ACAS 0612 - Professional
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Professional Thin Film Chip Resistor Array
The ACAS 0612 thin film chip resistor arrays combine the
proven reliability of professional thin film chip resistor
products with the advantages of chip resistor arrays. A small
package enables the design of high density circuits in
combination with reduction of assembly costs. Four equal
resistor values or two pairs are available.
FEATURES
• Advanced thin film technology
• Two pairs or four equal resistor values
• TCR down to ± 25 ppm/K
• Tolerance down to ± 0.5 %
• Pure Sn termination on Ni barrier layer
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Voltage divider
• Feedback circuits
• Signal conditioning
Notes
(1) Resistance values to be selected from E24; E192.
(2) For specified TCR tracking, tolerance matching and even tighter absolute tolerance and TCR please refer to data sheet ACAS 0612 -
Precision available on our web site at www.vishay.com/doc?28751.
TECHNICAL SPECIFICATIONS
DESCRIPTION ACAS 0612
EIA size 0612
Metric size RR1632M
Configuration, isolated 4 x 0603
Design:
All equal AE
Two pairs TP
Resistance values 47 to 221 k (1)
Absolute tolerance (2) ±1 %; ± 0.5 %
Absolute temperature coefficient (2) ± 50 ppm/K; ± 25 ppm/K
Max. resistance ratio Rmin./Rmax. 1:10
Rated dissipation: P70
Element 0.1 W
Package, 4 x 0603 0.3 W
Operating voltage 75 V
Permissibe film temperature 125 °C
Operating temperature range - 55 °C to 125 °C
Insulation voltage (Uins) against ambient and between isolated
resistors, continuous 75 V
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APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow
support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is
not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits.
CIRCUITS
Notes
• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION.
(1) R1 = R4 R2 = R3.
(2) Please refer to the table TEMPERATURE COEFFICIENT AND RESISTANCE RANGE, see next page.
(3) Please refer to the table PACKAGING, see next page.
DESIGN
ACAS 0612
AE R1 = R2 = R3 = R4
TP R1 = R4 < R2 = R3
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: ACASA110012200P500
MODEL/
SIZE TERMINAL SIZE RESISTANCE (1) ACCURACY
GRADE (2) RESISTANCE (1) PACKAGING SPECIAL
ACA S = Convex
square
A = 0612 3 digit
resistance
value R1, R4
1 digit
multiplier
MULTIPLIER
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
TCR and
tolerance
1
2
3
3 digit
resistance
value R2, R3
1 digit multiplier
MULTIPLIER
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
P1
P5
00 = Standard
Product Description: ACAS 0612 110R 1 220R P5
ACA S 0612 110R 1 220R P5
MODEL/SIZE TERMINATION SIZE RESISTANCE
R1, R4 (1)
ACCURACY
GRADE (2)
RESISTANCE
R2, R3 (1) PACKAGING
ACA = Chip
Array
S = Convex
square
0612 110R = 110
1K1 = 1.1 k
22K1 = 22.1 k
TCR and
tolerance
1
2
3
220R = 220
1K1 = 1.1 k
22K1 = 22.1 k
P1
P5
1
R
2
R
3
R
4
R
ACAS 0612
SA11001 2 0C AA 20 50P0
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Revision: 13-Dec-12 3Document Number: 28754
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DIMENSIONS
PATTERN STYLES FOR CHIP RESISTOR ARRAY
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE ACCURACY
GRADE
ABSOLUTE RELATIVE RESISTANCE
VALUE
TCR TOLERANCE TCR TOLERANCE
ACAS 0612
1 ± 25 ppm/K ± 0.5 % - - 47 to 221 k
2 ± 50 ppm/K ± 0.5 % - - 47 to 221 k
3 ± 50 ppm/K ± 1 % - - 47 to 221 k
PACKAGING
TYPE CODE QUANTITY PACKAGING
STYLE WIDTH PITCH REEL DIAMETER
ACAS 0612
P1 1000 Tape and reel
cardboard tape
acc. IEC 60286-3
Type I
8 mm 4 mm 180 mm/7"
P5 5000
DIMENSIONS - Chip resistor array, mass and relevant physical dimensions
TYPE L
(mm)
W
(mm)
H
(mm)
P
(mm)
A1
(mm)
A
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
ACAS 0612 1.5 ± 0.15 3.2 ± 0.15 0.45 ± 0.1 0.8 ± 0.1 0.6 ± 0.1 0.4 ± 0.1 0.3 ± 0.15 0.4 ± 0.15 6.6
RECOMMENDED SOLDER PAD DIMENSIONS FOR CHIP RESISTOR ARRAYS
TYPE G
(mm)
Y
(mm)
X
(mm)
U
(mm)
Z
(mm)
I
(mm)
P
(mm)
ACAS 0612 0.7 0.7 0.64 0.5 2.1 0.3 0.8
T2
H
A1A
A
T1
W
L
0.1
Z
G
Y
UI X
ACAS 0612
Dimensions in mm
limits for solder resist
P
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DESCRIPTION
The production of the components is strictly controlled and
follows an extensive set of instructions established for
reproducibility. A homogeneous film of metal alloy is
deposited on a high grade (Al2O3) ceramic substrate using a
mask to separate the adjacent resistors and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are realized on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics.
The resistor elements are covered by a protective coating
designed for electrical, mechanical and climatic protection.
The terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with IEC 60286-3 (3).
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using reflow or vapour phase as shown in
IEC 61760-1 (3). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, if applied, shall be
qualified by appropriate means to ensure the long-term
stability of the whole system. The resistors are RoHS
compliant; the pure tin plating provides compatibility with
lead (Pb)-free and lead-containing soldering processes. The
permitted storage time is 20 years, whereas the solderability
is specified for 2 years after production or requalification.
The immunity of the plating against tin whisker growth has
been proven under extensive testing.
All products comply with the GADSL (1) and the
CEFIC-EECA-EICTA (2) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and Annex
II (ELV II)
• 2011/65/EC Restriction of the use of Hazardous
Substances directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
TESTS
Where applicable, the resistors are tested in accordance
with EN 140401-801 which refers to EN 60115-1 and
EN 140400.
Notes
(1) Global Automotive Declarable Substance List, see www.gadsl.org.
(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org policy
environmental policy group chemicals jig Joint Industry Guide (JIG-101 Ed 2.0).
(3) The quoted IEC standards are also released as EN standards with the same number and identical contents.
ACAS 0612 - Professional
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FUNCTIONAL PERFORMANCE
100- 55
Ambient Temperature in °C
155
0
Rated Power in %
050
70
20
40
60
80
100
125 180
Derating
10K10
Resistance Value R
100K
10
100
10K
Test Voltage
100 1K Ω
V
1K
10M1M
Pulse load rating for arrays with equal values, design type AE, in accordance with
EN 60115-1 clause 4.27; 1.2 µs/50 µs; 5 pulses at 12 s interval; for permissible resistance change (0.5 % R + 0.05 Ω)
1.2/50 Pulse
10K10
Resistance Value R
100K
10
100
10K
Test Voltage
100 1K Ω
V
1K
10M1M
Pulse load rating rating for arrays with equal values, design type AE in accordance with
EN 60115-1 clause 4.27; 10 µs/700 µs; 10 pulses at 1 min intervals; for permissible resistance change (0.5 % R + 0.05 Ω)
10/700 Pulse
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TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-801, detail specification
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068 (1)
and under standard atmospheric conditions according to
IEC 60068-1 (1), 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid (LCT = - 55 °C/UCT = 125 °C).
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
The requirements stated in the “Test Procedures and
Requirements” table are based on the required tests and
permitted limits of EN 140401-801 where applicable.
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) Figures are given for arrays with equal values, design type AE.
(3) For a single element.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (2)
(R)
Stability for product types:
ACAS 0612 47 to 221 k
4.5 - Resistance - ± 1 %; ± 0.5 %
4.8.4.2 - Temperature coefficient At (20/- 55/20) °C and
(20/125/20) °C ± 50 ppm/K; ± 25 ppm/K
4.25.1 - Endurance
U= or U = Umax.;
1.5 h on; 0.5 h off;
whichever is the less severe;
70 °C; 1000 h
± (0.25 % R+ 0.05)
4.25.3 - Endurance at upper
category temperature 125 °C; 1000 h ± (0.25 % R+ 0.05)
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.5 % R+ 0.05)
4.13 - Short time overload (3) U= 2.5 x or
U = 2 x Umax.; 5 s
± (0.1 % R+ 0.01)
no visible damage
4.19 14 (Na) Rapid change of
temperature
30 min at - 55 °C and
30 min at 125 °C;
5cycles
± (0.1 % R+ 0.01)
no visible damage
4.18.2 58 (Td) Resistance to soldering
heat
Reflow method 2
(IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s
± (0.25 % R+ 0.01)
no visible damage
4.17.2 58 (Td) Solderability
Solder bath method;
SnPb; non-activated flux
accelerated ageing 4 h/155 °C
(215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAgCu; non-activated flux
accelerated ageing 4 h/155 °C
(235 ± 3) °C; (2 ± 0.2) s
4.32 21 (Ue3) Shear (adhesion) 45 N No visible damage
4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times
± (0.1 % R+ 0.01)
no visible damage;
no open circuit in bent position
4.7 - Voltage proof
URMS = Uins
(60 ± 5) s; against ambient,
between adjacent resistors
No flashover or breakdown
P70 x R
P70 x R
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