006791001003005 - AVX - Product.Network

1#

Product Family Data Sheet Rev. 3.5 2018. 09. 21

High Power LED Series

Chip Scale Package

LH181B

Use of Samsung’s Chip Scale Package technology

provide high performance and energy conserving

Featur

es & Benefits

 Utilizes Samsung TF chip technology

 Suitable for use in indoor and outdoor lighting

 Operates at a maximum current of up to 1.4 A

 Compact footprint (2.36 x 2.36 mm)

Applications

 Indoor Lighting: Spotlight, Downlight, MR, PAR

 Outdoor Lighting: Street Light, Tunnel Light, Security Light, Parking Lot Light

 Industrial Lighting: High Bay Light, Low Bay Light

 Consumer Lighting: Torch Light

2

Table of Contents

1.

Characteristics

-----------------------

3

2.

Product Code Information

-----------------------

6

3.

Typical Characteristics Graphs

-----------------------

11

4.

Outline Drawing & Dimension

-----------------------

13

5.

Reliability Test Items & Conditions

-----------------------

14

6.

Soldering Conditions

-----------------------

15

7.

Tape & Reel

-----------------------

16

8.

Label Structure

-----------------------

18

9.

Packing Structure

-----------------------

19

10.

Precautions in Handling & Use

-----------------------

21

3

1. Characteristics

a) Absolute Maximum Rating

Item

Symbol

Rating

Unit

Condition

Ambient / Operating Temperature

Ta

-40 ~ +100

ºC

Note 1)

Storage Temperature

Tstg

-40 ~ +125

ºC

-

LED Junction Temperature

Tj

135

ºC

-

Forward Current

IF

1400

mA

Note 1)

Peak Pulse Forward Current

IFP

2000

mA

Duty 1/10 pulse width 10ms

Assembly Process Temperature

-

260

<10

ºC

s

-

ESD (HBM)

-

±2

kV

-

Note:

1) Refer to the derating curve, ‘3. Typical Characteristics Graph’, for proper driving current that maintained below maximum

junction temperature.

4

b) Electro-optical Characteristics

Item

Unit

Nominal CCT

(K)

Condition

Value

Typ.

IF (mA)

Tj (°C)

Luminous Flux (Φv)

lm

3500

(80 CRI)

350

25

168

350

85

152

700

85

283

1000

85

381

1400

85

492

Forward Voltage (VF)

V

350

25

2.92

350

85

2.82

700

85

2.97

1000

85

3.08

1400

85

3.20

Thermal Resistance

(junction to solder point)

K/W

2

Beam Angle

º

120

Note:

Samsung maintains measurement tolerance of: luminous flux = ±7%, forward voltage = ±0.1 V

5

c) Luminous Flux Characteristics (Ts = 85 ºC)

Sorting @ 350 mA (lm)

Calculated Minimum Flux2) (lm)

Flux Rank

Flux Range1)

Sub Rank

@ 350 mA

@ 700 mA

@ 1050 mA

@ 1500 mA

E3

80 ~ 110

E1, F1, G1

80

149

200

259

F3

90 ~ 120

F1, G1, H1

90

167

226

291

G3

100 ~ 130

G1, H1, J1

100

186

251

324

H3

110 ~ 140

H1, J1, K1

110

205

276

356

J3

120 ~ 150

J1, K1, M1

120

223

301

388

K3

130 ~ 160

K1, M1, N1

130

242

326

421

M3

140 ~ 170

M1, N1, P1

140

260

351

453

N3

150 ~ 180

N1, P1, Q1

150

279

376

485

P3

160 ~ 190

P1, Q1, R1

160

298

401

518

Q3

170 ~ 200

Q1, R1, S1

170

316

426

550

R3

180 ~ 210

R1, S1, T1

180

335

451

582

S3

190 ~ 220

S1, T1, U1

190

353

476

615

T3

200 ~ 230

T1, U1, V1

200

372

501

647

U3

210 ~ 240

U1, V1, W1

210

391

526

679

V3

220 ~ 250

V1, W1, X1

220

409

551

712

W3

230 ~ 260

W1, X1, Y1

230

428

576

744

X3

240 ~ 270

X1, Y1, Z1

240

446

601

776

Y3

250 ~ 280

Y1, Z1, 11

250

465

627

809

Z3

260 ~ 290

Z1, 11, 21

260

484

652

841

Notes:

1) Samsung maintains measurement tolerance of: luminous flux = ±7 %, CRI = ±3

2) Calculated minimum flux values are for reference only

6

2. Product Code Information

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

S

C

P

8

U

T

F

1

H

E

L

1

U

K

M

3

4

E

Digit

PKG Information

Code

Specification

1 2 3

Samsung Chip Scale Package

SCP

4

CRI

7

CRI 70

8

CRI 80

9

CRI 90

5

CCT(K)

W

2700K

V

3000K

U

3500K

T

4000K

R

5000K

Q

5700K

P

6500K

6

Chip Shape

T

Square type

7 8 9

Product

F1H

Chip version

10 11 12

Product Purpose

EL1

FEC for lighting

13

CCT (K)

W

2700K

V

3000K

U

3500K

T

4000K

R

5000K

Q

5700K

P

6500K

14

MacAdam Step

K

Full Bin for MacAdam 5-Step

U

Full Bin for MacAdam 3-Step

15 16

Luminous Flux

F 3

90- 120

F1

90-100

G 3

100- 130

G1

100-110

F3

H 3

110- 140

H1

110- 120

G3

J 3

120- 150

J1

120- 130

H3

K 3

130~160

K1

130~140

J 3

M 3

140~170

M1

140~150

K 3

N 3

150~180

N1

150~160

M 3

P 3

160~190

P1

160~170

N 3

Q 3

170~200

Q1

170~180

P 3

Q 3

Digit 15: Min. spec

Digit 16: The number of higher bin(s) from min. spec.

e.g.: K1 = 130~140 lm, K3 = 130~160 lm

17 18

Forward Voltage (Vf)

4 E

2.7 ~ 3.1 V

7

a) Luminous Flux Bins (IF = 350 mA, Ts = 85 ºC)

CRI/

Nominal CCT (K)

Flux rank

E1

F1

G1

H1

J1

K1

M1

N1

P1

Q1

R1

S1

(min. flux)

80

90

100

110

120

130

140

150

160

170

180

190

70

2700

SCP7WTF1HEL1W

◇

M34E

3000

SCP7VTF1HEL1V

◇

N34E

3500

SCP7UTF1HEL1U

◇

N34E

4000

SCP7TTF1HEL1T

◇

P34E

5000

SCP7RTF1HEL1R

◇

P34E

5700

SCP7QTF1HEL1Q

◇

P34E

6500

SCP7PTF1HEL1P

◇

N34E

80

2700

SCP8WTF1HEL1W

◇

K34E

3000

SCP8VTF1HEL1V

◇

K34E

3500

SCP8UTF1HEL1U

◇

M34E

4000

SCP8TTF1HEL1T

◇

M34E

5000

SCP8RTF1HEL1R

◇

N34E

5700

SCP8QTF1HEL1Q

◇

N34E

6500

SCP8PTF1HEL1P

◇

M34E

90

2700

SCP9WTF1HEL1W

◇

G34E

3000

SCP9VTF1HEL1V

◇

G34E

3500

SCP9UTF1HEL1U

◇

H34E

4000

SCP9TTF1HEL1T

◇

H34E

5000

SCP9RTF1HEL1R

◇

H34E

Notes:

1) ◇ : MacAdam step code, K(MacAdam 5-step) / U(MacAdam 3-step)

8

b) Color Bins (IF = 350 mA, Ts= 85 ºC)

Nominal CCT (K)

CRI (Ra)

Color Rank

Chromaticity Bins

2700, 3000, 3500, 4000,

5000, 5700, 6500

70

K

(Full Bin for MacAdam 5-step)

U

(Full Bin for MacAdam 3-step)

☆K

☆U

2700, 3000, 3500, 4000,

5000, 5700, 6500

80

2700, 3000, 3500,4000,5000

90

Notes:

1) ☆ : Nominal CCT code, W(2700K)/V(3000K)/U(3500K)/T(4000K)/R(5000K)/Q(5700K)/P(6500K)

c) Voltage Bins (IF = 350 mA, Ts = 85 ºC)

CRI (Ra)

Nominal CCT

(K)

Product Code

Voltage Rank

Voltage Bin

Voltage Range

(V)

4E

2.7 ~ 3.1

9

d) Chromaticity Region & Coordinates (IF = 350 mA, Ts = 85 ºC)

10

e) Chromaticity Region & Coordinates (IF = 350 mA, Ts = 85 ºC)

MacAdam

CCT

(K)

Center point

Major-axis

Minor-axis

Rotation

CIE x

CIE y

a

b

Φ

3 step

2700

0.4578

0.4101

0.0081

0.0042

53.70

3000

0.4338

0.4030

0.0083

0.0041

53.22

3500

0.4073

0.3917

0.0093

0.0041

54.00

4000

0.3818

0.3797

0.0094

0.0040

53.72

5000

0.3447

0.3553

0.0082

0.0035

59.62

5700

0.3287

0.3417

0.0075

0.0032

59.10

6500

0.3123

0.3282

0.0067

0.0029

58.57

5 step

2700

0.4578

0.4101

0.0135

0.0070

53.70

3000

0.4338

0.4030

0.0138

0.0068

53.22

3500

0.4073

0.3917

0.0155

0.0068

54.00

4000

0.3818

0.3797

0.0157

0.0067

53.72

5000

0.3447

0.3553

0.0137

0.0058

59.62

5700

0.3287

0.3417

0.0125

0.0053

59.10

6500

0.3123

0.3282

0.0112

0.0048

58.57

Note:

Samsung maintains measurement tolerance of: Cx, Cy = ±0.005

11

3. Typical Characteristics Graphs

a) Spectrum Distribution (IF = 350 mA, Ts = 85 ºC)

3000K/CRI70 5000K/CRI70

b) Forward Current Characteristics (Ts = 85 ºC)

c) Temperature Characteristics (IF = 350 mA)

12

d) Color Shift Characteristics (IF = 350 mA, Ts = 85 ºC)

e) Derating Curve and Beam Angle Characteristics (IF = 350 mA, Ts = 25 ºC)

13

4. Outline Drawing & Dimension

Precautions:

1) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on

the LEDs. Do not put stress on the LEDs during heating.

2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics

should be carefully checked before and after such repair.

3) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED

might cause catastrophic failure of the LEDs.

 Measurement unit: mm

 Tolerance: ±0.13 mm

14

5. Reliability Test Items & Conditions

a) Test Items

Test Item

Test Condition

Test

Hour / Cycle

Room Temperature

Life Test

25 ºC, Derated maximum current

1000 h

High Temperature

Life Test

85 ºC, Derating maximum current

1000 h

High Temperature

Humidity Life Test

60 ºC, 90% RH, Derating maximum current

1000 h

Low Temperature

Life Test

-40 ºC, Derating maximum current

1000 h

Temperature

Humidity Cycle Test

-10℃↔25℃/Dry, 25℃ ↔ 65℃ 95% R.H.

Derating maximum current

10 cycles

Powered Temperature

Cycle Test

-40 ºC / 85 ºC each 20 min, 100 min transfer

power on/off each 5 min, Derating maximum current

100 cycles

Thermal Shock

-45 ºC / 15 min ↔ 125 ºC / 15 min

temperature change within 5 min

500 cycles

High Temperature

Storage

120 ºC

1000 h

Low Temperature

Storage

-40 ºC

1000 h

ESD (HBM)

R1: 10 MΩ

R2: 1.5 kΩ

C: 100 pF

V: ±2 kV

5 times

ESD (MM)

R1: 10 MΩ

R2: 0

C: 200 pF

V: ±0.2 kV

5 times

Vibration Test

20~2000~20 Hz, 200 m/s2, sweep 4 min

X, Y, Z 3 direction, each 1 cycle

4 cycles

Mechanical Shock Test

1500 g, 0.5 ms

3 shocks each X-Y-Z axis

5 cycles

b) Criteria for Judging the Damage

Item

Symbol

Test Condition

(Ts = 25 ºC)

Limit

Min.

Max.

Forward Voltage

VF

IF = 350 mA

Init. Value * 0.9

Init. Value * 1.1

Luminous Flux

Φv

IF = 350 mA

Init. Value * 0.7

Init. Value * 1.1

15

6. Soldering Conditions

a) Reflow Conditions (Pb free)

Reflow frequency: 2 times max.

b) Manual Soldering Conditions

No more than 5 seconds @ max. 300 ºC, under soldering iron.

16

7. Tape & Reel

a) Taping Dimension

- +

17

b) Reel Dimension

(unit: mm)

Notes:

1) Quantity: 2,000 Qty/reel

2) Cumulative tolerance: Cumulative tolerance / 10 pitches is ±0.2 mm

3) Adhesion strength of cover tape: Adhesion strength is 0.1-0.7 N when the cover tape is turned off from the carrier tape at

10° angle to the carrier tape

4) Packaging: P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag

18

Rank Code

Lot Number

Product Code

ⓐⓑⓒⓓⓔⓕ

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

T1H2C00NB / 1001 / X,XXX pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

LED Qty

Model

8. Label Structure

a) Label Structure

Note: Denoted Bin ID and product code above is only an example

Rank Code:

ⓐⓑ: Chromaticity bin (refer to page 6)

ⓔⓕ: Voltage bin (refer to page 6,9)

b) Lot Number

The lot number is composed of the following characters:

①

: T (T: Taping ID)

②

: 1 (1: LED Manufacture Line)

③

: Year (G:2016, H: 2017, …)

④

: Month (1, 2, … , 7: July, … , A: Oct., B: Nov., C: Dec.)

⑤

: Day (1~9, A: 10, … , K: 20, … , U: 30, V:31)

⑥⑦⑧⑨

: Product serial number (0001 ~ 9999)

UUN14E

SCP8UTF1HEL1UUM34E UUN14E

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

①②③④⑤⑥⑦⑧⑨ / 1001 / X,XXX pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

LH181B [CRI] [CCT]

19

UUN14E

SCP8UTF1HEL1UUM34E UUN14E

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

T1H2C00NB / 1001 / X,XXX pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

UUN14E

SCP8UTF1HEL1UUM34E UUN14E

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

T1H2C00NB / 1001 / X,XXX pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

UUN14E

SCP8UTF1HEL1UUM34E UUN14E

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

T1H2C00NB / 1001 / X,XXX pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

9. Packing Structure

a) Packing Process

Material: Paper SW(B)

Type

Size (mm)

Note

(a)

(b)

(c)

7 inch

245 ± 5

220 ± 5

182 ± 5

Up to 7 reels

Reel

Outer Box

Aluminum Vinyl Packing Bag

LH181B [CRI] [CCT]

20

b) Aluminum Vinyl Packing Bag

c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag

UUN14E

SCP8UTF1HEL1UKM34E UUN14E

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

T1H2C00NB / 1001 / X,XXX pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

LH181B [CRI] [CCT]

21

10. Precautions in Handling & Use

1) For over-current protection, users are recommended to apply resistors connected in series with the LEDs to mitigate

sudden change of the forward current caused by shift of forward voltage.

2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA

is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the

device.

3) When the device is in operation, the forward current should be carefully determined considering the maximum ambient

temperature and corresponding junction temperature.

4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped

from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at

temperature 0~40 ºC, 0~90 % RH).

5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:

a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or

b. Stored at <10 % RH

6) Repack unused devices with anti-moisture packing, fold to close any opening and then store in a dry place.

7) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.

8) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.

9) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-

electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may

cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as

increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.

10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in

luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a

discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light

emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical

properties of materials used in luminaires and they must be carefully selected.

Legal and additional information.

About Samsung Electronics Co., Ltd.

Samsung Electronics Co. Ltd inspires the world and shapes the future with transformative

ideas and technologies. The company is redefining the worlds of TVs, smartphones,

wearable devices, tablets, digital appliances, network systems, and semiconductor and

LED solutions. For the latest news, please visit the Samsung Newsroom at

http://news.samsung.com.

Samsung is a registered trademark of Samsung Electronics Co., Ltd.

Specifications and designs are subject to change without notice. Non-metric

weights and measurements are approximate. All data were deemed correct

at time of creation. Samsung is not liable for errors or omissions. All brand, product,

service names and logos are trademarks and/or registered trademarks of their

respective owners and are hereby recognized and acknowledged.

Samsung Electronics Co., Ltd.

1, Samsung-ro

Giheung-gu

Yongin-si, Gyeonggi-do, 17113

KOREA

www.samsungled.com