Application Note
InvenSense Motion Sensor Universal
Evaluation Board (UEVB) User Guide
PURPOSE
This document describes the hardware and circuitry on the Universal Evaluation Board (UEVB). The UEVB is used to
evaluate most of InvenSense’s current motion sensing (gyroscopes, accelerometers, magnetometers) products. It
covers applying the UEVB to a larger system, and requires the understanding of key signals and circuit functions,
hardware jumper settings, and port connections.
USAGE
This UEVB provides up to nine axes of motion sensing comprised of:
• Digital-output of 3-axis gyroscope with user-programmable full-scale ranges
• Digital-output of 3-axis accelerometer with user-programmable full-scale ranges
• Digital-output of 3-axis magnetometer
• On-chip temperature sensor
• Data is measured using on-chip ADCs and is transmitted over I²C or SPI interfaces
The UEVB may be used by itself utilizing SPI or I²C serial communications interfaces. Alternatively, it may be
connected to the InvenSense ARM Controller Board (EV_INVARM_D) for connectivity to a host computer via USB
interface.
The UEVB was designed to support up to 9-axis MPUs (Motion Processing Units) with a built-in compass (MPU-
91xx and MPU-92xx). Connecting an external compass board to the UEVB may require the user to connect their
third-party compass to the UEVB via its auxiliary I2C bus. The UEVB is populated with an external compass, and can
access the main or auxiliary I2C bus lines provided by the sensor (AUX_DA and AUX_CL) via resistor options.
RELATED DOCUMENTS
Please refer to the product specification of the main motion sensor for electrical characteristics, pin out and
applications details. Sensor product specifications can be found at www.invensense.com. For product
specifications for unreleased parts, please contact the InvenSense sales department at sales@invensense.com.
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: AN-IVS-0001EVB-00
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
TABLE OF CONTENTS
PURPOSE ..................................................................................................................................................... 1
USAGE ...................................................................................................................................................... 1
RELATED DOCUMENTS .......................................................................................................................... 1
UEVB OVERVIEW ........................................................................................................................................ 3
TABLE 1A. PARTS FOR UEVB FOOTPRINTS ........................................................................................ 3
TABLE 1B. RE SISTO R OPT IO N S ............................................................................................................ 4
KEY FUNCTIONS AND PINOUTS ............................................................................................................ 6
I2C/SPI BUS CONNECTIONS .................................................................................................................. 6
SCHEMATIC ................................................................................................................................................. 7
BILL OF MATERIAL (BOM) .......................................................................................................................... 8
TABLE 2A. BILL OF MATERIAL FOR U1A (e.g. with MPU-92XX) ........................................................... 8
TABLE 2B. BILL OF MATERIAL FOR U1B (e.g. with ITG-35XX) ............................................................. 8
TABLE 2C. BILL OF MATERIAL FOR U1D, OPTION-A (e.g. with MPU-60XX) ....................................... 9
TABLE 2D. BILL OF MATERIAL FOR U1D, OPTION-B (e.g. with MPU-91XX) ....................................... 9
POWER SUPPLY CONNECTIONS ............................................................................................................ 10
TABLE 3. POWER SELECTION JUMPERS (JP1, JP2) ......................................................................... 10
UEVB CONNECTOR SIGNALS DESCRIPTION ........................................................................................ 11
TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CN1) ............................................................. 11
CONNECTING THE FSYNC LINE .......................................................................................................... 12
SERIAL BUS LEVELS, SPEEDS, TERMINATIONS ............................................................................... 12
DATA GATHERING OPTIONS ................................................................................................................... 12
CONNECTION TO INVENSENSE ARM CONTROLLER BOARD ......................................................... 12
USE OF THE UEVB WITHOUT AN ARM CONTROLLER BOARD ........................................................ 12
SPECIAL INSTRUCTIONS ......................................................................................................................... 13
ELECTROSTATIC DISCHARGE SENSIT IVI TY ..................................................................................... 13
BOARD LAYOUT AND FOOTPRINT DISCUSSION .............................................................................. 13
REVISIO N HISTOR Y .............................................................................................................................. 14
Document Number: AN-IVS-0001EVB-00 Page 2 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
UEVB OVERVIEW
The UEVB hosts most of InvenSense’s motion sensors and MPUs. To support a number of different products with
the UEVB, resistor options were implemented for easy and flexible circuit configurations. For example, Table 1a
shows the most popular parts that fit on the UEVB. Table 1b lists the resistor options for different configurations.
TABLE 1A. PARTS FOR UEVB FOOTPRINTS
UEVB
IDENTIFIER
PART
NUMBER
SENSOR TYPE
FEATURES
PACKAGE TYPE
& DIMENSIONS
PIN COUNT
U1A
MPU-65xx 6-axis (accel, gyro) QFN, 3 x 3 x 0.9 mm 24
MPU-68xx 6-axis (accel, gyro) QFN, 3 x 3x 0.9 mm 24
MPU-92xx
9-axis (accel, gyro,
compass)
AKM
compass
QFN, 3 x 3 x 1 mm 24
ICM-206xx 6-axis (accel, gyro)
LGA, 3 x 3 x 0.9 mm*
QFN, 3 X 3 X 0.75 mm
24
ICM-209xx
9-axis (accel, gyro,
compass)
AKM
compass
LGA, 3 x 3 x 1 mm** 24
U1B
IDG-20xx 2-axis gyro (X, Y) OIS QFN, 3 x 3 x 0.75 mm 16
IXZ-20xx 2-axis gyro (X, Z) OIS QFN, 3 x 3 x 0.75 mm 16
IDG-25xx 2-axis gyro (X, Y) QFN, 3 x 3 x 0.9 mm 16
IXZ-25xx 2-axis gyro (X, Z) QFN, 3 x 3 x 0.9 mm 16
ITG-35xx 3-axis gyro QFN, 3 x 3 x 0.9 mm 16
ITG-352x 3-axis gyro OIS
QFN, 3 x 3 x 0.9 mm
QFN, 3 x 3 x 0.75 mm
16
ITG-358x 3-axis gyro Custom QFN, 3 x 3 x 0.9 mm 16
U1C N/A N/A N/A N/A N/A
U1D
IMU-30xx 3-axis gyro QFN, 4 x 4 x 0.9 mm 24
MPU-30xx 3-axis gyro QFN, 4 x 4 x 0.9 mm 24
MPU-33xx
3-axis gyro
QFN, 4 x 4 x 0.9 mm
24
MPU-60xx
6-axis (accel, gyro)
QFN, 4x 4 x 0.9 mm
24
MPU-615x 6-axis (accel, gyro) QFN, 4 x 4 x 0.9mm 24
MPU-91xx
9-axis (accel, gyro,
compass)
LGA, 4 x 4 x 1 mm 24
* Engineering samples only
** Preliminary package information
Document Number: AN-IVS-0001EVB-00 Page 3 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
TABLE 1B. RESISTOR OPTIONS
CS/V_LOGIC Pin Resistor
Option for All Footprints
Function as CS
R18 = 1kΩ (or Open)
R22 = 0 Ω
V_LOGIC
R18 = 0 Ω
R22 = Open
U1A Resistor
Option
Reserved
R1, R3, R5, R7 = 0 Ω
R2, R4, R6, R8 = Open
MPU-92xx and other
QFN24_3x3mm parts
R1, R3, R5, R7 = Open
R2, R4, R6, R8 = 0 Ω
U1D Resistor
Option
Pin 15 = High
R19 = 10 kΩ
R20 = Open
Pin 15 = Low
R19 = Open
R20 = 10 kΩ
U2 Resistor
Option
Connects U2 to primary I2C bus
R11, R13 = 0 Ω
R12, R14 = Open
Connects U2 to U1's auxiliary I2C
bus (if available)
R11, R13 = Open
R12, R14 = 0 Ω
Document Number: AN-IVS-0001EVB-00 Page 4 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
There are four footprints on the UEVB PCB (Figures 1A, 1B, 1C and 1D) to fit various motion sensors, but only one
may be populated at a time.
U1A
QFN/LGA24
3mm x 3mm
1
2
3
4
5
613
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
U1B
QFN/LGA16
3mm x 3mm
1
2
3
4
12
11
10
9
5
6
7
8
16
15
14
13
Figure 1A: U1A (QFN/LGA24_3x3mm) Figure 1B: U1B (QFN/LGA16_3x3mm)
U1D
QFN/LGA24
4mm x 4mm
1
2
3
4
5
613
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
Figure 1C: U1C (QFN/LGA16_3x3mm) Figure 1D: U1D (QFN/LGA24_4x4mm)
The UEVB is populated with components only on its top side (see Figure 2) to achieve ease of measurement access.
A 10 x 2 connector (CN1) is designed to interface with the InvenSense ARM Controller Board (EV_INVARM_D),
which is a host microcontroller board useful for programming the registers of the sensor on the UEVB and accessing
sensor data via a PC or laptop through the USB port.
A 3-pin power selection header (JP1) is provided to choose the voltage level for VDD. Similarly, a 3-pin VDDIO
selection header (JP2) allows the user to select the power source for the board’s/sensor’s digital I/O voltage.
Document Number: AN-IVS-0001EVB-00 Page 5 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
KEY FUNCTIONS AND PINOUTS
The motion sensing UEVB is a fully assembled and tested evaluation board, allowing for simple and swift
evaluation of the device’s X/Y/Z axis angular rate gyroscope, X/Y/Z axis accelerometer, and X/Y/Z axis compass.
The motion sensing device has a primary interface to talk to the application processor and a secondary interface
that allows a user to communicate with an external sensor, such as a pressure sensor or compass.
The motion sensing device utilizes the InvenSense proprietary MEMS technology with driven vibrating masses to
produce a functionally complete, low-cost motion sensor. The motion processing unit incorporates X/Y/Z axis low-
pass filters and an EEPROM for on-chip factory calibration of the sensor. Factory-trimmed scale factors eliminate
the need for external active components and end-user calibration. A built-in Proportional-To-Absolute-
Temperature (PTAT) sensor provides temperature compensation information. Refer to the product specification
document for each sensor to obtain more details on each sensor’s specific features. The UEVB is lead-free and
RoHS compliant.
I2C/SPI BUS CONNECTIONS
The UEVB communicates with a system processor through the customer header using either the I²C or the SPI
serial interface. The device always acts as a slave when communicating with the system processor.
Figure 2. Top Side of the UEVB (e.g. MPU-65xx)
Document Number: AN-IVS-0001EVB-00 Page 6 of 15
Rev Number: 1.1
Rev Date: 1/31/14
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
VDD Select VDDIO Select
Universal EVB
QFN24_3x3
magnetic sensor
INV Universal EVB
U1A option
9250: R1,R3,R5,R7 = 0
R2,R4,R6,R8 = OPEN
9350: R1,R3,R5,R7 = OPEN
R2,R4,R6,R8 = 0
QFN24_4x4
QFN16_3x3 (5353)
QFN16_3x3
FSYNC
AD0_SDO
/CS
INT
AUX_DA
AUX_CL
TP0
VPP
DRDY-CMP
SDA_SDI
SCL_SCLK
FSYNC
REGOUT
AUX_DA
AUX_CL
DRDY
FSYNC
SCL_SCLK
SDA_SDI
AD0_SDO
/CSAUX_DA
AUX_CL
INT
REGOUT
TP0
SDA_SDI
SCL_SCLK
AD0_SDO
FSYNC
/CS
DRDY VPP
REGOUT
TP0
AD0_SDO
SCL_SCLK
/CS
INT
SDA_SDI
VPP
FSYNC
REGOUT
INT
DRDY-CMP
/CS
3V0
VIN 1V8 VDDIO VDDVDD 3V0
VIN
GND
VDD
VDDIO
VDDIO
VDD
VDDIO
VDDIO
VDDIO
VDD
VDD
VDDIO
VDD
VDDIO
1V8
AD0_SDO
SDA_SDI
SCL_SCLK
AUX_DA
AUX_CL
FSYNC
INT
VPP
TP0
REGOUT
Title
Size Document Number
Rev
Date: Sheet of
B
Universal EVB
InvenSense
1197 Borregas Ave.
Custom
1 1Friday, August 23, 2013
Sunnyvale, CA 94089 www.invensense.com
Tel: 408-988-7339
Title
Size Document Number
Rev
Date: Sheet of
B
Universal EVB
InvenSense
1197 Borregas Ave.
Custom
1 1Friday, August 23, 2013
Sunnyvale, CA 94089 www.invensense.com
Tel: 408-988-7339
Title
Size Document Number
Rev
Date: Sheet of
B
Universal EVB
InvenSense
1197 Borregas Ave.
Custom
1 1Friday, August 23, 2013
Sunnyvale, CA 94089 www.invensense.com
Tel: 408-988-7339
U2
AK8963C
BGA14_2X2(0.4PITCH)
DRDY A1
CS A2
SDA/SI A4
SCL/SK A3
RST
D4
CAD0
D1
VDDIO
C4 TRG
C3 TST1
C2
SO B4
RSV B3
VDD B1
VSS
C1
CAD1
D2
C11
0.1uF
C13
0.1uF
U1B
OPEN
SDA 1
TP1/FSYNC
8
VDDIO 3
VDD
9
SCL 16
GND
12
REG_OUT
7
INT
10 NC
11
CS 4
NC 2
SDO/AD0
6
TP0/RSV
5
NC 13
VPP 14
NC 15
JP1
HEADER 3, 2.54mm, Male
1
2
3
H3
1
R25
10K
C8
0.1uF
R13 0
R20 OPEN
C19
0.1uF
R21 10K
C20
0.1uF
C1
0.1uF
R22 0
R7 OPEN
R17 OPEN
C18
0.1uF
C2
0.1uF
H4
1
U1A
OPEN
SDA/SDI 24
VPP 20
SDO/AD0
9
VDDIO
8
VDD
13
SCL/SCLK 23
GND
18
REGOUT
10
CS/ TP3 22
INT/ TP2
12
FSYNC/ TP1
11
ES_CL
7
NC 6
NC 2
NC 3
NC 4
NC 5
NC
14
NC
16 NC
17
DRDY/ TP0 19
ES_DA 21
NC
15
RESV/CCS 1
C9
0.1uF
C6
0.1uF
TP2
TEST-POINT
1
R11 0
C3
0.1uF
R2 OPEN
R9
10K
H2
1
C7
0.1uF
U1D
OPEN
SDA/ SDI 24
CP_OUT
20
CLK_I
1
SDO/ ADDR 9
CS/V_LOGIC 8
VDD
13 SCL/ SCLK 23
GND
18 REG_O 10
CLK_O 22
INT
12
FSYNC
11
ES_SCL
7ES_SDA
6
TST1
2
CCSB 3
NC
4TST6
5
DRDY 14
CAD1 15
TST2
16
CAD0 17
RESV1
19 RESV2
21
C14
0.1uF
R16 OPEN
C5
0.1uF
C16
0.033uF
R19 10K
R1 OPEN
R6 OPEN
R8 OPEN
C17
2.2uF
R10
10K
R15
10K
C12
0.1uF
R3 OPEN
U4
SOT235
YB1210ST25R300
Vin
1OUT 5
GND
2
EN
3NC 4
R14
OPEN
C4
0.1uF
C10
2200pF
R5 OPEN
H1
1
R4 OPEN
R12
OPEN
R18 1K
U1C
OPEN
QFN16_IT36_3X3(0.5PITCH)A
SDA/SDI 3
FSYNC
8
VDDIO 1
VDD 16
SCL/SCLK 2
GND
13
INT/DRDY
7
NC
12
CS 5
AD0/SDO 4
RES/INT
6
NC
11
FILT 14
RES 15
NC
10 NC
9
CN1
HEADER 10X2, Male, 90D, 2.54mmx2.54mm
2
4
6
8
10
12
14
16
18
20
22
24
26
28
1
3
5
7
9
11
13
15
17
19
21
23
25
27
TP1
TEST-POINT
1
JP2
HEADER 3, 2.54mm, Male
1
2
3
R24
10K
C15
2.2uF
R23 10K
Figure 3. UEVB Schematic
UEVB
BILL OF MATERIAL (BOM)
The UEVB offers five different BOMs, which cover most of InvenSense’s sensor (see Table 2a, 2b, 2c, and 2d). There
are two BOM versions for U1D, one for U1A and U1B.
TABLE 2A. BILL OF MATERIAL FOR U1A (e.g. with MPU-92XX)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10 X 2, M,
90D, 2.54 x 2.54
mm
HDB2X14NRA
2 16
C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12,
C13, C14, C18, C19, C20
0.1 µF C0402
3 1 C10 2200 pF C0402
4 2 C15, C17 2.2 µF C0402
5
1
C16
0.033 µF
C0402
7 2 JP1, JP2
Header 3, 2.54
mm, Male
SIP-3P
9
8
R9, R10, R15, R19, R21, R23, R24, R25
10 kΩ
R0402
10 7 R1, R3, R5, R7, R11, R13, R22 0 Ω R0402
11 1 R18 1 kΩ R0402
13 1 U1A MPU-92xx QFN24_3x3 mm
17 1 U2 AK8963C BGA14_2X2 mm
18
1
U4
XC6210B302MR-G
SOT25
TABLE 2B. BILL OF MATERIAL FOR U1B (e.g. with ITG-35XX)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10X2, M, 90D,
2.54 x 2.54 mm
HDB2X14NRA
2 16
C1, C2, C3, C4, C5, C6, C7, C8, C9, C11,
C12, C13, C14, C18, C19, C20
0.1 µF C0402
3 1 C10 2200 pF C0402
4 2 C15, C17 2.2 µF C0402
5 1 C16 0.033 µF C0402
7 2 JP1 JP2
Header 3, 2.54mm,
Male
SIP-3P
9 8 R9, R10, R15, R19, R21, R23, R24, R25 10 kΩ R0402
10 3 R11, R13, R22 0 Ω R0402
11 1 R18 1 kΩ R0402
14 1 U1B ITG-35xx
QFN16_3X3
(0.5 Pitch)A
17 1 U2 AK8963C
BGA14_2X2
(0.4 Pitch)
18
1
U4
XC6210B302MR-G
SOT25
Document Number: AN-IVS-0001EVB-00 Page 8 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
TABLE 2C. BILL OF MATERIAL FOR U1D, OPTION-A (e.g. with MPU-60XX)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10X2, M, 90D,
2.54 x 2.54 mm
HDB2X14NRA
2 16
C1, C2, C3, C4, C5, C6, C7, C8, C9, C11,
C12, C13, C14, C18, C19, C20
0.1 µF C0402
3
1
C10
2200 pF
C0402
4 2 C15, C17 2.2 µF C0402
5 1 C16 0.033 µF C0402
7 2 JP1, JP2
Header 3, 2.54 mm,
Male
SIP-3P
9
8
R9, R10, R15, R19, R21, R23, R24, R25
10 kΩ
R0402
10 3 R11, R13, R22 0 Ω R0402
11 1 R18 1 kΩ R0402
16 1 U1D MPU-60xx QFN24_4X4(0.5 Pitch)
17
1
U2
AK8963C
BGA14_2X2(0.4Pitch)
18
1
U4
XC6210B302MR-G
SOT25
TABLE 2D. BILL OF MATERIAL FOR U1D, OPTION-B (e.g. with MPU-91XX)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10X2, M, 90D,
2.54 x 2.54 mm
HDB2X14NRA
2 16
C1, C2, C3, C4, C5, C6, C7, C8, C9, C11,
C12, C13, C14, C18, C19, C20
0.1µF C0402
3
1
C10
2200 pF
C0402
4
2
C15, C17
2.2 µF
C0402
5
1
C16
0.033uF
C0402
7 2 JP1, JP2
HEADER 3, 2.54 mm,
Male
SIP-3P
9 6 R9, R10, R15, R21, R24, R25 10 kΩ R0402
10
5
R11, R13, R20, R22, R23
0 Ω
R0402
11 1 R18 1 kΩ R0402
16 1 U1D MPU-91xx QFN24_4X4(0.5 Pitch)
17 1 U2 AK8963C BGA14_2X2(0.4 Pitch)
18 1 U4 XC6210B302MR-G SOT25
Document Number: AN-IVS-0001EVB-00 Page 9 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
POWER SUPPLY CONNECTIONS
JP1 and JP2 are 3-pin jumpers, which allow the user to select between an on-board LDO (Low-Voltage Dropout
Regulator, U4) and an external DC supply (VIN) to power the motion sensor. For details, please refer to Table 3:
Power Selection Jumpers.
The on-board low-noise 3V LDO offers an output that is called 3V0 (Figure 3). Using this will ensure that the sensor
performance will meet data sheet specifications.
Selecting VIN to power the chip/board is generally done while designing and evaluating an embedded platform,
where the host processor and related electronics need full control over the motion processing chipset’s power
supply.
If a user intends to use the on-board 3V power source, an external VIN must be provided with at least 3.7V to
ensure the LDO works properly.
If the user provides a VIN power level of 5V, JP1 and JP2 must be shunted across pins 1-2, since the motion
sensors’ VDD and VDDIO operational ranges are ≤3.6V.
TABLE 3. POWER SELECTION JUMPERS (JP1, JP2)
JP1 PIN NUMBER
SIGNAL DESCRIPTION
1-2 Shunted
VDD = 3V (from LDO, VIN > 3.7V, net name 3V0)
2-3 Shunted
VDD = VIN (from an external source)
JP2 PIN NUMBER
SIGNAL DESCRIPTION
1-2 Shunted
VDDIO = VDD
2-3 Shunted
VDDIO = 1.8V (from an external source, net name 1V8)
Document Number: AN-IVS-0001EVB-00 Page 10 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
UEVB CONNECTOR SIGNALS DESCRIPTION
TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CN1)
CN1 PIN
NUMBER
CN1 SIGNAL NAME
SIGNAL DESCRIPTION
1
AUX_DA
AUX_DA. Auxiliary I2C clock
2, 4, 9, 12,
14, 16, 19,
25, 26, 27,
28
NC NC. Do not connect to these pins.
3 AUX_CL AUX_CL. Auxiliary I2C data
5 1V8
1V8 Power. Receive power from InvenSense ARM controller board or
an external source. 1.8V @ > 200mA current sourcing capabilities are
recommended.
6 DRDY DRDY. Data ready and FIFO interrupts
7 INT INT. Interrupt output to controller
8 /CS Test Signal or SPI Chip Select
10 DRDY-CMP Compass (U2) DRDY
11 TP0 Test Signal
13 VPP Test Signal
15, 17 GND GND. Ground connection
18 REGOUT REGOUT. On- chip regulator output
20 SCL_SCLK SCL/SCLK. I2C or SPI clock
21 FSYNC FSYNC. Frame synchronization input
22 SDA_SDI SDA/MOSI. I²C SDA or SPI MOSI signal
23 VIN
Power. Receive power from InvenSense ARM controller board or an
external source. 5V @ > 200mA current sourcing capabilities are
recommended.
24 AD0_SDO AD0/MISO. I²C lowest address bit or SPI MISO signal
Document Number: AN-IVS-0001EVB-00 Page 11 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
CONNECTING THE FSYNC LINE
The FSYNC line is intended for use in a camera’s image-stabilization system. It is an input from the camera platform
to the UEVB, and is intended to synchronize the motion-sensor serial-bus transfer with the master timing set by
the camera system.
SERIAL BUS LEVELS, SPEEDS, TERMINATIONS
The UEBV supports I²C communications up to 400kHz, or SPI communications up to 1MHz clock rates for writing. It
can be operated at up to 20MHz for reading. The I²C bus open-drain pull-up resistors are connected to VDDIO.
DATA GATHERING OPTIONS
The motion sensor’s digital sensor data is available on the UEVB’s header CN1. Alternatively, for connectivity with
a host PC, an InvenSense ARM controller board may be used.
CONNECTION TO INVENSENSE ARM CONTROLLER BOARD
For communications via USB with a host computer, the UEVB can be connected to the InvenSense ARM controller
board; the EV_INVARM_D. InvenSense provides a software to support the collection of sensor data through the
UEVB/ARM controller board combo connected to a PC/laptop via a USB port. Please refer to the Readme
InvenSense Universal DataLogger document for additional instructions on how to use the data logger to obtain the
sensor data. This information can be provided by your local field team applications engineer on an as-needed
basis.
Figure 4 shows the connection of the UEVB to the ARM controller board. Connections between the two boards are
made via header CN1 on the UEVB and connector JP6 on the EV_INVARM_A controller board.
Figure 4. UEVB connected to InvenSense ARM Controller Board
USE OF THE UEVB WITHOUT AN ARM CONTROLLER BOARD
I²C and SPI signals are made available on header CN1. Users may develop their own tools to communicate with the
UEVB as there is no bus mode selection setting required.
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Rev Number: 1.1
Rev Date: 1/31/14
UEVB
SPECIAL INSTRUCTIONS
ELECTROSTATIC DISCHARGE SENSITIVITY
The motion sensors can be permanently damaged by electrostatic discharge (ESD). ESD precautions for handling
and storage must be taken to avoid damage to the devices.
BOARD LAYOUT AND FOOTPRINT DISCUSSION
The UEVB is a 4-layer FR-4 PCB design with the dimensions: 38.1mm x 38.1mm x 1.6mm (1500 mil x 1500 mil x 62
mil). See Figure 5 and Figure 6 for a detailed top and bottom view of the UEVB.
The MPU footprint on the UEVB supports both QFN and LGA packages. Footprints and sensor land patterns were
chosen large enough, so they offer ease of use, reliable contact with the sensor, hand-solder and debugging
capabilities for both packages.
Note that to avoid potential shorting/clearance issues at the corner pins for LGA packages, the land pattern shapes
for the individual pins in this design were chosen to be oblong rather than square. The dimensions for the pin pads
are 0.225 mm x 0.7 mm.
Solder mask (also called solder resist is a layer of protective coating for PCB’s copper traces, which helps to prevent
undesired solder bridges and shorts) dimensions will not be provided as they are dependent upon the
manufacturing process and the clearance capabilities of the chosen fabrication house. Contact your PCB vendor to
determine the minimum required clearance between pin pads (usually 4 mil to 6 mil or 0.102 mm to 0.152 mm)
and traces allowing them enough room to print an adequate solder mask.
Document Number: AN-IVS-0001EVB-00 Page 13 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
Figure 5 & Figure 6.Top & Bottom View of UEVB Board Layout
REVISION HISTORY
DATE
REVISION
DESCRIPTION
1/22/14
1.0
Initial Release
1/31/14
1.1
Updated parts list and BOM tables.
Document Number: AN-IVS-0001EVB-00 Page 14 of 15
Rev Number: 1.1
Rev Date: 1/31/14
UEVB
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its
use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without
notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or
performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and
specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained
in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the
infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or
otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied.
Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in
the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life
threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear
instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps,
DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the
respective companies with which they are associated.
.
©2014 InvenSense, Inc. All rights reserved.
Document Number: AN-IVS-0001EVB-00 Page 15 of 15
Rev Number: 1.1
Rev Date: 1/31/14