Application Note InvenSense Motion Sensor Universal Evaluation Board (UEVB) User Guide PURPOSE This document describes the hardware and circuitry on the Universal Evaluation Board (UEVB). The UEVB is used to evaluate most of InvenSense's current motion sensing (gyroscopes, accelerometers, magnetometers) products. It covers applying the UEVB to a larger system, and requires the understanding of key signals and circuit functions, hardware jumper settings, and port connections. USAGE This UEVB provides up to nine axes of motion sensing comprised of: * Digital-output of 3-axis gyroscope with user-programmable full-scale ranges * Digital-output of 3-axis accelerometer with user-programmable full-scale ranges * Digital-output of 3-axis magnetometer * On-chip temperature sensor * Data is measured using on-chip ADCs and is transmitted over IC or SPI interfaces The UEVB may be used by itself utilizing SPI or IC serial communications interfaces. Alternatively, it may be connected to the InvenSense ARM Controller Board (EV_INVARM_D) for connectivity to a host computer via USB interface. The UEVB was designed to support up to 9-axis MPUs (Motion Processing Units) with a built-in compass (MPU91xx and MPU-92xx). Connecting an external compass board to the UEVB may require the user to connect their 2 third-party compass to the UEVB via its auxiliary I C bus. The UEVB is populated with an external compass, and can 2 access the main or auxiliary I C bus lines provided by the sensor (AUX_DA and AUX_CL) via resistor options. RELATED DOCUMENTS Please refer to the product specification of the main motion sensor for electrical characteristics, pin out and applications details. Sensor product specifications can be found at www.invensense.com. For product specifications for unreleased parts, please contact the InvenSense sales department at sales@invensense.com. InvenSense reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988-7339 www.invensense.com Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 UEVB TABLE OF CONTENTS PURPOSE ..................................................................................................................................................... 1 USAGE ...................................................................................................................................................... 1 RELATED DOCUMENTS .......................................................................................................................... 1 UEVB OVERVIEW ........................................................................................................................................ 3 TABLE 1A. PARTS FOR UEVB FOOTPRINTS ........................................................................................ 3 TABLE 1B. RESISTOR OPTIONS ............................................................................................................ 4 KEY FUNCTIONS AND PINOUTS ............................................................................................................ 6 I2C/SPI BUS CONNECTIONS .................................................................................................................. 6 SCHEMATIC ................................................................................................................................................. 7 BILL OF MATERIAL (BOM) .......................................................................................................................... 8 TABLE 2A. BILL OF MATERIAL FOR U1A (e.g. with MPU-92XX)........................................................... 8 TABLE 2B. BILL OF MATERIAL FOR U1B (e.g. with ITG-35XX)............................................................. 8 TABLE 2C. BILL OF MATERIAL FOR U1D, OPTION-A (e.g. with MPU-60XX)....................................... 9 TABLE 2D. BILL OF MATERIAL FOR U1D, OPTION-B (e.g. with MPU-91XX)....................................... 9 POWER SUPPLY CONNECTIONS............................................................................................................ 10 TABLE 3. POWER SELECTION JUMPERS (JP1, JP2) ......................................................................... 10 UEVB CONNECTOR SIGNALS DESCRIPTION ........................................................................................ 11 TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CN1) ............................................................. 11 CONNECTING THE FSYNC LINE .......................................................................................................... 12 SERIAL BUS LEVELS, SPEEDS, TERMINATIONS ............................................................................... 12 DATA GATHERING OPTIONS ................................................................................................................... 12 CONNECTION TO INVENSENSE ARM CONTROLLER BOARD ......................................................... 12 USE OF THE UEVB WITHOUT AN ARM CONTROLLER BOARD........................................................ 12 SPECIAL INSTRUCTIONS ......................................................................................................................... 13 ELECTROSTATIC DISCHARGE SENSITIVITY ..................................................................................... 13 BOARD LAYOUT AND FOOTPRINT DISCUSSION .............................................................................. 13 REVISION HISTORY .............................................................................................................................. 14 Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 2 of 15 UEVB UEVB OVERVIEW The UEVB hosts most of InvenSense's motion sensors and MPUs. To support a number of different products with the UEVB, resistor options were implemented for easy and flexible circuit configurations. For example, Table 1a shows the most popular parts that fit on the UEVB. Table 1b lists the resistor options for different configurations. TABLE 1A. PARTS FOR UEVB FOOTPRINTS UEVB IDENTIFIER U1A PART NUMBER U1D PIN COUNT MPU-65xx 6-axis (accel, gyro) QFN, 3 x 3 x 0.9 mm 24 6-axis (accel, gyro) 9-axis (accel, gyro, compass) QFN, 3 x 3x 0.9 mm 24 QFN, 3 x 3 x 1 mm 24 LGA, 3 x 3 x 0.9 mm* QFN, 3 X 3 X 0.75 mm 24 MPU-92xx AKM compass 6-axis (accel, gyro) AKM compass OIS LGA, 3 x 3 x 1 mm** 24 IDG-20xx 9-axis (accel, gyro, compass) 2-axis gyro (X, Y) QFN, 3 x 3 x 0.75 mm 16 OIS ICM-209xx U1C FEATURES MPU-68xx ICM-206xx U1B SENSOR TYPE PACKAGE TYPE & DIMENSIONS IXZ-20xx 2-axis gyro (X, Z) QFN, 3 x 3 x 0.75 mm 16 IDG-25xx 2-axis gyro (X, Y) QFN, 3 x 3 x 0.9 mm 16 IXZ-25xx 2-axis gyro (X, Z) QFN, 3 x 3 x 0.9 mm 16 ITG-35xx 3-axis gyro 16 ITG-352x 3-axis gyro OIS ITG-358x 3-axis gyro Custom QFN, 3 x 3 x 0.9 mm QFN, 3 x 3 x 0.9 mm QFN, 3 x 3 x 0.75 mm QFN, 3 x 3 x 0.9 mm 16 N/A 16 N/A N/A N/A N/A IMU-30xx 3-axis gyro QFN, 4 x 4 x 0.9 mm 24 MPU-30xx 3-axis gyro QFN, 4 x 4 x 0.9 mm 24 MPU-33xx 3-axis gyro QFN, 4 x 4 x 0.9 mm 24 MPU-60xx 6-axis (accel, gyro) QFN, 4x 4 x 0.9 mm 24 MPU-615x 6-axis (accel, gyro) 9-axis (accel, gyro, compass) QFN, 4 x 4 x 0.9mm 24 LGA, 4 x 4 x 1 mm 24 MPU-91xx * Engineering samples only ** Preliminary package information Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 3 of 15 UEVB TABLE 1B. RESISTOR OPTIONS R18 = 1k (or Open) CS/V_LOGIC Pin Resistor Option for All Footprints Function as CS R22 = 0 R18 = 0 V_LOGIC R22 = Open R1, R3, R5, R7 = 0 U1A Resistor Option Reserved R2, R4, R6, R8 = Open R1, R3, R5, R7 = Open MPU-92xx and other QFN24_3x3mm parts R2, R4, R6, R8 = 0 R19 = 10 k U1D Resistor Option Pin 15 = High R20 = Open R19 = Open Pin 15 = Low R20 = 10 k U2 Resistor Option R11, R13 = 0 2 Connects U2 to primary I C bus R12, R14 = Open 2 Connects U2 to U1's auxiliary I C bus (if available) Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 4 of 15 R11, R13 = Open R12, R14 = 0 UEVB 17 1 16 2 15 3 5 14 4 6 13 5 13 1 2 12 2 14 13 19 20 21 22 23 5 14 6 13 Figure 1C: U1C (QFN/LGA16_3x3mm) 16 15 12 11 9 10 4 9 10 8 3 8 7 17 U1D QFN/LGA24 4mm x 4mm 11 5 6 18 7 4 10 9 24 1 3 11 Figure 1B: U1B (QFN/LGA16_3x3mm) 14 15 16 Figure 1A: U1A (QFN/LGA24_3x3mm) U1C QFN/LGA16 3mm x 3mm U1B QFN/LGA16 3mm x 3mm 12 11 10 9 7 4 8 U1A QFN/LGA24 3mm x 3mm 3 12 8 2 7 18 6 1 15 16 19 20 21 22 23 24 There are four footprints on the UEVB PCB (Figures 1A, 1B, 1C and 1D) to fit various motion sensors, but only one may be populated at a time. Figure 1D: U1D (QFN/LGA24_4x4mm) The UEVB is populated with components only on its top side (see Figure 2) to achieve ease of measurement access. A 10 x 2 connector (CN1) is designed to interface with the InvenSense ARM Controller Board (EV_INVARM_D), which is a host microcontroller board useful for programming the registers of the sensor on the UEVB and accessing sensor data via a PC or laptop through the USB port. A 3-pin power selection header (JP1) is provided to choose the voltage level for VDD. Similarly, a 3-pin VDDIO selection header (JP2) allows the user to select the power source for the board's/sensor's digital I/O voltage. Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 5 of 15 UEVB KEY FUNCTIONS AND PINOUTS The motion sensing UEVB is a fully assembled and tested evaluation board, allowing for simple and swift evaluation of the device's X/Y/Z axis angular rate gyroscope, X/Y/Z axis accelerometer, and X/Y/Z axis compass. The motion sensing device has a primary interface to talk to the application processor and a secondary interface that allows a user to communicate with an external sensor, such as a pressure sensor or compass. The motion sensing device utilizes the InvenSense proprietary MEMS technology with driven vibrating masses to produce a functionally complete, low-cost motion sensor. The motion processing unit incorporates X/Y/Z axis lowpass filters and an EEPROM for on-chip factory calibration of the sensor. Factory-trimmed scale factors eliminate the need for external active components and end-user calibration. A built-in Proportional-To-AbsoluteTemperature (PTAT) sensor provides temperature compensation information. Refer to the product specification document for each sensor to obtain more details on each sensor's specific features. The UEVB is lead-free and RoHS compliant. I2C/SPI BUS CONNECTIONS The UEVB communicates with a system processor through the customer header using either the IC or the SPI serial interface. The device always acts as a slave when communicating with the system processor. Figure 2. Top Side of the UEVB (e.g. MPU-65xx) Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 6 of 15 5 4 3 2 INV Universal EVB 1 VDDIO AUX_DA VDDIO VIN VDD 3V0 1V8 VDDIO VDD R2 OPEN R1 OPEN R9 10K /CS R10 10K VPP OPEN SCL_SCLK R5 OPEN SDA_SDI R6 OPEN VDDIO Select C1 0.1uF U1A option 9250: R1,R3,R5,R7 R2,R4,R6,R8 9350: R1,R3,R5,R7 R2,R4,R6,R8 = = = = 18 17 16 15 14 13 0 OPEN OPEN 0 GND NC NC NC NC VDD VDDIO 12 11 10 9 8 7 OPEN AUX_DA OPEN AUX_CL FSYNC FSYNC R15 10K OPEN C6 0.1uF FSYNC C3 0.1uF C8 0.1uF R14 OPEN C1 C2 C3 C4 REGOUT SCL_SCLK SDA_SDI AD0_SDO B1 VSS TST1 TRG VDDIO VDDIO BGA14_2X2(0.4PITCH) SDA/SI SCL/SK CS DRDY D1 D2 C13 0.1uF AK8963C VDD C12 0.1uF A4 A3 A2 A1 R11 0 R13 0 SCL_SCLK SDA_SDI AD0_SDO /CS DRDY-CMP C20 0.1uF U1C OPEN QFN16_IT36_3X3(0.5PITCH)A 6 7 8 INT DRDY FSYNC VDDIO C19 0.1uF C15 2.2uF magnetic sensor 9 10 11 12 13 3V0 5 Vin OUT GND EN NC C17 2.2uF FSYNC 6 7 13 18 11 1 H4 1 H3 1 H2 INT C9 0.1uF C10 2200pF 21 19 12 20 ES_SDA ES_SCL CS/V_LOGIC SDO/ ADDR SDA/ SDI SCL/ SCLK VDD GND FSYNC CLK_I REG_O RESV2 RESV1 INT CP_OUT CLK_O DRDY 2 16 5 4 1 1 C5 0.1uF B QFN16_3x3 (5353) VDDIO TST1 TST2 TST6 NC AUX_DA AUX_CL 1 R24 10K C14 0.1uF U1D VDD A VPP REGOUT C18 0.1uF OPEN TP1 TP2 TEST-POINT TEST-POINT VDD RES FILT 4 C16 0.033uF 1 RES/INT INT/DRDY FSYNC VDD 16 15 14 NC NC NC NC GND U4 YB1210ST25R300 SOT235 1 2 3 AD0_SDO R12 OPEN U2 DRDY /CS DRDY-CMP B4 B3 0 R25 10K VIN TP0 REGOUT VDD GND B C7 0.1uF QFN16_3x3 D4 TP0 VPP C4 0.1uF R22 OPEN R8 C SO RSV INT 2 4 6 8 10 12 14 16 18 20 22 24 26 28 R7 /CS AUX_CL CAD0 CAD1 1 3 5 7 9 11 13 15 17 19 21 23 25 27 AUX_DA AUX_CL 1 2 3 4 5 6 VDDIO 1 2 3 4 SDA NC VDDIO CS AD0_SDO CN1 HEADER 10X2, Male, 90D, 2.54mmx2.54mm 1V8 INT GND NC INT VDD QFN24_3x3 INT FSYNC REGOUT C 12 11 10 9 OPEN RESV/CCS NC NC NC NC NC C2 0.1uF R17 R16 U1A RST VDD Select OPEN VDD DRDY/ TP0 VPP ES_DA CS/ TP3 SCL/SCLK SDA/SDI HEADER 3, 2.54mm, Male INT/ TP2 FSYNC/ TP1 REGOUT SDO/AD0 VDDIO ES_CL HEADER 3, 2.54mm, Male 19 20 21 22 23 24 VDD 8 7 6 5 JP2 D 5 4 3 2 1 3 2 1 JP1 U1B 13 14 15 16 R3 TP0 CS AD0/SDO SDA/SDI SCL/SCLK VDDIO 3 2 1 D SCL_SCLK SDA_SDI NC VPP NC SCL OPEN TP1/FSYNC REG_OUT SDO/AD0 TP0/RSV R4 VPP H1 CCSB CAD1 CAD0 8 9 24 23 /CS AD0_SDO SDA_SDI SCL_SCLK 10 REGOUT 22 14 TP0 3 15 17 R18 1K C11 0.1uF R21 R19 R20 10K 10K OPEN R23 10K A InvenSense 1197 Borregas Ave. Sunnyvale, CA 94089 QFN24_4x4 Tel: 408-988-7339 www.invensense.com Title Universal EVB Figure 3. UEVB Schematic 5 4 3 2 Size Custom Document Number Date: Friday, August 23, 2013 Rev B Universal EVB Sheet 1 1 of 1 UEVB BILL OF MATERIAL (BOM) The UEVB offers five different BOMs, which cover most of InvenSense's sensor (see Table 2a, 2b, 2c, and 2d). There are two BOM versions for U1D, one for U1A and U1B. TABLE 2A. BILL OF MATERIAL FOR U1A (e.g. with MPU-92XX) ITEM QUANTITY REFERENCE 1 1 2 16 3 4 5 1 2 1 C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12, C13, C14, C18, C19, C20 C10 C15, C17 C16 7 2 JP1, JP2 9 8 R9, R10, R15, R19, R21, R23, R24, R25 10 7 R1, R3, R5, R7, R11, R13, R22 11 13 17 18 1 1 1 1 R18 U1A U2 U4 CN1 PART Header 10 X 2, M, 90D, 2.54 x 2.54 mm PCB FOOTPRINT 0.1 F C0402 2200 pF 2.2 F 0.033 F Header 3, 2.54 mm, Male 10 k C0402 C0402 C0402 0 R0402 1 k MPU-92xx AK8963C XC6210B302MR-G R0402 QFN24_3x3 mm BGA14_2X2 mm SOT25 PART Header 10X2, M, 90D, 2.54 x 2.54 mm PCB FOOTPRINT HDB2X14NRA SIP-3P R0402 TABLE 2B. BILL OF MATERIAL FOR U1B (e.g. with ITG-35XX) ITEM QUANTITY REFERENCE 1 1 2 16 3 4 5 1 2 1 C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12, C13, C14, C18, C19, C20 C10 C15, C17 C16 7 2 JP1 JP2 9 10 11 8 3 1 14 CN1 HDB2X14NRA 0.1 F C0402 C0402 C0402 C0402 R9, R10, R15, R19, R21, R23, R24, R25 R11, R13, R22 R18 2200 pF 2.2 F 0.033 F Header 3, 2.54mm, Male 10 k 0 1 k 1 U1B ITG-35xx 17 1 U2 AK8963C 18 1 U4 XC6210B302MR-G Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 8 of 15 SIP-3P R0402 R0402 R0402 QFN16_3X3 (0.5 Pitch)A BGA14_2X2 (0.4 Pitch) SOT25 UEVB TABLE 2C. BILL OF MATERIAL FOR U1D, OPTION-A (e.g. with MPU-60XX) ITEM QUANTITY REFERENCE PART Header 10X2, M, 90D, 2.54 x 2.54 mm 1 1 2 16 3 4 5 1 2 1 C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12, C13, C14, C18, C19, C20 C10 C15, C17 C16 7 2 JP1, JP2 9 10 11 16 17 8 3 1 1 1 18 1 CN1 PCB FOOTPRINT HDB2X14NRA 0.1 F C0402 C0402 C0402 C0402 R9, R10, R15, R19, R21, R23, R24, R25 R11, R13, R22 R18 U1D U2 2200 pF 2.2 F 0.033 F Header 3, 2.54 mm, Male 10 k 0 1 k MPU-60xx AK8963C R0402 R0402 R0402 QFN24_4X4(0.5 Pitch) BGA14_2X2(0.4Pitch) U4 XC6210B302MR-G SOT25 SIP-3P TABLE 2D. BILL OF MATERIAL FOR U1D, OPTION-B (e.g. with MPU-91XX) ITEM QUANTITY REFERENCE 1 1 2 16 3 4 1 2 C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12, C13, C14, C18, C19, C20 C10 C15, C17 5 1 C16 7 2 JP1, JP2 9 10 6 5 11 16 17 18 1 1 1 1 CN1 PART Header 10X2, M, 90D, 2.54 x 2.54 mm PCB FOOTPRINT HDB2X14NRA 0.1F C0402 2200 pF 2.2 F C0402 C0402 C0402 R9, R10, R15, R21, R24, R25 R11, R13, R20, R22, R23 0.033uF HEADER 3, 2.54 mm, Male 10 k 0 R0402 R0402 R18 U1D U2 U4 1 k MPU-91xx AK8963C XC6210B302MR-G R0402 QFN24_4X4(0.5 Pitch) BGA14_2X2(0.4 Pitch) SOT25 Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 9 of 15 SIP-3P UEVB POWER SUPPLY CONNECTIONS JP1 and JP2 are 3-pin jumpers, which allow the user to select between an on-board LDO (Low-Voltage Dropout Regulator, U4) and an external DC supply (VIN) to power the motion sensor. For details, please refer to Table 3: Power Selection Jumpers. The on-board low-noise 3V LDO offers an output that is called 3V0 (Figure 3). Using this will ensure that the sensor performance will meet data sheet specifications. Selecting VIN to power the chip/board is generally done while designing and evaluating an embedded platform, where the host processor and related electronics need full control over the motion processing chipset's power supply. If a user intends to use the on-board 3V power source, an external VIN must be provided with at least 3.7V to ensure the LDO works properly. If the user provides a VIN power level of 5V, JP1 and JP2 must be shunted across pins 1-2, since the motion sensors' VDD and VDDIO operational ranges are 3.6V. TABLE 3. POWER SELECTION JUMPERS (JP1, JP2) JP1 PIN NUMBER 1-2 Shunted 2-3 Shunted JP2 PIN NUMBER 1-2 Shunted 2-3 Shunted Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 SIGNAL DESCRIPTION VDD = 3V (from LDO, VIN > 3.7V, net name 3V0) VDD = VIN (from an external source) SIGNAL DESCRIPTION VDDIO = VDD VDDIO = 1.8V (from an external source, net name 1V8) Page 10 of 15 UEVB UEVB CONNECTOR SIGNALS DESCRIPTION TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CN1) CN1 PIN NUMBER 1 2, 4, 9, 12, 14, 16, 19, 25, 26, 27, 28 CN1 SIGNAL NAME AUX_DA NC SIGNAL DESCRIPTION AUX_DA. Auxiliary I C clock 2 NC. Do not connect to these pins. 2 3 AUX_CL 5 1V8 6 DRDY 7 INT INT. Interrupt output to controller 8 /CS Test Signal or SPI Chip Select 10 DRDY-CMP 11 TP0 Test Signal 13 VPP Test Signal 15, 17 GND GND. Ground connection 18 REGOUT REGOUT. On- chip regulator output 20 SCL_SCLK SCL/SCLK. I C or SPI clock 21 FSYNC 22 SDA_SDI 23 VIN 24 AD0_SDO Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 AUX_CL. Auxiliary I C data 1V8 Power. Receive power from InvenSense ARM controller board or an external source. 1.8V @ > 200mA current sourcing capabilities are recommended. DRDY. Data ready and FIFO interrupts Compass (U2) DRDY 2 FSYNC. Frame synchronization input SDA/MOSI. IC SDA or SPI MOSI signal Power. Receive power from InvenSense ARM controller board or an external source. 5V @ > 200mA current sourcing capabilities are recommended. AD0/MISO. IC lowest address bit or SPI MISO signal Page 11 of 15 UEVB CONNECTING THE FSYNC LINE The FSYNC line is intended for use in a camera's image-stabilization system. It is an input from the camera platform to the UEVB, and is intended to synchronize the motion-sensor serial-bus transfer with the master timing set by the camera system. SERIAL BUS LEVELS, SPEEDS, TERMINATIONS The UEBV supports IC communications up to 400kHz, or SPI communications up to 1MHz clock rates for writing. It can be operated at up to 20MHz for reading. The IC bus open-drain pull-up resistors are connected to VDDIO. DATA GATHERING OPTIONS The motion sensor's digital sensor data is available on the UEVB's header CN1. Alternatively, for connectivity with a host PC, an InvenSense ARM controller board may be used. CONNECTION TO INVENSENSE ARM CONTROLLER BOARD For communications via USB with a host computer, the UEVB can be connected to the InvenSense ARM controller board; the EV_INVARM_D. InvenSense provides a software to support the collection of sensor data through the UEVB/ARM controller board combo connected to a PC/laptop via a USB port. Please refer to the Readme InvenSense Universal DataLogger document for additional instructions on how to use the data logger to obtain the sensor data. This information can be provided by your local field team applications engineer on an as-needed basis. Figure 4 shows the connection of the UEVB to the ARM controller board. Connections between the two boards are made via header CN1 on the UEVB and connector JP6 on the EV_INVARM_A controller board. Figure 4. UEVB connected to InvenSense ARM Controller Board USE OF THE UEVB WITHOUT AN ARM CONTROLLER BOARD IC and SPI signals are made available on header CN1. Users may develop their own tools to communicate with the UEVB as there is no bus mode selection setting required. Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 12 of 15 UEVB SPECIAL INSTRUCTIONS ELECTROSTATIC DISCHARGE SENSITIVITY The motion sensors can be permanently damaged by electrostatic discharge (ESD). ESD precautions for handling and storage must be taken to avoid damage to the devices. BOARD LAYOUT AND FOOTPRINT DISCUSSION The UEVB is a 4-layer FR-4 PCB design with the dimensions: 38.1mm x 38.1mm x 1.6mm (1500 mil x 1500 mil x 62 mil). See Figure 5 and Figure 6 for a detailed top and bottom view of the UEVB. The MPU footprint on the UEVB supports both QFN and LGA packages. Footprints and sensor land patterns were chosen large enough, so they offer ease of use, reliable contact with the sensor, hand-solder and debugging capabilities for both packages. Note that to avoid potential shorting/clearance issues at the corner pins for LGA packages, the land pattern shapes for the individual pins in this design were chosen to be oblong rather than square. The dimensions for the pin pads are 0.225 mm x 0.7 mm. Solder mask (also called solder resist is a layer of protective coating for PCB's copper traces, which helps to prevent undesired solder bridges and shorts) dimensions will not be provided as they are dependent upon the manufacturing process and the clearance capabilities of the chosen fabrication house. Contact your PCB vendor to determine the minimum required clearance between pin pads (usually 4 mil to 6 mil or 0.102 mm to 0.152 mm) and traces allowing them enough room to print an adequate solder mask. Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 13 of 15 UEVB Figure 5 & Figure 6.Top & Bottom View of UEVB Board Layout REVISION HISTORY DATE 1/22/14 1/31/14 Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 REVISION 1.0 1.1 Page 14 of 15 DESCRIPTION Initial Release Updated parts list and BOM tables. UEVB This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. (c)2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. . (c)2014 InvenSense, Inc. All rights reserved. Document Number: AN-IVS-0001EVB-00 Rev Number: 1.1 Rev Date: 1/31/14 Page 15 of 15