I
I
Part:
IRFC024NB
0escrifl1ion:
55V Size 85x66
Gen
5
HEXFET
DIE
ON
WAFER
Support
Docs:
Datasheet
Specifica1ions
Parameter
I
p
roduct
Family I
HEXFET
package I
DIE
ON
WAFER
package Equivalent I
1RFIZ24N
~
en
5
ill
oltage
55
p
ie
Product
I
DieProduct
I
Packaging
Op1ions
I
Product
10
I Description I Status Standard
Pack
IRFC024N8
55V Size 85x66 Gen 5 HEXFET DIE I Active
ON WAFER
Package
Support
Docs
IR can offer a range
of
carrier options to
suit
individual
customer
needs.
As
standard,
we
offer
probed
Die
on
wafer,
sawn
Die
on
film
and
in
waffle
trav
I chip
pack.
For
certain
Die
products. Tape and Reel, in the
form
of
Pocket
Tape
is
available.
Please
use
our
online
help
utilitv
for
details.
Details on the advantages/disadvantages
of
the
various carrier options can
be
found in the
application
note
on
carrier
options
or
the
links
above.
Part Search: 1
Value
[1K
Budgetary
[
~
]
Pricing
(USO)
llllt.
I D l
lit.Jiii
•UMI]
1\,iJI
