TGA2904-FL Ku Band 2 Watt Packaged Amplifier Key Features and Performance * Frequency Range: 13-17 GHz * Optimized for VSAT band (13.75-14.5 GHz) * * * 33 dB Nominal Gain Typical > 33.5 dBm Psat in VSAT band @ 7V Bias 5-8 V @ 680 mA (Quiescent) * 0.5-m pHEMT 3MI Technology * 10 lead flange packaged * Package dimensions: 0.70x 0.33 x 0.1 in3 Primary Applications * * VSAT Point to Point Preliminary Measured Performance Bias Conditions: Vd = 7 V, Idq = 680 mA Product Description The TriQuint TGA2904-FL is a compact 2 Watt High Power Amplifier Packaged MMIC for Ku-band applications. The packaged part provides 33 dB nominal gain. The part is ideally suited for low cost emerging markets such as base station transmitters for satellite ground terminals and point to point radio. 35 34 The TGA2904-FL is 100% RF tested to ensure performance compliance. Evaluation boards are available. 32 Psat (dBm) Lead-Free & RoHS compliant. Vd=8V 7V 6V 33 31 5V 30 29 28 27 26 25 12 13 14 15 16 Frequency (GHz) 17 18 Datasheet subject to change without notice TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 1 TGA2904-FL TABLE I MAXIMUM RATINGS 1/ Symbol Parameter Value Notes 8V 2/ Vd Drain Supply Voltage Vg Gate Supply Voltage Range Idq Drain Supply Current (Quiescent) 1.3 A | Ig | Gate Current 18 mA PIN Input Continuous Wave Power 21 dBm 2/ 2/ 3/ 4/ 5/ -5V to 0V PD Power Dissipation 8.8 W TCH Operating Channel Temperature 200 C Mounting Temperature (30 Seconds) 260 C Storage Temperature -65 to 150 C TSTG 2/ 1/ These ratings represent the maximum operable values for this device. 2/ Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. 3/ When operated at this bias condition with a base plate temperature of 85 C, the median life is 7.5E5 hrs. 4/ These ratings apply to each individual FET. 5/ Junction operating temperature will directly affect the device median time to failure (Tm). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. TABLE II RF CHARACTERIZATION TABLE (T A = 25C, Nominal) (Vd = 7 V, Idq = 680 mA) SYMBOL PARAMETER TEST CONDITION TYPICAL UNITS Gain Small Signal Gain F = 13 -17 GHz 33 dB IRL Input Return Loss F = 13 -17 GHz 10 dB ORL Output Return Loss F = 13 -17 GHz 10 dB PW R Output Power @ Pin = +5 dBm F = 13 -15 GHz 34 dBm TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 2 TGA2904-FL TABLE III THERMAL INFORMATION PARAMETER TEST CONDITIONS TCH (C) JC (C/W) Tm (HRS) JC Thermal Resistance (channel to Case) Vd = 7 V Id = 680 mA Pdiss = 4.76 W Small Signal 147 13.0 1.3E+6 JC Thermal Resistance (channel to Case) Vd = 7 V Id = 1.25 A @ Psat Pdiss = 6.3 W Pout = 2.5 W (RF) 166 13.0 2.8E+5 Note: Assumes eutectic attach using 1.5 mil 80/20 AuSn mounted to a 20 mil CuMo Carrier at 85 C baseplate temperature. . Median Lifetime (Tm) vs. Channel Temperature TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 3 TGA2904-FL Typical Fixtured Performance Bias Conditions: Vd = 7 V, Idq = 680 mA 35 34 Vd = 8V 7V 6V 33 Psat (dBm) 32 31 5V 30 29 28 27 26 25 12 13 14 15 16 Frequency (GHz) 17 18 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 4 TGA2904-FL Typical Fixtured Performance 35 2400 33 2200 31 2000 Pout Id 29 27 1800 1600 25 1400 23 1200 21 1000 19 800 17 600 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 Id (mA) Output Power (dBm) Bias Conditions: Vd = 7 V, Idq = 680 mA, F = 14 GHz 10 Input power (dBm) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 5 TGA2904-FL Mechanical Drawing Units: inches Tolerance (unless otherwise noted): +/- 0.005 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 6 TGA2904-FL Package Assembly Diagram 1 uF Vd Vd 1 uF 0.01 uF 0.01 uF 10 ohm 10 ohm 1 uF 1 uF 0.01 uF 0.01 uF Vg Vg TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 7 TGA2904-FL Assembly of a TGA2904-FL Surface Mount Package onto a Motherboard Manual Assembly for Prototypes 1. Clean the motherboard or module. Rinse with alcohol and DI water. Allow the circuit to fully dry. 2. To improve the thermal and RF performance, a heat sink attached to the bottom of the package is recommended. Apply indium alloy, SN63 solder or tin/lead solder to the bottom of TGA2904-FL. 3. Apply tin/lead solder to each pin of TGA2904-FL. 4 Clean the assembly with alcohol. Ordering Information Part TGA2904-FL Package Style Flange Lead GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com May 2009 (c) Rev - 8