–2–
SMP08–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
Parameter Symbol Conditions Min Typ Max Units
Linearity Error –3 V ≤ V
IN
≤ +3 V 0.01 %
Buffer Offset Voltage V
OS
T
A
= +25°C, V
IN
= 0 V 2.5 10 mV
–40°C ≤ T
A
≤ +85°C, V
IN
= 0 V 3.5 20 mV
Hold Step V
HS
V
IN
= 0 V, T
A
= +25°C to +85°C 2.5 4 mV
V
IN
= 0 V, T
A
= –40°C5mV
Droop Rate ∆V
CH
/∆tT
A
= +25°C, V
IN
= 0 V 2 20 mV/s
Output Source Current I
SOURCE
V
IN
= 0 V
1
1.2 mA
Output Sink Current I
SINK
V
IN
= 0 V
1
0.5 mA
Output Voltage Range R
L
= 20 kΩ–3.0 +3.0 V
LOGIC CHARACTERISTICS
Logic Input High Voltage V
INH
2.4 V
Logic Input Low Voltage V
INL
0.8 V
Logic Input Current I
IN
V
IN
= 2.4 V 0.5 1 µA
DYNAMIC PERFORMANCE
2
Acquisition Time
3
t
AQ
T
A
= +25°C, –3 V to +3 V to 0.1% 3.6 7 µs
Hold Mode Settling Time t
H
To ±1 mV of Final Value 1 µs
Channel Select Time t
CH
90 ns
Channel Deselect Time t
DCS
45 ns
Inhibit Recovery Time t
IR
90 ns
Slew Rate SR 3 V/µs
Capacitive Load Stability <30% Overshoot 500 pF
Analog Crosstalk –3 V to +3 V Step –72 dB
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio PSRR V
S
= ±5 V to ±6 V 60 75 dB
Supply Current I
DD
T
A
= +25°C 4 7.5 mA
–40°C ≤ T
A
≤ +85°C 5 9.5 mA
ELECTRICAL CHARACTERISTICS
Parameter Symbol Conditions Min Typ Max Units
Linearity Error 60 mV ≤ V
IN
≤ 10 V 0.01 %
Buffer Offset Voltage V
OS
T
A
= +25°C, V
IN
= 6 V 2.5 10 mV
–40°C ≤ T
A
≤ +85°C, V
IN
= 6 V 3.5 20 mV
Hold Step V
HS
V
IN
= 6 V, T
A
= +25°C to +85°C 2.5 4 mV
V
IN
= 6 V, T
A
= –40°C5mV
Droop Rate ∆V
CH
/∆tT
A
= +25°C, V
IN
= 6 V 2 20 mV/s
Output Source Current I
SOURCE
V
IN
= 6 V
1
1.2 mA
Output Sink Current I
SINK
V
IN
= 6 V
1
0.5 mA
Output Voltage Range R
L
= 20 kΩ0.06 10.0 V
R
L
= 10 kΩ0.06 9.5 V
LOGIC CHARACTERISTICS
Logic Input High Voltage V
INH
2.4 V
Logic Input Low Voltage V
INL
0.8 V
Logic Input Current I
IN
V
IN
= 2.4 V 0.5 1 µA
DYNAMIC PERFORMANCE
2
Acquisition Time
3
t
AQ
T
A
= +25°C, 0 V to 10 V to 0.1% 3.5 4.25 µs
–40°C ≤ T
A
≤ +85°C 3.75 6.00 µs
Hold Mode Settling Time t
H
To ±1 mV of Final Value 1 µs
Channel Select Time t
CH
90 ns
Channel Deselect Time t
DCS
45 ns
Inhibit Recovery Time t
IR
90 ns
Slew Rate SR R
L
= 20 kΩ
4
34 V/µs
Capacitive Load Stability <30% Overshoot 500 pF
Analog Crosstalk 0 V to 10 V Step –72 dB
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio PSRR 10.8 V ≤ V
DD
≤ 13.2 V 60 75 dB
Supply Current I
DD
T
A
= +25°C 6.0 8.0 mA
–40°C ≤ T
A
≤ +85°C 8.0 10.0 mA
NOTES
1
Outputs are capable of sinking and sourcing over 20 mA but offset is guaranteed at specified load levels.
2
All input control signals are specified with t
r
= t
f
= 5 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V.
3
This parameter is guaranteed without test.
4
Slew rate is measured in the sample mode with 0 V to 10 V step from 20% to 80%.
Specifications subject to change without notice.
(@ VDD = +5 V, VSS = –5 V, DGND = 0 V, RL = No Load, TA = –408C to +858C for SMP08F,
unless otherwise noted)
(@ VDD = +12 V, VSS = 0 V, DGND = 0 V, RL = No Load, TA = –408C to +858C for SMP08F,
unless otherwise noted)
REV. D
SMP08
–3–
REV. D
ABSOLUTE MAXIMUM RATINGS
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
V
LOGIC
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
V
IN
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
SS
, V
DD
V
OUT
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
SS
, V
DD
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
(Not Short-Circuit Protected)
Operating Temperature Range
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Package Type u
JA
*u
JC
Units
16-Pin Plastic DIP (P) 76 33 °C/W
16-Pin SOIC (S) 92 27 °C/W
*θ
JA
is specified for worst case mounting conditions, i.e., θ
JA
is specified for device
in socket for plastic DIP package; θ
JA
is specified for device soldered to printed
circuit board for SO package.
ORDERING GUIDE
Temperature Package Package
Model Range Description Option
SMP08FP –40°C to +85°C Plastic DIP N-16
SMP08FS –40°C to +85°C SO-16 R-16A
PIN CONNECTIONS
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5TOP VIEW
(Not to Scale)
SMP08
CH
4
OUT
CH
0
OUT
CH
1
OUT
CH
2
OUT
V
DD
CH
6
OUT
INPUT
CH
7
OUT
B CONTROL
A CONTROL
CH
3
OUT
CH
5
OUT
INH
V
SS
DGND C CONTROL
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SMP08 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
INPUT VOLTAGE – Volts
DROOP RATE – mV/s
1800
1200
60001 10
23456789
1600
1400
1000
800
V
DD
= +12V
V
SS
= 0V
T
A
= +125
°
C
NO LOAD
Figure 3. Droop Rate vs. Input Voltage
V
DD
– Volts
SLEW RATE – V/µs
7
6
310 11 18
12 13 14 15 16 17
5
4
V
SS
= 0V
T
A
= +25
°
C
NO LOAD
–SR
+SR
Figure 6. Slew Rate vs. V
DD
INPUT VOLTAGE – Volts
OFFSET VOLTAGE – mV
4
–10 01 10
23456789
2
0
–2
–4
–6
–8
VDD = +12V
VSS = 0V
TA = –40°C
NO LOAD
RL = ∞
RL = 20kΩ
RL = 10kΩ
Figure 9. Offset Voltage vs. Input
Voltage
INPUT VOLTAGE – Volts
DROOP RATE – mV/s
3
0
–301 10
234 567 89
2
1
–1
–2
V
DD
= +12V
V
SS
= 0V
T
A
= +25
°
C
NO LOAD
Figure 2. Droop Rate vs. Input Voltage
TEMPERATURE –
°
C
HOLD STEP – mV
2
–4
–55 –35 85
–155 254565
1
0
–1
–2
–3
V
DD
= +12V
V
SS
= 0V
V
IN
= +5V
NO LOAD
Figure 5. Hold Step vs. Temperature
INPUT VOLTAGE – Volts
OFFSET VOLTAGE – mV
20
5
–20 01 10
23456789
15
10
–5
–15
0
–10
VDD = +12V
VSS = 0V
TA = +85°C
NO LOAD
RL = ∞
RL = 20kΩ
RL = 10kΩ
Figure 8. Offset Voltage vs. Input
Voltage
REV. D
SMP08–Typical Performance Characteristics
TEMPERATURE –
°
C
DROOP RATE – mV/s
1000
100
0.1
–55 –35 125–15 5 25 65 85 10545
10
1
V
DD
= +12V
V
SS
= 0V
V
IN
= +5V
R
L
= 10kΩ
Figure 1. Droop Rate vs. Temperature
INPUT VOLTAGE – Volts
HOLD STEP – mV
2
–1
–401 10
23456789
1
0
–2
–3
VDD = +12V
VSS = 0V
TA = +25°C
NO LOAD
Figure 4. Hold Step vs. Input Voltage
INPUT VOLTAGE – Volts
OFFSET VOLTAGE – mV
4
–10 01 10
23456789
2
0
–2
–4
–6
–8
VDD = +12V
VSS = 0V
TA = +25°C
NO LOAD
RL = ∞
RL = 20kΩ
RL = 10kΩ
Figure 7. Offset Voltage vs. Input
Voltage
TEMPERATURE –
°
C
OFFSET VOLTAGE – mV
0
–8
–55 –35 125
–15 5 25 65 85 10545
–1
–4
–5
–6
–7
–2
–3
V
DD
= +12V
V
SS
= 0V
V
IN
= +5V
R
L
= 10kΩ
Figure 10. Offset Voltage vs.
Temperature
V
DD
– Volts
SUPPLY CURRENT – mA
14
246 18
8 10121416
12
10
8
6
4
V
SS
= 0V
NO LOAD
+85
°
C
+25
°
C
–40
°
C
Figure 11. Supply Current vs. V
DD
FREQUENCY – Hz
90
80
010 100 1M1k 10k 100k
70
60
20
50
40
30
10
REJECTION RATIO – dB
VDD = +12V
VSS = 0V
VIN = +6V
TA = +25°C
NO LOAD
+PSRR
–PSRR
Figure 12. Sample Mode Power
Supply Rejection
Typical Performance Characteristics–SMP08
REV. D –5–
FREQUENCY – Hz
GAIN – dB
2
1
–5
100 1k 10M10k 100k 1M
0
–1
–2
–3
–4
90
45
–225
0
–45
–90
–135
–180
PHASE SHIFT – Degrees
V
DD
= +12V
V
SS
= 0V
T
A
= +25
°
C
NO LOAD
GAIN
PHASE
Figure 13. Gain, Phase Shift vs.
Frequency
FREQUENCY – Hz
PEAK-TO-PEAK OUTPUT – Volts
15
12
0
10k 100k 10M
1M
9
6
3
V
DD
= +6V
V
SS
= –6V
T
A
= +25
°
C
NO LOAD
Figure 15. Maximum Output Voltage
vs. Frequency
FREQUENCY – Hz
OUTPUT IMPEDANCE – Ω
35
30
010 100 1M1k 10k 100k
25
20
15
10
5
V
DD
= +12V
V
SS
= 0V
T
A
= +25
°
C
NO LOAD
Figure 14. Output Impedance vs.
Frequency
FREQUENCY – Hz
REJECTION RATIO – dB
60
50
–1010 100 1M
1k 10k 100k
40
30
20
10
0
VDD = +12V
VSS = 0V
TA = +25°C
NO LOAD
+PSRR
HOLD CAPACITORS
REFERENCED TO VSS
–PSRR
Figure 16. Hold Mode Power Supply
Rejection
SMP08
–6– REV. D
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5
SMP08
R2
10kΩ
R2
10kΩ
R2
10kΩ
R2
10kΩ
R3
6.5kΩR4
1kΩ
R1
10Ω
D1
C1
10µF
C2
1µF
+
V
CC
+15V
R2
10kΩ
R2
10kΩ
R2
10kΩ
R2
10kΩ
Figure 17. Burn-In Circuit
OUTPUT BUFFERS (Pins 1, 2, 4, 5, 12, 13, 14, 15)
The buffer offset specification is 10 mV; this is less than 1/2 LSB
of an 8-bit DAC with 10 V full scale. The hold step (magni-
tude of step caused in the output voltage when switching from
sample-to-hold mode, also referred to as the pedestal error or
sample-to-hold offset), is about 2.5 mV with little variation
over the full output voltage range, T
A
= +25°C to +85°C. The
droop rate of a held channel is 2 mV/s typical and 20 mV/s
maximum.
The buffers are designed to drive loads connected to ground.
The outputs can source more than 20 mA, over the full voltage
range, but have limited current sinking capability near V
SS
. In
split supply operation, symmetrical output swings can be ob-
tained by restricting the output range to 2 V from either supply.
On-chip SMP08 buffers eliminate potential stability problems
associated with external buffers; outputs are stable with ca-
pacitive loads up to 500 pF. However, since the SMP08’s
buffer outputs are not short-circuit protected, care should be
taken to avoid shorting any output to the supplies or ground.
SIGNAL INPUT (Pin 3)
The signal input should be driven from a low impedance volt-
age source such as the output of an op amp. The op amp
should have a high slew rate and fast settling time if the
SMP08’s acquisition time characteristics are to be maintained.
As with all CMOS devices, all input voltages should be kept
within range of the supply rails (V
SS
< V
IN
< V
DD
) to avoid the
possibility of latchup. If single supply operation is desired, op
amps such as the OP183 or AD820 that have input and output
voltage compliances including ground, can be used to drive the
inputs. Split supplies, such as ±7.5 V, can be used with the
SMP08.
APPLICATION TIPS
All unused digital inputs should be connected to logic LOW
and unused analog inputs connected to analog ground. For
connector-driven analog inputs that may become temporarily
disconnected, a resistor to V
DD
, V
SS
or analog ground should
be used with a value ranging from 200 kΩ to 1 MΩ.
APPLICATIONS INFORMATION
The SMP08, a multiplexed octal S/H, minimizes board space in
systems requiring cycled calibration or an array of control volt-
ages. When used in conjunction with a low cost 16-bit D/A, the
SMP08 can easily be integrated into microprocessor based sys-
tems. Since the SMP08 features break-before-make switching
and an internal decoder, no external logic is required. The
SMP08 has an internally regulated TTL supply so that TTL/
CMOS compatibility is maintained over the full supply range.
See Figure 18 for channel decode address information.
POWER SUPPLIES
The SMP08 is capable of operating with either single or dual
supplies, over a voltage range of 7 volts to 15 volts. Based on the
supply voltages chosen, V
DD
and V
SS
establish the input and
output voltage range, which is:
(V
SS
+0.06 V) ≤ V
OUT/IN
≤ (V
DD
–2 V)
Note that several specifications, including acquisition time, off-
set and output voltage compliance, will degrade for supply volt-
ages of less than 7 V.
If split supplies are used, the negative supply should be bypassed
with a 0.1 µF capacitor in parallel with a 10 µF to ground. The
internal hold capacitors are connected to this supply pin and any
noise will appear at the outputs.
In single supply applications, it is extremely important that the
V
SS
(negative supply) pin is connected to a clean ground. The
hold capacitors are internally tied to the V
SS
(negative) rail. Any
ground noise or disturbance will directly couple to the output of
the sample-and-hold, degrading the signal-to-noise perfor-
mance. The analog and digital ground traces on the circuit
board should be physically separated to reduce digital switching
noise from entering the analog circuitry.
POWER SUPPLY SEQUENCING
V
DD
should be applied to the SMP08 before the logic input sig-
nals. The SMP08 has been designed to be immune to latchup,
but standard precautions should still be taken.
SMP08
–7–
REV. D
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SMP08
13
14
15
12
1
2
4
5
3
16
6
7
8
9
10
11
+12V
CH
0
CH
1
CH
2
CH
3
CH
4
CH
5
CH
6
CH
7
3
15
1
516
17
4
+12V
+5V
REF02
+12V
V
REF
AV
DD
V
OA
V
Z
GND
WR CS
DAC8228
A
B
C
ADDRESS
DECODE
ADDRESS
BUS
DIGITAL
INPUTS
WR
DGND
INH
0.1µF
PIN 9
CPIN 10
BPIN 11
APIN 6
INH CH PIN
0
0
0
0
1
1
1
1
X
0
0
1
1
0
0
1
1
X
0
1
0
1
0
1
0
1
X
0
0
0
0
0
0
0
0
1
0
1
2
3
4
5
6
7
NONE
13
14
15
12
1
5
2
4
–
CHANNEL DECODING
Figure 18. 8-Channel Multiplexed D/A Converter
Do not apply signals to the SMP08 with power off unless the
input current is limited to less than 10 mA.
TYPICAL APPLICATIONS
AN 8-CHANNEL MULTIPLEXED D/A CONVERTER
Figure 18 illustrates a typical demultiplexing function of the
SMP08. It is used to sample-and-hold eight different output
voltages corresponding to eight different digital codes from a
D/A converter. The SMP08’s droop rate of 20 mV/s requires a
refresh once every 500 ms, before the voltage drifts beyond
1/2 LSB accuracy (1 LSB of an 8-bit DAC is equivalent to
19.5 mV out of a full-scale voltage of 5 V). For a 10-bit DAC
the refresh rate must be less than 120 ms, and, for a 12-bit
system, 31 ms. This implementation is very cost effective com-
pared to using multiple DACs as the number of output channels
increases.
SMP08
–8– REV. D
C2192–2–10/96
PRINTED IN U.S.A.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead Plastic DIP
(N-16)
16
18
9
0.840 (21.33)
0.745 (18.93)
0.280 (7.11)
0.240 (6.10)
PIN 1
SEATING
PLANE
0.022 (0.558)
0.014 (0.356)
0.060 (1.52)
0.015 (0.38)
0.210 (5.33)
MAX 0.130
(3.30)
MIN
0.070 (1.77)
0.045 (1.15)
0.100
(2.54)
BSC
0.160 (4.06)
0.115 (2.93)
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
16-Lead SOIC (Narrow Body)
(SO-16)
16 9
81
0.3937 (10.00)
0.3859 (9.80)
0.2550 (6.20)
0.2284 (5.80)
0.1574 (4.00)
0.1497 (5.80)
PIN 1
SEATING
PLANE
0.0098 (0.25)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.0688 (1.75)
0.0532 (1.35)
0.0500
(1.27)
BSC
0.0099 (0.25)
0.0075 (0.19)
0.0500 (1.27)
0.0160 (0.41)
8°
0°
0.0196 (0.50)
0.0099 (0.25) x 45°
