〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioac ti ve rays
. 1/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
2014.04.04 Rev.001
TSZ22111 • 14 • 001
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Small-sized Class-D S peaker A mpli fiers
Analog Input
Monaural Class-D Speaker Amplifier
BD5469GUL
General Description
BD5469GUL is a monaural Class-D speaker amplifier that
has integrated ALC function suitable for mobile phones,
portable type electronic devices, etc. LC filter at the
speaker output is not needed. The IC forms a monaural
speaker amplifier using j ust 3 external components. ALC,
short for Automatic Level Control, is a function that
automatically adjusts the level of suppression to avoid
distortion (clipping) of the output waveform during
excessive input. The time until the suppression of the
output level is released is called the release time (or
recovery time). This IC has a typical release time of
262ms/1dB which suits music play applications.
Through Class-D operation, the IC can achieve high
efficiency and low power consumption which makes it
suitable for battery driven applications. The current
consumption in shutdown mode is lowered to
0.01μA(Typ). Startup time from shutdown mode to active
mode is fast and pop noise is minimized which enables it
to withstand repeated active and shutdown modes.
Features
Integrated D igital A LC (Automatic Level Control)
Function.
External parts : 3 components.
Ultra slim type package: 9 pin
WL-CSP(1.7×1.7×0.55mmMax).
Pin Compatible Specs.
BD5460/61GUL
(No ALC Functi on, Fixed Output Gain)
BD5465/66/68GUL
(ALC Function, Fixed Output Gain)
ALC release (recovery) time : 262ms/1dB (Typ).
Output Power Limit
: 0.88W (Typ) [VDD=4.2V, RL=8Ω, T HD+N ≤ 1%]
: 0.9W (Typ) [VDD=3.7V, RL=6Ω, THD+N ≤ 1%]
: 0.64W (Typ) [VDD=3.6V, RL=8Ω, THD+N ≤ 1%]
Audio Anal og Input (has option for either single-end
input or differential input).
No need for output LC filter
Pop noise suppression circuit
Shutdown Mode (used as mute at the same time) [low
shutdown current = 0.01μA (Typ)]
Built-in protect ion circuits: output short protection,
high temperat ure prot e cti on, under voltage protection
Applications
Mobile Phones, Portable Audio Devices, PND, DSC,
Note-PC etc.
Key Specificatio ns
Supply Voltage Range: 2.5V to 5.5V
THD+N: 0.2%(0.3W, RL=8Ω, Typ)
Switching Frequency: 250kHz(Typ)
Shutdown Current: 0.01μA (Typ)
Operating Temperature Range: -40°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
VCSP50L1 1.70mm x 1.70mm x 0.55mm
Typic al Application Circuit
SDNB
IN+OUT+
OUT-
IN-
Diff. Input
VDD
GND
V
DD
V
DD
VCSP50L1
Datashee
t
2/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Pin Configuration
(Bottom View)
IN +GND OUT-
VDD PVDD PGND
IN -SDNB OUT+
A 1 A 2 A 3
B 1 B 2 B 3
C 1 C 2 C 3
Index Post
Pin Descriptions
Pin No. Pin Name Function
A1 IN+ Audio differ e ntia l input positive terminal
A2 GND GND terminal (signal)
A3 OUT- Class-D BTL output negative terminal
B1 VDD VDD terminal (signal)
B2 PVDD VDD terminal (power)
B3 PGND GND terminal (power)
C1 IN- Audio dif ferential input negative terminal
C2 SDNB Shutdown control terminal
C3 OUT+ Class-D BTL output positive terminal
Block Diagram
C2
SDNB
B1 B2
VDD PVDD
A1
C1
IN+
IN-
A3
C3
OUT-
OUT+
A2 B3 PGNDGND
BIAS
OSC
PWM H-
Bridge
Shutdown
Control
Ri
Ri
Rf
Rf
ALC
VDD
3/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Absolute Maximum Ratings (Ta = 25°C)
Parameter Symbol Limit Unit
Supply Voltage [VDD, PVDD]
VDD
PVDD
-0.3 to +7.0 V
Power Dissipation Pd 0.69
(Note 1)
W
Operating Temperat ure Ra nge Topr -40 to +85 °C
Storage Temperature Range Tstg -55 to +150 °C
Max imum Junction Temperat u re Tjmax 150 °C
SDNB, IN+, IN- Voltage VIN -0.3 to +7.0 V
OUT Voltage VOUT -0.3 to +7.0 V
(Note 1) Derate by 5.52 mW/°C when operating above Ta = 25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board)
Caution: Operating th e IC ove r the absol ute ma ximum rati ngs ma y damage t he IC. Th e damag e can eit her be a sh ort circuit betwee n pins or a n open ci rcuit
betwee n pi ns a nd the i nt er nal c i rcui t r y. Therefore, it i s im portant to c ons i de r c ir cui t p rot ect i on m e as u res , such as a dding a fus e, in case the IC is op er ated ove r
the absolute maximum ratings.
Recommended Operating Condition s (Ta= -40°C to +85°C)
Parameter Symbol Min Typ Max Unit
Supply Voltage
VDD
PVDD
2.5 3.6 5.5 V
Common Mode Input Voltage Range VSW +0.5 - VDD-0.8 V
Minimum Load Impedance RL 3.6 - - Ω
4/22 TSZ02201-0C1C0E700150-1-2
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2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Electrical Characteristics (Unless otherwise specified, VDD=3.6V, Ta=25°C)
Parameter Symbol Limit Unit Conditions
Min Typ Max
Whole Circuit
Circuit Current (No Signal) ICC - 3 6 mA IC Acti ve, No Load
VSDNB =VDD
Circuit Current (Shutdown) ISDN - 0.01 2 μA IC Shutdown
VSDNB =GND
Audio Circuit
Limit Output Power PO 0.044 x
VDD2 0.050 x
VDD2 0.055
xVDD2 W BTL, f=1kHz, RL=8Ω
THD+N ≤ 1% , (Note 2)
Total Harmonic Distortion THD+N - 0.2 1 % BTL, fIN=1kH z, RL=8Ω
PO =0.3W, (Note 2)
Maximum Gain GMAX 12 13 14 dB BTL, (Note 2)
ALC Limit Level VLIM 1.68 x VDD 1.78 x VDD 1.89 x VDD VP-P BTL, (Note 2)
ALC Release Level VREL 1.34 x VDD 1.41 x VDD 1.5 x VDD VP-P BTL, (Note 2)
Switching Frequency fOSC 150 250 350 kHz
Start-up Time tON 0.73 1.02 1.71 msec
Audio Input Resistance RI 47 72 97 kΩ Gain=13dB
Control Circuit
SDNB Terminal
Threshold Voltage
H VSDNBH 1.4 - VDD V IC Active
L VSDNBL 0 - 0.4 V IC Shutdown
SDNB Terminal
Inflow Current
H ISDBNH 24 48 72 µA VSDNB =3.6V
L ISDNBL - ±5 µA VSDNB =0V
(Note 2) Filter bandwidth for measurement：400Hz to 30kHz, LC filter for AC measurement : L=22μH / C=1μF, BTL：Voltage between A3,C3
5/22 TSZ02201-0C1C0E700150-1-2
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2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Typical Performance Curves
Figure 1. Efficiency vs Output Power
(f=1kHz, RL=8Ω+33μH)
0
10
20
30
40
50
60
70
80
90
100
00.2 0.4 0.6 0.8 11.2
Effi ciency [%]
Output Power [W]
VDD=2.5V
VDD=3.6V
VDD=5V
0
10
20
30
40
50
60
70
80
90
100
00.2 0.4 0.6 0.8 11.2
Effi ciency [%]
Output Power [W]
VDD=2.5V
VDD=3.6V
VDD=5V
Figure 2. Efficiency vs Output Power
(f=1kHz, RL=4Ω+33μH)
0
50
100
150
200
250
300
00.2 0.4 0.6 0.8 11.2
Icc [mA ]
Output Power [W]
VDD=2.5V
VDD=3.6V
VDD=5V
0
50
100
150
200
250
300
00.2 0.4 0.6 0.8 11.2
Icc [mA ]
Output Power [W]
VDD=2.5V
VDD=3.6V
VDD=5V
Figure 3. Supply Current vs Output Power
(f=1kHz, RL=8Ω+33μH)
Figure 4. Supply Current vs Output Power
(f=1kHz, RL=4Ω+33μH)
V
DD
=2.5V
V
DD
=3.6V
VDD=5V
V
DD
=2.5V
V
DD
=3.6V
V
DD
=5V
V
DD
=2.5V
V
DD
=3.6V
V
DD
=5V
V
DD
=2.5V
V
DD
=3.6V
V
DD
=5V
0
50
100
150
200
250
300
00.2 0.4 0.6 0.8 11.2
Icc [mA ]
Output Power [W]
VDD=2.5V
VDD=3.6V
VDD=5V
6/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Typical Performance Curves - continued
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
00.2 0.4 0.6 0.8 11.2
Pd (W)
Output Power (W)
VDD=2.5V
VDD=3.6V
VDD=5V
0
0.05
0.1
0.15
0.2
0.25
0.3
00.2 0.4 0.6 0.8 11.2
Pd (W)
Output Power (W)
VDD=2.5V
VDD=3.6V
VDD=5V
Figure 5. Power Dissipation vs Output Power
(f=1kHz, RL=8Ω+33μH) Figure 6. Power Dissipation vs Output Power
(f=1kHz, RL=4Ω+33μH)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0246
I
SDNB
[μA]
V
DD
[V]
Figure 7. Supply Current vs Power Supply
(No Load, No Signal) Figure 8. Shutdown Current vs Power Supply
(No Load, No Signal)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0 2 4 6
ICC [mA]
V
DD
[V]
VDD=2.5V
V
DD
=3.6V
V
DD
=5V
V
DD
=2.5V
V
DD
=3.6V
V
DD
=5V
7/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Typical Performance Curves - continued
0
0.5
1
1.5
2
2.5
3
2.5 33.5 44.5 55.5 6
Output Power [W]
V
DD
[V]
Figure 10. Output Power vs Power Supply
(f=1kHz, RL=8Ω)
Figure 11. Output Power vs Power Supply
(f=1kHz, RL=4Ω)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
2.5 33.5 44.5 55.5 6
Output Power [W]
V
DD
[V]
VDD=2.5V
V
DD
=3.6V
V
DD
=5V
Figure 9. Output Power vs Load Resistance
(f=1kHz)
0
0.5
1
1.5
2
2.5
4 8 12 16 20 24 28 32
Output Powe r [W]
R
L
[Ω]
VDD=2.5V
VDD=3.6V
VDD=5V
8/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Typical Performance Curves - continued
Figure 13. THD+N vs Frequency
(VDD=5.0V, f=1kHz, RL=8Ω, 400H z -30kHz BPF)
Figure 14. THD+N vs Frequency
(VDD=3.6V, f=1kHz, RL=8Ω, 400H z -30kHz BPF)
0.01
0.1
1
10
10 100 1k 10k 100k
THD+N [% ]
Frequency [Hz]
Po=25mW
Po=100mW
Po=250mW
0.01
0.1
1
10
10 100 1k 10k 100k
THD+N [% ]
Frequency [Hz]
Po=25mW
Po=100mW
Po=150mW
Figure 12. THD+N vs Output Power
(f=1kHz, RL=8Ω, 400Hz-30kHz BPF)
Figure 13. THD+N vs Output Power
(f=1kHz, RL=4Ω, 400Hz-30kHz BPF)
0.01
0.1
1
10
100
0.01 0.1 110
THD+N [% ]
Output Powe r [W]
VDD=2.5V
VDD=3.6V
VDD=5V
0.01
0.1
1
10
100
0.01 0.1 110
THD+N [% ]
Output Powe r [W]
VDD=2.5V
VDD=3.6V
VDD=5V
V
DD
=2.5V
VDD=3.6V
V
DD
=5V
V
DD
=2.5V
VDD=3.6V
V
DD
=5V
9/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Typical Performance Curves - continued
0
2
4
6
8
10
12
14
10 100 1k 10k 100k
Gain [dB]
Frequency [Hz]
VDD=2.5V
VDD=3.6V
VDD=5V
Figure 17. G a in vs Frequ en cy
(Vin=0.5VP-P, RL=8Ω, 400Hz-30kHz BPF) Figure 18. G a in vs Frequ en cy
(Vin=0.5VP-P, RL=4Ω, 400Hz-30kHz BPF)
Figure 15. THD+N vs Frequency
(VDD=2.5V, f=1kHz, RL=8Ω, 400H z -30kHz BPF)
Figure 16. THD+N vs Frequency
(f=1kHz, RL=8Ω, Po=1 25mW, 400Hz -30kHz BPF)
0
2
4
6
8
10
12
14
10 100 1k 10k 100k
Gain [dB]
Frequency [Hz]
VDD=2.5V
VDD=3.6V
VDD=5V
0.01
0.1
1
10
10 100 1k 10k 100k
THD+N [% ]
Frequency [Hz]
VDD=2.5V
VDD=3.6V
VDD=5V
0.01
0.1
1
10
10 100 1k 10k 100k
THD+N [% ]
Frequency [Hz]
Po=25mW
Po=100mW
Po=150mW
V
DD
=2.5V
VDD=3.6V
V
DD
=5V
V
DD
=2.5V
V
DD
=3.6V
VDD=5V
10/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Typical Performance Curves - continued
0.01
0.1
1
10
-30 -25 -20 -15 -10 -5 0 5 10 15
Output Power [W]
Vi n [d BV]
VDD=2.5V
VDD=3.6V
VDD=5V
V
DD
=2.5V
V
DD
=3.6V
V
DD
=5V
Figure 19. Output Power vs Input Level
(f=1kHz, RL=8Ω)
Figure 20. Output Power vs Input Level
(f=1kHz, RL=4Ω)
0.01
0.1
1
10
-30 -25 -20 -15 -10 -5 0 5 10 15
Output Power [W]
Vi n [d BV]
VDD=2.5V
VDD=3.6V
VDD=5V
V
DD
=2.5V
V
DD
=3.6V
V
DD
=5V
V
DD
=2.5V
V
DD
=3.6V
VDD=5V
V
DD
=2.5V
V
DD
=3.6V
VDD=5V
0.01
0.1
1
10
100
-40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15
Pd [W]
Output Power [W]
VDD=2.5V
VDD=3.6V
VDD=5V
0.01
0.1
1
10
100
-40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15
Pd [W]
Output Power [W]
VDD=2.5V
VDD=3.6V
VDD=5V
Figure 21. THD+N vs Output Power
(f=1kHz, RL=8Ω, 400Hz-30kHz BPF) Figure 22. THD+N vs Output Power
(f=1kHz, RL=4Ω, 400Hz-30kHz BPF)
V
DD
=2.5V
VDD=3.6V
V
DD
=5V
V
DD
=2.5V
V
DD
=3.6V
V
DD
=5V
11/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Typical Performance Curves - continued
Figure 23. ALC Limit waveform Figure 24. ALC Release waveform
(VDD=3.6V, RL=8Ω) (VDD=3.6V, RL=8Ω)
Figure 25. Start waveform Figure 26. Shutdown waveform
(VDD=3.6V, RL=8Ω) (VDD=3.6V, RL=8Ω)
INPUT
2V/div
OUTPUT
2V/div
f=1kHz
INPUT
2V/div
OUTPUT
2V/div
f=1kHz
1msec/div
400msec/div
SDNB
2V/div
OUTPUT
2V/div
200μsec/div
SDNB
2V/div
OUTPUT
2V/div
200μsec/div
12/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Application Information
1. Shutdown Control
2. ALC Parameter
The gain switc h timing during ALC operation occurs at zero cross point of audio output voltage.
For that, attack time and release time will change at input frequency “fIN”.
ALC Parameter is fixed. ALC operation doesn’t corresp ond t o impulse noise.
3. Protection Function Description
Protection Fun cti on Detecting and Releasing Condition Speaker PWM
Output
Output Short Protection Detecting
condition Detect ing curre nt= 2.5A (Typ) High Z
(Latch)
High Temperature Prote ctio n
Detecting
condition Chip temperature above 180°C (Typ) High Z
Releasing
condition Chip temperature below 110 °C (Typ) Normal operatio n
Under Voltage Protection
Detecting
condition Power supply voltage below 2.2V (Typ) 1kΩ pulldown
Releasing
condition
Power supply voltage above 2.3V (Typ) Normal operation
Once an IC is latched, the circuit is not released automatically even after the detecting status is removed.
Procedure 1 or 2 below is needed for recovery.
1 SDNB pin is turned Low once. After the soft mute transition time, SDNB pin is returned to High again.
2 Power supply is turned on again after dropping to VDD<1V (10ms (Min) holding time) in which the int er nal po w er ON rese t cir cui t acti v ate s.
Control terminal Condition
SDNB
H IC operation (active)
L IC stop (shutdown)
ALC Parameter
Attac k Time (Typ) R elea se Time (Typ) Gain Switch Step(Typ)
~1ms/1dB@fIN=100Hz
~0.5ms/1dB@ fIN=1kHz
~0.05ms/1dB@ fIN=10kHz
262ms/1dB
@ fIN=100Hz to 10kHz ±1dB
13/22 TSZ02201-0C1C0E700150-1-2
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TSZ22111 • 15 • 001
BDD5469GUL
Application Examples
Application Circuit Example 1: Differential Input (With Input Coupling Capacitor)
C2
SDNB
B1 B2
VDD PVDD
C3
10uF
VDD
A1
C1
IN+
IN-
0.1uF
0.1uF
Audio
Input+
Audio
Input-
Differential
Input
A3
C3
OUT-
OUT+
C1
C2
A2 B3 PGNDGND
H = IC Active
L = IC Shutdown
Shutdown Signal
75k
(Typ.)
BIAS
OSC
PWM H-
Bridge
Shutdown
Control
Ri
Ri
Rf
Rf
ALC
Application Circuit Example 2: (W ithout Input Coupling Capacitor)
C2
SDNB
B1 B2
VDD PVDD
C3
10uF
A1
C1
IN+
IN-
Audio
Input+
Audio
Input-
Differential
Input
A3
C3
OUT-
OUT+
A2 B3 PGNDGND
H = IC Active
L = IC Shutdown
Shutdown Signal
75k
(Typ.)
BIAS
OSC
PWM H-
Bridge
Shutdown
Control
Ri
Ri
Rf
Rf
ALC
V
DD
The BD5469GUL does not require input coupling capacitors if the design uses a differential source that is biased
from 0.5V to VDD-0.8V.
14/22 TSZ02201-0C1C0E700150-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Application Circuit Example 3: Single End Input (IN-)
C2
SDNB
B1 B2
VDD PVDD
C3
10uF
A1
C1
IN+
IN-
0.1uF
0.1uF
Audio
Input-
A3
C3
OUT-
OUT+
C1
C2
A2 B3 PGNDGND
H = IC Active
L = IC Shutdown
Shutdown Signal
75k
(Typ.)
BIAS
OSC
PWM H-
Bridge
Shutdown
Control
Ri
Ri
Rf
Rf
ALC
V
DD
The output (OUT+ to OUT-) and IN- are in reverse phase.
Application Circuit Example 4: Single End Input (IN+)
C2
SDNB
B1 B2
VDD PVDD
C3
10uF
A1
C1
IN+
IN-
0.1uF
0.1uF
Audio
Input+ A3
C3
OUT-
OUT+
C1
C2
A2 B3 PGNDGND
H = IC Active
L = IC Shutdown
Shutdown Signal
75k
(Typ.)
BIAS
OSC
PWM H-
Bridge
Shutdown
Control
Ri
Ri
Rf
Rf
ALC
V
DD
The output (OUT+ to OUT-) and IN+ are in phase.
Input pin should not be left open through the input coupling capacitor. Please connect to GND as seen on the example
above. Audio input pin should be in “mute” condition and not “open” condition when t her e ’s no input signal.
15/22 TSZ02201-0C1C0E700150-1-2
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2014.04.04 Rev.001
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TSZ22111 • 15 • 001
BDD5469GUL
Application Circuit Example 5: Differential Input (With Input Coupling Capacitor)
When it is not possible to drive in 1kΩ pull-down at SDNB=L.
C2
SDNB
B1 B2
VDD PVDD
C3
10uF
A1
C1
IN+
IN-
0.1uF
0.1uF
Audio
Input+
Audio
Input-
Differential
Input
A3
C3
OUT-
OUT+
C1
C2
A2 B3 PGNDGND
H = IC Active
L = IC Shutdown
Shutdown
Signal 75k
(Typ)
BIAS
OSC
PWM H-
Bridge
Shutdown
Control
Ri
Ri
Rf
Rf
ALC
R
IN+
1kΩ
1kΩ
VDD
R
IN-
The input pin uses a 1kΩ pull-down when PDNB=L (Please refer to the I/O equivalent circuit chart). Therefore, please
take note of the drive current capability of the audio input. Please insert 1kΩ in the terminal as shown in the above figure
when the drive current capability of the input line is insufficient. There is no influence at the ALC level of the output when
1kΩ is inserted.
Selecting External Components
(1) Input Coupling Capaci tor (C1, C2)
The input coupling cap ac itor is 0.1μF.
Input impedance during maximum gain of 13dB is 72kΩ (Typ). A high-pass filter is composed by the input coupling
capacitor and the input impedance.
Cut-off frequency “fc” is calculated using the formula below, given the input coupling capacitor C=(C1=C2) and input
impedance Ri.
[Hz]
CRiπ2
1
fc
××
=
In case of Ri=72kΩ and C=(C1=C2)=0.1μF, the cut-off fr equency is about 22Hz.
(2) Power Supply Decoupling Capacitor (C3)
The power supply decoupling capac i tor i s 10µ F. When the capacity value of the power supply decoupling capac i to r i s
made small, it will have an influence to the audio characteristics THD+N, ALC Limit level, ALC Release level. When
making it small, be careful with the audio characteristics at actual application. Please use a capacitor having low
enough ESR (equivalent series resistance).
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BDD5469GUL
Power D is s ipat io n
The IC Characteristics has a big relation with the temperature that is used. Exceeding the maximum tolerance junction
temperature can deteriorate and destroy it. To avoid instant destruction and maintain long-time operation of the IC, there
should be extra caution during thermal operation.
Refer to the maximum junction temperature (Tjmax) and the operating temperature range (Topr) in the absolute maximum
ratings of the IC, and the Pd-Ta characteristics (Thermal reduction ratio curve) shown below. If input signal is excessive at a
state where heat sink is not suf fic ien t, ther e will be T S D (Thermal Shutdown)
TSD of the chip is detected at around 180°C, and is released at around 120°C or less. Since the aim is to prevent damage
on the chip, avoid opera t in g at TSD temperature window for a long period of time because this can deteriorate the IC.
Thermal Reduction Ratio Curve
The value of power dissipation changes based on the board that wi ll be mounted.
The power dissipation may exceed the value on the above graph depending on the heat dissipation efficiency of the
mounted boar d.
Measurement Condition : ROHM Typical Board Mount
Board Size : 70mmx70mmx1.6mm
(Note) This value is the real measurement, but not the guaranteed value.
Reference Data
VCSP50L1
2.0
1.5
1.0
0.5
0.0
0
25
50
75
100
125
150
Ambient Temperature : Ta (°C)
Power Dissipation : Pd (W)
0.69W
θja = 181.8℃/W
85
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BDD5469GUL
I/O Equivalent Circuits (Provided pin voltages are typical values)
Pin No. Pin Name Pin Voltage
(TYP)
Pin Descriptions Internal Equivalent Circuits
C2 SDNB 0V Shutdown control terminal
H: Active
L: Shutdown
A1 IN+ 0V Audio differential input
positive terminal
1kΩ pull-down at PDNB=L
C1 IN- 0V Audio differential input
negative term inal
1kΩ pull-down at PDNB=L
A3 OUT-
0V
Class-D BTL output
negative terminal
C3 OUT+ Class-D BTL output
positive terminal
B1 VDD - VDD terminal (signal) -
B2 PVDD - VDD terminal (power) -
A2 GND - GND t erminal (signal) -
B3 PGND - GND terminal (power) -
A 2
A 1
B 2
1k PD
A 2
C 2
B 2
75k
50k
B 3
A 3
C 3
B 2
1k
A 2
C 1
B 2
1k PD
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TSZ22111 • 15 • 001
BDD5469GUL
Operation al Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low im pedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
10. Inter-pin Short and Mounting Error s
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power
supply or ground line.
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BDD5469GUL
Operation al Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P s ubstrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N juncti on operates as a paras iti c diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 27. Example of Monolithic IC Structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature
(Tj) will rise which wil l activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold,
the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from hea t
damage.
16. Over-Current Protection Circuit (OCP)
This IC has a built-in over-current protection circuit that activates when the output is accidentally shorted. However, it is
strongly advised not to subject the IC to prolonged shorting of the output.
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Orderi n g Information
B D 5 4 6 9 G U L - E 2
Part Number
Package
GUL:VCSP50L1
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
Part Number Marking Package Orderable Part Number
5469 VCSP50L1 BD5469GUL-E2
VCSP50L1
(TOP VIEW)
5469
Part Number Marking
LOT Number
1PIN MARK
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) dependi ng on Ambient temp erature (T a). When used i n sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range d escribed in the product specification.
9. ROHM shall n ot be in any way responsible or liable for failure induce d under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shal l not be in any way responsible or liable f or any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are store d in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommende d b y ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidit y barrier bag. Baking is require d before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using a n authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
