SMP08-SPECIFICATIONS(@ V ELECTRICAL CHARACTERISTICS Parameter Linearity Error Buffer Offset Voltage Symbol Hold Step VHS Droop Rate Output Source Current Output Sink Current Output Voltage Range VCH/t ISOURCE ISINK VOS LOGIC CHARACTERISTICS Logic Input High Voltage Logic Input Low Voltage Logic Input Current DYNAMIC PERFORMANCE Acquisition Time3 Hold Mode Settling Time Channel Select Time Channel Deselect Time Inhibit Recovery Time Slew Rate Capacitive Load Stability Analog Crosstalk VINH VINL IIN DD = +5 V, VSS = -5 V, DGND = 0 V, RL = No Load, TA = -408C to +858C for SMP08F, unless otherwise noted) Conditions -3 V VIN +3 V TA = +25C, VIN = 0 V -40C TA +85C, VIN = 0 V VIN = 0 V, TA = +25C to +85C VIN = 0 V, TA = -40C TA = +25C, VIN = 0 V VIN = 0 V1 VIN = 0 V1 RL = 20 k Min Typ 0.01 2.5 3.5 2.5 2 1.2 0.5 -3.0 Max +3.0 Units % mV mV mV mV mV/s mA mA V 0.8 1 V V A 10 20 4 5 20 2.4 VIN = 2.4 V 0.5 TA = +25C, -3 V to +3 V to 0.1% To 1 mV of Final Value 3.6 1 90 45 90 3 500 -72 2 SUPPLY CHARACTERISTICS Power Supply Rejection Ratio Supply Current tAQ tH tCH tDCS tIR SR <30% Overshoot -3 V to +3 V Step PSRR IDD ELECTRICAL CHARACTERISTICS Parameter Linearity Error Buffer Offset Voltage Symbol Hold Step VHS Droop Rate Output Source Current Output Sink Current Output Voltage Range VCH/t ISOURCE ISINK VOS LOGIC CHARACTERISTICS Logic Input High Voltage Logic Input Low Voltage Logic Input Current VINH VINL IIN DYNAMIC PERFORMANCE2 Acquisition Time3 tAQ Hold Mode Settling Time Channel Select Time Channel Deselect Time Inhibit Recovery Time Slew Rate Capacitive Load Stability Analog Crosstalk SUPPLY CHARACTERISTICS Power Supply Rejection Ratio Supply Current tH tCH tDCS tIR SR PSRR IDD VS = 5 V to 6 V TA = +25C -40C TA +85C 60 75 4 5 7 7.5 9.5 s s ns ns ns V/s pF dB dB mA mA (@ VDD = +12 V, VSS = 0 V, DGND = 0 V, RL = No Load, TA = -408C to +858C for SMP08F, unless otherwise noted) Conditions 60 mV VIN 10 V TA = +25C, VIN = 6 V -40C TA +85C, VIN = 6 V VIN = 6 V, TA = +25C to +85C VIN = 6 V, TA = -40C TA = +25C, VIN = 6 V VIN = 6 V1 VIN = 6 V1 RL = 20 k RL = 10 k Min Typ 0.01 2.5 3.5 2.5 2 1.2 0.5 0.06 0.06 Max 10.0 9.5 Units % mV mV mV mV mV/s mA mA V V 0.8 1 V V A 10 20 4 5 20 2.4 VIN = 2.4 V 0.5 TA = +25C, 0 V to 10 V to 0.1% -40C TA +85C To 1 mV of Final Value 3.5 3.75 1 90 45 90 4 500 -72 RL = 20 k4 <30% Overshoot 0 V to 10 V Step 3 10.8 V VDD 13.2 V TA = +25C -40C TA +85C 60 75 6.0 8.0 4.25 6.00 8.0 10.0 s s s ns ns ns V/s pF dB dB mA mA NOTES 1 Outputs are capable of sinking and sourcing over 20 mA but offset is guaranteed at specified load levels. 2 All input control signals are specified with t r = tf = 5 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V. 3 This parameter is guaranteed without test. 4 Slew rate is measured in the sample mode with 0 V to 10 V step from 20% to 80%. Specifications subject to change without notice. -2- REV. D SMP08 ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V, 17 V VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V, 17 V VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V, VDD VIN to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD VOUT to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . 20 mA (Not Short-Circuit Protected) Operating Temperature Range FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to +85C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150C Storage Temperature . . . . . . . . . . . . . . . . . . -65C to +150C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300C Package Type uJA* uJC Units 16-Pin Plastic DIP (P) 16-Pin SOIC (S) 76 92 33 27 C/W C/W Model Temperature Range Package Description Package Option SMP08FP SMP08FS -40C to +85C -40C to +85C Plastic DIP SO-16 N-16 R-16A PIN CONNECTIONS CH4OUT 1 16 VDD CH6OUT 2 15 CH2OUT SMP08 13 CH0OUT TOP VIEW CH5OUT 5 (Not to Scale) 12 CH3OUT CH7OUT 4 *JA is specified for worst case mounting conditions, i.e., JA is specified for device in socket for plastic DIP package; JA is specified for device soldered to printed circuit board for SO package. INH 6 11 A CONTROL VSS 7 10 B CONTROL DGND 8 9 C CONTROL CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the SMP08 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. D 14 CH1OUT INPUT 3 -3- WARNING! ESD SENSITIVE DEVICE SMP08-Typical Performance Characteristics 100 10 1 0.1 -55 -35 -15 5 25 45 65 85 105 125 TEMPERATURE - C Figure 1. Droop Rate vs. Temperature 2 1600 1 0 -1 VDD = +12V VSS = 0V -2 TA = +25C NO LOAD -3 2 3 4 5 6 7 8 0 1 INPUT VOLTAGE - Volts 1200 1000 800 600 9 0 10 0 -1 -2 -3 1 2 3 4 5 6 7 8 INPUT VOLTAGE - Volts 9 10 Figure 3. Droop Rate vs. Input Voltage 7 VSS = 0V T A = +25 C NO LOAD 6 SLEW RATE - V/s HOLD STEP - mV NO LOAD TA = +125C NO LOAD VDD = +12V VSS = 0V V I N = +5V NO LOAD 1 TA = +25C VDD = +12V VSS = 0V 1400 2 VDD = +12V VSS = 0V 1 0 -1 -2 -SR 5 +SR 4 -3 -4 0 1 2 3 4 5 6 7 8 INPUT VOLTAGE - Volts 9 Figure 4. Hold Step vs. Input Voltage 4 -4 -55 10 20 TA = +25C NO LOAD -2 -4 RL = 20k RL = 10k -6 -8 NO LOAD 5 RL = 0 -5 RL = 10k RL = 20k -10 1 2 3 4 5 6 7 8 INPUT VOLTAGE - Volts 9 10 Figure 7. Offset Voltage vs. Input Voltage 13 14 15 VDD - Volts 16 17 18 Figure 6. Slew Rate vs. VDD VDD = +12V VSS = 0V 0 RL = TA = -40C NO LOAD RL = 20k -2 RL = 10k -4 -6 -8 -20 0 12 2 TA = +85C 10 11 4 -15 -10 3 10 85 65 VDD = +12V VSS = 0V 15 OFFSET VOLTAGE - mV RL = 0 -15 5 25 45 TEMPERATURE - C Figure 5. Hold Step vs. Temperature VDD = +12V VSS = 0V 2 -35 OFFSET VOLTAGE - mV HOLD STEP - mV 1800 Figure 2. Droop Rate vs. Input Voltage 2 OFFSET VOLTAGE - mV 3 DROOP RATE - mV/s VDD = +12V VSS = 0V V I N = +5V RL = 10k DROOP RATE - mV/s DROOP RATE - mV/s 1000 -10 0 1 2 3 4 5 6 7 8 INPUT VOLTAGE - Volts 9 10 Figure 8. Offset Voltage vs. Input Voltage -4- 0 1 2 3 4 5 6 7 8 INPUT VOLTAGE - Volts 9 10 Figure 9. Offset Voltage vs. Input Voltage REV. D Typical Performance Characteristics-SMP08 14 -2 V I N = +5V RL = 10k 90 VSS = 0V NO LOAD 12 -3 -4 -5 -6 10 +85C 8 +25C 6 -40C 4 -7 25 45 65 85 105 125 4 TEMPERATURE - C Figure 10. Offset Voltage vs. Temperature VDD = +12V VSS = 0V 1 TA = +25C NO LOAD 0 GAIN - dB 8 10 12 VDD - Volts 35 45 30 -45 PHASE -90 -2 -135 -3 GAIN -180 -4 1k 10k 100k FREQUENCY - Hz 1M 25 NO LOAD -PSRR 40 30 20 0 10 18 100 1k 10k 100k FREQUENCY - Hz VDD = +12V VSS = 0V TA = +25C NO LOAD 15 10 100 1k 10k 100k FREQUENCY - Hz 1M Figure 14. Output Impedance vs. Frequency 60 VDD = +6V VSS = -6V 50 TA = +25C NO LOAD 9 6 3 +PSRR 40 VDD = +12V 30 VSS = 0V TA = +25C 20 NO LOAD 10 HOLD CAPACITORS REFERENCED TO VSS 0 -PSRR 0 10k 1M 100k FREQUENCY - Hz -10 10 10M Figure 15. Maximum Output Voltage vs. Frequency REV. D 100 1k 10k 100k FREQUENCY - Hz 1M Figure 16. Hold Mode Power Supply Rejection -5- 1M Figure 12. Sample Mode Power Supply Rejection 20 0 10 REJECTION RATIO - dB PEAK-TO-PEAK OUTPUT - Volts 50 V I N = +6V TA = +25C 60 5 -225 10M Figure 13. Gain, Phase Shift vs. Frequency 12 16 90 0 -1 15 14 Figure 11. Supply Current vs. VDD 2 -5 100 6 OUTPUT IMPEDANCE - 5 +PSRR 70 10 2 PHASE SHIFT - Degrees -8 -55 -35 -15 VDD = +12V VSS = 0V 80 REJECTION RATIO - dB -1 VDD = +12V VSS = 0V SUPPLY CURRENT - mA OFFSET VOLTAGE - mV 0 SMP08 VCC R3 6.5k R4 1k +15V D1 C1 10F + C2 1F R1 10 1 16 2 15 3 14 SMP08 4 R2 10k R2 10k R2 10k R2 10k 13 5 12 6 11 7 10 8 9 R2 10k R2 10k R2 10k R2 10k Figure 17. Burn-In Circuit APPLICATIONS INFORMATION OUTPUT BUFFERS (Pins 1, 2, 4, 5, 12, 13, 14, 15) The SMP08, a multiplexed octal S/H, minimizes board space in systems requiring cycled calibration or an array of control voltages. When used in conjunction with a low cost 16-bit D/A, the SMP08 can easily be integrated into microprocessor based systems. Since the SMP08 features break-before-make switching and an internal decoder, no external logic is required. The SMP08 has an internally regulated TTL supply so that TTL/ CMOS compatibility is maintained over the full supply range. See Figure 18 for channel decode address information. The buffer offset specification is 10 mV; this is less than 1/2 LSB of an 8-bit DAC with 10 V full scale. The hold step (magnitude of step caused in the output voltage when switching from sample-to-hold mode, also referred to as the pedestal error or sample-to-hold offset), is about 2.5 mV with little variation over the full output voltage range, TA = +25C to +85C. The droop rate of a held channel is 2 mV/s typical and 20 mV/s maximum. The buffers are designed to drive loads connected to ground. The outputs can source more than 20 mA, over the full voltage range, but have limited current sinking capability near VSS. In split supply operation, symmetrical output swings can be obtained by restricting the output range to 2 V from either supply. POWER SUPPLIES The SMP08 is capable of operating with either single or dual supplies, over a voltage range of 7 volts to 15 volts. Based on the supply voltages chosen, VDD and VSS establish the input and output voltage range, which is: On-chip SMP08 buffers eliminate potential stability problems associated with external buffers; outputs are stable with capacitive loads up to 500 pF. However, since the SMP08's buffer outputs are not short-circuit protected, care should be taken to avoid shorting any output to the supplies or ground. (VSS +0.06 V) VOUT/IN (VDD -2 V) Note that several specifications, including acquisition time, offset and output voltage compliance, will degrade for supply voltages of less than 7 V. If split supplies are used, the negative supply should be bypassed with a 0.1 F capacitor in parallel with a 10 F to ground. The internal hold capacitors are connected to this supply pin and any noise will appear at the outputs. In single supply applications, it is extremely important that the VSS (negative supply) pin is connected to a clean ground. The hold capacitors are internally tied to the VSS (negative) rail. Any ground noise or disturbance will directly couple to the output of the sample-and-hold, degrading the signal-to-noise performance. The analog and digital ground traces on the circuit board should be physically separated to reduce digital switching noise from entering the analog circuitry. SIGNAL INPUT (Pin 3) The signal input should be driven from a low impedance voltage source such as the output of an op amp. The op amp should have a high slew rate and fast settling time if the SMP08's acquisition time characteristics are to be maintained. As with all CMOS devices, all input voltages should be kept within range of the supply rails (VSS < VIN < VDD) to avoid the possibility of latchup. If single supply operation is desired, op amps such as the OP183 or AD820 that have input and output voltage compliances including ground, can be used to drive the inputs. Split supplies, such as 7.5 V, can be used with the SMP08. APPLICATION TIPS POWER SUPPLY SEQUENCING All unused digital inputs should be connected to logic LOW and unused analog inputs connected to analog ground. For connector-driven analog inputs that may become temporarily disconnected, a resistor to VDD, VSS or analog ground should be used with a value ranging from 200 k to 1 M. VDD should be applied to the SMP08 before the logic input signals. The SMP08 has been designed to be immune to latchup, but standard precautions should still be taken. -6- REV. D SMP08 +12V SMP08 13 CH0 REF02 +12V +5V DIGITAL INPUTS 4 17 VREFA VDD CS 16 15 14 CH1 VOA 3 DAC8228 WR VSS 3 VSS VZ 1 GND 15 CH2 5 VSS WR ADDRESS BUS A B ADDRESS DECODE C CHANNEL DECODING 12 CH3 11 VSS 10 9 1 CH4 5 CH5 2 CH6 4 CH7 VSS DGND 8 VSS INH PIN 9 C PIN 10 B PIN 11 A PIN 6 INH CH PIN 0 0 0 0 1 1 1 1 X 0 0 1 1 0 0 1 1 X 0 1 0 1 0 1 0 1 X 0 0 0 0 0 0 0 0 1 0 1 2 3 4 5 6 7 NONE 13 14 15 12 1 5 2 4 - VSS 6 VSS 16 7 +12V 0.1F Figure 18. 8-Channel Multiplexed D/A Converter Do not apply signals to the SMP08 with power off unless the input current is limited to less than 10 mA. TYPICAL APPLICATIONS AN 8-CHANNEL MULTIPLEXED D/A CONVERTER Figure 18 illustrates a typical demultiplexing function of the SMP08. It is used to sample-and-hold eight different output voltages corresponding to eight different digital codes from a D/A converter. The SMP08's droop rate of 20 mV/s requires a refresh once every 500 ms, before the voltage drifts beyond REV. D 1/2 LSB accuracy (1 LSB of an 8-bit DAC is equivalent to 19.5 mV out of a full-scale voltage of 5 V). For a 10-bit DAC the refresh rate must be less than 120 ms, and, for a 12-bit system, 31 ms. This implementation is very cost effective compared to using multiple DACs as the number of output channels increases. -7- SMP08 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). C2192-2-10/96 16-Lead Plastic DIP (N-16) 0.840 (21.33) 0.745 (18.93) 16 9 1 8 0.280 (7.11) 0.240 (6.10) 0.060 (1.52) PIN 1 0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93) 0.015 (0.38) 0.210 (5.33) MAX 0.160 (4.06) 0.130 (3.30) MIN 0.115 (2.93) 0.100 (2.54) BSC 0.022 (0.558) 0.014 (0.356) 0.015 (0.381) 0.070 (1.77) SEATING 0.045 (1.15) PLANE 0.008 (0.204) 16-Lead SOIC (Narrow Body) (SO-16) 0.3937 (10.00) 0.3859 (9.80) 0.1574 (4.00) 0.1497 (5.80) 16 9 1 8 PIN 1 0.0098 (0.25) 0.2550 (6.20) 0.2284 (5.80) 0.0688 (1.75) 0.0196 (0.50) 0.0532 (1.35) 0.0099 (0.25) x 45 0.0040 (0.10) 0.0500 (1.27) BSC 0.0192 (0.49) 0.0138 (0.35) 8 0.0099 (0.25) 0 0.0500 (1.27) 0.0160 (0.41) 0.0075 (0.19) PRINTED IN U.S.A. SEATING PLANE -8- REV. D