecting XA/XB pins to an external reference clock. Clock Inputs. These pins accept both differential and singleended clock signals. Refer 3.3.2 Input Clocks (IN0, IN1, IN2) for input termination options. These pins are high-impedance and must be terminated externally. If both the INx and INx (with overstrike) inputs are un-used and powered down, then both inputs can be left floating. ClockBuilder Pro will power down an input that is set as "Unused". External Feedback Input. These pins are used as the external feedback input (FB_IN/FB_INb) for the optional zero delay mode. See 3.5.12 Zero Delay Mode for details on the optional zero delay mode. If FB_IN and FB_IN (with overstrike) are un-used and powered down, then both inputs can be left floating. ClockBuilder Pro will power down an input that is set as "Unused". Rev. 1.0 | 39 Si5341/40 Rev D Data Sheet Pin Descriptions Pin Name Pin Number Pin Type1 Function Output Clocks. These output clocks support a programmable signal amplitude when configured as a differential output. Desired output signal format is configurable using register control. Termination recommendations are provided in 3.5.2 Differential Output Terminations and 3.5.4 LVCMOS Output Terminations. Unused outputs should be left unconnected. Si5341 Si5340 OUT0 24 20 O OUT0b 23 19 O OUT1 28 25 O OUT1b 27 24 O OUT2 31 31 O OUT2b 30 30 O OUT3 35 36 O OUT3b 34 35 O OUT4 38 -- O OUT4b 37 -- O OUT5 42 -- O OUT5b 41 -- O OUT6 45 -- O OUT6b 44 -- O OUT7 51 -- O OUT7b 50 -- O OUT8 54 -- O OUT8b 53 -- O OUT9 59 -- O OUT9b 58 -- O I2C_SEL 39 38 I SDA/SDIO 18 13 I/O Serial Data Interface.2 This is the bidirectional data pin (SDA) for the I2C mode, or the bidirectional data pin (SDIO) in the 3-wire SPI mode, or the input data pin (SDI) in 4-wire SPI mode. When in I2C mode, this pin must be pulled-up using an external resistor of at least 1 k. No pull-up resistor is needed when in SPI mode. A1/SDO 17 15 I/O Address Select 1/Serial Data Output.2 In I2C mode, this pin functions as the A1 address input pin and does not have an internal pull up or pull down resistor. In 4-wire SPI mode this is the serial data output (SDO) pin (SDO) pin and drives high to the voltage selected by the IO_VDD_SEL pin. SCLK 16 14 I Serial Clock Input.2 This pin functions as the serial clock input for both I2C and SPI modes.This pin is internally pulled up by a ~20 k resistor to the voltage selected by the IO_VDD_SEL register bit. In I2C mode this pin should have an external pull up of at least 1 k. No pull-up resistor is needed when in SPI mode. Outputs Serial Interface silabs.com | Smart. Connected. Energy-friendly. I2C Select.2 This pin selects the serial interface mode as I2C (I2C_SEL = 1) or SPI (I2C_SEL = 0). This pin is internally pulled up by a ~ 20 k resistor to the voltage selected by the IO_VDD_SEL register bit. Rev. 1.0 | 40 Si5341/40 Rev D Data Sheet Pin Descriptions Pin Name Pin Number Pin Type1 Function Si5341 Si5340 19 16 I Address Select 0/Chip Select.2 This pin functions as the hardware controlled address A0 in I2C mode. In SPI mode, this pin functions as the chip select input (active low). This pin is internally pulled up by a ~20 k resistor to the voltage selected by the IO_VDD_SEL register bit. INTRb 12 33 O Interrupt. 2 This pin is asserted low when a change in device status has occurred. This interrupt has a push pull output and should be left unconnected when not in use. RSTb 6 17 I Device Reset. 2 Active low input that performs power-on reset (POR) of the device. Resets all internal logic to a known state and forces the device registers to their default values. Clock outputs are disabled during reset. This pin is internally pulled up with a ~20 k resistor to the voltage selected by the IO_VDD_SEL bit. OEb 11 12 I Output Enable.2 This pin disables all outputs when held high. This pin is internally pulled low and can be left unconnected when not in use. LOLb 47 -- O Loss Of Lock.2 This output pin indicates when the DSPLLTM is locked (high) or out-of-lock (low). An external pull up or pull down is not needed. -- 27 O Loss Of Lock.3 This output pin indicates when the DSPLL is locked (high) or out-of-lock (low). An external pull up or pull down is not needed. LOS_XAXBb -- 28 O Loss Of Signal.3 This output pin indicates a loss of signal at the XA/XB pins. SYNCb 5 -- I Output Clock Synchronization.2 An active low signal on this pin resets the output dividers for the purpose of re-aligning the output clocks. For a tighter alignment of the clocks, a soft reset should be applied. This pin is internally pulled up with a ~20 k resistor to the voltage selected by the IO_VDD_SEL bit and can be left unconnected when not in use. FDEC 25 -- I Frequency Decrement Pin.2 This pin is used to step-down the output frequency of a selected output. The affected output driver and its frequency change step size is register configurable. This pin is internally pulled low with a ~20 k resistor and can be left unconnected when not in use. FINC 48 -- I Frequency Increment Pin.2 This pin is used to step-up the output frequency of a selected output. The affected output and its frequency change step size is register configurable. This pin is internally pulled low with a ~20 k resistor and can be left unconnected when not in use. IN_SEL0 3 3 I IN_SEL1 4 37 I Input Reference Select.2 The IN_SEL[1:0] pins are used in the manual pin controlled mode to select the active clock input. These pins are internally pulled up with a ~20 k resistor to the voltage selected by the IO_VDD_SEL bit and can be left unconnected when not in use. RSVD 20 -- -- 21 -- -- 55 -- -- 56 -- -- A0/CSb Control/Status silabs.com | Smart. Connected. Energy-friendly. Reserved. These pins are connected to the die. Leave disconnected. Rev. 1.0 | 41 Si5341/40 Rev D Data Sheet Pin Descriptions Pin Name Pin Number Pin Type1 Function Si5341 Si5340 -- 22 -- No Connect. These pins are not connected to the die. Leave disconnected. 32 21 P 46 32 Core Supply Voltage. The device core operates from a 1.8 V supply. A 1.0 f bypass capacitor is recommended. 60 39 -- 40 13 8 P -- 9 P Core Supply Voltage 3.3 V. This core supply pin requires a 3.3 V power source. A 1.0 f bypass capacitor is recommended. VDDS -- 26 P Status Output Voltage. The voltage on this pin determines the VOL/VOH on LOLb and LOS_XAXBb status output pins. A 0.1 f to 1.0 f bypass capacitor is recommended. VDDO0 22 18 P VDDO1 26 23 P VDDO2 29 29 P VDDO3 33 34 P Output Clock Supply Voltage 0-9. Supply voltage (3.3 V, 2.5 V, 1.8 V) for OUTx, OUTx outputs. See the Si5341/40 Family Reference Manual for power supply filtering recommendations. Leave VDDO pins of unused output drivers unconnected. An alternate option is to connect the VDDO pin to a power supply and disable the output driver to minimize current consumption. VDDO4 36 -- P VDDO5 40 -- P VDDO6 43 -- P VDDO7 49 -- P VDDO8 52 -- P VDDO9 57 -- P NC Power VDD VDDA GND PAD P Ground Pad This pad provides electrical and thermal connection to ground and must be connected for proper operation. Use as many vias as practical and keep the via length to an internal ground plan as short as possible. Note: 1. I = Input, O = Output, P = Power. 2. The IO_VDD_SEL control bit (0x0943 bit 0) selects 3.3 V or 1.8 V operation. 3. The voltage on the VDDS pin(s) determines 3.3 V or 1.8 V operation. 4. Refer to the Family Reference Manual for more information on register setting names. 5. All status pins except I2C and SPI are push-pull. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 42 Si5341/40 Rev D Data Sheet Package Outlines 10. Package Outlines 10.1 Si5341 9x9 mm 64-QFN Package Diagram The figure below illustrates the package details for the Si5341. The table below lists the values for the dimensions shown in the illustration. Figure 10.1. 64-Pin Quad Flat No-Lead (QFN) Table 10.1. Package Dimensions Dimension Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 D D2 9.00 BSC 5.10 5.20 e 0.50 BSC E 9.00 BSC 5.30 E2 5.10 5.20 5.30 L 0.30 0.40 0.50 aaa -- -- 0.15 bbb -- -- 0.10 ccc -- -- 0.08 ddd -- -- 0.10 eee -- -- 0.05 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 43 Si5341/40 Rev D Data Sheet Package Outlines 10.2 Si5340 7x7 mm 44-QFN Package Diagram The figure below illustrates the package details for the Si5340. The table below lists the values for the dimensions shown in the illustration. Figure 10.2. 44-Pin Quad Flat No-Lead (QFN) Table 10.2. Package Dimensions Dimension Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 D D2 7.00 BSC 5.10 5.20 e 0.50 BSC E 7.00 BSC 5.30 E2 5.10 5.20 5.30 L 0.30 0.40 0.50 aaa -- -- 0.15 bbb -- -- 0.10 ccc -- -- 0.08 ddd -- -- 0.10 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 44 Si5341/40 Rev D Data Sheet PCB Land Pattern 11. PCB Land Pattern The figure below illlustrates the PCB land pattern details for the devices. The table below lists the values for the dimensions shown in the illustration. Si5341 Si5340 Figure 11.1. PCB Land Pattern silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 45 Si5341/40 Rev D Data Sheet PCB Land Pattern Table 11.1. PCB Land Pattern Dimensions Dimension Si5341 (Max) Si5340 (Max) C1 8.90 6.90 C2 8.90 6.90 E 0.50 0.50 X1 0.30 0.30 Y1 0.85 0.85 X2 5.30 5.30 Y2 5.30 5.30 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition is calculated based on a fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 4. A 3x3 array of 1.25 mm square openings on 1.80 mm pitch should be used for the center ground pad. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 46 Si5341/40 Rev D Data Sheet Top Marking 12. Top Marking Si 5 3 4 1 g Rx x x x x - GM YYWWTTTTTT e4 TW Si 5 3 4 0 g Rx x x x x - GM YYWWTTTTTT e4 TW 64-QFN 44-QFN Figure 12.1. Si5341-40 Top Markings Table 12.1. Si5341-40 Top Marking Explanation Line Characters 1 Si5341gSi5340g- Description Base part number and Device Grade for Low Jitter, Any-Frequency, 10-output Clock Generator. Si5341: 10-output, 64-QFN Si5340: 4-output, 44-QFN g = Device Grade (A, B, C, D). See " " on page 26 for more information. - = Dash character. 2 Rxxxxx-GM R = Product revision. (See ordering guide for current revision). xxxxx = Customer specific NVM sequence number. Optional NVM code assigned for custom, factory pre-programmed devices. Characters are not included for standard, factory default configured devices. See Ordering Guide for more information. -GM = Package (QFN) and temperature range (-40 to +85 C) 3 YYWWTTTTTT YYWW = Characters correspond to the year (YY) and work week (WW) of package assembly. TTTTTT = Manufacturing trace code. 4 Circle w/ 1.6 mm (64-QFN) or 1.4 mm (44-QFN) diameter Pin 1 indicator; left-justified e4 Pb-free symbol; Center-Justified TW TW = Taiwan; Country of Origin (ISO Abbreviation) silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 47 Si5341/40 Rev D Data Sheet Device Errata 13. Device Errata Please log in or register at www.silabs.com to access the device errata document. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 48 Si5341/40 Rev D Data Sheet Document Change List 14. Document Change List 14.1 Revision 1.0 July 15, 2016 * Initial release. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 49 Table of Contents 1. Features List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.1 Power-up and Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.2 Frequency Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.3 Inputs . . . . . . . . . . . 3.3.1 XA/XB Clock and Crystal Input . . 3.3.2 Input Clocks (IN0, IN1, IN2) . . . 3.3.3 Input Selection (IN0, IN1, IN2, XA/XB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Fault Monitoring . . . 3.4.1 Status Indicators . . 3.4.2 Interrupt Pin (INTRb) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 . 7 . 7 3.5 Outputs . . . . . . . . . . . . . . . . . . . . 3.5.1 Output Signal Format. . . . . . . . . . . . . . . 3.5.2 Differential Output Terminations . . . . . . . . . . . 3.5.3 Programmable Common Mode Voltage for Differential Outputs. 3.5.4 LVCMOS Output Terminations . . . . . . . . . . . 3.5.5 LVCMOS Output Impedance and Drive Strength Selection . . 3.5.6 LVCMOS Output Signal Swing . . . . . . . . . . . 3.5.7 LVCMOS Output Polarity . . . . . . . . . . . . . 3.5.8 Output Enable/Disable . . . . . . . . . . . . . . 3.5.9 Output Driver State When Disabled . . . . . . . . . . 3.5.10 Synchronous/Asynchronous Output Disable Feature . . . . 3.5.11 Output Delay Control (t0-t4) . . . . . . . . . . . . 3.5.12 Zero Delay Mode. . . . . . . . . . . . . . . . 3.5.13 Sync Pin (Synchronizing R Dividers) . . . . . . . . . 3.5.14 Output Crosspoint . . . . . . . . . . . . . . . 3.5.15 Digitally Controlled Oscillator (DCO) Modes . . . . . . . 3.5.15.1 DCO with Frequency Increment/Decrement Pins/Bits . . . 3.5.15.2 DCO with Direct Register Writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 . 8 . 8 . 8 . 9 . 9 . 9 . 9 . 9 . 9 .10 .10 .11 .11 .11 .12 .12 .12 3.6 Power Management . . . . . . . . . . . . . . . . 4 5 6 7 . . . . . . . . . . . . . . . . . . . . . . . . . . .12 3.7 In-Circuit Programming . . . . . . . . . . . . . . . . . . . . . . . . . . .12 3.8 Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . .12 3.9 Custom Factory Preprogrammed Devices . . . . . . . . . . . . . . . . . . . .12 . . . 3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory PreProgrammed Devices . . . . . . . . . . . . . . . . . . . . . . . . . . 13. 4. Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Addressing Scheme . . 15 . . . . . . . . . . . . . . . . . . . . . . . . . .15 4.2 High-Level Register Map . . . . . . . . . . . . . . . . . . . . . . . . . .16 5. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . 33 Table of Contents 50 7. Detailed Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . 34 8. Typical Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . 36 9. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 10. Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 10.1 Si5341 9x9 mm 64-QFN Package Diagram . . . . . . . . . . . . . . . . . . .43 10.2 Si5340 7x7 mm 44-QFN Package Diagram . . . . . . . . . . . . . . . . . . .44 11. PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 12. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 13. Device Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 14. Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . 49 14.1 Revision 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Table of Contents 51 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. Available for Windows and iOS (CBGo only). www.silabs.com/CBPro Timing Portfolio www.silabs.com/timing SW/HW www.silabs.com/CBPro Quality www.silabs.com/quality Support and Community community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Laboratories. 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