TDA6120Q/N1 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Preliminary speciﬁcation

Supersedes data of 1997 Jul 17

File under Integrated Circuits, IC02

1997 Aug 27

INTEGRATED CIRCUITS

TDA6120Q

Video output amplifier

1997 Aug 27 2

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

FEATURES

•High large signal bandwidth of 32 MHz (typ.) at

125 V (p-p)

•High small signal bandwidth of 47 MHz (typ.) at

60 V (p-p)

•Rise/fall time of 12.5 ns for 125 V (p-p)

•High slew rate of 10 V/ns

•Low static power dissipation of 2.5 W at 200 V supply

voltage

•High maximum output voltage

•Bandwidth independent of voltage gain

•Maximum overall voltage gain over 46 dB

•High Power Supply Rejection Ratio (PSRR)

•Fast cathode current measurement output for dark

current control loop

•Differential voltage input.

GENERAL DESCRIPTION

The TDA6120Q is a single 30 MHz, 125 V (p-p) video

output amplifier contained in a plastic DIL-bent-SIL power

package.The device uses high-voltage DMOS technology

and is intended to drive the cathodes of a CRT in High

Definition TVs (HDTVs) or monitors.

ORDERING INFORMATION

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA6120Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) SOT141-8

1997 Aug 27 3

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGK440

1×

CURRENT

INPUT

out 1×

in out 4×

MIRROR

1×

in out

CASCODE

MIRROR

4×

in out

CASCODE

+J5 mA

0.7 pF

TDA6120Q

9, 11

n.c.

VCC

VIN−

134

RC−RC+VIN+

GND

OUTC

OUT

OUTM

IIN VDD

Fig.2 Top view.

handbook, full pagewidth

MGK441

442 Ω

68 pF

RC−RC+

135791113

24 6 8 10 12

22 Ω

VIN−VIN+

10 nF

CCC

µF

CDD

3.3

µF

TDA6120Q

22 kΩ

IIN OUTM n.c. n.c. OUT

CRTVIN 147 Ω

Rflash

VCC VDD

Dflash

OUTCGND

+12 V +200 V

Vref

Ria

1997 Aug 27 4

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

PINNING

SYMBOL PIN DESCRIPTION

RC−1 inverting input pre-emphasis

network

VIN−2 inverting voltage input

RC+ 3 non-inverting input pre-emphasis

network

VIN+ 4 non-inverting voltage input

IIN 5 feedback current input

VCC 6 low supply voltage (12 V)

OUTM 7 cathode current measurement

output

GND 8 power ground and heatsink

n.c. 9 not connected

VDD 10 high supply voltage (200 V)

n.c. 11 not connected

OUTC 12 cathode output

OUT 13 feedback output

Fig.3 Pin configuration.

handbook, halfpage

RC−

VIN−

RC+

VIN+

IIN

VCC

OUTM

GND

n.c.

VDD

n.c.

OUTC

OUT

TDA6120Q

MGK438

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. 1250 V for IIN (pin 5).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VDD high supply voltage 0 280 V

VCC low supply voltage 0 20 V

Viinput voltage (pins 2 and 4) 0 VCC V

Vi(dif) differential mode input voltage (pins 2 and 4) −VCC VCC V

Vi(pe) pre-emphasis input voltage (pins 1 and 3) 0 VCC V

Vi(dif)(pe) differential mode pre-emphasis input voltage

(pins 1 and 3) −VCC VCC V

VIIN input voltage (pin 5) 0 2VBE V

VOUTM measurement output voltage 0 20 V

Vooutput voltage (pins 12 and 13) 0 VDD V

Tstg storage temperature −55 +150 °C

Tjjunction temperature −20 +150 °C

VESD voltage peak human body model note 1 −2000 V

voltage peak machine model −300 V

1997 Aug 27 5

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

QUALITY SPECIFICATION

Quality specification in accordance with

“SNW-FQ-611 part E”

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

Rth j-c thermal resistance from junction to case 3.0 K/W

Fig.4 Power derating curve.

(1) Infinite heatsink.

(2) No heatsink.

handbook, halfpage

−20 160

(1)

(2)

MGK442

04020 80 120

Tamb (°C)

Ptot

(W)

1997 Aug 27 6

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

CHARACTERISTICS

Operating range: Tj=−20 to +150 °C; VDD = 180 to 210 V; VCC = 10.8 to 13.2 V; VOUTM = 4 to 20 V; VVIN−= 1.5 to 5 V;

VVIN+= 1.5 to 5 V.

Test conditions: Tamb =25°C; VDD = 200 V; VCC = 12 V; VVIN+ =3V; V

OUTM =6V; C

L= 10 pF (CL consists of parasitic

and cathode capacitance); Rth h = 4 K/W; test circuit of Fig.5; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IDD(q) quiescent high voltage supply

current VOUTC = 100 V 8 10 12 mA

ICC(q) quiescent low voltage supply

current VVIN−=V

VIN+ 25 31 39 mA

Ibias input bias current

(pins 2 and 4) VOUTC = 100 V −30 −µA

OUTC DC output voltage

(pins 12 and 13) VVIN−=V

VIN+ 70 100 130 V

∆VOUTC(T) DC output voltage

temperature drift

(pins 12 and 13)

VVIN−=V

VIN+ −−5V

(offset)OUTM of fset current of measurement

output note 1 −40 +20 +120 µA

∆IOUTM/∆IOUTC linearity of current transfer −50 µA<I

OUTC < +50 µA;

note 1 −1.0 −

Ciinput capacitance

(pins 2 and 4) VOUTC =V

OUTC(max) −3−pF

IOUTC(max) maximum dynamic peak

output current (pin 12) 20V<V

OUTC <V

DD −20 V −100 −mA

VOUTC(min) minimum output voltage

(pin 12) −410V

OUTC(max) maximum output voltage

(pin 12) VDD −10 VDD −6−V

Gint internal gain 1.68 1.87 2.08

Bssmall signal bandwidth

(pin 12) VOUTC(AC) = 60 V (p-p);

VOUTC(DC) = 100 V 40 47 −MHz

Bllarge signal bandwidth

(pin 12) VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V 28 32 −MHz

tpd cathode output propagation

time 50% input to 50% output

(pin 12)

VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V;

square wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns;

see Figs 6 and 7

10 −15 ns

to(r) cathode output rise time

10% output to 90% output

(pin 12)

VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V;

square wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns;

see Fig.6

10 14 18 ns

1997 Aug 27 7

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

Notes

1. The operating range of the measurement output OUTM is 4 to 20 V. Below 4 V, OUTM acts as a voltage source with

an output resistance such that the maximum current input from OUTM is 2 mA.

a) The linearity of the current transfer is guaranteed until a junction temperature of 125 °C.

2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.

to(f) cathode output fall time

90% output to 10% output

(pin 12)

VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V;

square wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns;

see Fig.7

10 12.5 15 ns

tst settling time 50% input to

(99% <output <101%)

(pin 12)

VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V;

square wave f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns;

see Figs 6 and 7

−−250 ns

SRrslew rate rise between

30Vto(V

DD −30 V) (pin 12) VVIN−= 2 V (p-p) square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) =10ns

−8−V/ns

SRfslew rate fall between

(VDD −30 V) to 30 V (pin 12) VVIN−= 2 V (p-p) square

wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns;

−10 −V/ns

OVr cathode output voltage

overshoot rise (pin 12) VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V;

square wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns;

see Figs 6 and 7

−5−%

OVf cathode output voltage

overshoot fall (pin 12) VOUTC(AC) = 125 V (p-p);

VOUTC(DC) = 100 V;

square wave; f < 1 MHz;

tf(VIN−) = 10 ns;

tr(VIN−) = 10 ns;

see Figs 6 and 7

−20 −%

PSRRh high voltage power supply

rejection ratio f < 50 kHz; note 2 −44 −dB

PSRRl low voltage power supply

rejection ratio f < 50 kHz; note 2 −48 −dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Aug 27 8

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

Fig.5 Test circuit with gain of 40 dB.

handbook, full pagewidth

MGK443

442 Ω

22 Ω

Ria

47 Ω

RCC

47 Ω

RDD

147 Ω

Rflash

68 pF

22 kΩ

2 MΩ

1 kΩ

100 kΩ

CCCC

50 Ω

RaRba

1 kΩ

Rbb

RC−

VIN−

VIN

+12 V +200 V

Vref RC+

VIN+

IIN

VCC

OUTM

GND Im

VDD

OUTC

OUT

VOUT

C11 10 µF

C10 22 nF

C13 10 µF

47 µF

CCC

10 nF

6.8 pF

3.3 pF C9

136 pF

CDDD

10 µF

CDD

10 nF

C12 22 nF

TDA6120Q

Overall gain Gint Rf

-----

×=

1997 Aug 27 9

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

162.5

150

100

37.5

163.75

161.25

tst

overshoot (in %)

to(r)

Voc

MGK444

tpd

Fig.6 Output (pins 12 and 13; rising edge) as a function of input signal.

1997 Aug 27 10

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

Fig.7 Output (pins 12 and 13; falling edge) as a function of input signal.

162.5

150

100

37.5 38.75

36.25

overshoot (in %)

MGK445

Voc

tpd

tst

to(r)

FLASHOVER PROTECTION

The TDA6120Q does NOT include protection diodes that

clamp the cathode output pin to the high voltage supply pin

during a CRT flashover discharge. Therefore an external

high voltage reverse biased diode has to be connected

between the OUTC pin and the VDD pin. An external 147 Ω

carbon high-voltage resistor in combination with a 2 kV

spark gap between the cathode and ground will limit the

maximum clamp current (for this resistor value, the CRT

has to be connected to the main printed-circuit board).

This external network causes an increase in the rise and

fall times and a decrease in the overshoot.

Pin 10 must be decoupled to pin 8:

•By a capacitor >22 nF with good HF behaviour (e.g. foil).

This capacitor must be placed as close as possible to

pin 10 and pin 8; definitely within 5 mm.

•By a capacitor >3.3 µF on the picture tube base printed

circuit board (common for three output stages).

1997 Aug 27 11

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

TEST AND APPLICATION INFORMATION

Dissipation

Regarding dissipation, distinction must be made between

static dissipation (independent of frequency) and dynamic

dissipation (proportional to frequency). The static

dissipation of the TDA6120Q is due to supply currents, and

currents in the feedback network and CRT.

The static dissipation is given by the following equation:

Where:

Rf= feedback resistance

IOUTC = DC cathode current.

The dynamic dissipation is given by the following equation:

Pstat VCC ICC VDD IDD VOUTC VOUTC

RfIOUTC

–

---------------------------

×–×+×=

Pdyn VDD CLCint

+()f×V

OUTC p p–()

×b××=

Where:

CL= load capacitance

Cint = effective internal load capacitance

(approximately 7 pF)

f = frequency

VOUTC(p-p) = output voltage (peak-to-peak value)

b = non-blanking duty cycle (0.8).

The IC must be mounted on the picture tube base

printed-circuit board to minimize the load capacitance CL.

Switch-off

The voltage at output pins OUT and OUTC will be pulled

to ground when the low voltage supply voltage (VCC) is

switched off.

1997 Aug 27 12

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

INTERNAL PIN CONFIGURATION

Fig.8 Internal pin diagram.

andbook, full pagewidth

MGK439

ESD

TDA6120Q

ESD

RC+

VIN+

RC−OUTC

VDD

VCC

OUT

OUTM

GND

VIN−

IIN

1997 Aug 27 13

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

PACKAGE OUTLINE

UNIT A e1

A2bpcD

(1) E(1) Z(1)

deD

hLL

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 17.0

15.5 4.6

4.2 0.75

0.60 0.48

0.38 24.0

23.6 20.0

19.6 10 3.4

12.2

11.8 1.7

5.08 2.4

1.6

62.00

1.45

2.1

1.8

3.4

3.1 4.3

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

8.4

7.0

SOT141-8

0 5 10 mm

scale

0.25

0.6

0.03

Ze2

113

92-11-17

95-03-11

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) SOT141-8

non-concave

view B: mounting base side

1997 Aug 27 14

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1997 Aug 27 15

Philips Semiconductors Preliminary speciﬁcation

Video output ampliﬁer TDA6120Q

NOTES

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Printed in The Netherlands 547047/1200/02/pp16 Date of release: 1997 Aug 27 Document order number: 9397 750 02701