UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLER
1
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FEATURES
DEnhanced Replacement for UC3842A Family
With Pin-to-Pin Compatibility
D1-MHz Operation
D50-μA Standby Current, 100-μA Maximum
DLow Operating Current of 2.3 mA at 52 kHz
DFast 35-ns Cycle-by-Cycle Overcurrent
Limiting
D±1-A Peak Output Current
DRail-to-Rail Output Swings with 25-ns Rise
and 20-ns Fall Times
D±1% Initial Trimmed 2.5-V Error Amplifier
Reference
DTrimmed Oscillator Discharge Current
DNew Under Voltage Lockout Versions
DMSOP-8 Package Minimizes Board Space
APPLICATIONS
DSwitch-Mode Power Supplies
Ddc-to-dc Converters
DBoard Mount Power Modules
DESCRIPTION
UCC38C4x family is a high-performance current-
mode PWM controller. It is an enhanced BiCMOS
version with pin-for-pin compatibility to the
industry standard UC384xA family and UC384x
family of PWM controllers. In addition, lower
startup voltage versions of 7 V are offered as
UCC38C40 and UCC38C41.
Providing necessary features to control fixed
frequency, peak current-mode power supplies,
this family offers the following performance
advantages. The device offers high-frequency
operation up to 1 MHz with low start-up and
operating currents, thus minimizing start-up loss
and low operating power consumption for
improved efficiency. The device also features a
very fast current-sense-to-output delay time of
35 ns and a ±1 A peak output current capability
with improved rise and fall times for driving large
external MOSFETs directly.
The UCC38C4x family is offered in 8-pin
packages, MSOP (DGK), SOIC (D) and PDIP (P).
FUNCTIONAL BLOCK DIAGRAM
UDG--99139
8
2
4
7VREF
Note: Toggle flip--flop used only in UCC38C41, UCC38C44, and UCC38C45.
VREF
RT/CT
+
VDD
5GND
6OUT
OSC
T
SQ
QR
FB
2R
R1V
1COMP
3CS
UVLO
ERROR AMP
(NOTE)
+
+
5.0 V
2.5 V
VREF
GOOD LOGIC
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright ©2003 -- 2010, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Te
x
as Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
2www.ti.com
recommended operating conditions
MIN MAX UNIT
Input voltage, VDD 18 V
Output voltage range, VOUT 18 V
Average output current, IOUTW200 mA
Reference output current, IOUT(ref)W-- 2 0 mA
Operating junction temperature, TJW-- 4 0 105 °C
¶It is not recommended that the device operate under conditions beyond those specified in this table for extended periods of time.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)}w
Supply voltage (VDD) 20 V......................................................................
(MAX ICC) 30 mA..................................................................
Output current, IOUT peak ±1A...................................................................
Output energy, capacitive load 5μJ...............................................................
Voltage rating (COMP, CS, FB) --0.3 V to 6.3 V....................................................
(OUT) --0.3 V to 20 V...............................................................
(RT/CT) --0.3 V to 6.3 V............................................................
(VREF) 7V.......................................................................
Error amplifier output sink current 10 mA..........................................................
Total Power Dissipation at TA=25°C: D package 50 °C/W..........................................
DGK package 120°C/W......................................
P package 65°C/W..........................................
Operating junction temperature range, TJ-- 5 5 °C to 150°C...........................................
Storage temperature range Tstg -- 6 5 °C to 150°C....................................................
Lead Temperature (Soldering, 10 seconds) 300°C..................................................
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
§All voltages are with respect to ground. Currents are positive into and negative out of the specified terminals. Consult the Packaging Section of
the Databook for thermal limitations and considerations of the package.
AVAILABLE OPTIONS
TA=T
JMAXIMUM
DUTY CYCLE
UVLO
ON/OFF
SOIC--8
SMALL OUTLINE
(D){
PDIP--8
PLASTIC DIP
(P)
MSOP--8
SMALL OUTLINE
(DGK){
14.5V / 9.0V UCC28C42D UCC28C42P UCC28C42DGK
100% 8.4V / 7.6V UCC28C43D UCC28C43P UCC28C43DGK
4
0
°
C
t
o
1
0
5
°
C
7.0V / 6.6V UCC28C40D UCC28C40P UCC28C40DGK
-- 4 0 °C to 105°C14.5V / 9.0V UCC28C44D UCC28C44P UCC28C44DGK
50% 8.4V / 7.6V UCC28C45D UCC28C45P UCC28C45DGK
7.0V / 6.6V UCC28C41D UCC28C41P UCC28C41DGK
14.5V / 9.0V UCC38C42D UCC38C42P UCC38C42DGK
100% 8.4V / 7.6V UCC38C43D UCC38C43P UCC38C43DGK
0°Cto70°C7.0V / 6.6V UCC38C40D UCC38C40P UCC38C40DGK
0
C
t
o
7
0
C
14.5V / 9.0V UCC38C44D UCC38C44P UCC38C44DGK
50% 8.4V / 7.6V UCC38C45D UCC38C45P UCC38C45DGK
7.0V / 6.6V UCC38C41D UCC38C41P UCC38C41DGK
†D (SOIC--8) and DGK (MSOP--8) packages are available taped and reeled. Add R suffix to device type (e.g.
UCC28C42DR) to order quantities of 2500 devices per reel. Tube quantities are 75 for D packages (SOIC--8) and
80 for DGK package (MSOP--8), and 50 for P package (PDIP-8).
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
3
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electrical characteristics VDD = 15 V (See Note 1), RT=10kΩ,C
T=3.3nF,C
VDD =0.1μF and no load
on the outputs, TA=--40°C to 105°C for the UCC28C4x and TA=0°Cto70°C for the UCC38C4x,
TA=T
J(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Reference Section
Output voltage, initial accuracy TA=25°CI
OUT =1mA 4.9 5.0 5.1 V
Line regulation VDD =12Vto18V 0.2 20 mV
Load regulation 1mA to 20mA 325 mV
Temperature stability SeeNote2 0.2 0.4 mV/°C
Total output variation SeeNote2 4.82 5.18 V
Output noise voltage 10 Hz to 10 kHz, TA=25°C, SeeNote2 50 μV
Long term stability 1000 hours, TA= 125°C, SeeNote2 525 mV
Output short circuit –30 –45 –55 mA
Oscillator Section
Initial accuracy TA=25°C, SeeNote3 50.5 53 55 kHz
Voltage stability VDD =12Vto18V 0.2% 1.0%
Temperature stability TMIN to TMAX,SeeNote2 1% 2.5%
Amplitude RT/CT Pin peak-to-peak 1.9 V
D
i
s
c
h
a
r
g
e
c
u
r
r
e
n
t
TA=25°C, RT/CT = 2 V, See Note 4 7.7 8.4 9.0 mA
Discharge current RT/CT = 2 V, See Note 4 7.2 8.4 9.5 mA
Error Amplifier Section
Feedback input voltage, initial accuracy VCOMP =2.5V, T
A=25°C2.475 2.500 2.525 V
Feedback input voltage, total variation VCOMP =2.5V, 2.45 2.50 2.55 V
Input bias current VFB =5.0V –0.1 –2.0 μA
Open-loop voltage gain (AVOL) VOUT =2Vto4V 65 90 dB
Unity gain bandwidth SeeNote2 1.0 1.5 MHz
Power supply rejection ratio (PSRR) VDD =12Vto18V 60 dB
Output sink current VFB =2.7V, V
COMP =1.1V 214 mA
Output source current VFB =2.3V, V
COMP =5V –0.5 –1.0 mA
High-level output voltage (VOH) VFB =2.7V, R
LOAD =15ktoGND 56.8 V
Low-level output voltage (VOL) VFB =2.7V, R
LOAD = 15 k to VREF 0.1 1.1 V
Current Sense Section
Gain SeeNote5,6 2.85 3.00 3.15 V/V
Maximum input signal VFB <2.4V 0.9 1.0 1.1 V
Power supply rejection ratio (PSRR) VDD = 12 V to 18 V, See Note 2, 5 70 dB
Input bias current –0.1 –2.0 μA
CS to output delay 35 70 ns
COMP to CS offset VCS =0V 1.15 V
NOTE: 1. Adjust VDD above the start threshold before setting at 15 V.
NOTE: 2. Ensured by design. Not production tested.
NOTE: 3. Output frequencies of the UCC38C41, UCC38C44 and the UCC38C45 are half the oscillator frequency.
NOTE: 4. Oscillator discharge current is measured with RT=10kΩto VREF.
NOTE: 5. Parameter measured at trip point of latch with VFB =0V.
NOTE: 6. Gain is defined as ACS =
ΔVCOM
ΔVCS
,0V≼VCS ≼900mV
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
4www.ti.com
electrical characteristics VDD = 15 V (See Note 1), RT=10kΩ,C
T=3.3nF,C
VDD =0.1μF and no load
on the outputs, TA=--40°C to 105°C for the UCC28C4x and TA=0°Cto70°C for the UCC38C4x,
TA=T
J(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Output Section
VOUT low (RDS(on) pull-down) ISINK = 200 mA 5.5 15
Ω
VOUThigh (RDS(on) pull-up) ISOURCE = 200 mA 10 25 Ω
Rise tIme TA=25°C, CLOAD =1nF 25 50
n
s
Fall time TA=25°C, CLOAD =1nF 20 40 ns
Undervoltage Lockout Section
UCC38C42, UCC38C44 13.5 14.5 15.5
Start threshold UCC38C43, UCC38C45 7.8 8.4 9.0
S
t
a
r
t
t
h
r
e
s
h
o
l
d
UCC38C40, UCC38C41 6.5 7.0 7.5
V
UCC38C42, UCC38C44 8 9 10
V
Minimum operating voltage UCC38C43, UCC38C45 7.0 7.6 8.2
M
i
n
i
m
u
m
o
p
e
r
a
t
i
n
g
v
o
l
t
a
g
e
UCC38C40, UCC38C41 6.1 6.6 7.1
PWM Section
M
a
x
i
m
u
m
d
u
t
y
c
y
c
l
e
UCC38C42, UCC38C43, UCC38C40, VFB <2.4V 94% 96%
Maximum duty cycle UCC38C44, UCC38C45, UCC38C41, VFB <2.4V 47% 48%
Minimum duty cycle VFB >2.6V 0%
Current Supply Section
Start-up current (ISTART-UP) VDD = Undervoltage lockout start threshold (--0.5 V) 50 100 μA
Operating supply current (IDD) VFB =V
CS =0V 2.3 3.0 mA
NOTE 1: Adjust VDD above the start threshold before setting at 15 V.
1
2
3
4
8
7
6
5
COMP
FB
CS
RT/CT
VREF
VDD
OUT
GND
PDIP (P) or SOIC (D) PACKAGE
(TOP VIEW) MSOP (DGK) PACKAGE
(TOP VIEW)
VREF
VDD
OUT
GND
8
7
6
5
1
2
3
4
COMP
FB
CS
RT/CT
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
5
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pin assignments
COMP: This pin provides the output of the error amplifier for compensation. In addition, the COMP pin is
frequently used as a control port by utilizing a secondary-side error amplifier to send an error signal across the
secondary-primary isolation boundary through an opto-isolator.
CS: The current sense pin is the non-inverting input to the PWM comparator. This is compared to a signal
proportional to the error amplifier output voltage. A voltage ramp can be applied to this pin to run the device with
a voltage mode control configuration.
FB: This pin is the inverting input to the error amplifier. The non-inverting input to the error amplifier is internally
trimmedto2.5V±1%.
GND: Ground return pin for the output driver stage and the logic level controller section.
OUT: The output of the on-chip drive stage. OUT is intended to directly drive a MOSFET. The OUT pin in the
UCC38C40, UCC38C42 and UCC38C43 is the same frequency as the oscillator, and can operate near 100%
duty cycle. In the UCC38C41, UCC38C44 and the UCC38C45, the frequency of OUT is one-half that of the
oscillator due to an internal T flipflop. This limits the maximum duty cycle to < 50%.
RT/CT: Timing resistor and timing capacitor. The timing capacitor should be connected to the device ground
using minimal trace length.
VDD: Power supply pin for the device. This pin should be bypassed with a 0.1-μF capacitor with minimal trace
lengths. Additional capacitance may be needed to provide hold up power to the device during startup.
VREF: 5-V reference. For stability, the reference should be bypassed with a 0.1-μF capacitor to ground using
the minimal trace length possible.
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
6www.ti.com
APPLICATION INFORMATION
This device is a pin-for-pin replacement of the bipolar UC3842 family of controllers, the industry standard PWM
controller for single-ended converters. Familiarity with this controller family is assumed.
The UCC28C4x/UCC38C4x series is an enhanced replacement with pin-to-pin compatibility to the bipolar
UC284x/UC384x and UC284xA/UC384xA families. The new series offers improved performance when
compared to older bipolar devices and other competitive BiCMOS devices with similar functionality. Note that
these improvements discussed below generally consist of tighter specification limits that are a subset of the
older product ratings, maintaining drop-in capability. In new designs these improvements can be utilized to
reduce the component count or enhance circuit performance when compared to the previously available
devices.
advantages
This device increases the total circuit efficiency whether operating off-line or in dc input circuits. In off-line
applications the low start-up current of this device reduces steady state power dissipation in the startup resistor,
and the low operating current maximizes efficiency while running. The low running current also provides an
efficiency boost in battery operated supplies.
low voltage operation
Two members of the UCC38C4x family are intended for applications that require a lower start-up voltage than
the original family members. The UCC38C40 and UCC38C41 have a turn-on voltage of 7.0 V typical and exhibit
hysteresis of 0.4 V for a turn-off voltage of 6.6 V. This reduced start-up voltage enables use in systems with lower
voltages, such as 12-V battery systems which are nearly discharged.
high speed operation
The BiCMOS design allows operation at high frequencies that were not feasible in the predecessor bipolar
devices. First, the output stage has been redesigned to drive the external power switch in approximately half
the time of the earlier devices. Second, the internal oscillator is more robust with less variation as frequency
increases. In addition, the current sense to output delay has been reduced by a factor of three, to 45ns typical.
These features combine to provide a device capable of reliable high frequency operation.
The UCC38C4x family oscillator is true to the curves of the original bipolar devices at lower frequencies yet
extends the frequency programmability range to at least 1MHz. This allows the device to offer pin to pin
capability where required yet capable of extending the operational range to the higher frequencies typical of
latest applications. When the original UC3842 was released in 1984 most switching supplies operated between
20kHz and 100kHz. Today, the UCC38C4x can be used in designs cover a span roughly ten times higher than
those numbers.
start/run current improvements
The start--up current is only 60 μA typical, a significant reduction from the bipolar device’s ratings of 300uA
(UC384xA). For operation over the temperature range of --40 to 85°C the UCC28C4x devices offer a maximum
startup current of 100 μA, an improvement over competitive BiCMOS devices. This allows the power supply
designer to further optimize the selection of the startup resistor value to provide a more efficient design. In
applications where low component cost overrides maximum efficiency the low run current of 2.3 mA, typical,
may allow the control device to run directly through the single resistor to (+) rail, rather than needing a bootstrap
winding on the power transformer, along with a rectifier. The start/run resistor for this case must also pass
enough current to allow driving the primary switching MOSFET, which may be a few milliamps in small devices.
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
7
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APPLICATION INFORMATION
±1% initial reference voltage
The BiCMOS internal reference of 2.5 V has an enhanced design and utilizes production trim to allow initial
accuracy of ±1% at room temperature and ±2% over the full temperature range. This can be used to eliminate
an external reference in applications that do not require the extreme accuracy afforded by the additional device.
This is very useful for nonisolated dc-to-dc applications where the control device is referenced to the same
common as the output. It is also applicable in offline designs that regulate on the primary side of the isolation
boundary by looking at a primary bias winding, or perhaps from a winding on the output inductor of a
buck-derived circuit.
reduced discharge current variation
The original UC3842 oscillator did not have trimmed discharged current, and the parameter was not specified
on the datasheet. Since many customers attempted to use the discharge current to set a crude deadtime limit
the UC3842A family was released with a trimmed discharge current specified at 25°C. The
UCC28C4x/UCC38C4x series now offers even tighter control of this parameter, with approximately ±3%
accuracy at 25°C, and less than 10% variation over temperature using the UCC28C4x devices. This level of
accuracy can enable a meaningful limit to be programmed, a feature not currently seen in competitive BiCMOS
devices. The improved oscillator and reference also contribute to decreased variation in the peak to peak
variation in the oscillator waveform, which is often used as the basis for slope compensation for the complete
power system.
soft-start
The following diagram provides a typical soft-start circuit for use with the UCC38C42. The values of R and C
should be selected to bring the COMP pin up at a controlled rate, limiting the peak current supplied by the power
stage. After the soft-start interval is complete the capacitor continues to charge to VREF
, effectively removing
the PNP transistor from circuit considerations.
The optional diode in parallel with the resistor forces a soft-start each time the PWM goes through UVLO and
the reference (VREF) goes low. Without the diode,the capacitor otherwise remains charged during a brief loss
of supply or brown-out, and no soft-start is enabled upon reapplication of VIN.
Figure 1 UDG--01072
VREF
UCC38C42
8
1COMP
5
GND
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
8www.ti.com
APPLICATION INFORMATION
oscillator synchronization
The UCC38C4x oscillator has the same synchronization characteristics as the original bipolar devices. Thus,
the information in the Application Note U--100A, UC3842/3/4/5 Provides Low-Cost Current-Mode Control, (TI
Literature No. SLUA143) still applies. The application note describes how a small resistor from the timing
capacitor-to-ground can offer an insertion point for synchronization to an external clock, (see Figures 2 and 3).
Figure 2 shows how the UCC38C42 can be synchronized to an external clock source. This allows precise
control of frequency and dead time with a digital pulse train.
UDG--01069
8
4
VREF
RT/C
T
UCC38C42
PWM
RT
CT
24 Ω
SYNCHRONIZATION
CIRCUIT INPUT
Figure 2. Oscillator Synchronization Circuit
ON .
LOW LOWHIGH
ON .OFF .
CLOCK
INPUT
PWM
OUT
UPPER THRESHOLD
LOWER THRESHOLD
OUTPUT A
COMBINED
UPPER THRESHOLD
LOWER THRESHOLD
VCT
VCT (ANALOG)
VSYNC (DIGITAL)
UDG--01070
Figure 3. Synchronization to an External Clock
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
9
www.ti.com
APPLICATION INFORMATION
precautions
The absolute maximum supply voltage is 20 V, including any transients that may be present. If this voltage is
exceeded, device damage is likely. This is in contrast to the predecessor bipolar devices, which could survive
up to 30 V. Thus, the supply pin should be decoupled as close to the ground pin as possible. Also, since no clamp
is included in the device, the supply pin should be protected from external sources which could exceed the 20 V
level.
Careful layout of the printed board has always been a necessity for high frequency power supplies. As the device
switching speeds and operating frequencies increase the layout of the converter becomes increasingly
important.
This 8-pin device has only a single ground for the logic and power connections. This forces the gate drive current
pulses to flow through the same ground that the control circuit uses for reference. Thus, the interconnect
inductance should be minimized as much as possible. One implication is to place the device (gate driver)
circuitry close to the MOSFET it is driving. Note that this can conflict with the need for the error amplifier and
the feedback path to be away from the noise generating components.
circuit applications
Figure 4 shows a typical off-line application.
UDG--01071
C53
1COMP
2FB
3CS
4RT/CT
8REF
7VCC
6OUT
5GND
UCC38C44
R6
C13
R16
T1
R12
C5
C12
D50
C52
D51
C3
R10
R11
C18C1A
F1
BR1
+
RT1
L50
C54
R55
R53
R56
C55
R52
SEC
COMMON
12 V
OUT
R50
C50
C51
R50
IC3
R54
AR
K
Q1
5V
OUT
AC INPUT
100 Vac -- 240 Vac
EMI FILTER
REQUIRED
D2
D6
IC2
IC2
Figure 4. Typical Off-Line Application
Figure 5 shows the forward converter with synchronous rectification. This application provides 48 V to 3.3 V at
10 A with over 85% efficiency and uses the UCC38C42 as the secondary-side controller and UCC3961 as the
primary-side startup control device.
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
10 www.ti.com
APPLICATION INFORMATION
R28
100
D3
BAR74
C26
2uF
D5
BAR74
R14
20k 40%
C16
5.6nF
+
C15
1uF
C14
1uF
C13
0.22uF
C12
3300pF
C11
1500pF
D6
BZX84C15LT1
UCC38C4x
1COMP
2FB
3CS
4Rt/Ct 5
GND
6
OUT
7
Vcc
8
REF
U2
C22
4.7nF
C23 680pF
C24
0.1uF
C10
2.7nF
1
2
3
4
T2
Q4
Q3
L1
4.7uH
C21
0.1uF
+
C20
470uF
+
C19
470uF
3r3V
PWRGND
D2
C2
1nF
C18
4700pF
C25
0.047uF
VinN
VinP
C9
0.1uF
ucc3961
4FB
5Rt
6Ref
7AGnd 8
Vs
9
CS
10
PGnd
11
Out
1OVS
2SD
3SS 12
Vdd
13
St
14
UVS
U1
+
C1
470uF
C3 10nF
C4
0.22uF
C5
0.1uF C6
470pF
C7
100pF
C8
1uF
C17
4700pF
D1
Q1
Q2
TPS2832
8
BOOT
1IN
6
BTLO
3DT
7
HIDR
4Vcc
2PGND
5
LODR
U4
T1
R19
20
R22
100
R18
7.5k
R17
20k
R16 21.5k
R15
50k
R23
402
R24
20k
R25
20k
R12
200 R13
300
R27
4.7
R26
4.7
R7
10k
R21
10
R1
32.4k
R2
1.2k
R3
2.4k
R4
1.5k R5
76.8k
R6
4.7
R8
5.1k
R9
0.33
R10
1k
R11
46.4k
R20
10
Figure 5. Forward Converter with Synchronous Rectification Using the UCC38C42
as the Secondary-Side Controller
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
11
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TYPICAL CHARACTERISTICS
1k
10 k
100 k
1 k 10 k 100
k
1M
10 M
Figure 6
OSCILL
A
TOR FREQUENC
Y
vs
TIMING RESISTANCE AND CAPACITANCE
CT = 220 pF
CT = 4.7 nF
CT = 2.2 nF
CT = 1 nF
CT = 470 pF
RT-- Timing Resistance -- Ω
f -- Frequency -- Hz
Figure 7
IDISCH -- Oscillator Discharge Current -- mA
TJ-- Temperature -- °C
9.0
9.5
8.0
7.5
7.0
8.5
--50 --25 0 25 50 75 100 125
OSCILLATOR DISCHARGE CURRENT
vs
TEMPERATURE
Figure 8
f -- Frequency -- Hz
Gain -- (dB)
ERROR AMPLIFIER
FREQUENCY RESPONSE
1 10 100 10 k 100 k 1 M 10 M1k
10
0
20
200
180
140
120
80
40
0
60
100
160
20
30
40
50
60
70
80
90
100
Phase Margin -- (°)
GAIN
PHASE
MARGIN
Figure 9
COMP to CS OFFSET VOLTAGE (with CS = 0)
vs
TEMPERATURE
COMP to CS
TJ-- Temperature -- °C
0.2
1.8
1.4
1.2
0.8
0.4
0.0
0.6
1.0
1.6
--50 --25 0 25 50 75 100 125
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
12 www.ti.com
TYPICAL CHARACTERISTICS
Figure 10
REFERENCE VOLTAGE
vs
TEMPERATURE
VREF -- Reference Voltage -- V
--50 --25 0 25 50 75 100 125
TJ-- Temperature -- °C
4.96
4.97
4.98
4.99
5.01
5.02
5.03
5.04
5.05
5.00
4.95
2.46
2.55
2.54
2.52
2.51
2.49
2.47
2.45
2.48
2.50
2.53
--50 --25 0 25 50 75 100 125
ERROR AMPLIFIER REFERENCE VOLTAGE
vs
TEMPERATURE
Figure 11
VEAREF -- Error Amplifier Reference Voltage -- V
TJ-- Temperature -- °C
Figure 12
ISC -- Reference Short Circuit Current -- mA
REFERENCE SHORT-CIRCUIT CURRENT
vs
TEMPERATURE
-- 5 5
-- 3 5
-- 3 7
-- 4 1
-- 4 5
-- 5 1
-- 5 3
-- 4 7
-- 4 9
-- 4 3
-- 3 9
--50 --25 0 25 50 75 100 125
TJ-- Temperature -- °C
--200
200
150
50
0
-- 5 0
--150
100
--100
ERROR AMPLIFIER INPUT BIAS CURRENT
vs
TEMPERATURE
Figure 13
IBIAS -- Error Amplifier Input Bias Current -- nA
TJ-- Temperature -- °C
--50 --25 0 25 50 75 100 125
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
13
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TYPICAL CHARACTERISTICS
Figure 14
6
16
15
13
11
8
7
10
9
12
14
--50 --25 0 25 50 75 100 125
UVLO
ON
UVLO
OFF
UNDER
V
OLT
A
GE LOC
K
OUT
vs
TEMPERATURE (UCC38C42 & UCC38C44)
VUVLO -- U V L O V o l t a g e -- V
TJ-- Temperature -- °C
Figure 15
UNDERVOLTAGE LOCKOUT
vs
TEMPERATURE (UCC38C43 & UCC38C45)
VUVLO -- U V L O V o l t a g e -- V
TJ-- Temperature -- °C
7.0
9.0
8.8
8.4
8.0
7.4
7.2
7.8
7.6
8.2
8.6
--50 --25 0 25 50 75 100 125
UVLO
ON
UVLO
OFF
6.3
7.3
7.2
7.0
6.8
6.5
6.4
6.7
6.6
7.1
--50 --25 0 25 50 75 100 125
6.9
Figure 16
UNDERVOLTAGE LOCKOUT
vs
TEMPERATURE (UCC38C40 & UCC38C41)
VUVLO -- U V L O V o l t a g e -- V
TJ-- Temperature -- °C
UVLO
ON
UVLO
OFF
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
14 www.ti.com
TYPICAL CHARACTERISTICS
Figure 17
5
0
10
15
20
25
200 k 400 k 600 k 800 k
0k 1M
1-nF LOAD
NO LOAD
SUPPLY CURRENT
vs
OSCILLATOR FREQUENCY
IDD -- Supply Current -- mA
f -- Frequency -- Hz
Figure 18
IDD -- Supply Current -- mA
-- 5 0
2.1
3.0
2.9
2.7
2.6
2.4
2.2
2.0
2.3
2.5
2.8
--25 0 25 50 75 100 125
SUPPLY CURRENT
vs
TEMPERATURE
TJ-- Temperature -- °C
NO LOAD
Figure 19
OUTPUT RISE TIME AND FALL TIME
vs
TEMPERATURE
Output Rise and Fall TIme -- ns
10
15
40
35
30
20
25
tf
tr
(1 nF)
--50 --25 0 25 50 75 100 125
TJ-- Temperature -- °C
(1 nF)
10% to 90%
VDD =12V
Figure 20
Duty Cycle -- %
f -- Frequency -- kHz
MAXIMUM DUTY CYCLE
vs
OSCILLATOR FREQUENCY
50
100
90
60
0500
80
70
CT = 220 pF
CT = 1 nF
1000 1500 2000 2500
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
15
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TYPICAL CHARACTERISTICS
Figure 21
Maximum Duty Cycle -- %
M
A
XIMUM DUT
Y
C
Y
CLE
vs
TEMPERATURE
90
100
92
94
96
98
--50 --25 0 25 50 75 100 125
UCC38C40
UCC38C42
UCC38C43
TJ-- Temperature -- °C
Figure 22
MAXIMUM DUTY CYCLE
vs
TEMPERATURE
Output Rise and Fall TIme -- ns
45
50
46
47
48
49
--50 --25 0 25 50 75 100 125
UCC38C41
UCC38C44
UCC38C45
TJ-- Temperature -- °C
Figure 23
CURRENT SENSE THRESHOLD VOLTAGE
vs
TEMPERATURE
VCS_th -- Current Sense Threshold -- V
0.90
0.95
1.00
1.05
1.10
--50 --25 0 25 50 75 100 125
TJ-- Temperature -- °C
Figure 24
tD-- CD to OUT Delay Time -- ns
CS TO OUT DEL
A
Y
TIME
vs
TEMPERATURE
30
--50 --25 0 25 50 75 100 125
35
70
65
60
55
45
40
50
TJ-- Temperature -- °C
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010
16 www.ti.com
Revision History
Revision SLUS458D to SLUS458E, 10/2010
1) Updated Operating Juction Temperature in the Recommended Operating Conditions Table, from
--55 to 150 to --40 to 105.
2) Updated Available Options Table heading from TAto TA=T
J.
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UCC28C40D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C40DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C40DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C40DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C40DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C40DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C40DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C40DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C40P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C40PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C41D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C41DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C41DGK ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C41DGKG4 ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C41DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C41DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C41DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
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UCC28C41DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C42D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C42DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C42DGK ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C42DGKG4 ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C42DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C42DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C42DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C42DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C42P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C42PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C43D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C43DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C43DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C43DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C43DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C43DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C43DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
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Ball Finish MSL Peak Temp (3) Samples
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UCC28C43DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C43P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C43PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C44D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C44DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C44DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C44DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C44DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C44DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C44DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C44DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C44P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C44PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C45D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C45DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C45DGK ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C45DGKG4 ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C45DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
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Ball Finish MSL Peak Temp (3) Samples
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UCC28C45DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC28C45DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C45DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC28C45P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC28C45PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C40D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C40DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C40DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C40DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C40DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C40DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C40DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C40DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C40P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C40PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C41D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C41DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C41DGK ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
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Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UCC38C41DGKG4 ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C41DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C41DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C41P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C41PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C42D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C42DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C42DGK ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C42DGKG4 ACTIVE VSSOP DGK 8 100 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C42DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C42DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C42DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C42DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C42P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C42PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C43D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C43DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C43DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
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Addendum-Page 6
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UCC38C43DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C43DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C43DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C43DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C43DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C43P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C43PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C44D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C44DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C44DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C44DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C44DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C44DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C44DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C44DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C44P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C44PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C45D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 7
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UCC38C45DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C45DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C45DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C45DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C45DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
UCC38C45DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C45DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC38C45P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC38C45PG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 8
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UCC28C41, UCC28C43, UCC28C45 :
•Automotive: UCC28C41-Q1
•Enhanced Product: UCC28C43-EP, UCC28C45-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UCC28C40DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC28C40DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC28C41DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC28C41DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC28C42DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC28C42DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC28C43DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC28C43DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC28C44DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC28C44DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC28C45DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC28C45DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC38C40DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC38C40DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC38C41DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC38C42DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC38C42DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC38C43DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UCC38C43DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC38C44DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC38C44DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC38C45DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC38C45DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC28C40DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
UCC28C40DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C41DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC28C41DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C42DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC28C42DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C43DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC28C43DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C44DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
UCC28C44DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C45DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
UCC28C45DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC38C40DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC38C40DR SOIC D 8 2500 340.5 338.1 20.6
UCC38C41DR SOIC D 8 2500 340.5 338.1 20.6
UCC38C42DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC38C42DR SOIC D 8 2500 340.5 338.1 20.6
UCC38C43DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC38C43DR SOIC D 8 2500 340.5 338.1 20.6
UCC38C44DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC38C44DR SOIC D 8 2500 340.5 338.1 20.6
UCC38C45DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC38C45DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 3
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