UMBER
GS-12-675 TYPE PRODUCT SPECIFICATION
TITLE PAGE REVISION
1.25 mm pitch SMT Wire to Board Connector
1 of 7 A
AUTHORIZED BY DATE
Jason Hsu 11/9/10
CLASSIFICATION
UNRESTRICTED
Copyright FCI.
Form E-3701 – Revision B
GS-01-029 – Revision A
1.0 SCOPE
This specification covers performance, tests and quality requirements for 1.25 mm pitch Wire to Board
DIP & SMT Type of 10114826~10114831 Series.
2.0 REFERENCE DOCUMENTS
EIA-364 ELECTRONICS INDUSTRIES ASSOCIATION
3.0 DEFINITIONS
3.1 Design and Construction
Product shall be of design, construction and physical dimensions specified on applicable
product drawing.
All materials conform to RoHS
3.2 Materials and Finish
3.2.1 Contact: Copper alloy
Finish: (a) Contact Area: Based on drawing specification.
(b) Under plate: Nickel-plated all over.
(c) Solder area: Based on drawing specification.
3.2.2 Housing: Thermoplastic or Thermoplastic High Temp., UL94V-0 and meet IEC 60695-2
glowing/hot wire test.
3.2.3 M.H.D: Copper Alloy, Plating based on drawing specification.
3.3 Ratings
3.3.1 Voltage: 125 Volts AC (per pin)
3.3.2 Current: 1 Amp (0.8 A --32 AWG)
4.0 REQUIREMENTS
4.1 Test Requirements and Procedures Summary
Item Requirement Standard
Examination of Product
Product shall meet requirements
of applicable product drawing
and specification.
Visual, dimensional and functional
per applicable quality inspection
plan.
ELECTRICAL
Item Requirement Standard
Low-signal Level
Contact Resistance
20 m Ω Max.(initial)per contact
40 m Ω Max. after test
Mate connectors, measure by dry
circuit, 20mV Max., 100mA
Max. (EIA-364-23)
PDS: Rev :A STATUS:Released Printed: Apr 05, 2012
UMBER
GS-12-675 TYPE PRODUCT SPECIFICATION
TITLE PAGE REVISION
1.25 mm pitch SMT Wire to Board Connector
2 of 7 A
AUTHORIZED BY DATE
Jason Hsu 11/9/10
CLASSIFICATION
UNRESTRICTED
Copyright FCI.
Form E-3701 – Revision B
GS-01-029 – Revision A
Insulation Resistance 100 M Ω Min.
Unmated connectors, apply
500 V DC between adjacent terminals.
(EIA-364-21)
Dielectric
Withstanding Voltage
500 VAC Min. at sea level
for 1 minute.
No discharge, flashover or
breakdown.
Current leakage: 1 mA max.
Test between adjacent contacts of
unmated connectors.
(EIA-364-20)
MECHANICAL
Item Requirement Standard
Durability 30 cycles.
The sample should be mounted in the
tester and fully mated and unmated the
number of cycles specified at the rate of
25.4 ± 3mm/min.
(EIA-364-09)
Insertion/Withdrawal Force See Section 7.
Operation Speed：
25.4 ± 3 mm/minute..
Measure the force required to
mate/Unmate connector.
(EIA-364-13)
Contact
Retention Force 0.5kgf MIN.
A
pply axial pull out force at the speed rate
of 25.4 ± 3 mm/minute. On the terminal
assembled in the housing.
Hold down /Housing
Retention Force 1.0kgf MIN.
A
pply axial pull out force at the speed rate
of 25.4 ± 3 mm/minute. On the hold down
assembled in the housing.
Wire
Retention Force 0.5kgf MIN.
A
pply axial pull out force at the speed rate
of 25.4 ± 3 mm/minute. On the terminal
assembled in the housing.
Terminal / Housing
Retention Force 0.5kgf MIN.
A
pply axial pull out force at the speed rate
of 25.4 ± 3 mm/minute. On the terminal
assembled in the housing.
PDS: Rev :A STATUS:Released Printed: Apr 05, 2012
UMBER
GS-12-675 TYPE PRODUCT SPECIFICATION
TITLE PAGE REVISION
1.25 mm pitch SMT Wire to Board Connector
3 of 7 A
AUTHORIZED BY DATE
Jason Hsu 11/9/10
CLASSIFICATION
UNRESTRICTED
Copyright FCI.
Form E-3701 – Revision B
GS-01-029 – Revision A
Vibration 1 µs Max.
The electrical load condition shall be 100
mA maximum for all contacts. Subject to
a simple harmonic motion having
amplitude of 0.76mm (1.52mm maximum
total excursion) in frequency between
the limits of 10 and 55 Hz. The entire
frequency range, from 10 to 55 Hz and
return to 10 Hz, shall be traversed in
approximately 1 minute. This motion
shall be applied for 2 hours in each of
three mutually perpendicular directions.
(EIA-364-28 Condition I)
Shock (Mechanical) 1 µs Max.
Subject mated connectors to
50 G’s (peak value) half-sine shock
pulses of 11 milliseconds duration.
Three shocks in each direction shall be
applied along the three mutually
perpendicular axes of the test specimen
(18 shocks). The electrical load
condition shall be 100mA maximum for
all contacts.
(EIA-364-27, test condition A)
ENVIRONMENTAL
Item Requirement Standard
Resistance to Reflow
Soldering Heat
See Product Qualification and
Test Sequence Group 9 (Lead
Free)
Pre Heat：150℃~180℃, 60~90sec.
Heat：230℃ Min., 40sec Min.
Peak Temp.：260℃Max, 10sec Max.
Resistance to Hand
Soldering Heat
Excessive pressure shall not
be applied to the terminals.
See Product Qualification and
Test Sequence Group 10
Soldering iron：350±10℃
Duration：3~4 sec. at least
Thermal Shock See Product Qualification and
Test Sequence Group 3
Mate module and subject to follow
condition for 5 cycles.
1 cycles:
-40 +0/-3 , 30 minutes
+85 +3/-0 , 30 minutes
(EIA-364-32, test condition A)
Humidity See Product Qualification and
Test Sequence Group 3
Mated Connector
40℃, 90~95% RH, 96 hours
(EIA-364-31, test condition A)
PDS: Rev :A STATUS:Released Printed: Apr 05, 2012
UMBER
GS-12-675 TYPE PRODUCT SPECIFICATION
TITLE PAGE REVISION
1.25 mm pitch SMT Wire to Board Connector
4 of 7 A
AUTHORIZED BY DATE
Jason Hsu 11/9/10
CLASSIFICATION
UNRESTRICTED
Copyright FCI.
Form E-3701 – Revision B
GS-01-029 – Revision A
Temperature life See Product Qualification and
Test Sequence Group 4
Subject mated connectors to
temperature life at 105 for 96 hours.
Measure Signal.
(EIA-364-17, Test condition A)
Salt Spray See Product Qualification and
Test Sequence Group 5
Subject mated/unmated connectors to
5% salt-solution concentration, 35 for
48 hours.
(EIA-364-26, Test condition B)
Solder ability
Solder able area shall have
minimum of 95% solder
coverage.
And then into solder bath, Temperature
at 245 ±5, for 4-5 sec.
Note. Flowing Mixed Gas shell be conduct by customer request.
5.0 INFRARED REFLOW CONDITION
5.1 Lead-Free Process
PDS: Rev :A STATUS:Released Printed: Apr 05, 2012
UMBER
GS-12-675 TYPE PRODUCT SPECIFICATION
TITLE PAGE REVISION
1.25 mm pitch SMT Wire to Board Connector
5 of 7 A
AUTHORIZED BY DATE
Jason Hsu 11/9/10
CLASSIFICATION
UNRESTRICTED
Copyright FCI.
Form E-3701 – Revision B
GS-01-029 – Revision A
6.0 PRODUCT QUALIFICATION AND TEST SEQUENCES
Test or Examination
Test Group
1 2 3 4 5 6 7 8 9 10
Test Sequence
Examination of Product 1、71、61、4 1 1
Low-signal Level Contact Resistance 1、51、42、10 2、92、5 3
Insulation Resistance 3、93、8
Dielectric Withstanding Voltage 4、84、7
Insertion / Withdrawal Force 2、4
Durability 3
Contact Retention Force (Wafer) 1
Vibration(Random) / Vibration 2
Shock (Mechanical) 3
Thermal Shock 5
Humidity 6
Temperature life 5
Salt Spray 3
Solder ability 1
Wire Retention Force 1
Terminal / Housing Retention Force 2
Metal Hold-Down
/
Housing Retention
Force 2
Resistance to Reflow Soldering Heat 2
Resistance to Hand Soldering Heat 2
Sample Size 4 4 4 4 4 2 4 4 4 4
PDS: Rev :A STATUS:Released Printed: Apr 05, 2012
UMBER
GS-12-675 TYPE PRODUCT SPECIFICATION
TITLE PAGE REVISION
1.25 mm pitch SMT Wire to Board Connector
6 of 7 A
AUTHORIZED BY DATE
Jason Hsu 11/9/10
CLASSIFICATION
UNRESTRICTED
Copyright FCI.
Form E-3701 – Revision B
GS-01-029 – Revision A
7.0 INSERTION / WITHDRAWAL FORCE
No of Insertion Force ( Kgf, Max ) Withdrawal Force (Kgf, Min )
CKT 1st 6th 30th 1st 6th 30th
2 2.00 1.80 1.60 0.28 0.23 0.18
3 2.50 2.30 2.10 0.30 0.25 0.20
4 3.00 2.80 2.60 0.33 0.28 0.23
5 3.50 3.30 3.10 0.38 0.33 0.28
6 4.00 3.80 3.60 0.43 0.38 0.33
7 4.50 4.30 4.10 0.48 0.43 0.38
8 5.00 4.80 4.60 0.53 0.48 0.43
9 5.50 5.30 5.10 0.56 0.51 0.46
10 6.00 5.80 5.60 0.59 0.54 0.49
11 6.50 6.30 6.10 0.62 0.57 0.52
12 7.00 6.80 6.60 0.65 0.60 0.55
13 7.50 7.30 7.10 0.68 0.63 0.58
14 8.00 7.80 7.60 0.71 0.66 0.61
15 8.50 8.30 8.10 0.74 0.69 0.64
PDS: Rev :A STATUS:Released Printed: Apr 05, 2012
UMBER
GS-12-675 TYPE PRODUCT SPECIFICATION
TITLE PAGE REVISION
1.25 mm pitch SMT Wire to Board Connector
7 of 7 A
AUTHORIZED BY DATE
Jason Hsu 11/9/10
CLASSIFICATION
UNRESTRICTED
Copyright FCI.
Form E-3701 – Revision B
GS-01-029 – Revision A
RECORD RETENTION
Revision Page Description ECR No. Date
A ALL New release T10-0090 11/09/2010
PDS: Rev :A STATUS:Released Printed: Apr 05, 2012
