TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 features D D D D D D D D D D typical applications Dual-Input, Single-Output MOSFET Switch With No Reverse Current Flow (No Parasitic Diodes) IN1 . . . 250-m, 500-mA N-Channel; 16-A Max Supply Current IN2 . . . 1.3-, 10-mA P-Channel; 1.5-A Max Supply Current (VAUX Mode) Advanced Switch Control Logic CMOS- and TTL-Compatible Enable Input Controlled Rise, Fall, and Transition Times 2.7-V to 4 V Operating Range SOT-23-5 and SOIC-8 Package - 40C to 70C Ambient Temperature Range 2-kV Human-Body-Model, 750-V CDM, 200-V Machine-Model ElectrostaticDischarge Protection D D Notebook and Desktop PCs Palmtops and PDAs TPS2100 IN1 3.3 V VCC 3.3 V IN2 3.3 V VAUX EN D3 or PME Status Control Signal Controller (CardBus, 1394, PCI, et al.) Hold-Up Capacitor Figure 1. Typical Dual-Input Single-Output Application description The TPS2100 and TPS2101 are dual-input, single-output power switches designed to provide uninterrupted output voltage when transitioning between two independent power supplies. Both devices combine one n-channel (250 m) and one p-channel (1.3 ) MOSFET with a single output. The p-channel MOSFET (IN2) is used with auxiliary power supplies that deliver lower current for standby modes. The n-channel MOSFET (IN1) is used with a main power supply that delivers higher current required for normal operation. Low on-resistance makes the n-channel the ideal path for higher main supply current when power-supply regulation and system voltage drops are critical. When using the p-channel MOSFET, quiescent current is reduced to 0.75 A to decrease the demand on the standby power supply. The MOSFETs in the TPS2100 and TPS2101 do not have the parasitic diodes, found in discrete MOSFETs, which allow the devices to prevent back-flow current when the switch is off. TPS2100 D PACKAGE (TOP VIEW) DBV PACKAGE (TOP VIEW) PCI Bus VAUX VGA 3.3 V EN GND 1 IN2 3 5 IN1 2 4 OUT TPS210x VCC IN2 GND EN NC 1 8 2 7 3 6 4 5 OUT OUT NC IN1 TPS2101 D3-STAT D PACKAGE (TOP VIEW) DBV PACKAGE (TOP VIEW) PCI12xx / PCI14xx CardBus Controller Figure 2. VAUX CardBus Implementation EN GND 1 IN2 3 5 IN1 2 4 OUT IN2 GND EN NC 1 8 2 7 3 6 4 5 OUT OUT NC IN1 NC - No internal connection Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 AVAILABLE OPTIONS PACKAGED DEVICES TJ - 40C to 85C DEVICE ENABLE SOT-23-5 (DBV) SOIC-8 (D) TPS2100 EN TPS2100D TPS2101 EN TSP2100DBV TPS2101DBV TPS2101D Both packages are available left-end taped and reeled. Add an R suffix to the D device type (e.g., TPS2101DR). Add T (e.g., TPS2100DBVT) to indicate tape and reel at order quantity of 250 parts. Add R (e.g., TPS2100DBVR) to indicate tape and reel at order quantity of 3000 parts. TPS2100 functional block diagram SW1 250 m IN1 OUT Charge Pump Pullup Circuit VCC Select EN IN2 Discharge Circuit Driver SW2 1.3 GND Driver TPS2101 functional block diagram SW1 250 m IN1 OUT Charge Pump VCC Select EN IN2 Pulldown Circuit Driver SW2 1.3 GND Driver 2 Discharge Circuit POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 Function Tables TPS2100 VIN1 TPS2101 VIN2 EN OUT VIN1 VIN2 EN OUT 0V 0V XX GND 0V 3.3 V L GND 0V 0V XX GND 0V 3.3 V H 3.3 V 3.3 V L GND VIN1 3.3 V 3.3 V H 3.3 V 0V VIN1 L VIN1 3.3 V 0V H 0V VIN1 3.3 V H VIN2 0V 3.3 V L VIN2 3.3 V 0V H VIN2 3.3 V 0V L VIN2 3.3 V 3.3 V H VIN2 3.3 V 3.3 V L VIN2 XX = don't care Terminal Functions TERMINAL NO. NAME TPS2100 DBV D EN DESCRIPTION I/O TPS2101 DBV D 1 3 Active-high enable for IN1-OUT switch EN 1 3 I Active-low enable for IN1-OUT switch GND 2 2 2 2 I Ground IN1 5 5 5 5 I Main Input voltage, NMOS drain (250 m) IN2 3 1 3 1 I Auxilliary input voltage, PMOS drain (1.3 ) OUT 4 7, 8 4 7, 8 O Power switch output NC 4, 6 4, 6 No connection detailed description power switches n-channel MOSFET The IN1-OUT n-channel MOSFET power switch has a typical on-resistance of 250 m at 3.3-V input voltage, and is configured as a high-side switch. p-channel MOSFET The IN2-OUT p-channel MOSFET power switch with typical on-resistance of 1.3 at 3.3-V input voltage and is configured as a high-side switch. When operating, the p-channel MOSFET quiescent current is reduced to less than 1.5 A. charge pump An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires very little supply current. driver The driver controls the gate voltage of the IN1-OUT and IN2-OUT power switches. To limit large current surges and reduce the associated electromagnetic interference (EMI) produced, the drivers incorporate circuitry that controls the rise times and fall times of the output voltage. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 detailed description (continued) enable The logic enable will turn on the IN2-OUT power switch when a logic high is present on EN (TPS2100) or logic low is present on EN (TPS2101). A logic low input on EN (TPS2100) or logic high on EN (TPS2101) restores bias to the drive and control circuits and turns on the IN1-OUT power switch. The enable input is compatible with both TTL and CMOS logic levels. the VAUX application for CardBus controllers The PC Card specification requires the support of VAUX to the CardBus controller as well as to the PC Card sockets. Both are 3.3-V requirements; however the CardBus controller's current demand from the VAUX supply is limited to 10 A, whereas the PC Card may consume as much as 200 mA. In either implementation, if support of a wake-up event is required, the controller and the socket will transition from the 3.3-V VCC rail to the 3.3-V VAUX rail when the equipment moves into a low power mode such as D3. The transition from VCC to VAUX needs to be seamless in order to maintain all memory and register information in the system. If VAUX is not supported, the system will lose all register information when it transitions to the D3 state. absolute maximum ratings over operating free-air temperature (unless otherwise noted) Input voltage range, VI(IN1) (see Note1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.3 V to 5 V Input voltage range, VI(IN2) (see Note1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.3 V to 5 V Input voltage range, VI at EN or EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.3 V to 5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.3 V to 5 V Continuous output current, IO(IN1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700 mA Continuous output current, IO(IN2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See dissipation rating table Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 40C to 85C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 65C to 150C Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . 260C Electrostatic discharge (ESD) protection: Human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV Machine model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 V Charged device model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . 750 V Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltages are with respect to GND. DISSIPATION RATING TABLE PACKAGE TA < 25C POWER RATING DERATING FACTOR ABOVE TA = 25C TA = 70C POWER RATING TA = 85C POWER RATING DBV 309 mW 3.1 mW/C 170 mW 123 mW D 568 mW 5.7 mW/C 313 mW 227 mW recommended operating conditions Input voltage, VI(INx) Input voltage, VI at EN and EN Continuous output current, IO(IN1) MIN MAX 2.7 4 V 0 4 V 500 10 Continuous output current, IO(IN2) UNIT mA mA Operating virtual junction temperature, TJ - 40 85 C The device can deliver up to 220 mA at IO(IN2). However, operation at the higher current levels will result in greater voltage drop across the device, and greater voltage droop when switching between IN1 and IN2. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 electrical characteristics over recommended operating junction temperature range, VI(IN1) = V(IN2) = 3.3 V, IO = rated current (unless otherwise noted) power switch TEST CONDITIONS PARAMETER rDS(on) DS( ) MIN TYP IN1 OUT IN1-OUT TJ = 25C TJ = 85C 250 IN2 OUT IN2-OUT TJ = 25C TJ = 85C 1.3 On state resistance On-state 300 1.5 MAX 375 2.1 UNIT m Pulse-testing techniques maintain junction temperature close to ambient termperature; thermal effects must be taken into account separately. enable input (EN and EN) PARAMETER VIH VIL II TEST CONDITIONS High-level input voltage 2.7 V VI(INx) 4 V Low-level input voltage 2.7 V VI(INx) 4 V Input current MIN TYP MAX 2 UNIT V 0.8 V TPS2100 EN = 0 V or EN = VI(INx) -0.5 0.5 A TPS2101 EN = 0 V or EN = VI(INx) -0.5 0.5 A supply current PARAMETER TEST CONDITIONS TYP EN = H, IN2 selected TJ = 25C -40C TJ 85C 0.75 EN = L, IN1 selected TJ = 25C -40C TJ 85C 10 EN = L,, IN2 selected TJ = 25C -40C TJ 85C 0.75 EN = H,, IN1 selected TJ = 25C -40C TJ 85C 10 TPS2100 II MIN Supply current TPS2101 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MAX 1.5 16 1.5 16 UNIT A A A A 5 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 switching characteristics, TJ = 25C, VI(IN1) = VI(IN2) = 3.3 V (unless otherwise noted) TEST CONDITIONS PARAMETER CL = 1 F, IN1-OUT tr VI(IN2) ( )=0 CL = 10 F, CL = 1 F, Output rise time CL = 1 F, IN2-OUT VI(IN1) ( )=0 CL = 10 F, CL = 1 F, CL = 1 F, IN1-OUT tf VI(IN2) ( )=0 CL = 10 F, CL = 1 F, Output fall time CL = 1 F, IN2-OUT tPLH Propagation delay time, time low-to-high low to high output tPHL time high-to-low high to low output Propagation delay time, IN1-OUT IN2-OUT IN1-OUT IN2-OUT VI(IN1) ( )=0 CL = 10 F, 6 IL = 10 mA IL = 10 mA 640 IL = 500 mA IL = 500 mA 93 VI(IN2) = 0 VI(IN1) = 0 CL = 10 F F, IL = 10 mA VI(IN2) = 0 VI(IN1) = 0 CL = 10 F F, IL = 10 mA * DALLAS, TEXAS 75265 5.5 5.5 IL = 10 mA IL = 10 mA MAX UNIT 840 IL = 10 mA IL = 1 mA IL = 10 mA IL = 1 mA POST OFFICE BOX 655303 TYP 830 CL = 1 F, All timing parameters refer to Figure 3. MIN IL = 500 mA IL = 500 mA s 70 8 23 690 s 6900 6900 75 2 3 370 s s TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 PARAMETER MEASUREMENT INFORMATION OUT IO CL LOAD CIRCUIT 50% EN or EN 50% EN or EN tPHL VI tPLH VI 90% VO GND GND VO 10% Propagation Delay Time, Low-to-High-Level Output Propagation Delay Time, High-to-Low-Level Output tr tf VI 90% VO 10% GND Rise/Fall Time 50% EN or EN 50% EN or EN ton toff VI VI 90% VO VO GND GND 10% Turn-off Transition Time Turn-on Transition Time WAVEFORMS Figure 3. Test Circuit and Voltage Waveforms Table of Timing Diagrams FIGURE Propagation Delay and Rise Time With 0.1-F Load, IN1 4 Propagation Delay and Rise Time With 0.1-F Load, IN2 5 Propagation Delay and Fall Time With 0.1-F Load, IN1 6 Propagation Delay and Fall Time With 0.1-F Load, IN2 7 Propagation Delay and Rise Time With 1-F Load, IN1 8 Propagation Delay and Rise Time With 1-F Load, IN2 9 Propagation Delay and Fall Time With 1-F Load, IN1 10 Propagation Delay and Fall Time With 1-F Load, IN2 Waveforms shown in Figures 4-11 refer to TPS2100 at TJ = 25C POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 7 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 PARAMETER MEASUREMENT INFORMATION VI(IN1) = 3.3 V VI(IN2) = 0 V CL = 0.1 F RL = 330 EN (2 V/div) EN (2 V/div) VO (2 V/div) VO (2 V/div) t - Time - 1 s/div t - Time - 250 s/div Figure 4. Propagation Delay and Rise Time With 0.1-F Load, IN1 EN (2 V/div) VI(IN1) = 3.3 V VI(IN2) = 0 V CL = 0.1 F RL = 330 Figure 5. Propagation Delay and Fall Time With 0.1-F Load, IN2 VI(IN1) = 0 V VI(IN2) = 3.3 V CL = 0.1 F RL = 330 EN (2 V/div) VO (2 V/div) VO (2 V/div) t - Time - 50 s/div t - Time - 5 s/div Figure 6. Propagation Delay and Fall Time With 0.1-F Load, IN1 8 VI(IN1) = 0 V VI(IN2) = 3.3 V CL = 0.1 F RL = 330 POST OFFICE BOX 655303 Figure 7. Propagation Delay and Fall Time With 0.1-F Load, IN2 * DALLAS, TEXAS 75265 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 PARAMETER MEASUREMENT INFORMATION VI(IN1) = 3.3 V VI(IN2) = 0 V CL = 1 F RL = 330 EN (2 V/div) EN (2 V/div) VO (2 V/div) VO (2 V/div) t - Time - 2.5 s/div t - Time - 250 s/div Figure 8. Propagation Delay and Rise Time With 1-F Load, IN1 EN (2 V/div) VI(IN1) = 0 V VI(IN2) = 3.3 V CL = 1 F RL = 330 VI(IN1) = 3.3 V VI(IN2) = 0 V CL = 1 F RL = 330 Figure 9. Propagation Delay and Rise Time With 1-F Load, IN2 VI(IN1) = 0 V VI(IN2) = 3.3 V CL = 1 F RL = 330 EN (2 V/div) VO (2 V/div) VO (2 V/div) t - Time - 250 s/div t - Time - 10 s/div Figure 10. Propagation Delay and Fall Time With 1-F Load, IN1 POST OFFICE BOX 655303 Figure 11. Propagation Delay and Fall Time With 1-F Load, IN2 * DALLAS, TEXAS 75265 9 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 TYPICAL CHARACTERISTICS Table of Graphs FIGURE IN1 Switch Rise Time vs Output Current 12 IN2 Switch Fall Time vs Output Current 13 IN1 Switch Fall Time vs Output Current 14 IN2 Switch Fall Time vs Output Current 15 Output Voltage Droop vs Output Current When Output Is Switched From IN2 to IN1 16 Inrush Current vs Output Capacitance 17 IN1 Supply Current vs Junction Temperature (IN1 Enabled) 18 IN1 Supply Current vs Junction Temperature (IN1 Disabled) 19 IN2 Supply Current vs Junction Temperature (IN2 Enabled) 20 IN2 Supply Current vs Junction Temperature (IN2 Disabled) 21 IN1-OUT On-State Resistance vs Junction Temperature 22 IN2-OUT On-State Resistance vs Junction Temperature 23 IN1 SWTICH RISE TIME vs OUTPUT CURRENT IN2 SWTICH RISE TIME vs OUTPUT CURRENT 900 t r - Rise Time - s 800 CL = 47 F 100 CL = 47 F 750 700 CL = 10 F 650 600 550 500 0.01 CL = 100 F CL = 100 F t r - Rise Time - s 850 1000 VI(IN1) = 3.3 V VI(IN2) = 0 V TJ = 25C 0.1 100 1 10 IO - Output Current - mA 10 CL = 1 F 1 CL = 1 F CL = 0.1 F CL = 10 F CL = 0.1 F 1000 0.1 0 1 Figure 12 10 2 7 8 3 4 5 6 IO - Output Current - mA Figure 13 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 VI(IN1) = 0 V VI(IN2) = 3.3 V TJ = 25C 9 10 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 TYPICAL CHARACTERISTICS IN1 SWITCH FALL TIME vs OUTPUT CURRENT 10000 CL = 47 F CL = 10 F 100 CL = 100 F CL = 100 F t f - Output Fall Time - ms t f - Fall Time - s 1000 VI(IN1) = 3.3 V VI(IN2) = 0 V TJ = 25C 1000 IN2 SWITCH FALL TIME vs OUTPUT CURRENT CL = 1 F 10 100 CL = 10 F CL = 1 F 10 CL = 0.1 F 1 VI(IN1) = 0 V VI(IN2) = 3.3 V TJ = 25C CL = 0.1 F 1 0.01 0.1 100 1 10 IO - Output Current - mA 0.1 0.01 1000 Figure 14 1.6 CL = 0.1 F CL = 1 F VI(IN1) = 3.3 V VI(IN2) = 0 V RL = 6.6 TJ = 25C 1.4 0.8 1.2 CL = 10 F 0.6 CL = 47 F 0.4 10 INRUSH CURRENT vs OUTPUT CAPACITANCE Inrush Current - A VO- Output Voltage Droop - V VI(IN1) = 3.3 V VI(IN2) = 3.3 V TJ = 25C 1 0.1 IO - Output Current - mA Figure 15 OUTPUT VOLTAGE DROOP vs OUTPUT CURRENT WHEN OUTPUT IS SWITCHED FROM IN2 TO IN1 1 CL = 47 F CL = 100 F 1 0.8 0.6 0.4 0.2 0.2 0 0.01 0 0.1 1 IO - Output Current - mA 10 0 Figure 16 400 100 200 300 Co - Output Capacitance - F 500 Figure 17 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 TYPICAL CHARACTERISTICS IN1 SUPPLY CURRENT vs JUNCTION TEMPERATURE (IN1 DISABLED) IN1 SUPPLY CURRENT vs JUNCTION TEMPERATURE (IN1 ENABLED) 0.25 0.23 VI(INx) = 4 V I CC - Supply Currenmt - A I CC - Supply Currenmt - A 14 12 VI(INx) = 3.3 V 10 VI(INx) = 2.7 V 8 VI(INx) = 4 V 0.21 VI(INx) = 3.3 V 0.19 VI(INx) = 2.7 V 0.17 6 -40 -20 60 80 0 20 40 TJ Junction Temperature - C 0.15 -40 100 -20 Figure 18 100 Figure 19 IN2 SUPPLY CURRENT vs JUNCTION TEMPERATURE (IN2 ENABLED) IN2 SUPPLY CURRENT vs JUNCTION TEMPERATURE (IN2 DISABLED) 0.75 0.6 0.7 0.56 I CC - Supply Currenmt - A I CC - Supply Currenmt - A 60 80 0 20 40 TJ Junction Temperature - C VI(INx) = 4 V 0.65 VI(INx) = 3.3 V 0.6 VI(INx) = 2.7 V 0.55 0.52 VI(INx) = 4 V 0.48 VI(INx) = 3.3 V 0.44 VI(INx) = 2.7 V 0.5 -40 -20 0 20 40 60 80 TJ Junction Temperature - C 100 0.4 -40 Figure 20 12 -20 60 80 0 20 40 TJ Junction Temperature - C Figure 21 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 100 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 TYPICAL CHARACTERISTICS IN2-OUT ON-STATE RESISTANCE vs JUNCTION TEMPERATURE IN1-OUT ON-STATE RESISTANCE vs JUNCTION TEMPERATURE 2 r on - IN1-OUT On-State resistance - r on - IN1-OUT On-State resistance - m 305 280 255 VI(INx) = 2.7 V 230 VI(INx) = 3.3 V 205 1.75 VI(INx) = 2.7 V 1.5 VI(INx) = 3.3 V 1.25 VI(INx) = 4 V 1 0.75 VI(INx) = 4 V 180 -40 -20 60 80 0 20 40 TJ Junction Temperature - C 0.5 -40 100 -20 0 20 40 60 80 100 TJ Junction Temperature - C Figure 22 Figure 23 APPLICATION INFORMATION TPS2100 CardBus or System Controller 0.1 F EN 3.3 V VCC IN1 3.3 V VAUX IN2 3.3 V OUT 0.1 F xx F GND 0.1 F Figure 24. Typical Application power supply considerations A 0.01-F to 0.1-F ceramic bypass capacitor between IN and GND, close to the device is recommended. The output capacitor should be chosen based on the size of the load during the transition of the switch. A 47-F capacitor is recommended for 10-mA loads. Typical output capacitors (xx F, shown in Figure 24) required for a given load can be determined from Figure 16 which shows the output voltage droop when output is switched from IN2 to IN1. The output voltage droop is insignificant when output is switched from IN1 to IN2. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the immunity of the device to short-circuit transients. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 13 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 APPLICATION INFORMATION power supply considerations (continued) switch transition The n-channel MOSFET on IN1 uses a charge-pump to create the gate-drive voltage, which gives the IN1 switch a rise time of approximately 1 ms. The p-channel MOSFET on IN2 has a simpler drive circuit that allows a rise time of approximately 8 s. Because the device has two switches and a single enable pin, these rise times are seen as transition times, from IN1 to IN2, or IN2 to IN1, by the output. The controlled transition times help limit the surge currents seen by the power supply during switching. thermal protection Thermal protection provided on the IN1 switch prevents damage to the IC when heavy-overload or short-circuit faults are present for extended periods of time. The increased dissipation causes the junction temperature to rise to dangerously high levels. The protection circuit senses the junction temperature of the switch and shuts it off at approximately 125C (TJ). The switch remains off until the junction temperature has dropped. The switch continues to cycle in this manner until the load fault or input power is removed. undervoltage lockout An undervoltage lockout function is provided to ensure that the power switch is in the off state at power-up. Whenever the input voltage falls below approximately 2 V, the power switch quickly turns off. This function facilitates the design of hot-insertion systems that may not have the capability to turn off the power switch before input power is removed. Upon reinsertion, the power switch will be turned on with a controlled rise time to reduce EMI and voltage overshoots. power dissipation and junction temperature The low on-resistance on the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass large currents. The thermal resistances of these packages are high compared to that of power packages; it is good design practice to check power dissipation and junction temperature. First, find ron at the input voltage, and operating temperature. As an initial estimate, use the highest operating ambient temperature of interest and read ron from Figure 22 or Figure 23. Next calculate the power dissipation using: P D + ron I2 Finally, calculate the junction temperature: T J + PD R qJA ) TA Where: TA = Ambient temperature RJA = Thermal resistance Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees, repeat the calculation using the calculated value as the new estimate. Two or three iterations are generally sufficient to obtain a reasonable answer. ESD protection All TPS2100 and TPS2101 terminals incorporate ESD-protection circuitry designed to withstand a 2-kV human-body-model discharge as defined in MIL-STD-883C. 14 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 MECHANICAL DATA DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE 0,50 0,30 0,95 5 0,20 M 4 1,70 1,50 1 0,15 NOM 3,00 2,60 3 Gage Plane 3,00 2,80 0,25 0-8 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-4/E 05/99 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-178 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 15 TPS2100, TPS2101 VAUX POWER-DISTRIBUTION SWITCHES SLVS197D - JUNE 1999 - REVISED JUNE 2000 MECHANICAL DATA D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0.050 (1,27) 0.020 (0,51) 0.014 (0,35) 14 0.010 (0,25) M 8 0.008 (0,20) NOM 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) Gage Plane 0.010 (0,25) 1 7 0- 8 A 0.044 (1,12) 0.016 (0,40) Seating Plane 0.069 (1,75) MAX 0.010 (0,25) 0.004 (0,10) PINS ** 0.004 (0,10) 8 14 16 A MAX 0.197 (5,00) 0.344 (8,75) 0.394 (10,00) A MIN 0.189 (4,80) 0.337 (8,55) 0.386 (9,80) DIM 4040047 / D 10/96 NOTES: A. B. C. D. 16 All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). Falls within JEDEC MS-012 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS2100DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2100DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2100DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2100DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2101D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2101DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2101DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2101DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2101DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2101DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) TPS2100DBVR SOT-23 DBV 5 3000 180.0 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TPS2100DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TPS2101DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TPS2101DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2100DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0 TPS2100DBVT SOT-23 DBV 5 250 182.0 182.0 20.0 TPS2101DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0 TPS2101DBVT SOT-23 DBV 5 250 182.0 182.0 20.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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