SFH 4580
SFH 4585
GaAlAs-IR-Lumineszenzdioden (880 nm) in SMR® Gehäuse
GaAlAs Infrared Emitters (880 nm) in SMR® Package
Lead (Pb) Free Product - RoHS Compliant
SFH 4580 SFH 4585
2008-07-29 1
Wesentliche Merkmale
• GaAlAs-LED mit sehr hohem Wirkungsgrad
•SMR
® (Surface Mount Radial) Gehäuse
• Für Oberflächenmontage geeignet
• Gegurtet lieferbar
• Gehäusegleich mit Fotodiode SFH 2500/
SFH 2505
• Hohe Zuverlässigkeit
• Gute spektrale Anpassung an
Si-Fotoempfänger
• UL-Freigabe
Anwendungen
• IR-Fernsteuerung von Fernseh- und
Rundfunkgeräten, Videorecordern,
Lichtdimmern
• Gerätefernsteuerungen für Gleich- und
Wechsellichtbetrieb
• Sensorik
• Diskrete Lichtschranken
• Diskrete Optokoppler
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4580 Q65110A2632 ≥ 25 (typ. 55)
SFH 4585 Q65110A2631
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
Features
• Very highly efficient GaAlAs-LED
•SMR
® (Surface Mount Radial) package
• Suitable for surface mounting (SMT)
• Available on tape and reel
• Same package as photodiode SFH 2500/
SFH 2505
• High reliability
• Spectral match with silicon photodetectors
• UL-approval
Applications
• IR remote control of hi-fi and TV-sets, video
tape recorders, dimmers
• Remote control for steady and varying intensity
• Sensor technology
• Discrete interrupters
• Discrete optocouplers
2008-07-29 2
SFH 4580, SFH 4585
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage
VR5 V
Durchlassstrom
Forward current
IF100 mA
Stoßstrom, tp = 10 µs, D = 0
Surge current
IFSM 2.5 A
Verlustleistung
Power dissipation
Ptot 200 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 20 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 20 mm2 each
RthJA 375 K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak 880 nm
Spektrale Bandbreite bei 50% von Irel
Spectral bandwidth at 50% of Irel
IF = 100 m A
∆λ 80 nm
Abstrahlwinkel
Half angle
ϕ± 15 Grad
deg.
Aktive Chipfläche
Active chip area
A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.3 × 0.3 mm²
Abstand Chipoberfläche bis Linsenscheitel
Distance chip front to lens top
H3.9 … 4.5 mm
SFH 4580, SFH 4585
2008-07-29 3
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ie from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf0.6/0.5 µs
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co15 pF
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
VF
1.50 (≤ 1.8)
3.00 (≤ 3.8)
V
V
Sperrstrom
Reverse current
VR = 5 V
IR0.01 (≤ 1) µA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe25 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe,
IF = 100 mA
TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV– 2 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
TCλ0.25 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2008-07-29 4
SFH 4580, SFH 4585
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol Wert
Value
Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie typ
25
55
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ 500 mW/sr
SFH 4580, SFH 4585
2008-07-29 5
Relative Spectral Emission
Irel = f (λ)
Forward Current
IF = f (VF), single pulse, tp = 20 µs
Radiation Characteristics Irel = f (ϕ)
0
750
Ιrel
OHR00877
800 850 900 950 nm 1000
20
40
60
80
%
100
λ
10
OHR00881
F
V
-3
-2
10
-1
10
0
10
1
10
0123456V8
A
Ι
F
OHF00300
02040 60 80 100 1200.40.60.81.0
100
90
80
70
60
50
0
10203040
0
0.2
0.4
0.6
0.8
1.0
ϕ
Radiant Intensity
Single pulse, tp = 20 µs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
Ie
Ie 100 mA = f (IF)
10
OHR00878
Ιe
F
Ι
-3
-2
10
-1
10
0
10
1
10
2
10
0
10 10 110 210 4
mA
e
Ι
(100mA)
3
10
10
Ι
F
OHR00886
1
2
10
3
10
4
10
mA
-5
10 s
=D
F
Ι
T
DC
0.005=
D
p
t
T
t
p
p
t
0.5
0.2
0.1
0.01
0.02
0.05
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
Max. Permissible Forward Current
IF = f (TA)
OHF01534
0
I
F
T
0
25
50
75
100
125
mA
10 20 30 40 50 60 70 80 ˚C 100
2008-07-29 6
SFH 4580, SFH 4585
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
SFH 4580
GEOY6960
3.9 (0.154)
4.5 (0.177)
Cathode
7.1 (0.280)
7.7 (0.303)
2.54 (0.100)
spacing
13.1 (0.516)
14.7 (0.579)
5.5 (0.217)
7.5 (0.295)
1.95 (0.077)
2.05 (0.081)
R
((3.2) (0.126))
5.4 (0.213)
6.0 (0.236)
((3.2) (0.126))
2.7 (0.106)
2.4 (0.094)
4.4 (0.173)
4.8 (0.189)
((R2.8 (0.110))
(-0.004...0.008)
3.7 (0.146)
3.3 (0.130)
2.8 (0.110)
2.4 (0.094)
Chip position
3.9 (0.154)
4.5 (0.177)
-0.1...0.2
SFH 4585
GEOY6961
3.9 (0.154)
4.5 (0.177)
Cathode
7.1 (0.280)
7.7 (0.303)
2.54 (0.100)
spacing
14.7 (0.579)
15.5 (0.610)
7.4 (0.291)
8.0 (0.315) ((3.2) (0.126))
5.4 (0.213)
6.0 (0.236)
((3.2) (0.126))
2.7 (0.106)
2.4 (0.094)
4.4 (0.173)
4.8 (0.189)
((R2.8 (0.110))
R2.05 (0.081)
1.95 (0.077)
Chip position
3.9 (0.154)
4.5 (0.177)
(-0.006...0.006)
-0.15...0.15
SFH 4580, SFH 4585
2008-07-29 7
Empfohlenes Lötpaddesign Reflow Löten
Recommended Solder Pad Reflow Soldering
Maße in mm (inch) / Dimensions in mm (inch).
SFH 4580
OHFY2449
5.3 (0.209)
1.3 (0.051)
2.54 (0.100)
7 (0.276)
3 (0.118)
Lötpad
Cu-Fläche > 20 mm
Cu-area > 20 mm 2
2
Paddesign for
verbesserte Wärmeableitung
improved heat dissipation
Padgeometrie für
Lötstopplack
Solder resist
Bauteil positioniert
Component Location on Pad
SFH 4585
OHF02450
5.9 (0.232)
1.3 (0.051)
2.54 (0.100)
7 (0.276)
3 (0.118)
Cu-Fläche > 20 mm
Cu-area > 20 mm
2
Paddesign for
verbesserte Wärmeableitung
improved heat dissipation
Padgeometrie für
Lötstopplack
Solder resist
Component Location on Pad
Bauteil positioniert
Aussparung 4.85 (0.191)
5.2 (0.205)
Lötpad (1 (0.039))
1.5 (0.059)
2
±0.05 (0.002)
2008-07-29 8
SFH 4580, SFH 4585
Lötbedingungen Vorbehandlung nach JEDEC Level 3
Soldering Conditions Preconditioning acc. to JEDEC Level 3
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
min. condition for IR Reflow Soldering:
solder point temperature ≥ 235 °C for at least 10 sec.
