LMH0002 www.ti.com SNLS215E - JANUARY 2006 - REVISED APRIL 2013 LMH0002 SMPTE 292M / 259M Serial Digital Cable Driver Check for Samples: LMH0002 FEATURES APPLICATIONS * * 1 2 * * * * * * * * * * * SMPTE 292M, SMPTE 344M and SMPTE 259M Compliant Supports DVB-ASI at 270 Mbps Data Rates to 1.485 Gbps Differential Input 75 Differential Output Selectable Slew Rate Adjustable Output Amplitude Single 3.3V Supply Operation Operating Temperature Range: Commercial 0C to +70C (LMH0002MA) or Industrial -40C to +85C (LMH0002TMA and LMH0002SQ) Typical Power Consumption: 125 mW in SD Mode and 149 mW in HD Mode 8-pin SOIC or 16-pin WQFN Package Replaces the GS1528, GS1528A, or GS1578A * * * * * * SMPTE 292M, SMPTE 344M, and SMPTE 259M Serial Digital Interfaces Sonet/SDH and ATM Interfaces Digital Routers and Switches Distribution Amplifiers Buffer Applications Set Top Boxes Security Cameras DESCRIPTION The LMH0002 SMPTE 292M / 259M serial digital cable driver is a monolithic, high-speed cable driver designed for use in SMPTE 292M / 259M serial digital video and ITU-T G.703 serial digital data transmission applications. The LMH0002 drives 75 transmission lines (Belden 8281, Belden 1694A or equivalent) at data rates up to 1.485 Gbps. The LMH0002 provides two selectable slew rates for SMPTE 259M and SMPTE 292M compliance. The output voltage swing is adjustable via a single external resistor. The LMH0002 is powered from a single 3.3V supply. Power consumption is typically 125 mW in SD mode and 149 mW in HD mode. The LMH0002 is available in an 8-pin SOIC or 16-pin WQFN package. Typical Application VCC 75: SD/HD VCC 75: 0.1 PF 5.6 nH 4.7 PF 1.0 PF SDI VCC SD/HD 50: LMH0002 RREF Differential Input 1.0 PF 50: 75: SDO SDO 75: 4.7 PF SDI VEE VCC 5.6 nH 0.1 PF 750: 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2013, Texas Instruments Incorporated LMH0002 SNLS215E - JANUARY 2006 - REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) -0.5V to 3.6V Supply Voltage: -0.3V to VCC+0.3V Input Voltage (all inputs) Output Current 28 mA -65C to +150C Storage Temperature Range Junction Temperature +150C Lead Temperature (Soldering 4 Sec) +260C Package Thermal Resistance JA 8-pin SOIC JA 16-pin WQFN JC 8-pin SOIC JC 16-pin WQFN +160C/W +78.9C/W +105C/W +42.7C/W ESD Rating (HBM) 5kV ESD Rating (MM) (1) 250V "Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values. The table of Electrical Characteristics specifies acceptable device operating conditions. Recommended Operating Conditions Supply Voltage (VCC - VEE): 3.3V 5% Operating Free Air Temperature (TA) LMH0002MA LMH0002TMA and LMH0002SQ 2 0C to +70C -40C to +85C Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LMH0002 LMH0002 www.ti.com SNLS215E - JANUARY 2006 - REVISED APRIL 2013 DC Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2). Symbol Parameter VCMIN Input Common Mode Voltage VSDI Input Voltage Swing Conditions Reference SDI, SDI Typ 1.6 + VSDI/2 Differential 100 VCMOUT Output Common Mode Voltage VSDO Min SDO, SDO Output Voltage Swing SD/HD Input Voltage Max Units VCC - VSDI/2 V 2000 mVP-P VCC - VSDO V Single-ended, 75 load, RREF = 750 1% 750 800 850 mVP-P Single-ended, 75 load, RREF = 590 1% 900 1000 1100 mVP-P Min for SD SD/HD 2.4 V Max for HD SD/HD Input Current ICC (1) (2) (3) 0.8 V 3.7 Supply Current A SD/HD = 0 (3) 45 49 mA SD/HD = 1 (3) 38 43 mA Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to VEE = 0 Volts. Typical values are stated for VCC = +3.3V and TA = +25C. Maximum ICC is measured at VCC = +3.465V and TA = +70C. AC Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1). Symbol Parameter Conditions DRSDI Input Data Rate . tjit Additive Jitter 1.485 Gbps tr,tf Output Rise Time, Fall Time Reference (2) SDO, SDO Typ Max Units 1485 Mbps 26 psP-P 270 Mbps 18 SD/HD = 0, 20% - 80%, (3) 120 220 ps 560 800 ps SD/HD = 1, 20% - 80% 400 (2) psP-P Mismatch in Rise/Fall Time . 30 ps Duty Cycle Distortion SD/HD = 0, (2) 30 ps SD/HD = 1, (2) 100 ps tOS Output Overshoot . (2) RLSDO Output Return Loss . (4) (1) (2) (3) (4) Min SDI, SDI 8 15 20 % dB Typical values are stated for VCC = +3.3V and TA = +25C. Specification is ensured by characterization. Specification is ensured by characterization and verified by test. Output return loss is dependent on board design. The LMH0002 meets this specification on the SD002 evaluation board from 5MHz to 1.5GHz. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LMH0002 3 LMH0002 SNLS215E - JANUARY 2006 - REVISED APRIL 2013 www.ti.com 1 2 3 4 SDI SDI VEE RREF LMH002MA CONNECTION DIAGRAM SDO SDO SD/HD VCC 8 7 6 5 VEE 3 RREF 4 NC NC NC 13 LMH0002SQ (top view) 5 6 7 8 NC 2 14 NC SDI 15 NC 1 16 NC SDI NC Figure 1. 8-Pin SOIC See D Package 12 SDO 11 SDO 10 SD/HD 9 VCC Figure 2. 16-Pin WQFN See RUM0016A Package Table 1. PIN DESCRIPTIONS SOIC Pin # WQFN Pin # 1 1 SDI Serial data true input. 2 2 SDI Serial data complement input. 3 3 VEE Negative power supply (ground). 4 4 RREF Output driver level control. Connect a resistor to VCC to set output voltage swing. 5 9 VCC Positive power supply (+3.3V). 6 10 SD/HD Output slew rate control. Output rise/fall time complies with SMPTE 292M when low and SMPTE 259M when high. 7 11 SDO Serial data complement output. 8 12 SDO Serial data true output. -- -- 4 Name 5, 6, 7, 8, NC 13, 14, 15, 16 DAP VEE Description No connect. Connect exposed DAP to negative power supply (ground). Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LMH0002 LMH0002 www.ti.com SNLS215E - JANUARY 2006 - REVISED APRIL 2013 APPLICATION INFORMATION Device Operation INPUT INTERFACING The LMH0002 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple AC or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. SDI and SDI are selfbiased at approximately 2.1V with VCC = 3.3V. Figure 3 shows the differential input stage for SDI and SDI. VCC SDI SDI VCC 5 k: 10 k: 80: 10 k: 10 k: Figure 3. Differential Input Stage for SDI and SDI. OUTPUT INTERFACING The LMH0002 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75 AC-coupled coaxial cable (with RREF = 750). Output level is controlled by the value of the RREF resistor connected between the RREF pin and VCC. The RREF resistor should be placed as close as possible to the RREF pin. In addition, the copper in the plane layers below the RREF network should be removed to minimize parasitic capacitance. OUTPUT SLEW RATE CONTROL The LMH0002 output rise and fall times are selectable for either SMPTE 259M or SMPTE 292M compliance via the SD/HD pin. For slower rise and fall times, or SMPTE 259M compliance, SD/HD is set high. For faster rise and fall times, or SMPTE 292M compliance, SD/HD is set low. REPLACING THE GENNUM GS1528, GS1528A, and GS1578A The LMH0002MA is form-fit-function compatible with the Gennum GS1528 and GS1528A. The LMH0002SQ is form-fit-function compatible with the Gennum GS1578A. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LMH0002 5 LMH0002 SNLS215E - JANUARY 2006 - REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E * 6 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LMH0002 PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LMH0002MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L002 LMH0002MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L002 LMH0002SQ/NOPB ACTIVE WQFN RUM 16 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM L002 LMH0002SQ/S250 ACTIVE WQFN RUM 16 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM L002 LMH0002SQE/NOPB ACTIVE WQFN RUM 16 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM L002 LMH0002SQX/NOPB ACTIVE WQFN RUM 16 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM L002 LMH0002TMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L002T LMH0002TMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L002T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMH0002MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH0002SQ/NOPB WQFN RUM 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002SQ/S250 WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002SQE/NOPB WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002SQX/NOPB WQFN RUM 16 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002TMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH0002MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH0002SQ/NOPB WQFN RUM 16 1000 210.0 185.0 35.0 LMH0002SQ/S250 WQFN RUM 16 250 210.0 185.0 35.0 LMH0002SQE/NOPB WQFN RUM 16 250 210.0 185.0 35.0 LMH0002SQX/NOPB WQFN RUM 16 4500 367.0 367.0 35.0 LMH0002TMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA RUM0016A SQB16A (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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