Low Value Flat Chip Resistor
LR Series
Standard 2512, 2010 and 1206 sizes
Resistance values down to 0.003 ohms
Leachresistantsolder-platedcopperwrap-aroundterminaon
AEC-Q200Qualied
RoHS compliant and SnPb variants
Resistors
06.18
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronics.com/resistors
BI Technologies IRC Welwyn
Standard 2512, 2010 and 1206 sizes
Resistance values down to 0.003 ohms
Leachresistantsolder-platedcopperwrap-aroundterminaon
AEC-Q200Qualied
RoHS compliant and SnPb variants
Low Value Flat Chip Resistor
LR Series
H
W
D
L
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Alumina Substrate
Copper Wraparound
Termination
2152 / 0102 / 6021 RL
Low Value Flat
Chip Resistor
LRC/LRF Series
•
Standard 2512, 2010 and 1206 sizes
•
Resistance values down to 0.003 ohms
•
Leach resistant solder-plated copper
wrap-around termination
•
Low inductance - less than 0.2nH
•
AEC-Q200 Qualified
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Physical Data
04.10
A subsidiary of
TT electronics plc
Welwyn Components
23
LR1206 LR2010 LR2512
*0.2/5.10.15.0sttawC°07 ta gnitar rewoP
R1 ot 300R0R1 ot 300R0R1 ot 010R0smhoegnar ecnatsiseR
002002002stlovegatlov gnidnatshtiw cirtceleiD
)smho 050.0 woleb eulav rof yrotcaf tcatnoC( 001±C°/mppRCT
%ecnarelot ecnatsiseR ≤R005 5%, >R005 1, 2, 5%
090804C°rewop detar ta esir erutarepmeT
Pad and trace area for max power rating @ 70°C mm230 30 100
*2 Watts with total solder pad and trace size of 300 mm
2
Dimensions (mm)
D)xam( HWLeziS
LR1206 0.48±0.25
0.48±0.25
0.48±0.25
LR2010
LR2512
i o` Ji oc| bKèñÇ==NOL OP LMQ==N MWMT =^j ==m~ ÖÉ =N
3.20±0.305 1.63±0.20 0.8
0.84
0.84
5.23±0.38 2.64±0.25
6.50±0.38 3.25±0.25
LR1206 LR2010 LR2512
Power rating @70°C watts 0.5 1 2
Resistance range
1
ohms R003 to 1R0
Resistance tolerance
1
% <R01: 5, ≥R01: 1, 2, 5
TCR ppm/°C ≥R05: ±100, R025–R047: <+200, R015-R024: <+300,
R01-R014: <+500, <R01: <+900
Dielectric withstand volts 200
Ambient temperature range °C -55 to +150
Values E24 preferred
2
Temperature rise at rated power °C 40 80 90
Pad / trace area
3
mm
2
30 100 300
H
W
D
L
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Alumina Substrate
Copper Wraparound
Termination
2152 / 0102 / 6021 RL
Low Value Flat
Chip Resistor
LRC/LRF Series
•Standard 2512, 2010 and 1206 sizes
•Resistance values down to 0.003 ohms
•Leach resistant solder-plated copper
wrap-around termination
•Low inductance - less than 0.2nH
•AEC-Q200 Qualified
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Physical Data
04.10
A subsidiary of
TT electronics plc
Welwyn Components
23
LR1206 LR2010 LR2512
*0.2/5.10.15.0sttawC°07 ta gnitar rewoP
R1 ot 300R0R1 ot 300R0R1 ot 010R0smhoegnar ecnatsiseR
002002002stlovegatlov gnidnatshtiw cirtceleiD
)smho 050.0 woleb eulav rof yrotcaf tcatnoC( 001±C°/mppRCT
%ecnarelot ecnatsiseR ≤R005 5%, >R005 1, 2, 5%
090804C°rewop detar ta esir erutarepmeT
Pad and trace area for max power rating @ 70°C mm230 30 100
*2 Watts with total solder pad and trace size of 300 mm2
Dimensions (mm)
D)xam( HWLeziS
LR1206 0.48±0.25
0.48±0.25
0.48±0.25
LR2010
LR2512
i o` Ji oc| bKèñÇ==NOLOP L MQ==N MWMT =^j ==m~ ÖÉ =N
3.20±0.305 1.63±0.20 0.8
0.84
0.84
5.23±0.38 2.64±0.25
6.50±0.38 3.25±0.25
Note 1: Contact factory for value – tolerance combinations outside this range. Note 2: Many values = N x R001 and N x R005 up to N=10 are also
available. Note 3: Recommended minimum pad & adjacent trace area for each termination for rated dissipation on FR4 PCB
Low Value Flat
Chip Resistor
LRC/LRF Series
© Welwyn Components Limited
Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com 04.10
Welwyn Components
Recommended Solder Pad Dimensions (mm)
A B C
LR1206 2.0 4.0 1.25
LR2010 3.05 6.5 1.5
LR2512 3.7 7.75 1.5
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies only to European Part Numbers at ohmic values ≥R01.
A
C
B
i o` Ji oc| bKèñÇ==NOLOP LMQ==N MWMT =^j ==m~ ÖÉ =O
LRC 2512 1 watt
LRC 2512 2 watt
LRC 2010 0.5 wattLRC 2010 1 watt
LRC 1206 0.25 watt
LRC 1206 0.5 watt
25 70 150 (°C)
0
20
40
60
80
100
(%)
Power Rating
Ambient temperature
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
L R F 2 5 1 2 – R 0 1 G W
Type
Mounting
Conventional (element up)
Values > R025
F
Flip-chip (element down)
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
F
1%
G
2%
J
5%
Packing
W Tape
1206 or 2010
Standard
2512
T1
All sizes
Values < R025
AEC-Q200 Table 7 Method Max.
(add R05)
Typ.
(@1R0)
ref Test
3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2
4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1
6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2
7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5
14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05
15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05
16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1
18 Solderability J-STD-002 >95% coverage
21 Board Flex AEC-Q200-005 R% 0.5 0.2
22 Terminal Strength AEC-Q200-006 R% 0.25 0.1
Short Term Overload 6.25 x Pr for 2s R% 0.5
Low Temperature Storage -65°C for 100 hours R% 0.5
Leach Resistance Solder dip at 250°C 90s minimum
H
W
D
L
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Alumina Substrate
Copper Wraparound
Termination
2152 / 0102 / 6021 RL
Low Value Flat
Chip Resistor
LRC/LRF Series
•Standard 2512, 2010 and 1206 sizes
•Resistance values down to 0.003 ohms
•Leach resistant solder-plated copper
wrap-around termination
•Low inductance - less than 0.2nH
•AEC-Q200 Qualified
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Physical Data
04.10
A subsidiary of
TT electronics plc
Welwyn Components
23
LR1206 LR2010 LR2512
*0.2/5.10.15.0sttawC°07 ta gnitar rewoP
R1 ot 300R0R1 ot 300R0R1 ot 010R0smhoegnar ecnatsiseR
002002002stlovegatlov gnidnatshtiw cirtceleiD
)smho 050.0 woleb eulav rof yrotcaf tcatnoC( 001±C°/mppRCT
%ecnarelot ecnatsiseR ≤R005 5%, >R005 1, 2, 5%
090804C°rewop detar ta esir erutarepmeT
Pad and trace area for max power rating @ 70°C mm230 30 100
*2 Watts with total solder pad and trace size of 300 mm2
Dimensions (mm)
D)xam( HWLeziS
LR1206 0.48±0.25
0.48±0.25
0.48±0.25
LR2010
LR2512
i o` J i oc| bKèñÇ==NOLOP LMQ==N MWMT =^j ==m~ ÖÉ =N
3.20±0.305 1.63±0.20 0.8
0.84
0.84
5.23±0.38 2.64±0.25
6.50±0.38 3.25±0.25
Make Possible
Resistors
12.15
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronicsresistors.com
AllPb-freepartscomplywithEUDirecve2011/65/EU(RoHS2)
Standard 2512, 2010 and 1206 sizes
Resistance values down to 0.003 ohms
Leachresistantsolder-platedcopperwrap-aroundterminaon
AEC-Q200Qualied
RoHS compliant and SnPb variants
Low Value Flat Chip Resistor
LR Series
H
W
D
L
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Alumina Substrate
Copper Wraparound
Termination
2152 / 0102 / 6021 RL
Low Value Flat
Chip Resistor
LRC/LRF Series
•
Standard 2512, 2010 and 1206 sizes
•
Resistance values down to 0.003 ohms
•
Leach resistant solder-plated copper
wrap-around termination
•
Low inductance - less than 0.2nH
•
AEC-Q200 Qualified
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Physical Data
04.10
A subsidiary of
TT electronics plc
Welwyn Components
23
LR1206 LR2010 LR2512
*0.2/5.10.15.0sttawC°07 ta gnitar rewoP
R1 ot 300R0R1 ot 300R0R1 ot 010R0smhoegnar ecnatsiseR
002002002stlovegatlov gnidnatshtiw cirtceleiD
)smho 050.0 woleb eulav rof yrotcaf tcatnoC( 001±C°/mppRCT
%ecnarelot ecnatsiseR ≤R005 5%, >R005 1, 2, 5%
090804C°rewop detar ta esir erutarepmeT
Pad and trace area for max power rating @ 70°C mm230 30 100
*2 Watts with total solder pad and trace size of 300 mm
2
Dimensions (mm)
D)xam( HWLeziS
LR1206 0.48±0.25
0.48±0.25
0.48±0.25
LR2010
LR2512
i o` Ji oc| bKèñÇ==NOL OP LMQ==N MWMT =^j ==m~ ÖÉ =N
3.20±0.305 1.63±0.20 0.8
0.84
0.84
5.23±0.38 2.64±0.25
6.50±0.38 3.25±0.25
LR1206 LR2010 LR2512
Power rating @70°C watts 0.5 1 2
Resistance range
1
ohms R003 to 1R0
Resistance tolerance
1
% <R01: 5, ≥R01: 1, 2, 5
TCR ppm/°C ≥R05: ±100, R025–R047: <+200, R015-R024: <+300,
R01-R014: <+500, <R01: <+900
Dielectric withstand volts 200
Ambient temperature range °C -55 to +150
Values E24 preferred
2
Temperature rise at rated power °C 40 80 90
Pad / trace area
3
mm
2
30 100 300
H
W
D
L
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Alumina Substrate
Copper Wraparound
Termination
2152 / 0102 / 6021 RL
Low Value Flat
Chip Resistor
LRC/LRF Series
•Standard 2512, 2010 and 1206 sizes
•Resistance values down to 0.003 ohms
•Leach resistant solder-plated copper
wrap-around termination
•Low inductance - less than 0.2nH
•AEC-Q200 Qualified
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Physical Data
04.10
A subsidiary of
TT electronics plc
Welwyn Components
23
LR1206 LR2010 LR2512
*0.2/5.10.15.0sttawC°07 ta gnitar rewoP
R1 ot 300R0R1 ot 300R0R1 ot 010R0smhoegnar ecnatsiseR
002002002stlovegatlov gnidnatshtiw cirtceleiD
)smho 050.0 woleb eulav rof yrotcaf tcatnoC( 001±C°/mppRCT
%ecnarelot ecnatsiseR ≤R005 5%, >R005 1, 2, 5%
090804C°rewop detar ta esir erutarepmeT
Pad and trace area for max power rating @ 70°C mm230 30 100
*2 Watts with total solder pad and trace size of 300 mm2
Dimensions (mm)
D)xam( HWLeziS
LR1206 0.48±0.25
0.48±0.25
0.48±0.25
LR2010
LR2512
i o` Ji oc| bKèñÇ==NOLOP L MQ==N MWMT =^j ==m~ ÖÉ =N
3.20±0.305 1.63±0.20 0.8
0.84
0.84
5.23±0.38 2.64±0.25
6.50±0.38 3.25±0.25
Note 1: Contact factory for value – tolerance combinations outside this range. Note 2: Many values = N x R001 and N x R005 up to N=10 are also
available. Note 3: Recommended minimum pad & adjacent trace area for each termination for rated dissipation on FR4 PCB
Low Value Flat
Chip Resistor
LRC/LRF Series
© Welwyn Components Limited
Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com 04.10
Welwyn Components
Recommended Solder Pad Dimensions (mm)
A B C
LR1206 2.0 4.0 1.25
LR2010 3.05 6.5 1.5
LR2512 3.7 7.75 1.5
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies only to European Part Numbers at ohmic values ≥R01.
A
C
B
i o` Ji oc| bKèñÇ==NOLOP LMQ==N MWMT =^j ==m~ ÖÉ =O
LRC 2512 1 watt
LRC 2512 2 watt
LRC 2010 0.5 wattLRC 2010 1 watt
LRC 1206 0.25 watt
LRC 1206 0.5 watt
25 70 150 (°C)
0
20
40
60
80
100
(%)
Power Rating
Ambient temperature
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
L R F 2 5 1 2 – R 0 1 G W
Type
Mounting
Conventional (element up)
Values > R025
F
Flip-chip (element down)
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
F
1%
G
2%
J
5%
Packing
W Tape
1206 or 2010
3000/reel
Standard
2512
1800/reel
T1
All sizes
1000/reel
Values < R025
AEC-Q200 Table 7 Method Max.
(add R05)
Typ.
(@1R0)
ref Test
3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2
4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1
6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2
7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5
14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05
15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05
16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1
18 Solderability J-STD-002 >95% coverage
21 Board Flex AEC-Q200-005 R% 0.5 0.2
22 Terminal Strength AEC-Q200-006 R% 0.25 0.1
Short Term Overload 6.25 x Pr for 2s R% 0.5
Low Temperature Storage -65°C for 100 hours R% 0.5
Leach Resistance Solder dip at 250°C 90s minimum
H
W
D
L
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Alumina Substrate
Copper Wraparound
Termination
2152 / 0102 / 6021 RL
Low Value Flat
Chip Resistor
LRC/LRF Series
•Standard 2512, 2010 and 1206 sizes
•Resistance values down to 0.003 ohms
•Leach resistant solder-plated copper
wrap-around termination
•Low inductance - less than 0.2nH
•AEC-Q200 Qualified
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Physical Data
04.10
A subsidiary of
TT electronics plc
Welwyn Components
23
LR1206 LR2010 LR2512
*0.2/5.10.15.0sttawC°07 ta gnitar rewoP
R1 ot 300R0R1 ot 300R0R1 ot 010R0smhoegnar ecnatsiseR
002002002stlovegatlov gnidnatshtiw cirtceleiD
)smho 050.0 woleb eulav rof yrotcaf tcatnoC( 001±C°/mppRCT
%ecnarelot ecnatsiseR ≤R005 5%, >R005 1, 2, 5%
090804C°rewop detar ta esir erutarepmeT
Pad and trace area for max power rating @ 70°C mm230 30 100
*2 Watts with total solder pad and trace size of 300 mm2
Dimensions (mm)
D)xam( HWLeziS
LR1206 0.48±0.25
0.48±0.25
0.48±0.25
LR2010
LR2512
i o` J i oc| bKèñÇ==NOLOP LMQ==N MWMT =^j ==m~ ÖÉ =N
3.20±0.305 1.63±0.20 0.8
0.84
0.84
5.23±0.38 2.64±0.25
6.50±0.38 3.25±0.25
Make Possible
Resistors
12.15
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronicsresistors.com
AllPb-freepartscomplywithEUDirecve2011/65/EU(RoHS2)
AllPb-freepartscomplywithEUDirecve2011/65/EUamendedby(EU)2015/863(RoHS3)AllPb-freepartscomplywithEUDirecve2011/65/EUamendedby(EU)2015/863(RoHS3)
Low Value Flat
Chip Resistor
LR Series
06.18
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronics.com/resistors
BI Technologies IRC Welwyn
Low Value Flat
Chip Resistor
LR Series
Low Value Flat
Chip Resistor
LRC/LRF Series
© Welwyn Components Limited
Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com 04.10
Welwyn Components
Recommended Solder Pad Dimensions (mm)
A B C
LR1206 2.0 4.0 1.25
LR2010 3.05 6.5 1.5
LR2512 3.7 7.75 1.5
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies only to European Part Numbers at ohmic values ≥R01.
A
C
B
i o` J i oc| bKèñÇ==NOLOP LMQ==N MWMT =^j ==m~ ÖÉ =O
LRC 2512 1 watt
LRC 2512 2 watt
LRC 2010 0.5 wattLRC 2010 1 watt
LRC 1206 0.25 watt
LRC 1206 0.5 watt
25 70 150 (°C)
0
20
40
60
80
100
(%)
Power Rating
Ambient temperature
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
L R F 2 5 1 2 – R 0 1 G W
Type
Mounting
Conventional (element up)
Values > R025
F
Flip-chip (element down)
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
F
1%
G
2%
J
5%
Packing
W Tape
1206 or 2010
3000/reel
Standard
2512
1800/reel
T1
All sizes
1000/reel
Values < R025
AEC-Q200 Table 7 Method Max.
(add R05)
Typ.
(@1R0)
ref Test
3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2
4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1
6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2
7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5
14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05
15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05
16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1
18 Solderability J-STD-002 >95% coverage
21 Board Flex AEC-Q200-005 R% 0.5 0.2
22 Terminal Strength AEC-Q200-006 R% 0.25 0.1
Short Term Overload 6.25 x Pr for 2s R% 0.5
Low Temperature Storage -65°C for 100 hours R% 0.5
Leach Resistance Solder dip at 250°C 90s minimum
Ordering Procedure
This product has two valid part numbers:
European (Welwyn) Part Number: LRF1206-R02FW (1206, 20 milliohms ±1%, Pb-free)
L
R
F
1
2
0
6
-
R
0
2
F
W
1
2
3
4
5
USA (IRC) Part Number: LRC-LRF1206LF-01-R020-F (1206, 20 milliohms ±1%, Pb-free)
L
R
C
-
L
R
F
1
2
0
6
L
F
-
0
1
-
R
0
2
0
-
F
1
2
3
4
5
6
7
Electrical Data
LR1206
LR2010
LR2512
Power rang @70°C
was
0.5
1
2
Resistance range
1
ohms
R003 to 1R0
Resistance tolerance
1
%
<R01: 5, ≥R01: 1, 2, 5
TCR ppm/°C
≥R05: ±100, R025–R047: <+200, R015-R024: <+300,
R01-R014: <+500, <R01: <+900
Dielectric withstand
volts
200
Ambient temperature range
°C
-55 to +150
Values
E24 preferred
2
Temperature rise at rated power
°C
40
80
90
Pad / trace area
3
mm
2
30
100
300
Note 1: Contact factory for value – tolerance combinaons outside this range. Note 2: Many values = N x R001 and N x R005 up to N=10 are also
available. Note 3: Recommended minimum pad & adjacent trace area for each terminaon for rated dissipaon on FR4 PCB
1
2
3
4
5
Type Size ValueTolerance Termination & Packing
LR = Conventional orientation
(values >R025)
1206
E24 = 3/4
characters
R = ohms
F = ±1%
W
Pb-free, standard packing
2010
G = ±2%
T1
Pb-free, 1000/reel (non-standard)
LRF = Flip-chip orientation
(values ≤R025)
2512
J = ±5%
PB
SnPb finish, standard packing
Standard packing is tape & reel
1206 & 2010
3000/reel
2512
1800/reel
1
2
3
4
5
6
7
Family Model Size Termination TCR ValueTolerance Packing
LRC
LR = Conventional orientation
(values >R025)
1206
Omit for SnPb
01 = standard
(±100ppm/°C
values ≥R05)
4 characters
R = ohms
F = ±1%
Standard packing is tape & reel
2010
LF = Pb-free
G = ±2%
LRF = Flip-chip orientation
(values ≤R025)
2512
J = ±5%
1206 & 2010
All sizes
3000/reel
1000/reel
Standard
1800/reel
Non-
standard
2512
Make Possible
12.15
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
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www.ttelectronicsresistors.com