A42MX36-BG272IX79 - Microsemi Corp.

April 2009 i

v6.1

40MX and 42MX FPGA Families

Features

High Capacity

• Single-Chip ASIC Alternative

• 3,000 to 54,000 System Gates

• Up to 2.5 kbits Configurable Dual-Port SRAM

• Fast Wide-Decode Circuitry

• Up to 202 User-Programmable I/O Pins

High Performance

• 5.6 ns Clock-to-Out

• 250 MHz Performance

• 5 ns Dual-Port SRAM Access

• 100 MHz FIFOs

• 7.5 ns 35-Bit Address Decode

HiRel Features

• Commercial, Industrial, Automotive, and Military

Temperature Plastic Packages

• Commercial, Military Temperature, and MIL-STD-883

Ceramic Packages

• QML Certification

• Ceramic Devices Available to DSCC SMD

Ease of Integration

• Mixed-Voltage Operation (5.0V or 3.3V for core and

I/Os), with PCI-Compliant I/Os

• Up to 100% Resource Utilization and 100% Pin

Locking

• Deterministic, User-Controllable Timing

• Unique In-System Diagnostic and Verification

Capability with Silicon Explorer II

• Low Power Consumption

• IEEE Standard 1149.1 (JTAG) Boundary Scan Testing

Product Profile

Device A40MX02 A40MX04 A42MX09 A42MX16 A42MX24 A42MX36

Capacity

System Gates

SRAM Bits

3,000

–

6,000

–

14,000

–

24,000

–

36,000

–

54,000

2,560

Logic Modules

Sequential

Combinatorial

Decode

–

295

–

547

–

348

336

–

624

608

–

954

912

1,230

1,184

Clock-to-Out 9.5 ns 9.5 ns 5.6 ns 6.1 ns 6.1 ns 6.3 ns

SRAM Modules

(64x4 or 32x8) ––– – –10

Dedicated Flip-Flops – – 348 624 954 1,230

Maximum Flip-Flops 147 273 516 928 1,410 1,822

Clocks 112 2 26

User I/O (maximum) 57 69 104 140 176 202

PCI ––– –YesYes

Boundary Scan Test (BST) ––– –YesYes

Packages (by pin count)

PLCC

PQFP

VQFP

TQFP

CQFP

PBGA

44, 68

100

–

44, 68, 84

100

–

100, 160

100

176

–

100, 160, 208

100

176

–

160, 208

–

176

–

208, 240

–

208, 256

272

40MX and 42MX FPGA Families

ii v6.1

Ordering Information

Plastic Device Resources

Part Number

Speed Grade

Package Type

Package Lead Count

Blank = Commercial (0 to +70˚C)

I = Industrial (–40 to +85˚C)

M = Military (–55 to +125˚C)

B = MIL-STD-883

A = Automotive (–40 to +125˚C)

Application (Temperature Range)

PL = Plastic Leaded Chip Carrier

PQ = Plastic Quad Flat Pack

TQ = Thin (1.4 mm) Quad Flat Pack

VQ = Very Thin (1.0 mm) Quad Flat Pack

BG = Plastic Ball Grid Array

CQ = Ceramic Quad Flat Pack

Blank = Standard Speed

–1 = Approximately 15% Faster than Standard

–2 = Approximately 25% Faster than Standard

–3 = Approximately 35% Faster than Standard

–F = Approximately 40% Slower than Standard

A40MX02 = 3,000 System Gates

A40MX04 = 6,000 System Gates

A42MX09 = 14,000 System Gates

A42MX16 = 24,000 System Gates

A42MX24 = 36,000 System Gates

A42MX36 = 54,000 S

stem Gates

A42MX16 1PQ 100 ES

User I/Os

Device

PLCC

44-Pin

PLCC

68-Pin

PLCC

84-Pin

PQFP

100-Pin

PQFP

160-Pin

PQFP

208-Pin

PQFP

240-Pin

VQFP

80-Pin

VQFP

100-Pin

TQFP

176-Pin

PBGA

272-Pin

A40MX02 34 57 – 57 – – – 57 – – –

A40MX04 34 57 69 69 – – – 69 – – –

A42MX09 – – 72 83 101 – – – 83 104 –

A42MX16 – – 72 83 125 140 – – 83 140 –

A42MX24 – – 72 – 125 176 – – – 150 –

A42MX36–––––176202–––202

Note: Package Definitions

PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad Flat Pack,

PBGA = Plastic Ball Grid Array

40MX and 42MX FPGA Families

v6.1 iii

Ceramic Device Resources

Temperature Grade Offerings

Speed Grade Offerings

Contact your local Actel representative for device availability.

User I/Os

Device CQFP 208-Pin CQFP 256-Pin

A42MX36 176 202

Note: Package Definitions CQFP = Ceramic Quad Flat Pack

Package A40MX02 A40MX04 A42MX09 A42MX16 A42MX24 A42MX36

PLCC 44 C, I, M C, I, M

PLCC 68 C, I, A, M C, I, M

PLCC 84 C, I, A, M C, I, A, M C, I, M C, I, M

PQFP 100 C, I, A, M C, I, A, M C, I, A, M C, I, M

PQFP 160 C, I, A, M C, I, M C, I, A, M

PQFP 208 C, I, A, M C, I, A, M C, I, A, M

PQFP 240 C, I, A, M

VQFP 80 C, I, A, M C, I, A, M

VQFP 100 C, I, A, M C, I, A, M

TQFP 176 C, I, A, M C, I, A, M C, I, A, M

PBGA 272 C, I, M

CQFP 208 C, M, B

CQFP 256 C, M, B

Note:

C = Commercial

I = Industrial

A = Automotive

M = Military

B = MIL-STD-883 Class B

– F Std–1–2–3

C✓✓✓✓✓

I✓✓✓✓

A✓

M✓✓

B✓✓

Note: Refer to the 40MX and 42MX Automotive Family FPGAs datasheet for details on automotive-grade MX offerings.

v6.1 v

Table of Contents

40MX and 42MX FPGA Families

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

MX Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

Development Tool Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13

5.0V Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

5V TTL Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15

3.3V Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

3.3V LVTTL Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

Mixed 5.0V/3.3V Operating Conditions (for 42MX Devices Only) . . . . . . . . . . . . . 1-18

Mixed 5.0V/3.3V Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18

Output Drive Characteristics for 5.0V PCI Signaling . . . . . . . . . . . . . . . . . . . . . . . . 1-19

Output Drive Characteristics for 3.3V PCI Signaling . . . . . . . . . . . . . . . . . . . . . . . . 1-20

Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22

Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22

Timing Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23

Parameter Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-25

Sequential Module Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-26

Sequential Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27

Decode Module Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28

SRAM Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28

Dual-Port SRAM Timing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28

Predictable Performance: Tight Delay Distributions . . . . . . . . . . . . . . . . . . . . . . . 1-30

Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-30

Temperature and Voltage Derating Factors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-31

PCI System Timing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-35

PCI Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-35

Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-36

Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-77

Package Pin Assignments

44-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

68-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

84-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

vi v6.1

40MX and 42MX FPGA Families

100-Pin PQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

160-Pin PQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

208-Pin PQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

240-Pin PQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17

80-Pin VQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

100-Pin VQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22

176-Pin TQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24

208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28

256-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-31

272-Pin BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-34

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

40MX and 42MX FPGA Families

v6.1 1-1

40MX and 42MX FPGA Families

General Description

Actel's 40MX and 42MX families offer a cost-effective

design solution at 5V. The MX devices are single-chip

solutions and provide high performance while

shortening the system design and development cycle.

MX devices can integrate and consolidate logic

implemented in multiple PALs, CPLDs, and FPGAs.

Example applications include high-speed controllers and

address decoding, peripheral bus interfaces, DSP, and co-

processor functions.

The MX device architecture is based on Actel’s patented

antifuse technology implemented in a 0.45µm triple-

metal CMOS process. With capacities ranging from 3,000

to 54,000 system gates, the MX devices provide

performance up to 250 MHz, are live on power-up and

have one-fifth the standby power consumption of

comparable FPGAs. Actel’s MX FPGAs provide up to 202

user I/Os and are available in a wide variety of packages

and speed grades.

Actel’s A42MX24 and A42MX36 devices also feature

MultiPlex I/Os, which support mixed-voltage systems,

enable programmable PCI, deliver high-performance

operation at both 5.0V and 3.3V, and provide a low-

power mode. The devices are fully compliant with the

PCI Local Bus Specification (version 2.1). They deliver

200 MHz on-chip operation and 6.1 ns clock-to-output

performance.

The 42MX24 and 42MX36 devices include system-level

features such as IEEE Standard 1149.1 (JTAG) Boundary

Scan Testing and fast wide-decode modules. In addition,

the A42MX36 device offers dual-port SRAM for

implementing fast FIFOs, LIFOs, and temporary data

storage. The storage elements can efficiently address

applications requiring wide datapath manipulation and

can perform transformation functions such as those

required for telecommunications, networking, and DSP.

All MX devices are fully tested over automotive and

military temperature ranges. In addition, the largest

member of the family, the A42MX36, is available in both

CQ208 and CQ256 ceramic packages screened to MIL-

STD-883 levels. For easy prototyping and conversion from

plastic to ceramic, the CQ208 and PQ208 devices are pin-

compatible.

MX Architectural Overview

The MX devices are composed of fine-grained building

blocks that enable fast, efficient logic designs. All devices

within these families are composed of logic modules, I/O

modules, routing resources and clock networks, which

are the building blocks for fast logic designs. In addition,

the A42MX36 device contains embedded dual-port

SRAM modules, which are optimized for high-speed

datapath functions such as FIFOs, LIFOs and scratchpad

memory. A42MX24 and A42MX36 also contain wide-

decode modules.

Logic Modules

The 40MX logic module is an eight-input, one-output

logic circuit designed to implement a wide range of logic

functions with efficient use of interconnect routing

resources (Figure 1-1).

The logic module can implement the four basic logic

functions (NAND, AND, OR and NOR) in gates of two,

three, or four inputs. The logic module can also

implement a variety of D-latches, exclusivity functions,

AND-ORs and OR-ANDs. No dedicated hard-wired latches

or flip-flops are required in the array; latches and flip-

flops can be constructed from logic modules whenever

required in the application.

Figure 1-1 • 40MX Logic Module

40MX and 42MX FPGA Families

1-2 v6.1

The 42MX devices contain three types of logic modules:

combinatorial (C-modules), sequential (S-modules) and

decode (D-modules). Figure 1-2 illustrates the

combinatorial logic module. The S-module, shown in

Figure 1-3, implements the same combinatorial logic

function as the C-module while adding a sequential

element. The sequential element can be configured as

either a D-flip-flop or a transparent latch. The S-module

combinatorial logic.

Figure 1-2 • 42MX C-Module Implementation

D00

D01

D10

D11

Figure 1-3 • 42MX S-Module Implementation

CLR

Up to 7-Input Function Plus D-Type Flip-Flop with Clear

Up to 4-Input Function Plus Latch with Clear

D1 S

YDQ

GATE

CLR

OUT

Up to 8-Input Function (Same as C-Module)

D00

D01

D10

D11

YOUT

Up to 7-Input Function Plus Latch

D00

D01

D10

D11

YOU

GATE

D00

D01

D10

D11

YDQ OUT

40MX and 42MX FPGA Families

v6.1 1-3

A42MX24 and A42MX36 devices contain D-modules,

which are arranged around the periphery of the device.

D-modules contain wide-decode circuitry, providing a

fast, wide-input AND function similar to that found in

CPLD architectures (Figure 1-4). The D-module allows

A42MX24 and A42MX36 devices to perform wide-

decode functions at speeds comparable to CPLDs and

PALs. The output of the D-module has a programmable

inverter for active HIGH or LOW assertion. The D-module

output is hardwired to an output pin, and can also be

fed back into the array to be incorporated into other

logic.

Dual-Port SRAM Modules

The A42MX36 device contains dual-port SRAM modules

that have been optimized for synchronous or

asynchronous applications. The SRAM modules are

arranged in 256-bit blocks that can be configured as 32x8

or 64x4. SRAM modules can be cascaded together to

form memory spaces of user-definable width and depth.

A block diagram of the A42MX36 dual-port SRAM block

is shown in Figure 1-5.

The A42MX36 SRAM modules are true dual-port

structures containing independent read and write ports.

Each SRAM module contains six bits of read and write

addressing (RDAD[5:0] and WRAD[5:0], respectively) for

64x4-bit blocks. When configured in byte mode, the

highest order address bits (RDAD5 and WRAD5) are not

used. The read and write ports of the SRAM block

contain independent clocks (RCLK and WCLK) with

programmable polarities offering active HIGH or LOW

implementation. The SRAM block contains eight data

inputs (WD[7:0]), and eight outputs (RD[7:0]), which are

connected to segmented vertical routing tracks.

The A42MX36 dual-port SRAM blocks provide an optimal

solution for high-speed buffered applications requiring

FIFO and LIFO queues. The ACTgen Macro Builder within

Actel's Designer software provides capability to quickly

design memory functions with the SRAM blocks. Unused

SRAM blocks can be used to implement registers for

other user logic within the design.

Figure 1-4 • A42MX24 and A42MX36 D-Module

Implementation

7 Inputs

Hard-Wire to I/O

Feedback to Array

Programmable

Inverter

Figure 1-5 • A42MX36 Dual-Port SRAM Block

SRAM Module

32 x 8 or 64 x 4

(256 Bits)

Read

Port

Logic

Write

Port

Logic

RD[7: 0]

Routing Tracks

Latches

Read

Logic

[5:0] RDAD[5:0]

REN

RCLK

Latches

WD[7: 0]

Latches

WRAD[5:0]

Write

Logic

MOD E

BLKEN

WEN

WCLK

[5:0]

[7:0]

40MX and 42MX FPGA Families

1-4 v6.1

Routing Structure

The MX architecture uses vertical and horizontal routing

tracks to interconnect the various logic and I/O modules.

These routing tracks are metal interconnects that may be

continuous or split into segments. Varying segment

lengths allow the interconnect of over 90% of design

tracks to occur with only two antifuse connections.

Segments can be joined together at the ends using

antifuses to increase their lengths up to the full length of

the track. All interconnects can be accomplished with a

maximum of four antifuses.

Horizontal Routing

Horizontal routing tracks span the whole row length or

are divided into multiple segments and are located in

between the rows of modules. Any segment that spans

more than one-third of the row length is considered a

long horizontal segment. A typical channel is shown in

Figure 1-6. Within horizontal routing, dedicated routing

tracks are used for global clock networks and for power

and ground tie-off tracks. Non-dedicated tracks are used

for signal nets.

Vertical Routing

Another set of routing tracks run vertically through the

module. There are three types of vertical tracks: input,

output, and long. Long tracks span the column length of

the module, and can be divided into multiple segments.

Each segment in an input track is dedicated to the input

of a particular module; each segment in an output track

is dedicated to the output of a particular module. Long

segments are uncommitted and can be assigned during

routing. Each output segment spans four channels (two

above and two below), except near the top and bottom

of the array, where edge effects occur. Long vertical

tracks contain either one or two segments. An example

of vertical routing tracks and segments is shown in

Figure 1-6.

Antifuse Structures

An antifuse is a "normally open" structure. The use of

antifuses to implement a programmable logic device

results in highly testable structures as well as efficient

programming algorithms. There are no pre-existing

connections; temporary connections can be made using

pass transistors. These temporary connections can isolate

individual antifuses to be programmed and individual

circuit structures to be tested, which can be done before

and after programming. For instance, all metal tracks can

be tested for continuity and shorts between adjacent

tracks, and the functionality of all logic modules can be

verified.

Clock Networks

The 40MX devices have one global clock distribution

network (CLK). A signal can be put on the CLK network

by being routed through the CLKBUF buffer.

In 42MX devices, there are two low-skew, high-fanout

clock distribution networks, referred to as CLKA and

CLKB. Each network has a clock module (CLKMOD) that

can select the source of the clock signal from any of the

following (Figure 1-7 on page 1-5):

• Externally from the CLKA pad, using CLKBUF

buffer

• Externally from the CLKB pad, using CLKBUF

buffer

• Internally from the CLKINTA input, using CLKINT

buffer

• Internally from the CLKINTB input, using CLKINT

buffer

The clock modules are located in the top row of I/O

modules. Clock drivers and a dedicated horizontal clock

track are located in each horizontal routing channel.

Clock input pads in both 40MX and 42MX devices can

also be used as normal I/Os, bypassing the clock

networks.

The A42MX36 device has four additional register control

resources, called quadrant clock networks (Figure 1-8 on

page 1-5). Each quadrant clock provides a local, high-

fanout resource to the contiguous logic modules within

its quadrant of the device. Quadrant clock signals can

originate from specific I/O pins or from the internal array

and can be used as a secondary register clock, register

clear, or output enable.

Figure 1-6 • MX Routing Structure

Segmented

Horizontal

Routing Logic

Modules

Antifuses

Vertical Routing Tracks

40MX and 42MX FPGA Families

v6.1 1-5

Figure 1-7 • Clock Networks of 42MX Devices

Note: *QCLK1IN, QCLK2IN, QCLK3IN, and QCLK4IN are internally-generated signals.

Figure 1-8 • Quadrant Clock Network of A42MX36 Devices

CLKB

CLKA

From

Pads

Clock

Drivers

CLKMOD

CLKINB

CLKINA

S1 Internal

Signal

CLKO(17)

CLKO(16)

CLKO(15)

CLKO(2)

CLKO(1)

Clock Tracks

Quad

Clock

Modul

QCLKA

QCLKB

*QCLK1IN

S0 S1

QCLK1

Quad

Clock

Modul

*QCLK2IN

S0 S1

QCLK2

Quad

Clock

Modul

QCLKC

QCLKD

*QCLK3IN

S0S1

QCLK3

Quad

Clock

Modul

*QCLK4IN

S0S1

QCLK4

40MX and 42MX FPGA Families

1-6 v6.1

MultiPlex I/O Modules

42MX devices feature Multiplex I/Os and support 5.0V,

3.3V, and mixed 3.3V/5.0V operations.

The MultiPlex I/O modules provide the interface between

the device pins and the logic array. Figure 1-9 is a block

diagram of the 42MX I/O module. A variety of user

functions, determined by a library macro selection, can

be implemented in the module. (Refer to the Antifuse

Macro Library Guide for more information.) All 42MX I/O

modules contain tristate buffers, with input and output

latches that can be configured for input, output, or

bidirectional operation.

All 42MX devices contain flexible I/O structures, where

each output pin has a dedicated output-enable control

(Figure 1-9). The I/O module can be used to latch input or

output data, or both, providing fast set-up time. In

addition, the Actel Designer software tools can build a D-

type flip-flop using a C-module combined with an I/O

module to register input and output signals. Refer to the

Antifuse Macro Library Guide for more details.

A42MX24 and A42MX36 devices also offer selectable PCI

output drives, enabling 100% compliance with version

2.1 of the PCI specification. For low-power systems, all

inputs and outputs are turned off to reduce current

consumption to below 500μA.

To achieve 5.0V or 3.3V PCI-compliant output drives on

A42MX24 and A42MX36 devices, a chip-wide PCI fuse is

programmed via the Device Selection Wizard in the

Designer software (Figure 1-10). When the PCI fuse is not

programmed, the output drive is standard.

Actel's Designer software development tools provide a

design library of I/O macro functions that can implement

all I/O configurations supported by the MX FPGAs.

Other Architectural Features

Performance

MX devices can operate with internal clock frequencies

of 250 MHz, enabling fast execution of complex logic

functions. MX devices are live on power-up and do not

require auxiliary configuration devices and thus are an

optimal platform to integrate the functionality

contained in multiple programmable logic devices. In

addition, designs that previously would have required a

gate array to meet performance can be integrated into

an MX device with improvements in cost and time-to-

market. Using timing-driven place-and-route (TDPR)

tools, designers can achieve highly deterministic device

performance.

User Security

The Actel FuseLock provides robust security against

design theft. Special security fuses are hidden in the

fabric of the device and prevent unauthorized users from

accessing the programming and/or probe interfaces. It is

virtually impossible to identify or bypass these fuses

without damaging the device, making Actel antifuse

FPGAs immune to both invasive and noninvasive attacks.

Special security fuses in 40MX devices include the Probe

Fuse and Program Fuse. The former disables the probing

circuitry while the latter prohibits further programming

of all fuses, including the Probe Fuse. In 42MX devices,

there is the Security Fuse which, when programmed,

both disables the probing circuitry and prohibits further

programming of the device.

Look for this symbol to ensure your valuable IP is secure.

For more information, refer to Actel's Implementation of

Security in Actel Antifuse FPGAs application note.

Note: *Can be configured as a Latch or D Flip-Flop (Using

C-Module)

Figure 1-9 • 42MX I/O Module

From Array

To Array

G/CLK*

PAD

Figure 1-10 • PCI Output Structure of A42MX24 and

A42MX36 Devices

Signal

PCI Enable

PCI

Fuse

Drive

STD

Output

40MX and 42MX FPGA Families

v6.1 1-7

Programming

Device programming is supported through the Silicon

Sculptor series of programmers. Silicon Sculptor II is a

compact, robust, single-site and multi-site device

programmer for the PC. With standalone software,

Silicon Sculptor II is designed to allow concurrent

programming of multiple units from the same PC.

Silicon Sculptor II programs devices independently to

achieve the fastest programming times possible. After

being programmed, each fuse is verified to insure that it

has been programmed correctly. Furthermore, at the end

of programming, there are integrity tests that are run to

ensure no extra fuses have been programmed. Not only

does it test fuses (both programmed and

nonprogrammed), Silicon Sculptor II also allows self-test

to verify its own hardware extensively.

The procedure for programming an MX device using

Silicon Sculptor II is as follows:

1. Load the .AFM file

2. Select the device to be programmed

3. Begin programming

When the design is ready to go to production, Actel

offers device volume-programming services either

through distribution partners or via In-House

Programming from the factory.

For more details on programming MX devices, please

refer to the Programming Antifuse Devices and the

Silicon Sculptor II user's guides.

Power Supply

MX devices are designed to operate in both 5.0V and

3.3V environments. In particular, 42MX devices can

operate in mixed 5.0V/3.3V systems. Table 1 describes the

voltage support of MX devices.

Power-Up/Down in Mixed-Voltage Mode

When powering up 42MX in mixed voltage mode

(VCCA =5.0V and V

CCI = 3.3V), VCCA must be greater than

or equal to VCCI throughout the power-up sequence. If

VCCI exceeds VCCA during power up, either the I/Os' input

protection junction on the I/Os will be forward-biased or

the I/Os will be at logical HIGH, and ICC rises to high

levels. For power-down, any sequence with VCCA and

VCCI can be implemented.

Low Power Mode

42MX devices have been designed with a Low Power

Mode. This feature, activated with setting the special LP

pin to HIGH for a period longer than 800 ns, is

particularly useful for battery-operated systems where

battery life is a primary concern. In this mode, the core of

the device is turned off and the device consumes minimal

power with low standby current. In addition, all input

buffers are turned off, and all outputs and bidirectional

buffers are tristated. Since the core of the device is

turned off, the states of the registers are lost. The device

must be re-initialized when exiting Low Power Mode. I/

Os can be driven during LP mode, and clock pins should

be driven HIGH or LOW and should not float to avoid

drawing current. To exit LP mode, the LP pin must be

pulled LOW for over 200 µs to allow for charge pumps to

power up, and device initialization will begin.

Figure 1-11 • Fuselock

™

Table 1 • Voltage Support of MX Devices

Device VCC VCCA VCCI Maximum Input Tolerance Nominal Output Voltage

40MX 5.0V – – 5.5V 5.0V

3.3V – – 3.6V 3.3V

42MX – 5.0V 5.0V 5.5V 5.0V

– 3.3V 3.3V 3.6V 3.3V

– 5.0V 3.3V 5.5V 3.3V

40MX and 42MX FPGA Families

1-8 v6.1

Power Dissipation

The general power consumption of MX devices is made

up of static and dynamic power and can be expressed

with the following equation:

General Power Equation

P = [ICCstandby + ICCactive] * VCCI + IOL* VOL* N

+ IOH * (VCCI – VOH) * M

where:

ICCstandby is the current flowing when no inputs or

outputs are changing.

ICCactive is the current flowing due to CMOS

switching.

IOL, IOH are TTL sink/source currents.

VOL, VOH are TTL level output voltages.

N equals the number of outputs driving TTL loads to

VOL.

M equals the number of outputs driving TTL loads to

VOH.

Accurate values for N and M are difficult to determine

because they depend on the family type, on design

details, and on the system I/O. The power can be divided

into two components: static and active.

Static Power Component

The static power due to standby current is typically a

small component of the overall power consumption.

Standby power is calculated for commercial, worst-case

conditions. The static power dissipation by TTL loads

depends on the number of outputs driving, and on the

DC load current. For instance, a 32-bit bus sinking 4mA at

0.33V will generate 42mW with all outputs driving LOW,

and 140mW with all outputs driving HIGH. The actual

dissipation will average somewhere in between, as I/Os

switch states with time.

Active Power Component

Power dissipation in CMOS devices is usually dominated

by the dynamic power dissipation. Dynamic power

consumption is frequency-dependent and is a function of

the logic and the external I/O. Active power dissipation

results from charging internal chip capacitances of the

interconnect, unprogrammed antifuses, module inputs,

and module outputs, plus external capacitances due to

PC board traces and load device inputs. An additional

component of the active power dissipation is the totem

pole current in the CMOS transistor pairs. The net effect

can be associated with an equivalent capacitance that

can be combined with frequency and voltage to

represent active power dissipation.

The power dissipated by a CMOS circuit can be expressed

by the equation:

Power (µW) = CEQ * VCCA2 * F(1)

where:

CEQ =Equivalent capacitance expressed in picofarads (pF)

VCCA =Power supply in volts (V)

F =Switching frequency in megahertz (MHz)

Equivalent Capacitance

Equivalent capacitance is calculated by measuring

ICCactive at a specified frequency and voltage for each

circuit component of interest. Measurements have been

made over a range of frequencies at a fixed value of VCC.

Equivalent capacitance is frequency-independent, so the

results can be used over a wide range of operating

conditions. Equivalent capacitance values are shown

below.

CEQ Values for Actel MX FPGAs

Modules (CEQM)3.5

Input Buffers (CEQI)6.9

Output Buffers (CEQO)18.2

Routed Array Clock Buffer Loads (CEQCR)1.4

To calculate the active power dissipated from the

complete design, the switching frequency of each part of

the logic must be known. The equation below shows a

piece-wise linear summation over all components.

Power = VCCA2 * [(m x CEQM * fm)Modules +

(n * CEQI * fn)Inputs + (p * (CEQO + CL) *

fp)outputs +

0.5 * (q1 * CEQCR * fq1)routed_Clk1 + (r1 *

fq1)routed_Clk1 +

0.5 * (q2 * CEQCR * fq2)routed_Clk2 + (r2 *

fq2)routed_Clk2 (2)

where:

m = Number of logic modules switching at

frequency fm

n = Number of input buffers switching at

frequency fn

p = Number of output buffers switching at

frequency fp

q1= Number of clock loads on the first routed array

clock

q2= Number of clock loads on the second routed

array clock

r1= Fixed capacitance due to first routed array

clock

r2= Fixed capacitance due to second routed array

clock

40MX and 42MX FPGA Families

v6.1 1-9

Fixed Capacitance Values for MX FPGAs (pF)

Test Circuitry and Silicon Explorer II Probe

MX devices contain probing circuitry that provides built-

in access to every node in a design, via the use of Silicon

Explorer II. Silicon Explorer II is an integrated hardware

and software solution that, in conjunction with the

Designer software, allow users to examine any of the

internal nets of the device while it is operating in a

prototyping or a production system. The user can probe

into an MX device without changing the placement and

routing of the design and without using any additional

resources. Silicon Explorer II's noninvasive method does

not alter timing or loading effects, thus shortening the

debug cycle and providing a true representation of the

device under actual functional situations.

Silicon Explorer II samples data at 100 MHz

(asynchronous) or 66 MHz (synchronous). Silicon Explorer

II attaches to a PC's standard COM port, turning the PC

into a fully functional 18-channel logic analyzer. Silicon

Explorer II allows designers to complete the design

verification process at their desks and reduces

verification time from several hours per cycle to a few

seconds.

Silicon Explorer II is used to control the MODE, DCLK, SDI

and SDO pins in MX devices to select the desired nets for

debugging. The user simply assigns the selected internal

nets in the Silicon Explorer II software to the PRA/PRB

output pins for observation. Probing functionality is

activated when the MODE pin is held HIGH.

Figure 1-12 illustrates the interconnection between

Silicon Explorer II and 40MX devices, while Figure 1-13

on page 1-10 illustrates the interconnection between

Silicon Explorer II and 42MX devices

To allow for probing capabilities, the security fuses must

not be programmed. (Refer to <zBlue>“User Security”

section on page 6 for the security fuses of 40MX and

42MX devices). Table 2 on page 1-10 summarizes the

possible device configurations for probing.

PRA and PRB pins are dual-purpose pins. When the

"Reserve Probe Pin" is checked in the

Designer software, PRA and PRB pins are reserved as

dedicated outputs for probing. If PRA and PRB pins are

required as user I/Os to achieve successful layout and

"Reserve Probe Pin" is checked, the layout tool will

override the option and place user I/Os on PRA and PRB

pins.

CEQM = Equivalent capacitance of logic modules in pF

CEQI = Equivalent capacitance of input buffers in pF

CEQO = Equivalent capacitance of output buffers in pF

CEQCR = Equivalent capacitance of routed array clock in

CL= Output load capacitance in pF

fm= Average logic module switching rate in MHz

fn= Average input buffer switching rate in MHz

fp= Average output buffer switching rate in MHz

fq1 = Average first routed array clock rate in MHz

fq2 = Average second routed array clock rate in MHz

Device Type

routed_Clk1

routed_Clk2

A40MX02 41.4 N/A

A40MX04 68.6 N/A

A42MX09 118 118

A42MX16 165 165

A42MX24 185 185

A42MX36 220 220

Figure 1-12 • Silicon Explorer II Setup with 40MX

40MX

Silicon

Explorer II

PRA

PRB

SDO

DCLK

SDI

MODE

Serial Connection

to Windows PC

16 Logic Analyzer Channels

40MX and 42MX FPGA Families

1-10 v6.1

Design Consideration

It is recommended to use a series 70Ω termination

resistor on every probe connector (SDI, SDO, MODE,

DCLK, PRA and PRB). The 70Ω series termination is used

to prevent data transmission corruption during probing

and reading back the checksum.

IEEE Standard 1149.1 Boundary Scan Test

(BST) Circuitry

42MX24 and 42MX36 devices are compatible with IEEE

Standard 1149.1 (informally known as Joint Testing

Action Group Standard or JTAG), which defines a set of

hardware architecture and mechanisms for cost-effective

board-level testing. The basic MX boundary-scan logic

circuit is composed of the TAP (test access port), TAP

controller, test data registers and instruction register

(Figure 1-14 on page 1-11). This circuit supports all

mandatory IEEE 1149.1 instructions (EXTEST, SAMPLE/

PRELOAD and BYPASS) and some optional instructions.

Table 3 on page 1-11 describes the ports that control

JTAG testing, while Table 4 on page 1-11 describes the

test instructions supported by these MX devices.

Each test section is accessed through the TAP, which has

four associated pins: TCK (test clock input), TDI and TDO

(test data input and output), and TMS (test mode

selector).

The TAP controller is a four-bit state machine. The '1's

and '0's represent the values that must be present at TMS

at a rising edge of TCK for the given state transition to

occur. IR and DR indicate that the instruction register or

the data register is operating in that state.

The TAP controller receives two control inputs (TMS and

TCK) and generates control and clock signals for the rest

of the test logic architecture. On power-up, the TAP

controller enters the Test-Logic-Reset state. To guarantee

a reset of the controller from any of the possible states,

TMS must remain high for five TCK cycles.

42MX24 and 42MX36 devices support three types of test

data registers: bypass, device identification, and

boundary scan. The bypass register is selected when no

other register needs to be accessed in a device. This

speeds up test data transfer to other devices in a test

data path. The 32-bit device identification register is a

shift register with four fields (lowest significant byte

(LSB), ID number, part number and version). The

boundary-scan register observes and controls the state of

each I/O pin.

Figure 1-13 • Silicon Explorer II Setup with 42MX

Table 2 • Device Configuration Options for Probe Capability

Security Fuse(s)

Programmed MODE PRA, PRB1SDI, SDO, DCLK1

No LOW User I/Os2User I/Os2

No HIGH Probe Circuit Outputs Probe Circuit Inputs

Yes – Probe Circuit Secured Probe Circuit Secured

Notes:

1. Avoid using SDI, SDO, DCLK, PRA and PRB pins as input or bidirectional ports. Since these pins are active during probing, input

signals will not pass through these pins and may cause contention.

2. If no user signal is assigned to these pins, they will behave as unused I/Os in this mode. See the <zBlue>“Pin Descriptions” section

on page 77 for information on unused I/O pins.

42MX

Silicon

Explorer II

PRA

PRB

SDO

DCLK

SDI

MODE

Serial Connection

to Windows PC

16 Logic Analyzer Channels

40MX and 42MX FPGA Families

v6.1 1-11

Each I/O cell has three boundary-scan register cells, each

with a serial-in, serial-out, parallel-in, and parallel-out

pin. The serial pins are used to serially connect all the

boundary-scan register cells in a device into a boundary-

scan register chain, which starts at the TDI pin and ends

at the TDO pin. The parallel ports are connected to the

internal core logic tile and the input, output and control

ports of an I/O buffer to capture and load data into the

Figure 1-14 • 42MX IEEE 1149.1 Boundary Scan Circuitry

Table 3 • Test Access Port Descriptions

Port Description

TMS (Test Mode

Select)

Serial input for the test logic control bits. Data is captured on the rising edge of the test logic clock (TCK).

TCK (Test Clock Input) Dedicated test logic clock used serially to shift test instruction, test data, and control inputs on the rising edge

of the clock, and serially to shift the output data on the falling edge of the clock. The maximum clock frequency

for TCK is 20 MHz.

TDI (Test Data Input) Serial input for instruction and test data. Data is captured on the rising edge of the test logic clock.

TDO (Test Data

Output)

Serial output for test instruction and data from the test logic. TDO is set to an Inactive Drive state (high

impedance) when data scanning is not in progress.

Table 4 • Supported BST Public Instructions

Instruction IR Code (IR2.IR0) Instruction Type Description

EXTEST 000 Mandatory Allows the external circuitry and board-level interconnections to

be tested by forcing a test pattern at the output pins and

capturing test results at the input pins.

SAMPLE/PRELOAD 001 Mandatory Allows a snapshot of the signals at the device pins to be

captured and examined during operation

HIGH Z 101 Optional Tristates all I/Os to allow external signals to drive pins. Please

refer to the IEEE Standard 1149.1 specification.

CLAMP 110 Optional Allows state of signals driven from component pins to be

determined from the Boundary-Scan Register. Please refer to

the IEEE Standard 1149.1 specification for details.

BYPASS 111 Mandatory Enables the bypass register between the TDI and TDO pins. The

test data passes through the selected device to adjacent devices

in the test chain.

Boundary Scan Register

Instruction

Decode

Control Logic

TAP Controller

Instruction

Bypass

TMS

TCK

TDI

Output

MUX TDO

JTAG

40MX and 42MX FPGA Families

1-12 v6.1

JTAG Mode Activation

The JTAG test logic circuit is activated in the Designer

software by selecting Tools -> Device Selection. This

brings up the Device Selection dialog box as shown in

Figure 1-15. The JTAG test logic circuit can be enabled by

clicking the "Reserve JTAG Pins" check box. Table 5

explains the pins' behavior in either mode.

TRST Pin and TAP Controller Reset

An active reset (TRST) pin is not supported; however, MX

devices contain power-on circuitry that resets the

boundary scan circuitry upon power-up. Also, the TMS

pin is equipped with an internal pull-up resistor. This

allows the TAP controller to remain in or return to the

Test-Logic-Reset state when there is no input or when a

logical 1 is on the TMS pin. To reset the controller, TMS

must be HIGH for at least five TCK cycles.

Boundary Scan Description Language

(BSDL) File

Conforming to the IEEE Standard 1149.1 requires that

the operation of the various JTAG components be

documented. The BSDL file provides the standard format

to describe the JTAG components that can be used by

automatic test equipment software. The file includes the

instructions that are supported, instruction bit pattern,

and the boundary-scan chain order. For an in-depth

discussion on BSDL files, please refer to Actel BSDL Files

Format Description application note.

Actel BSDL files are grouped into two categories -

generic and device-specific. The generic files assign all

user I/Os as inouts. Device-specific files assign user I/Os as

inputs, outputs or inouts.

Generic files for MX devices are available on Actel's website

at http://www.actel.com/techdocs/models/bsdl.html.

Figure 1-15 • Device Selection Wizard

Table 5 • Boundary Scan Pin Configuration and Functionality

Reserve JTAG Checked Unchecked

TCK BST input; must be terminated to logical HIGH or LOW to avoid floating User I/O

TDI, TMS BST input; may float or be tied to HIGH User I/O

TDO BST output; may float or be connected to TDI of another device User I/O

40MX and 42MX FPGA Families

v6.1 1-13

Development Tool Support

The MX family of FPGAs is fully supported by both Actel's

Libero™ Integrated Design Environment and Designer

FPGA Development software. Actel Libero IDE is a design

management environment that streamlines the design

flow. Libero IDE provides an integrated design manager

that seamlessly integrates design tools while guiding the

user through the design flow, managing all design and

log files, and passing necessary design data among tools.

Additionally, Libero IDE allows users to integrate both

schematic and HDL synthesis into a single flow and verify

the entire design in a single environment. Libero IDE

includes Synplify® for Actel from Synplicity®, ViewDraw

for Actel from Mentor Graphics, ModelSim™ HDL

Simulator from Mentor Graphics®, WaveFormer Lite™

from SynaptiCAD™, and Designer software from Actel.

Refer to the Libero IDE flow (located on Actel’s website)

diagram for more information.

Actel's Designer software is a place-and-route tool and

provides a comprehensive suite of backend support tools

for FPGA development. The Designer software includes

timing-driven place-and-route, and a world-class

integrated static timing analyzer and constraints editor.

With the Designer software, a user can lock his/her

design pins before layout while minimally impacting the

results of place-and-route. Additionally, the back-

annotation flow is compatible with all the major

simulators and the simulation results can be cross-probed

with Silicon Explorer II, Actel’s integrated verification

and logic analysis tool. Another tool included in the

Designer software is the ACTgen macro builder, which

easily creates popular and commonly used logic

functions for implementation into your schematic or HDL

design. Actel's Designer software is compatible with the

most popular FPGA design entry and verification tools

from companies such as Mentor Graphics, Synplicity,

Synopsys, and Cadence Design Systems. The Designer

software is available for both the Windows and UNIX

operating systems.

Actel's Designer software is compatible with the most

popular FPGA design entry and verification tools from

companies such as Mentor Graphics, Synplicity, Synopsys,

and Cadence Design Systems. The Designer software is

available for both the Windows and UNIX operating

systems.

Related Documents

Application Notes

Actel BSDL Files Format Description

www.actel.com/documents/BSDLformat_AN.pdf

Programming Antifuse Devices

http://www.actel.com/documents/

AntifuseProgram_AN.pdf

Actel's Implementation of Security in Actel Antifuse

FPGAs

www.actel.com/documents/Antifuse_Security_AN.pdf

User’s Guides and Manuals

Antifuse Macro Library Guide

www.actel.com/documents/libguide_UG.pdf

Silicon Sculptor II

www.actel.com/techdocs/manuals/default.asp#programmers

Miscellaneous

Libero IDE Flow Diagram

www.actel.com/products/tools/libero/flow.html

40MX and 42MX FPGA Families

1-14 v6.1

5.0V Operating Conditions

Table 6 • Absolute Maximum Ratings for 40MX Devices*

Symbol Parameter Limits Units

VCC DC Supply Voltage –0.5 to +7.0 V

VIInput Voltage –0.5 to VCC+0.5 V

VOOutput Voltage –0.5 to VCC+0.5 V

tSTG Storage Temperature –65 to +150 °C

Note: *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to

absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the

Recommended Operating Conditions.

Table 7 • Absolute Maximum Ratings for 42MX Devices*

Symbol Parameter Limits Units

VCCI DC Supply Voltage for I/Os –0.5 to +7.0 V

VCCA DC Supply Voltage for Array –0.5 to +7.0 V

VIInput Voltage –0.5 to VCCI+0.5 V

VOOutput Voltage –0.5 to VCCI+0.5 V

tSTG Storage Temperature –65 to +150 °C

Note: *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to

absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the

Recommended Operating Conditions.

Table 8 • Recommended Operating Conditions

Parameter Commercial Industrial Military Units

Temperature Range* 0 to +70 -40 to +85 –55 to +125 °C

VCC (40MX) 4.75 to 5.25 4.5 to 5.5 4.5 to 5.5 V

VCCA (42MX) 4.75 to 5.25 4.5 to 5.5 4.5 to 5.5 V

VCCI (42MX) 4.75 to 5.25 4.5 to 5.5 4.5 to 5.5 V

Note: *Ambient temperature (TA) is used for commercial and industrial grades; case temperature (TC) is used for military grades.

40MX and 42MX FPGA Families

v6.1 1-15

5V TTL Electrical Specifications

Table 9 • 5V TTL Electrical Specifications

Symbol Parameter

Commercial Commercial -F Industrial Military

UnitsMin. Max. Min. Max. Min. Max. Min. Max.

VOH1IOH = -10mA 2.4 2.4 V

IOH = -4mA 3.7 3.7 V

VOL1IOL = 10mA 0.5 0.5 V

IOL = 6mA 0.4 0.4 V

VIL -0.3 0.8 -0.3 0.8 -0.3 0.8 -0.3 0.8 V

VIH (40MX) 2.0 VCC+0.3 2.0 VCC+0.3 2.0 VCC+0.3 2.0 VCC+0.3 V

VIH (42MX) 2.0 VCCI+0.3 2.0 VCCI+0.3 2.0 VCCI+0.3 2.0 VCCI+0.3 V

IIL VIN = 0.5V -10 -10 -10 -10 µA

IIH VIN = 2.7V -10 -10 -10 -10 µA

Input Transition

Time, TR and TF

500 500 500 500 ns

CIO I/O Capacitance 10101010pF

Standby Current,

ICC2

A40MX02,

A40MX04

3 251025mA

A42MX09 5 25 25 25 mA

A42MX16 6 25 25 25 mA

A42MX24,

A42MX36

20 25 25 25 mA

Low-Power Mode

Standby Current

42MX devices

only

0.5 ICC - 5.0 ICC - 5.0 ICC - 5.0 mA

IIO, I/O source sink

current

Can be derived from the IBIS model (http://www.actel.com/techdocs/models/ibis.html)

Notes:

1. Only one output tested at a time. VCC/VCCI = min.

2. All outputs unloaded. All inputs = VCC/VCCI or GND.

40MX and 42MX FPGA Families

1-16 v6.1

3.3V Operating Conditions

Table 10 • Absolute Maximum Ratings for 40MX Devices*

Symbol Parameter Limits Units

VCC DC Supply Voltage –0.5 to +7.0 V

VIInput Voltage –0.5 to VCC+0.5 V

VOOutput Voltage –0.5 to VCC+0.5 V

tSTG Storage Temperature –65 to +150 °C

Note: *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to

absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the

Recommended Operating Conditions.

Table 11 • Absolute Maximum Ratings for 42MX Devices*

Symbol Parameter Limits Units

VCCI DC Supply Voltage for I/Os –0.5 to +7.0 V

VCCA DC Supply Voltage for Array –0.5 to +7.0 V

VIInput Voltage –0.5 to VCCI+0.5 V

VOOutput Voltage –0.5 to VCCI+0.5 V

tSTG Storage Temperature –65 to +150 °C

Note: *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to

absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the

Recommended Operating Conditions.

Table 12 • Recommended Operating Conditions

Parameter Commercial Industrial Military Units

Temperature Range* 0 to +70 –40 to +85 –55 to +125 °C

VCC (40MX) 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 V

VCCA (42MX) 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 V

VCCI (42MX) 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 V

Note: *Ambient temperature (TA) is used for commercial and industrial grades; case temperature (TC) is used for military grades.

40MX and 42MX FPGA Families

v6.1 1-17

3.3V LVTTL Electrical Specifications

Table 13 • 3.3V LVTTL Electrical Specifications

Symbol Parameter

Commercial Commercial -F Industrial Military

UnitsMin. Max. Min. Max. Min. Max. Min. Max.

VOH1IOH = –4mA 2.15 2.15 2.4 2.4 V

VOL1IOL = 6mA 0.4 0.4 0.48 0.48 V

VIL –0.3 0.8 –0.3 0.8 –0.3 0.8 –0.3 0.8 V

VIH (40MX) 2.0 VCC+0.3 2.0 VCC+0.3 2.0 VCC+0.3 2.0 VCC+0.3 V

VIH (42MX) 2.0 VCCI+0.3 2.0 VCCI+0.3 2.0 VCCI+0.3 2.0 VCCI+0.3 V

IIL –10 –10 –10 –10 µA

IIH –10 –10 –10 –10 µA

Input Transition Time,

TR and TF

500 500 500 500 ns

CIO I/O Capacitance 10 10 10 10 pF

Standby Current, ICC2A40MX02,

A40MX04

3251025mA

A42MX09 5 25 25 25 mA

A42MX16 6 25 25 25 mA

A42MX24,

A42MX36

15 25 25 25 mA

Low-Power Mode

Standby Current

42MX

devices only

0.5 ICC - 5.0 ICC - 5.0 ICC - 5.0 mA

IIO, I/O source sink

current

Can be derived from the IBIS model (http://www.actel.com/techdocs/models/ibis.html)

Notes:

1. Only one output tested at a time. VCC/VCCI = min.

2. All outputs unloaded. All inputs = VCC/VCCI or GND.

40MX and 42MX FPGA Families

1-18 v6.1

Mixed 5.0V/3.3V Operating Conditions (for 42MX Devices Only)

Mixed 5.0V/3.3V Electrical Specifications

Table 14 • Absolute Maximum Ratings*

Symbol Parameter Limits Units

VCCI DC Supply Voltage for I/Os –0.5 to +7.0 V

VCCA DC Supply Voltage for Array –0.5 to +7.0 V

VIInput Voltage –0.5 to VCCA+0.5 V

VOOutput Voltage –0.5 to VCCI+0.5 V

tSTG Storage Temperature –65 to +150 °C

Note: *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to

absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the

Recommended Operating Conditions.

Table 15 • Recommended Operating Conditions

Parameter Commercial Industrial Military Units

Temperature Range* 0 to +70 -40 to +85 –55 to +125 °C

VCCA 4.75 to 5.25 4.5 to 5.5 4.5 to 5.5 V

VCCI 3.14 to 3.47 3.0 to 3.6 3.0 to 3.6 V

Note: *Ambient temperature (TA) is used for commercial and industrial grades; case temperature (TC) is used for military grades.

Table 16 • Mixed 5.0V/3.3V Electrical Specifications

Symbol Parameter

Commercial Commercial '-F 'Industrial Military

UnitsMin. Max. Min. Max. Min. Max. Min. Max.

VOH1IOH = –10mA 2.4 2.4 V

IOH = –4mA 2.4 2.4 V

VOL1IOL = 10mA 0.5 0.5 V

IOL = 6mA 0.4 0.4 V

VIL –0.3 0.8 –0.3 0.8 –0.3 0.8 –0.3 0.8 V

VIH 2.0 VCCA+0.3 2.0 VCCA+0.3 2.0 VCCA+0.3 2.0 VCCA+0.3 V

ILVIN = 0.5V –10 –10 –10 –10 µA

IHVIN = 2.7V –10 –10 –10 –10 µA

Input Transition Time, TR and TF500 500 500 500 ns

CIO I/O Capacitance 10 10 10 10 pF

Standby Current, ICC2A42MX09 5 25 25 25 mA

A42MX16 6 25 25 25 mA

A42MX24,

A42MX36

20 25 25 25 mA

Low-Power Mode Standby Current 0.5 ICC - 5.0 ICC - 5.0 ICC - 5.0 mA

IIO I/O source sink current Can be derived from the IBIS model (http://www.actel.com/techdocs/models/ibis.html)

Notes:

1. Only one output tested at a time. VCCI = min.

2. All outputs unloaded. All inputs = VCCI or GND.

40MX and 42MX FPGA Families

v6.1 1-19

Output Drive Characteristics for 5.0V PCI Signaling

MX PCI device I/O drivers were designed specifically for high-performance PCI systems. Figure 1-16 on page 1-21 shows

the typical output drive characteristics of the MX devices. MX output drivers are compliant with the PCI Local Bus

Specification.

Table 17 • DC Specification (5.0V PCI Signaling)1

PCI MX

Symbol Parameter Condition Min. Max. Min. Max. Units

VCCI Supply Voltage for I/Os 4.75 5.25 4.75 5.252V

VIH Input High Voltage 2.0 VCC + 0.5 2.0 VCCI + 0.3 V

VIL Input Low Voltage –0.5 0.8 –0.3 0.8 V

IIH Input High Leakage Current VIN = 2.7V 70 — 10 µA

IIL Input Low Leakage Current VIN=0.5V –70 — –10 µA

VOH Output High Voltage IOUT = –2 mA

IOUT = –6 mA

2.4

3.84

VOL Output Low Voltage IOUT = 3 mA,

6 mA

0.55 — 0.33 V

CIN Input Pin Capacitance 10 — 10 pF

CCLK CLK Pin Capacitance 5 12 — 10 pF

LPIN Pin Inductance 20 — < 8 nH3nH

Notes:

1. PCI Local Bus Specification, Version 2.1, Section 4.2.1.1.

2. Maximum rating for VCCI –0.5V to 7.0V.

3. Dependent upon the chosen package. PCI recommends QFP and BGA packaging to reduce pin inductance and capacitance.

Table 18 • AC Specifications (5.0V PCI Signaling)*

PCI MX

Symbol Parameter Condition Min. Max. Min. Max. Units

ICL Low Clamp Current –5 < VIN ≤ –1 –25 + (VIN +1)

/0.015

–60 –10 mA

Slew (r) Output Rise Slew Rate 0.4V to 2.4V load 1 5 1.8 2.8 V/ns

Slew (f) Output Fall Slew Rate 2.4V to 0.4V load 1 5 2.8 4.3 V/ns

Note: *PCI Local Bus Specification, Version 2.1, Section 4.2.1.2.

40MX and 42MX FPGA Families

1-20 v6.1

Output Drive Characteristics for 3.3V PCI Signaling

Table 19 • DC Specification (3.3V PCI Signaling)1

PCI MX

Symbol Parameter Condition Min. Max. Min. Max. Units

VCCI Supply Voltage for I/Os 3.0 3.6 3.0 3.6 V

VIH Input High Voltage 0.5 VCC + 0.5 0.5 VCCI + 0.3 V

VIL Input Low Voltage –0.5 0.8 –0.3 0.8 V

IIH Input High Leakage Current VIN = 2.7V 70 10 µA

IIL Input Leakage Current –70 –10 µA

VOH Output High Voltage IOUT = –2 mA 0.9 3.3 V

VOL Output Low Voltage IOUT = 3 mA,

6 mA

0.1 0.1 VCCI V

CIN Input Pin Capacitance 10 10 pF

CCLK CLK Pin Capacitance 5 12 10 pF

LPIN Pin Inductance 20 < 8 nH3nH

Notes:

1. PCI Local Bus Specification, Version 2.1, Section 4.2.2.1.

2. Maximum rating for VCCI –0.5V to 7.0V.

3. Dependent upon the chosen package. PCI recommends QFP and BGA packaging to reduce pin inductance and capacitance.

Table 20 • AC Specifications for (3.3V PCI Signaling)*

PCI MX

Symbol Parameter Condition Min. Max. Min. Max. Units

ICL Low Clamp Current –5 < VIN ≤ –1 –25 + (VIN +1)

/0.015

–60 –10 mA

Slew (r) Output Rise Slew Rate 0.2V to 0.6V load 1 4 1.8 2.8 V/ns

Slew (f) Output Fall Slew Rate 0.6V to 0.2V load 1 4 2.8 4.0 V/ns

Note: *PCI Local Bus Specification, Version 2.1, Section 4.2.2.2.

40MX and 42MX FPGA Families

v6.1 1-21

Figure 1-16 • Typical Output Drive Characteristics (Based Upon Measured Data)

01 2 3 4 5 6

MX PCI IOL

MX PCI IOH

PCI I OL Maximum

PCI I OL Minimum

PCI I OH Minimum

PCI I OH Maximum

Voltage Out (V)

–0.20

–0.15

–0.10

–0.05

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

Current (A)

40MX and 42MX FPGA Families

1-22 v6.1

Junction Temperature (TJ)

The temperature variable in the Designer software refers

to the junction temperature, not the ambient

temperature. This is an important distinction because the

heat generated from dynamic power consumption is

usually hotter than the ambient temperature. EQ 1-1,

shown below, can be used to calculate junction

temperature.

EQ 1-1

Junction Temperature = ΔT + Ta(1)

Where:

Ta = Ambient Temperature

ΔT = Temperature gradient between junction (silicon)

and ambient

ΔT = θja * P(2)

P = Power

θja = Junction to ambient of package. θja numbers are

located in the Package Thermal Characteristics table

below.

Package Thermal Characteristics

The device junction-to-case thermal characteristic is θjc,

and the junction-to-ambient air characteristic is θja. The

thermal characteristics for θja are shown with two

different air flow rates.

The maximum junction temperature is 150°C.

Maximum power dissipation for commercial- and

industrial-grade devices is a function of θja.

A sample calculation of the absolute maximum power

dissipation allowed for a TQFP 176-pin package at

commercial temperature and still air is as follow:

The maximum power dissipation for military-grade devices is a function of θjc. A sample calculation of the absolute

maximum power dissipation allowed for CQFP 208-pin package at military temperature and still air is as follows:

Table 21 • Package Thermal Characteristics

Plastic Packages Pin Count θjc

θja

UnitsStill Air

1.0 m/s

200 ft/min.

2.5 m/s

500 ft/min.

Plastic Quad Flat Pack 100 12.0 27.8 23.4 21.2 °C/W

Plastic Quad Flat Pack 160 10.0 26.2 22.8 21.1 °C/W

Plastic Quad Flat Pack 208 8.0 26.1 22.5 20.8 °C/W

Plastic Quad Flat Pack 240 8.5 25.6 22.3 20.8 °C/W

Plastic Leaded Chip Carrier 44 16.0 20.0 24.5 22.0 °C/W

Plastic Leaded Chip Carrier 68 13.0 25.0 21.0 19.4 °C/W

Plastic Leaded Chip Carrier 84 12.0 22.5 18.9 17.6 °C/W

Thin Plastic Quad Flat Pack 176 11.0 24.7 19.9 18.0 °C/W

Very Thin Plastic Quad Flat Pack 80 12.0 38.2 31.9 29.4 °C/W

Very Thin Plastic Quad Flat Pack 100 10.0 35.3 29.4 27.1 °C/W

Plastic Ball Grid Array 272 3.0 18.3 14.9 13.9 °C/W

Ceramic Packages

Ceramic Quad Flat Pack 208 2.0 22.0 19.8 18.0 °C/W

Ceramic Quad Flat Pack 256 2.0 20.0 16.5 15.0 °C/W

Maximum Po wer Allowed Max. junction temp. (°C) Max. ambient temp. (°C)–

θja(°C/W)

--------------------------------------------------------------------------------------------------------------------------------- 150°C70°C–

28°C/W

-----------------------------------2.86W===

Maximum Power Allowed Max. junction temp. (°C) Max. am bient temp. (°C)–

θjc(°C/W)

--------------------------------------------------------------------------------------------------------------------------------- 150°C 125°C–

6.3°C/W

--------------------------------------3.97W===

40MX and 42MX FPGA Families

v6.1 1-23

Timing Models

Note: * Values are shown for 40MX ‘–3’ speed devices at 5.0V worst-case commercial conditions.

Figure 1-17 • 40MX Timing Model*

Notes: *Values are shown for A42MX09 ‘–3’ at 5.0V worst-case commercial conditions.

† Input module predicted routing delay.

Figure 1-18 • 42MX Timing Model*

Output DelayInput Delay

Logic Module

Internal Delays

tDLH=3.32 ns

tENHZ=7.92 ns

tRD1=1.28 ns

tRD2=1.80 ns

tRD4=2.33 ns

tRD8=4.93 ns

I/O Module

tPD=1.24 ns

tCO=1.24 ns

tIRD1=2.09 ns

tIRD4=3.64 ns

tIRD8=5.73 ns

tINYL=0.62 ns tIRD2=2.59 ns

I/O Module

FMAX=180 MHz

tCKH=4.55 ns FO=128

Array

Clock

Predicted

Routing

Delays

Array

Clocks

Combin

-ato r ia l

Logic

include

FO = 32

Output DelaysInternal DelaysInput Delays

I/O Module

†

Combinatorial

Logic Module

Sequential

Logic Module

I/O Module

Predicted

Routi ng

Delays

tRD1=0.7 ns

tRD2=1.9 ns

tRD4=1.4 ns

tRD8=2.3 ns

tOUTH=0.00 ns

tOUTSU=0.3 ns

tGLH=2.6 ns

tDLH=2.5 ns

tENHZ=4.9 ns

tRD1=0.70 ns

tLCO=5.2 ns (light loads, pad-to-pad)

tCO=1.3 ns

tSUD=0.3 ns

tHD=0.00 ns

tPD=1.2 ns

tIRD1=2.0 ns

tINYL=0.8 ns

tINH=0.0 ns

tINSU=0.3 ns

tINGL=1.3 ns

FMAX=296 MHz

tCKH=2.70 ns

40MX and 42MX FPGA Families

1-24 v6.1

Notes: * Values are shown for A42MX36 ‘–3’ at 5.0V worst-case commercial conditions.

** Load-dependent

Figure 1-19 • 42MX Timing Model (Logic Functions Using Quadrant Clocks)

Note: *Values are shown for A42MX36 ‘–3 at 5.0V worst-case commercial conditions.

Figure 1-20 • 42MX Timing Model (SRAM Functions)

Array

Clocks

Combin

-ato r ia l

Logic

include

FO = 32

Output DelaysInternal DelaysInput Delays

I/O Module

†

Combinatorial

Logic Module

Sequential

Logic Module

I/O Module

Predicted

Routi ng

Delays

tRD1=0.7 ns

tRD2=1.9 ns

tRD4=1.4 ns

tRD8=2.3 ns

tOUTH=0.00 ns

tOUTSU=0.3 ns

tGLH=2.6 ns

tDLH=2.5 ns

tENHZ=4.9 ns

tRD1=0.70 ns

tLCO=5.2 ns (light loads, pad-to-pad)

tCO=1.3 ns

tSUD=0.3 ns

tHD=0.00 ns

tPD=1.2 ns

tIRD1=2.0 ns

tINYL=0.8 ns

tINH=0.0 ns

tINSU=0.3 ns

tINGL=1.3 ns

FMAX=296 MHz

tCKH=2.70 ns

tINPY=1.0ns

Input Delays

I/O Module

Array

Clocks

I/O Module

WD [7:0]

WRAD [5:0]

BLKEN

WEN

WCLK

RD [7:0]

RDAD [5:0]

REN

RCLK

Predicted

Routing

Delays

tGHL=2.9ns

tLSU=0.5ns

tLH=0.0ns

tDLH=2.6ns

tADSU=1.6ns

tADH=0.0ns

tRENSU=0.6ns

tRCO=3.4ns

tADSU=1.6ns

tADH=0.0ns

tWENSU=2.7ns

tBENS=2.8ns

tRD1=0.9ns

FMAX =167 MHz

tIRD1=2.0ns

tINSU=0.5ns

tINH=0.0ns

tINGO=1.4ns

40MX and 42MX FPGA Families

v6.1 1-25

Parameter Measurement

Figure 1-21 • Output Buffer Delays

Figure 1-22 • AC Test Loads

To AC test loads (shown below)

PAD

TRIBUFF

In 50%

PAD 1.5V

50%

1.5V

E50%

PAD 1.5V

50%

10%

E50%

PAD

GND 1.5V

50%

90%

tENZL tENLZ tENZH tENHZ

tDLH tDHL

CCI

35 pF

Lo ad 1

(U sed to measure p ropagati on d elay)

To the output under tes t

T o the output under tes t

Lo ad 2

(U sed to measure r ising/falling ed ges)

VCCI GND

35 pF

R to V

CCI

for tPLZ/tPZL

R to GND for tPHZ/tPZH

R=1k

Figure 1-23 • Input Buffer Delays

PA D Y

INBUF

PAD

1.5V

GND 50%

1.5V

50%

tINYL

tINYH

VCCI

Figure 1-24 • Module Delays

S, A or B

50%

PLH

50%

50% 50%

PHL

PLH

40MX and 42MX FPGA Families

1-26 v6.1

Sequential Module Timing Characteristics

Note: *D represents all data functions involving A, B, and S for multiplexed flip-flops.

Figure 1-25 • Flip-Flops and Latches

tWCLKA

WASYN

tHD

tSU EN A

SUD

tWCLKI

HENA

G, CLK

PRE, CLR

(Positive Edge-Triggered)

CLK CLR

PRE Y

40MX and 42MX FPGA Families

v6.1 1-27

Sequential Timing Characteristics

Figure 1-26 • Input Buffer Latches

Figure 1-27 • Output Buffer Latches

PA D

CLK

DATA

CLK

INH

INSU

SU EX T

HEXT

IBDL

DATA

tOUTSU

tOUTH

PAD

OBDLHS

40MX and 42MX FPGA Families

1-28 v6.1

Decode Module Timing

SRAM Timing Characteristics

Dual-Port SRAM Timing Waveforms

Figure 1-28 • Decode Module Timing

Figure 1-29 • SRAM Timing Characteristics

Note: Identical timing for falling edge clock.

Figure 1-30 • 42MX SRAM Write Operation

A–G, H

tPLH

50%

tPHL

WRAD [5:0]

BLKEN

WEN

WCLK

RDAD [5:0]

LEW

REN

RCLK

RD [7:0]

WD [ 7:0]

Write Port Read Port

RAM Array

32x8 or 64x4

(256 Bits)

WCLK

WD[7: 0]

RAD[5:0]

WEN

BLKEN Valid

Valid

tRCKHL

tWENSU

tBENSU

tWENH

tBENH

ADSU

tADH

40MX and 42MX FPGA Families

v6.1 1-29

Note: Identical timing for falling edge clock.

Figure 1-31 • 42MX SRAM Synchronous Read Operation

Figure 1-32 • 42MX SRAM Asynchronous Read Operation—Type 1 (Read Address Controlled)

Figure 1-33 • 42MX SRAM Asynchronous Read Operation—Type 2 (Write Address Controlled)

RCLK

REN

RDAD[5:0]

RD[7:0] Old Data

Valid

RCKHL

CKHL

RENH

RCO

ADH

DOH

ADSU

New Data

RENSU

RDAD[5:0]

RD[7:0] Data 1

RDADV

tDOH

ADDR2ADDR1

Data 2

RPD

WEN

WD[7:0]

WCLK

RD[7:0] Old Data

Valid

WENH

RPD

WENSU

New Data

DOH

ADSU

WRAD[5:0]

BLKEN

ADH

40MX and 42MX FPGA Families

1-30 v6.1

Predictable Performance: Tight Delay Distributions

Propagation delay between logic modules depends on

the resistive and capacitive loading of the routing tracks,

the interconnect elements, and the module inputs being

driven. Propagation delay increases as the length of

routing tracks, the number of interconnect elements, or

the number of inputs increases.

From a design perspective, the propagation delay can be

statistically correlated or modeled by the fanout

(number of loads) driven by a module. Higher fanout

usually requires some paths to have longer routing

tracks.

The MX FPGAs deliver a tight fanout delay distribution,

which is achieved in two ways: by decreasing the delay of

the interconnect elements and by decreasing the number

of interconnect elements per path.

Actel’s patented antifuse offers a very low resistive/

capacitive interconnect. The antifuses, fabricated in

0.45 µm lithography, offer nominal levels of 100Ω

resistance and 7.0fF capacitance per antifuse.

MX fanout distribution is also tight due to the low

number of antifuses required for each interconnect path.

The proprietary architecture limits the number of

antifuses per path to a maximum of four, with

90 percent of interconnects using only two antifuses.

Timing Characteristics

Device timing characteristics fall into three categories:

family-dependent, device-dependent, and design-

dependent. The input and output buffer characteristics

are common to all MX devices. Internal routing delays

are device-dependent; actual delays are not determined

until after place-and-route of the user's design is

complete. Delay values may then be determined by using

the Designer software utility or by performing

simulation with post-layout delays.

Critical Nets and Typical Nets

Propagation delays are expressed only for typical nets,

which are used for initial design performance evaluation.

Critical net delays can then be applied to the most timing

critical paths. Critical nets are determined by net

property assignment in Actel's Designer software prior to

placement and routing. Up to 6% of the nets in a design

may be designated as critical.

Long Tracks

Some nets in the design use long tracks, which are

special routing resources that span multiple rows,

columns, or modules. Long tracks employ three and

sometimes four antifuse connections, which increase

capacitance and resistance, resulting in longer net delays

for macros connected to long tracks. Typically, up to

6 percent of nets in a fully utilized device require long

tracks. Long tracks add approximately a 3 ns to a 6 ns

delay, which is represented statistically in higher fanout

(FO=8) routing delays in the data sheet specifications

section, shown in Table 28 on page 1-36.

Timing Derating

MX devices are manufactured with a CMOS process.

Therefore, device performance varies according to

temperature, voltage, and process changes. Minimum

timing parameters reflect maximum operating voltage,

minimum operating temperature and best-case

processing. Maximum timing parameters reflect

minimum operating voltage, maximum operating

temperature and worst-case processing.

40MX and 42MX FPGA Families

v6.1 1-31

Temperature and Voltage Derating Factors

Table 22 • 42MX Temperature and Voltage Derating Factors

(Normalized to TJ = 25°C, VCCA = 5.0V)

42MX Voltage

Temperature

–55°C –40°C 0°C 25°C 70°C 85°C 125°C

4.50 0.93 0.95 1.05 1.09 1.25 1.29 1.41

4.75 0.88 0.90 1.00 1.03 1.18 1.22 1.34

5.00 0.85 0.87 0.96 1.00 1.15 1.18 1.29

5.25 0.84 0.86 0.95 0.97 1.12 1.14 1.28

5.50 0.83 0.85 0.94 0.96 1.10 1.13 1.26

Note: This derating factor applies to all routing and propagation delays.

Figure 1-34 • 42MX Junction Temperature and Voltage Derating Curves

(Normalized to TJ = 25°C, VCCA = 5.0V)

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

4.50 4.75 5.00 5.25 5.50

Voltage (V)

Derating Factor

–55˚C

–40˚C

0˚C

25˚C

70˚C

85˚C

125˚C

40MX and 42MX FPGA Families

1-32 v6.1

Table 23 • 40MX Temperature and Voltage Derating Factors

(Normalized to TJ = 25°C, VCC = 5.0V)

40MX Voltage

Temperature

–55°C –40°C 0°C 25°C 70°C 85°C 125°C

4.50 0.89 0.93 1.02 1.09 1.25 1.31 1.45

4.75 0.84 0.88 0.97 1.03 1.18 1.24 1.37

5.00 0.82 0.85 0.94 1.00 1.15 1.20 1.33

5.25 0.80 0.82 0.91 0.97 1.12 1.16 1.29

5.50 0.79 0.82 0.90 0.96 1.10 1.15 1.28

Note: This derating factor applies to all routing and propagation delays.

Figure 1-35 • 40MX Junction Temperature and Voltage Derating Curves

(Normalized to TJ = 25°C, VCC = 5.0V)

Factor

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

4.50 4.75 5.00 5.25 5.50

Voltage (V)

Derating

–55˚C

–40˚C

0˚C

25˚C

70˚C

85˚C

125˚C

40MX and 42MX FPGA Families

v6.1 1-33

Table 24 • 42MX Temperature and Voltage Derating Factors

(Normalized to TJ = 25°C, VCCA = 3.3V)

42MX Voltage

Temperature

–55°C –40°C 0°C 25°C 70°C 85°C 125°C

3.00 0.97 1.00 1.10 1.15 1.32 1.36 1.45

3.30 0.84 0.87 0.96 1.00 1.15 1.18 1.26

3.60 0.81 0.84 0.92 0.96 1.10 1.13 1.21

Note: This derating factor applies to all routing and propagation delays.

Figure 1-36 • 42MX Junction Temperature and Voltage Derating Curves

(Normalized to TJ = 25°C, VCCA = 3.3V)

(V)

0.40

0.50

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

1.60

Voltage (V)

Derating Factor

3.00 3.30 3.60

55˚C

40˚C

0˚C

25˚C

70˚C

85˚C

125˚C

40MX and 42MX FPGA Families

1-34 v6.1

Table 25 • 40MX Temperature and Voltage Derating Factors

(Normalized to TJ = 25°C, VCC = 3.3V)

40MX Voltage

Temperature

–55°C –40°C 0°C 25°C 70°C 85°C 125°C

3.00 1.08 1.12 1.21 1.26 1.50 1.64 2.00

3.30 0.86 0.89 0.96 1.00 1.19 1.30 1.59

3.60 0.83 0.85 0.92 0.96 1.14 1.25 1.53

Note: This derating factor applies to all routing and propagation delays.

Figure 1-37 • 40MX Junction Temperature and Voltage Derating Curves

(Normalized to TJ = 25°C, VCC = 3.3V)

3.00 3.30 3.60

Voltage (V)

Derating Factor

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

2.20

55˚C

40˚C

0˚C

25˚C

70˚C

85˚C

125˚C

40MX and 42MX FPGA Families

v6.1 1-35

PCI System Timing Specification

Table 26 and Table 27 list the critical PCI timing

parameters and the corresponding timing parameters

for the MX PCI-compliant devices.

PCI Models

Actel provides synthesizable VHDL and Verilog-HDL

models for a PCI Target interface, a PCI Target and

Target+DMA Master interface. Contact your Actel sales

representative for more details.

Table 26 • Clock Specification for 33 MHz PCI

Symbol Parameter

PCI A42MX24 A42MX36

UnitsMin. Max. Min. Max. Min. Max.

tCYC CLK Cycle Time 30 – 4.0 – 4.0 – ns

tHIGH CLK High Time 11 – 1.9 – 1.9 – ns

tLOW CLK Low Time 11 –1.9–1.9– ns

Table 27 • Timing Parameters for 33 MHz PCI

PCI A42MX24 A42MX36

SymbolParameter Min.Max.Min.Max.Min.Max.Units

tVAL CLK to Signal Valid—Bused Signals 2 11 2.0 9.0 2.0 9.0 ns

tVAL(PTP) CLK to Signal Valid—Point-to-Point 2 212 2.0 9.0 2.0 9.0 ns

tON Float to Active 2 – 2.0 4.0 2.0 4.0 ns

tOFF Active to Float – 28 – 8.31–8.3

1ns

tSU Input Set-Up Time to CLK—Bused Signals 7 – 1.5 – 1.5 – ns

tSU(PTP) Input Set-Up Time to CLK—Point-to-Point 10, 12 2–1.5–1.5– ns

tHInput Hold to CLK 0 – 0 – 0 – ns

Notes:

1. TOFF is system dependent. MX PCI devices have 7.4 ns turn-off time, reflection is typically an additional 10 ns.

2. REQ# and GNT# are point-to-point signals and have different output valid delay and input setup times than do bussed signals.

GNT# has a setup of 10; REW# has a setup of 12.

40MX and 42MX FPGA Families

1-36 v6.1

Timing Characteristics

Table 28 • A40MX02 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Logic Module Propagation Delays

tPD1 Single Module 1.2 1.4 1.6 1.9 2.7 ns

tPD2 Dual-Module Macros 2.7 3.1 3.5 4.1 5.7 ns

tCO Sequential Clock-to-Q 1.2 1.4 1.6 1.9 2.7 ns

tGO Latch G-to-Q 1.2 1.4 1.6 1.9 2.7 ns

tRS Flip-Flop (Latch) Reset-to-Q 1.2 1.4 1.6 1.9 2.7 ns

Logic Module Predicted Routing Delays1

tRD1 FO=1 Routing Delay 1.3 1.5 1.7 2.0 2.8 ns

tRD2 FO=2 Routing Delay 1.8 2.1 2.4 2.8 3.9 ns

tRD3 FO=3 Routing Delay 2.3 2.7 3.0 3.6 5.0 ns

tRD4 FO=4 Routing Delay 2.9 3.3 3.7 4.4 6.1 ns

tRD8 FO=8 Routing Delay 4.9 5.7 6.5 7.6 10.6 ns

Logic Module Sequential Timing2

tSUD Flip-Flop (Latch) Data Input Set-Up 3.1 3.5 4.0 4.7 6.6 ns

tHD3Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 3.1 3.5 4.0 4.7 6.6 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch)

Clock Active Pulse Width

3.3 3.8 4.3 5.0 7.0 ns

tWASYN Flip-Flop (Latch)

Asynchronous Pulse Width

3.3 3.8 4.3 5.0 7.0 ns

tAFlip-Flop Clock Input Period 4.8 5.6 6.3 7.5 10.4 ns

fMAX Flip-Flop (Latch) Clock

Frequency (FO = 128)

181 168 154 134 80 MHz

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 0.7 0.8 0.9 1.1 1.5 ns

tINYL Pad-to-Y LOW 0.6 0.7 0.8 1.0 1.3 ns

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35pF loading.

40MX and 42MX FPGA Families

v6.1 1-37

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.1 2.4 2.2 3.2 4.5 ns

tIRD2 FO=2 Routing Delay 2.6 3.0 3.4 4.0 5.6 ns

tIRD3 FO=3 Routing Delay 3.1 3.6 4.1 4.8 6.7 ns

tIRD4 FO=4 Routing Delay 3.6 4.2 4.8 5.6 7.8 ns

tIRD8 FO=8 Routing Delay 5.7 6.6 7.5 8.8 12.4 ns

Global Clock Network

tCKH Input Low to HIGH FO = 16

FO = 128

4.6

5.3

6.0

7.0

9.8

tCKL Input High to LOW FO = 16

FO = 128

4.8

5.6

6.3

7.4

10.4

tPWH Minimum Pulse

Width HIGH

FO = 16

FO = 128

2.2

2.4

2.6

2.7

2.9

3.1

3.4

3.6

4.8

5.1

tPWL Minimum Pulse

Width LOW

FO = 16

FO = 128

2.2

2.4

2.6

2.7

2.9

3.01

3.4

3.6

4.8

5.1

tCKSW Maximum Skew FO = 16

FO = 128

0.4

0.5

0.6

0.5

0.7

0.6

0.8

1.2

tPMinimum Period FO = 16

FO = 128

4.7

4.8

5.4

5.6

6.1

6.3

7.2

7.5

10.0

10.4

fMAX Maximum

Frequency

FO = 16

FO = 128

188

181

175

168

160

154

139

134

MHz

Table 28 • A40MX02 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35pF loading.

40MX and 42MX FPGA Families

1-38 v6.1

TTL Output Module Timing4

tDLH Data-to-Pad HIGH 3.3 3.8 4.3 5.1 7.2 ns

tDHL Data-to-Pad LOW 4.0 4.6 5.2 6.1 8.6 ns

tENZH Enable Pad Z to

HIGH

3.7 4.3 4.9 5.8 8.0 ns

tENZL Enable Pad Z to

LOW

4.7 5.4 6.1 7.2 10.1 ns

tENHZ Enable Pad HIGH to

7.9 9.1 10.4 12.2 17.1 ns

tENLZ Enable Pad LOW to

5.9 6.8 7.7 9.0 12.6 ns

dTLH Delta LOW to HIGH 0.02 0.02 0.03 0.03 0.04 ns/pF

dTHL Delta HIGH to LOW 0.03 0.03 0.03 0.04 0.06 ns/pF

CMOS Output Module Timing4

tDLH Data-to-Pad HIGH 3.9 4.5 5.1 6.05 8.5 ns

tDHL Data-to-Pad LOW 3.4 3.9 4.4 5.2 7.3 ns

tENZH Enable Pad Z to

HIGH

3.4 3.9 4.4 5.2 7.3 ns

tENZL Enable Pad Z to

LOW

4.9 5.6 6.4 7.5 10.5 ns

tENHZ Enable Pad HIGH to

7.9 9.1 10.4 12.2 17.0 ns

tENLZ Enable Pad LOW to

5.9 6.8 7.7 9.0 12.6 ns

dTLH Delta LOW to HIGH 0.03 0.04 0.04 0.05 0.07 ns/pF

dTHL Delta HIGH to LOW 0.02 0.02 0.03 0.03 0.04 ns/pF

Table 28 • A40MX02 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35pF loading.

40MX and 42MX FPGA Families

v6.1 1-39

Table 29 • A40MX02 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays

tPD1 Single Module 1.7 2.0 2.3 2.7 3.7 ns

tPD2 Dual-Module Macros 3.7 4.3 4.9 5.7 8.0 ns

tCO Sequential Clock-to-Q 1.7 2.0 2.3 2.7 3.7 ns

tGO Latch G-to-Q 1.7 2.0 2.3 2.7 3.7 ns

tRS Flip-Flop (Latch) Reset-to-Q 1.7 2.0 2.3 2.7 3.7 ns

Logic Module Predicted Routing Delays1

tRD1 FO=1 Routing Delay 2.0 2.2 2.5 3.0 4.2 ns

tRD2 FO=2 Routing Delay 2.7 3.1 3.5 4.1 5.7 ns

tRD3 FO=3 Routing Delay 3.4 3.9 4.4 5.2 7.3 ns

tRD4 FO=4 Routing Delay 4.2 4.8 5.4 6.3 8.9 ns

tRD8 FO=8 Routing Delay 7.1 8.2 9.2 10.9 15.2 ns

Logic Module Sequential Timing2

tSUD Flip-Flop (Latch) Data Input Set-Up 4.3 4.9 5.6 6.6 9.2 ns

tHD3Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 4.3 4.9 5.6 6.6 9.2 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

4.6 5.3 6.0 7.0 9.8 ns

tWASYN Flip-Flop (Latch)

Asynchronous Pulse Width

4.6 5.3 6.0 7.0 9.8 ns

tAFlip-Flop Clock Input Period 6.8 7.8 8.9 10.4 14.6 ns

fMAX Flip-Flop (Latch) Clock

Frequency (FO = 128)

109 101 92 80 48 MHz

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.0 1.1 1.3 1.5 2.1 ns

tINYL Pad-to-Y LOW 0.9 1.0 1.1 1.3 1.9 ns

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-40 v6.1

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.9 3.4 3.8 4.5 6.3 ns

tIRD2 FO=2 Routing Delay 3.6 4.2 4.8 5.6 7.8 ns

tIRD3 FO=3 Routing Delay 4.4 5.0 5.7 6.7 9.4 ns

tIRD4 FO=4 Routing Delay 5.1 5.9 6.7 7.8 11.0 ns

tIRD8 FO=8 Routing Delay 8.0 9.26 10.5 12.6 17.3 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 16

FO = 128

6.4

7.4

8.3

9.8

13.7

tCKL Input HIGH to LOW FO = 16

FO = 128

6.7

7.8

8.8

10.4

14.5

tPWH Minimum Pulse

Width HIGH

FO = 16

FO = 128

3.1

3.3

3.6

3.8

4.1

4.3

4.8

5.1

6.7

7.1

tPWL Minimum Pulse

Width LOW

FO = 16

FO = 128

3.1

3.3

3.6

3.8

4.1

4.3

4.8

5.1

6.7

7.1

tCKSW Maximum Skew FO = 16

FO = 128

0.6

0.8

0.6

0.9

0.7

1.0

0.8

1.2

1.6

tPMinimum Period FO = 16

FO = 128

6.5

6.8

7.5

7.8

8.5

8.9

10.1

10.4

14.1

14.6

fMAX Maximum Frequency FO = 16

FO = 128

113

109

105

101

MHz

TTL Output Module Timing4

tDLH Data-to-Pad HIGH 4.7 5.4 6.1 7.2 10.0 ns

tDHL Data-to-Pad LOW 5.6 6.4 7.3 8.6 12.0 ns

tENZH Enable Pad Z to HIGH 5.2 6.0 6.8 8.1 11.3 ns

tENZL Enable Pad Z to LOW 6.6 7.6 8.6 10.1 14.1 ns

tENHZ Enable Pad HIGH to Z 11.1 12.8 14.5 17.1 23.9 ns

tENLZ Enable Pad LOW to Z 8.2 9.5 10.7 12.6 17.7 ns

dTLH Delta LOW to HIGH 0.03 0.03 0.04 0.04 0.06 ns/pF

dTHL Delta HIGH to LOW 0.04 0.04 0.05 0.06 0.08 ns/pF

Table 29 • A40MX02 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-41

CMOS Output Module Timing4

tDLH Data-to-Pad HIGH 5.5 6.4 7.2 8.5 11.9 ns

tDHL Data-to-Pad LOW 4.8 5.5 6.2 7.3 10.2 ns

tENZH Enable Pad Z to HIGH 4.7 5.5 6.2 7.3 10.2 ns

tENZL Enable Pad Z to LOW 6.8 7.9 8.9 10.5 14.7 ns

tENHZ Enable Pad HIGH to Z 11.1 12.8 14.5 17.1 23.9 ns

tENLZ Enable Pad LOW to Z 8.2 9.5 10.7 12.6 17.7 ns

dTLH Delta LOW to HIGH 0.05 0.05 0.06 0.07 0.10 ns/pF

dTHL Delta HIGH to LOW 0.03 0.03 0.04 0.04 0.06 ns/pF

Table 29 • A40MX02 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-42 v6.1

Table 30 • A40MX04 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Logic Module Propagation Delays

tPD1 Single Module 1.2 1.4 1.6 1.9 2.7 ns

tPD2 Dual-Module Macros 2.3 3.1 3.5 4.1 5.7 ns

tCO Sequential Clock-to-Q 1.2 1.4 1.6 1.9 2.7 ns

tGO Latch G-to-Q 1.2 1.4 1.6 1.9 2.7 ns

tRS Flip-Flop (Latch) Reset-to-Q 1.2 1.4 1.6 1.9 2.7 ns

Logic Module Predicted Routing Delays1

tRD1 FO=1 Routing Delay 1.2 1.6 1.8 2.1 3.0 ns

tRD2 FO=2 Routing Delay 1.9 2.2 2.5 2.9 4.1 ns

tRD3 FO=3 Routing Delay 2.4 2.8 3.2 3.7 5.2 ns

tRD4 FO=4 Routing Delay 2.9 3.4 3.9 4.5 6.3 ns

tRD8 FO=8 Routing Delay 5.0 5.8 6.6 7.8 10.9 ns

Logic Module Sequential Timing2

tSUD Flip-Flop (Latch) Data Input Set-Up 3.1 3.5 4.0 4.7 6.6 ns

tHD3Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 3.1 3.5 4.0 4.7 6.6 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

3.3 3.8 4.3 5.0 7.0 ns

tWASYN Flip-Flop (Latch)

Asynchronous Pulse Width

3.3 3.8 4.3 5.0 7.0 ns

tAFlip-Flop Clock Input Period 4.8 5.6 6.3 7.5 10.4 ns

fMAX Flip-Flop (Latch) Clock Frequency

(FO = 128)

181 167 154 134 80 MHz

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 0.7 0.8 0.9 1.1 1.5 ns

tINYL Pad-to-Y LOW 0.6 0.7 0.8 1.0 1.3 ns

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer utility from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-43

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.1 2.4 2.2 3.2 4.5 ns

tIRD2 FO=2 Routing Delay 2.6 3.0 3.4 4.0 5.6 ns

tIRD3 FO=3 Routing Delay 3.1 3.6 4.1 4.8 6.7 ns

tIRD4 FO=4 Routing Delay 3.6 4.2 4.8 5.6 7.8 ns

tIRD8 FO=8 Routing Delay 5.7 6.6 7.5 8.8 12.4 ns

Global Clock Network

tCKH Input Low to HIGH FO = 16

FO = 128

4.6

5.3

6.0

7.0

9.8

tCKL Input High to LOW FO = 16

FO = 128

4.8

5.6

6.3

7.4

10.4

tPWH Minimum Pulse

Width HIGH

FO = 16

FO = 128

2.2

2.4

2.6

2.7

2.9

3.1

3.4

3.6

4.8

5.1

tPWL Minimum Pulse

Width LOW

FO = 16

FO = 128

2.2

2.4

2.6

2.7

2.9

3.01

3.4

3.6

4.8

5.1

tCKSW Maximum Skew FO = 16

FO = 128

0.4

0.5

0.6

0.5

0.7

0.6

0.8

1.2

tPMinimum Period FO = 16

FO = 128

4.7

4.8

5.4

5.6

6.1

6.3

7.2

7.5

10.0

10.4

fMAX Maximum

Frequency

FO = 16

FO = 128

188

181

175

168

160

154

139

134

MHz

TTL Output Module Timing4

tDLH Data-to-Pad HIGH 3.3 3.8 4.3 5.1 7.2 ns

tDHL Data-to-Pad LOW 4.0 4.6 5.2 6.1 8.6 ns

tENZH Enable Pad Z to HIGH 3.7 4.3 4.9 5.8 8.0 ns

tENZL Enable Pad Z to LOW 4.7 5.4 6.1 7.2 10.1 ns

tENHZ Enable Pad HIGH to Z 7.9 9.1 10.4 12.2 17.1 ns

tENLZ Enable Pad LOW to Z 5.9 6.8 7.7 9.0 12.6 ns

dTLH Delta LOW to HIGH 0.02 0.02 0.03 0.03 0.04 ns/pF

dTHL Delta HIGH to LOW 0.03 0.03 0.03 0.04 0.06 ns/pF

Table 30 • A40MX04 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer utility from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-44 v6.1

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 3.9 4.5 5.1 6.05 8.5 ns

tDHL Data-to-Pad LOW 3.4 3.9 4.4 5.2 7.3 ns

tENZH Enable Pad Z to HIGH 3.4 3.9 4.4 5.2 7.3 ns

tENZL Enable Pad Z to LOW 4.9 5.6 6.4 7.5 10.5 ns

tENHZ Enable Pad HIGH to Z 7.9 9.1 10.4 12.2 17.0 ns

tENLZ Enable Pad LOW to Z 5.9 6.8 7.7 9.0 12.6 ns

dTLH Delta LOW to HIGH 0.03 0.04 0.04 0.05 0.07 ns/pF

dTHL Delta HIGH to LOW 0.02 0.02 0.03 0.03 0.04 ns/pF

Table 30 • A40MX04 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer utility from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-45

Table 31 • A40MX04 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Logic Module Propagation Delays

tPD1 Single Module 1.7 2.0 2.3 2.7 3.7 ns

tPD2 Dual-Module Macros 3.7 4.3 4.9 5.7 8.0 ns

tCO Sequential Clock-to-Q 1.7 2.0 2.3 2.7 3.7 ns

tGO Latch G-to-Q 1.7 2.0 2.3 2.7 3.7 ns

tRS Flip-Flop (Latch) Reset-to-Q 1.7 2.0 2.3 2.7 3.7 ns

Logic Module Predicted Routing Delays1

tRD1 FO=1 Routing Delay 1.9 2.2 2.5 3.0 4.2 ns

tRD2 FO=2 Routing Delay 2.7 3.1 3.5 4.1 5.7 ns

tRD3 FO=3 Routing Delay 3.4 3.9 4.4 5.2 7.3 ns

tRD4 FO=4 Routing Delay 4.1 4.8 5.4 6.3 8.9 ns

tRD8 FO=8 Routing Delay 7.1 8.1 9.2 10.9 15.2 ns

Logic Module Sequential Timing2

tSUD Flip-Flop (Latch) Data Input Set-Up 4.3 5.0 5.6 6.6 9.2 ns

tHD3Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 4.3 5.0 5.6 6.6 9.2 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

4.6 5.3 5.6 7.0 9.8 ns

tWASYN Flip-Flop (Latch)

Asynchronous Pulse Width

4.6 5.3 5.6 7.0 9.8 ns

tAFlip-Flop Clock Input Period 6.8 7.8 8.9 10.4 14.6 ns

fMAX Flip-Flop (Latch) Clock Frequency

(FO = 128)

109 101 92 80 48 MHz

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.0 1.1 1.3 1.5 2.1 ns

tINYL Pad-to-Y LOW 0.9 1.0 1.1 1.3 1.9 ns

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-46 v6.1

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.9 3.3 3.8 4.5 6.3 ns

tIRD2 FO=2 Routing Delay 3.6 4.2 4.8 5.6 7.8 ns

tIRD3 FO=3 Routing Delay 4.4 5.0 5.7 6.7 9.4 ns

tIRD4 FO=4 Routing Delay 5.1 5.9 6.7 7.8 11.0 ns

tIRD8 FO=8 Routing Delay 8.0 9.3 10.5 12.4 17.2 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 16

FO = 128

6.4

7.4

8.4

9.9

13.8

tCKL Input HIGH to LOW FO = 16

FO = 128

6.8

7.8

8.9

10.4

14.6

tPWH Minimum Pulse

Width HIGH

FO = 16

FO = 128

3.1

3.3

3.6

3.8

4.1

4.3

4.8

5.1

6.7

7.1

tPWL Minimum Pulse

Width LOW

FO = 16

FO = 128

3.1

3.3

3.6

3.8

4.1

4.3

4.8

5.1

6.7

7.1

tCKSW Maximum Skew FO = 16

FO = 128

0.6

0.8

0.6

0.9

0.7

1.0

0.8

1.2

1.6

tPMinimum Period FO = 16

FO = 128

6.5

6.8

7.5

7.8

8.5

8.9

10.1

10.4

14.1

14.6

fMAX Maximum Frequency FO = 16

FO = 128

113

109

105

101

MHz

TTL Output Module Timing4

tDLH Data-to-Pad HIGH 4.7 5.4 6.1 7.2 10.0 ns

tDHL Data-to-Pad LOW 5.6 6.4 7.3 8.6 12.0 ns

tENZH Enable Pad Z to HIGH 5.2 6.0 6.9 8.1 11.3 ns

tENZL Enable Pad Z to LOW 6.6 7.6 8.6 10.1 14.1 ns

tENHZ Enable Pad HIGH to Z 11.1 12.8 14.5 17.1 23.9 ns

tENLZ Enable Pad LOW to Z 8.2 9.5 10.7 12.6 17.7 ns

dTLH Delta LOW to HIGH 0.03 0.03 0.04 0.04 0.06 ns/pF

dTHL Delta HIGH to LOW 0.04 0.04 0.05 0.06 0.08 ns/pF

Table 31 • A40MX04 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-47

CMOS Output Module Timing4

tDLH Data-to-Pad HIGH 5.5 6.4 7.2 8.5 11.9 ns

tDHL Data-to-Pad LOW 4.8 5.5 6.2 7.3 10.2 ns

tENZH Enable Pad Z to HIGH 4.7 5.5 6.2 7.3 10.2 ns

tENZL Enable Pad Z to LOW 6.8 7.9 8.9 10.5 14.7 ns

tENHZ Enable Pad HIGH to Z 11.1 12.8 14.5 17.1 23.9 ns

tENLZ Enable Pad LOW to Z 8.2 9.5 10.7 12.6 17.7 ns

dTLH Delta LOW to HIGH 0.05 0.05 0.06 0.07 0.10 ns/pF

dTHL Delta HIGH to LOW 0.03 0.03 0.04 0.04 0.06 ns/pF

Table 31 • A40MX04 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check the hold

time for this macro.

4. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-48 v6.1

Table 32 • A42MX09 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Logic Module Propagation Delays1

tPD1 Single Module 1.2 1.3 1.5 1.8 2.5 ns

tCO Sequential Clock-to-Q 1.3 1.4 1.6 1.9 2.7 ns

tGO Latch G-to-Q 1.2 1.4 1.6 1.8 2.6 ns

tRS Flip-Flop (Latch) Reset-to-Q 1.2 1.6 1.8 2.1 2.9 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 0.7 0.8 0.9 1.0 1.4 ns

tRD2 FO=2 Routing Delay 0.9 1.0 1.2 1.4 1.9 ns

tRD3 FO=3 Routing Delay 1.2 1.3 1.5 1.7 2.4 ns

tRD4 FO=4 Routing Delay 1.4 1.5 1.7 2.0 2.9 ns

tRD8 FO=8 Routing Delay 2.3 2.6 2.9 3.4 4.8 ns

Logic Module Sequential Timing3, 4

tSUD Flip-Flop (Latch) Data Input Set-Up 0.3 0.4 0.4 0.5 0.7 ns

tHD Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 0.4 0.5 0.5 0.6 0.8 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

3.4 3.8 4.3 5.0 7.0 ns

tWASYN Flip-Flop (Latch) Asynchronous

Pulse Width

4.5 4.9 5.6 6.6 9.2 ns

tAFlip-Flop Clock Input Period 3.5 3.8 4.3 5.1 7.1 ns

tINH Input Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Buffer Latch Set-Up 0.3 0.3 0.4 0.4 0.6 ns

tOUTH Output Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tOUTSU Output Buffer Latch Set-Up 0.3 0.3 0.4 0.4 0.6 ns

fMAX Flip-Flop (Latch) Clock Frequency 268 244 224 195 117 MHz

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-49

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.0 1.2 1.3 1.6 2.2 ns

tINYL Pad-to-Y LOW 0.8 0.9 1.0 1.2 1.7 ns

tINGH G to Y HIGH 1.3 1.4 1.6 1.9 2.7 ns

tINGL G to Y LOW 1.3 1.4 1.6 1.9 2.7 ns

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 2.0 2.2 2.5 3.0 4.2 ns

tIRD2 FO=2 Routing Delay 2.3 2.5 2.9 3.4 4.7 ns

tIRD3 FO=3 Routing Delay 2.5 2.8 3.2 3.7 5.2 ns

tIRD4 FO=4 Routing Delay 2.8 3.1 3.5 4.1 5.7 ns

tIRD8 FO=8 Routing Delay 3.7 4.1 4.7 5.5 7.7 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 32

FO = 256

2.4

2.7

3.0

3.4

3.6

4.0

5.0

5.5

tCKL Input HIGH to LOW FO = 32

FO = 256

3.5

3.9

4.3

4.4

4.9

5.2

5.7

7.3

8.0

tPWH Minimum Pulse

Width HIGH

FO = 32

FO = 256

1.2

1.3

1.4

1.5

1.7

1.8

2.0

2.5

2.7

tPWL Minimum Pulse

Width LOW

FO = 32

FO = 256

1.2

1.3

1.4

1.5

1.7

1.8

2.0

2.5

2.7

tCKSW Maximum Skew FO = 32

FO = 256

0.3

0.4

0.5

0.6

tSUEXT Input Latch External

Set-Up

FO = 32

FO = 256

0.0

tHEXT Input Latch External

Hold

FO = 32

FO = 256

2.3

2.2

2.6

2.4

3.0

3.3

3.5

3.9

4.9

5.5

tPMinimum Period FO = 32

FO = 256

3.4

3.7

4.1

4.0

4.5

4.7

5.2

7.8

8.6

fMAX Maximum Frequency FO = 32

FO = 256

296

268

269

244

247

224

215

195

129

117

MHz

Table 32 • A42MX09 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-50 v6.1

TTL Output Module Timing5

tDLH Data-to-Pad HIGH 2.5 2.7 3.1 3.6 5.1 ns

tDHL Data-to-Pad LOW 2.9 3.2 3.6 4.3 6.0 ns

tENZH Enable Pad Z to HIGH 2.6 2.9 3.3 3.9 5.5 ns

tENZL Enable Pad Z to LOW 2.9 3.2 3.7 4.3 6.1 ns

tENHZ Enable Pad HIGH to Z 4.9 5.4 6.2 7.3 10.2 ns

tENLZ Enable Pad LOW to Z 5.3 5.9 6.7 7.9 11.1 ns

tGLH G-to-Pad HIGH 2.6 2.9 3.3 3.8 5.3 ns

tGHL G-to-Pad LOW 2.6 2.9 3.3 3.8 5.3 ns

tLSU I/O Latch Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tLH I/O Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad), 64 Clock Loading

5.2 5.8 6.6 7.7 10.8 ns

tACO Array Clock-to-Out (Pad-to-Pad),

64 Clock Loading

7.4 8.2 9.3 10.9 15.3 ns

dTLH Capacity Loading, LOW to HIGH 0.03 0.03 0.03 0.04 0.06 ns/pF

dTHL Capacity Loading, HIGH to LOW 0.04 0.04 0.04 0.05 0.07 ns/pF

Table 32 • A42MX09 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-51

CMOS Output Module Timing5

tDLH Data-to-Pad HIGH 2.4 2.7 3.1 3.6 5.1 ns

tDHL Data-to-Pad LOW 2.9 3.2 3.6 4.3 6.0 ns

tENZH Enable Pad Z to HIGH 2.7 2.9 3.3 3.9 5.5 ns

tENZL Enable Pad Z to LOW 2.9 3.2 3.7 4.3 6.1 ns

tENHZ Enable Pad HIGH to Z 4.9 5.4 6.2 7.3 10.2 ns

tENLZ Enable Pad LOW to Z 5.3 5.9 6.7 7.9 11.1 ns

tGLH G-to-Pad HIGH 4.2 4.6 5.2 6.1 8.6 ns

tGHL G-to-Pad LOW 4.2 4.6 5.2 6.1 8.6 ns

tLSU I/O Latch Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tLH I/O Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad), 64 Clock Loading

5.2 5.8 6.6 7.7 10.8 ns

tACO Array Clock-to-Out (Pad-to-Pad),

64 Clock Loading

7.4 8.2 9.3 10.9 15.3 ns

dTLH Capacity Loading, LOW to HIGH 0.03 0.03 0.03 0.04 0.06 ns/pF

dTHL Capacity Loading, HIGH to LOW 0.04 0.04 0.04 0.05 0.07 ns/pF

Table 32 • A42MX09 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-52 v6.1

Table 33 • A42MX09 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Logic Module Propagation Delays1

tPD1 Single Module 1.6 1.8 2.1 2.5 3.5 ns

tCO Sequential Clock-to-Q 1.8 2.0 2.3 2.7 3.8 ns

tGO Latch G-to-Q 1.7 1.9 2.1 2.5 3.5 ns

tRS Flip-Flop (Latch) Reset-to-Q 2.0 2.2 2.5 2.9 4.1 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.0 1.1 1.2 1.4 2.0 ns

tRD2 FO=2 Routing Delay 1.3 1.4 1.6 1.9 2.7 ns

tRD3 FO=3 Routing Delay 1.6 1.8 2.0 2.4 3.3 ns

tRD4 FO=4 Routing Delay 1.9 2.1 2.4 2.9 4.0 ns

tRD8 FO=8 Routing Delay 3.2 3.6 4.1 4.8 6.7 ns

Logic Module Sequential Timing 3, 4

tSUD Flip-Flop (Latch) Data Input Set-Up 0.5 0.5 0.6 0.7 0.9 ns

tHD Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 0.6 0.6 0.7 0.8 1.2 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

4.7 5.3 6.0 7.0 9.8 ns

tWASYN Flip-Flop (Latch) Asynchronous

Pulse Width

6.2 6.9 7.8 9.2 12.9 ns

tAFlip-Flop Clock Input Period 5.0 5.6 6.2 7.1 9.9 ns

tINH Input Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Buffer Latch Set-Up 0.3 0.3 0.3 0.4 0.6 ns

tOUTH Output Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tOUTSU Output Buffer Latch Set-Up 0.3 0.3 0.3 0.4 0.6 ns

fMAX Flip-Flop (Latch) Clock

Frequency

161 146 135 117 70 MHz

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-53

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.5 1.6 1.8 2.17 3.0 ns

tINYL Pad-to-Y LOW 1.2 1.3 1.4 1.7 2.4 ns

tINGH G to Y HIGH 1.8 2.0 2.3 2.7 3.7 ns

tINGL G to Y LOW 1.8 2.0 2.3 2.7 3.7 ns

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 2.8 3.2 3.6 4.2 5.9 ns

tIRD2 FO=2 Routing Delay 3.2 3.5 4.0 4.7 6.6 ns

tIRD3 FO=3 Routing Delay 3.5 3.9 4.4 5.2 7.3 ns

tIRD4 FO=4 Routing Delay 3.9 4.3 4.9 5.7 8.0 ns

tIRD8 FO=8 Routing Delay 5.2 5.8 6.6 7.7 10.8 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 32

FO = 256

4.1

4.5

5.0

5.1

5.6

6.0

6.7

8.4

9.3

tCKL Input HIGH to LOW FO = 32

FO = 256

5.0

5.4

5.5

6.0

6.2

6.8

7.3

8.0

10.2

11.2

tPWH Minimum Pulse

Width HIGH

FO = 32

FO = 256

1.7

1.9

2.1

2.3

2.5

2.7

3.5

3.8

tPWL Minimum Pulse

Width LOW

FO = 32

FO = 256

1.7

1.9

2.1

2.3

2.5

2.7

3.5

3.8

tCKSW Maximum Skew FO = 32

FO = 256

0.4

0.5

0.6

0.9

tSUEXT Input Latch External

Set-Up

FO = 32

FO = 256

0.0

tHEXT Input Latch External

Hold

FO = 32

FO = 256

3.3

3.7

4.1

4.2

4.6

4.9

5.5

6.9

7.6

tPMinimum Period FO = 32

FO = 256

5.6

6.1

6.2

6.8

6.7

7.4

7.8

8.5

12.9

14.2

fMAX Maximum

Frequency

FO = 32

FO = 256

177

161

146

148

135

129

117

MHz

Table 33 • A42MX09 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-54 v6.1

TTL Output Module Timing5

tDLH Data-to-Pad HIGH 3.4 3.8 4.3 5.1 7.1 ns

tDHL Data-to-Pad LOW 4.0 4.5 5.1 6.1 8.3 ns

tENZH Enable Pad Z to

HIGH

3.7 4.1 4.6 5.5 7.6 ns

tENZL Enable Pad Z to

LOW

4.1 4.5 5.1 6.1 8.5 ns

tENHZ Enable Pad HIGH to

6.9 7.6 8.6 10.2 14.2 ns

tENLZ Enable Pad LOW to

7.5 8.3 9.4 11.1 15.5 ns

tGLH G-to-Pad HIGH 5.8 6.5 7.3 8.6 12.0 ns

tGHL G-to-Pad LOW 5.8 6.5 7.3 8.6 12.0 ns

tLSU I/O Latch Set-Up 0.7 0.8 0.9 1.0 1.4 ns

tLH I/O Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-

Out (Pad-to-Pad),

64 Clock Loading

8.7 9.7 10.9 12.9 18.0 ns

tACO Array Clock-to-Out

(Pad-to-Pad),

64 Clock Loading

12.2 13.5 15.4 18.1 25.3 ns

dTLH Capacity Loading,

LOW to HIGH

0.00 0.00 0.00 0.10 0.01 ns/pF

dTHL Capacity Loading,

HIGH to LOW

0.09 0.10 0.10 0.10 0.10 ns/pF

Table 33 • A42MX09 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-55

CMOS Output Module Timing5

tDLH Data-to-Pad HIGH 3.4 3.8 5.5 6.4 9.0 ns

tDHL Data-to-Pad LOW 4.1 4.5 4.2 5.0 7.0 ns

tENZH Enable Pad Z to HIGH 3.7 4.1 4.6 5.5 7.6 ns

tENZL Enable Pad Z to LOW 4.1 4.5 5.1 6.1 8.5 ns

tENHZ Enable Pad HIGH to Z 6.9 7.6 8.6 10.2 14.2 ns

tENLZ Enable Pad LOW to Z 7.5 8.3 9.4 11.1 15.5 ns

tGLH G-to-Pad HIGH 5.8 6.5 7.3 8.6 12.0 ns

tGHL G-to-Pad LOW 5.8 6.5 7.3 8.6 12.0 ns

tLSU I/O Latch Set-Up 0.7 0.8 0.9 1.0 1.4 ns

tLH I/O Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad), 64 Clock Loading

8.7 9.7 10.9 12.9 18.0 ns

tACO Array Clock-to-Out (Pad-to-Pad),

64 Clock Loading

12.2 13.5 15.4 18.1 25.3 ns

dTLH Capacity Loading, LOW to HIGH 0.04 0.04 0.05 0.06 0.08 ns/pF

dTHL Capacity Loading, HIGH to LOW 0.05 0.05 0.06 0.07 0.10 ns/pF

Table 33 • A42MX09 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-56 v6.1

Table 34 • A42MX16 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Logic Module Propagation Delays1

tPD1 Single Module 1.4 1.5 1.7 2.0 2.8 ns

tCO Sequential Clock-to-Q 1.4 1.6 1.8 2.1 3.0 ns

tGO Latch G-to-Q 1.4 1.5 1.7 2.0 2.8 ns

tRS Flip-Flop (Latch) Reset-to-Q 1.6 1.7 2.0 2.3 3.3 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 0.8 0.9 1.0 1.2 1.6 ns

tRD2 FO=2 Routing Delay 1.0 1.2 1.3 1.5 2.1 ns

tRD3 FO=3 Routing Delay 1.3 1.4 1.6 1.9 2.7 ns

tRD4 FO=4 Routing Delay 1.6 1.7 2.0 2.3 3.2 ns

tRD8 FO=8 Routing Delay 2.6 2.9 3.2 3.8 5.3 ns

Logic Module Sequential Timing3,4

tSUD Flip-Flop (Latch) Data Input Set-Up 0.3 0.4 0.4 0.5 0.7 ns

tHD Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 0.7 0.8 0.9 1.0 1.4 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

3.4 3.8 4.3 5.0 7.1 ns

tWASYN Flip-Flop (Latch) Asynchronous

Pulse Width

4.5 5.0 5.6 6.6 9.2 ns

tAFlip-Flop Clock Input Period 6.8 7.6 8.6 10.1 14.1 ns

tINH Input Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Buffer Latch Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tOUTH Output Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tOUTSU Output Buffer Latch Set-Up 0.5 0.5 0.6 0.7 1.0 ns

fMAX Flip-Flop (Latch) Clock Frequency 215 195 179 156 94 MHz

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, point and position whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-57

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.1 1.2 1.3 1.6 2.2 ns

tINYL Pad-to-Y LOW 0.8 0.9 1.0 1.2 1.7 ns

tINGH G to Y HIGH 1.4 1.6 1.8 2.1 2.9 ns

tINGL G to Y LOW 1.4 1.6 1.8 2.1 2.9 ns

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 1.8 2.0 2.3 2.7 4.0 ns

tIRD2 FO=2 Routing Delay 2.1 2.3 2.6 3.1 4.3 ns

tIRD3 FO=3 Routing Delay 2.3 2.6 3.0 3.5 4.9 ns

tIRD4 FO=4 Routing Delay 2.6 3.0 3.3 3.9 5.4 ns

tIRD8 FO=8 Routing Delay 3.6 4.0 4.6 5.4 7.5 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 32

FO = 384

2.6

2.9

3.2

3.3

3.6

3.9

4.3

5.4

6.0

tCKL Input HIGH to LOW FO = 32

FO = 384

3.8

4.5

4.2

5.0

4.8

5.6

6.6

7.8

9.2

tPWH Minimum Pulse

Width HIGH

FO = 32

FO = 384

3.2

3.7

3.5

4.1

4.0

4.6

4.7

5.4

6.6

7.6

tPWL Minimum Pulse

Width LOW

FO = 32

FO = 384

3.2

3.7

3.5

4.1

4.0

4.6

4.7

5.4

6.6

7.6

tCKSW Maximum Skew FO = 32

FO = 384

0.3

0.4

0.5

0.7

tSUEXT Input Latch External

Set-Up

FO = 32

FO = 384

0.0

tHEXT Input Latch External

Hold

FO = 32

FO = 384

2.8

3.2

3.1

3.5

5.5

4.0

4.1

4.7

5.7

6.6

tPMinimum Period FO = 32

FO = 384

4.2

4.6

4.67

5.1

5.6

5.8

6.4

9.7

10.7

fMAX Maximum

Frequency

FO = 32

FO = 384

237

215

195

198

179

172

156

103

MHz

Table 34 • A42MX16 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, point and position whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-58 v6.1

TTL Output Module Timing5

tDLH Data-to-Pad HIGH 2.5 2.8 3.2 3.7 5.2 ns

tDHL Data-to-Pad LOW 3.0 3.3 3.7 4.4 6.1 ns

tENZH Enable Pad Z to HIGH 2.7 3.0 3.4 4.0 5.6 ns

tENZL Enable Pad Z to LOW 3.0 3.3 3.8 4.4 6.2 ns

tENHZ Enable Pad HIGH to Z 5.4 6.0 6.8 8.0 11.2 ns

tENLZ Enable Pad LOW to Z 5.0 5.6 6.3 7.4 10.4 ns

tGLH G-to-Pad HIGH 2.9 3.2 3.6 4.3 6.0 ns

tGHL G-to-Pad LOW 2.9 3.2 3.6 4.3 6.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad), 64 Clock Loading

5.7 6.3 7.1 8.4 11.9 ns

tACO Array Clock-to-Out (Pad-to-Pad),

64 Clock Loading

8.0 8.9 10.1 11.9 16.7 ns

dTLH Capacitive Loading, LOW to HIGH 0.03 0.03 0.03 0.04 0.06 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.04 0.04 0.04 0.05 0.07 ns/pF

CMOS Output Module Timing5

tDLH Data-to-Pad HIGH 3.2 3.6 4.0 4.7 6.6 ns

tDHL Data-to-Pad LOW 2.5 2.7 3.1 3.6 5.1 ns

tENZH Enable Pad Z to HIGH 2.7 3.0 3.4 4.0 5.6 ns

tENZL Enable Pad Z to LOW 3.0 3.3 3.8 4.4 6.2 ns

tENHZ Enable Pad HIGH to Z 5.4 6.0 6.8 8.0 11.2 ns

tENLZ Enable Pad LOW to Z 5.0 5.6 6.3 7.4 10.4 ns

tGLH G-to-Pad HIGH 5.1 5.6 6.4 7.5 10.5 ns

tGHL G-to-Pad LOW 5.1 5.6 6.4 7.5 10.5 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad), 64 Clock Loading

5.7 6.3 7.1 8.4 11.9 ns

tACO Array Clock-to-Out (Pad-to-Pad),

64 Clock Loading

8.0 8.9 10.1 11.9 16.7 ns

dTLH Capacitive Loading, LOW to HIGH 0.03 0.03 0.03 0.04 0.06 ns/pF

Table 34 • A42MX16 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, point and position whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-59

Table 35 • A42MX16 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays1

tPD1 Single Module 1.9 2.1 2.4 2.8 4.0 ns

tCO Sequential Clock-to-Q 2.0 2.2 2.5 3.0 4.2 ns

tGO Latch G-to-Q 1.9 2.1 2.4 2.8 4.0 ns

tRS Flip-Flop (Latch) Reset-to-Q 2.2 2.4 2.8 3.3 4.6 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.1 1.2 1.4 1.6 2.3 ns

tRD2 FO=2 Routing Delay 1.5 1.6 1.8 2.1 3.0 ns

tRD3 FO=3 Routing Delay 1.8 2.0 2.3 2.7 3.8 ns

tRD4 FO=4 Routing Delay 2.2 2.4 2.7 3.2 4.5 ns

tRD8 FO=8 Routing Delay 3.6 4.0 4.5 5.3 7.5 ns

Logic Module Sequential Timing3, 4

tSUD Flip-Flop (Latch) Data Input Set-Up 0.5 0.5 0.6 0.7 0.9 ns

tHD Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 1.0 1.1 1.2 1.4 2.0 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

4.8 5.3 6.0 7.1 9.9 ns

tWASYN Flip-Flop (Latch) Asynchronous

Pulse Width

6.2 6.9 7.9 9.2 12.9 ns

tAFlip-Flop Clock Input Period 9.5 10.6 12.0 14.1 19.8 ns

tINH Input Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Buffer Latch Set-Up 0.7 0.8 0.9 1.01 1.4 ns

tOUTH Output Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tOUTSU Output Buffer Latch Set-Up 0.7 0.8 0.89 1.01 1.4 ns

fMAX Flip-Flop (Latch) Clock Frequency 129 117 108 94 56 MHz

Notes:

1. For dual-module macros use tPD1 + tRD1 + taped, to + tRD1 + taped, or tPD1 + tRD1 + tusk, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-60 v6.1

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.5 1.6 1.9 2.2 3.1 ns

tINYL Pad-to-Y LOW 1.1 1.3 1.4 1.7 2.4 ns

tINGH G to Y HIGH 2.0 2.2 2.5 2.9 4.1 ns

tINGL G to Y LOW 2.0 2.2 2.5 2.9 4.1 ns

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 2.6 2.9 3.2 3.8 5.3 ns

tIRD2 FO=2 Routing Delay 2.9 3.2 3.7 4.3 6.1 ns

tIRD3 FO=3 Routing Delay 3.3 3.6 4.1 4.9 6.8 ns

tIRD4 FO=4 Routing Delay 3.6 4.0 4.6 5.4 7.6 ns

tIRD8 FO=8 Routing Delay 5.1 5.6 6.4 7.5 10.5 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 32

FO = 384

4.4

4.8

5.3

5.5

6.0

6.5

7.1

9.0

9.9

tCKL Input HIGH to LOW FO = 32

FO = 384

5.3

6.2

5.9

6.9

6.7

7.9

7.8

9.2

11.0

12.9

tPWH Minimum Pulse

Width HIGH

FO = 32

FO = 384

5.7

6.6

6.3

7.4

7.1

8.3

8.4

9.8

11.8

13.7

tPWL Minimum Pulse

Width LOW

FO = 32

FO = 384

5.3

6.2

5.9

6.9

6.7

7.9

7.8

9.2

11.0

12.9

tCKSW Maximum Skew FO = 32

FO = 384

0.5

2.2

0.5

2.4

0.6

2.7

0.7

3.2

1.0

4.5

tSUEXT Input Latch External

Set-Up

FO = 32

FO = 384

0.0

tHEXT Input Latch External

Hold

FO = 32

FO = 384

3.9

4.5

4.3

4.9

5.6

5.7

6.6

8.0

9.2

tPMinimum Period FO = 32

FO = 384

7.0

7.7

7.8

8.6

8.4

9.3

9.7

10.7

16.2

17.8

fMAX Maximum Frequency FO = 32

FO = 384

142

129

117

119

108

103

MHz

Table 35 • A42MX16 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros use tPD1 + tRD1 + taped, to + tRD1 + taped, or tPD1 + tRD1 + tusk, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-61

TTL Output Module Timing5

tDLH Data-to-Pad HIGH 3.5 3.9 4.4 5.2 7.3 ns

tDHL Data-to-Pad LOW 4.1 4.6 5.2 6.1 8.6 ns

tENZH Enable Pad Z to HIGH 3.8 4.2 4.8 5.6 7.8 ns

tENZL Enable Pad Z to LOW 4.2 4.6 5.3 6.2 8.7 ns

tENHZ Enable Pad HIGH to Z 7.6 8.4 9.5 11.2 15.7 ns

tENLZ Enable Pad LOW to Z 7.0 7.8 8.8 10.4 14.5 ns

tGLH G-to-Pad HIGH 4.8 5.3 6.0 7.2 10.0 ns

tGHL G-to-Pad LOW 4.8 5.3 6.0 7.2 10.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad), 64 Clock Loading

8.0 8.9 10.1 11.9 16.7 ns

tACO Array Clock-to-Out (Pad-to-Pad),

64 Clock Loading

11.3 12.5 14.2 16.7 23.3 ns

dTLH Capacitive Loading, LOW to HIGH 0.04 0.04 0.05 0.06 0.08 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.05 0.05 0.06 0.07 0.10 ns/pF

CMOS Output Module Timing5

tDLH Data-to-Pad HIGH 4.5 5.0 5.6 6.6 9.3 ns

tDHL Data-to-Pad LOW 3.4 3.8 4.3 5.1 7.1 ns

tENZH Enable Pad Z to HIGH 3.8 4.2 4.8 5.6 7.8 ns

tENZL Enable Pad Z to LOW 4.2 4.6 5.3 6.2 8.7 ns

tENHZ Enable Pad HIGH to Z 7.6 8.4 9.5 11.2 15.7 ns

tENLZ Enable Pad LOW to Z 7.0 7.8 8.8 10.4 14.5 ns

tGLH G-to-Pad HIGH 7.1 7.9 8.9 10.5 14.7 ns

tGHL G-to-Pad LOW 7.1 7.9 8.9 10.5 14.7 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad), 64 Clock Loading

8.0 8.9 10.1 11.9 16.7 ns

tACO Array Clock-to-Out (Pad-to-Pad),

64 Clock Loading

11.3 12.5 14.2 16.7 23.3 ns

dTLH Capacitive Loading, LOW to HIGH 0.04 0.04 0.05 0.06 0.08 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.05 0.05 0.06 0.07 0.10 ns/pF

Table 35 • A42MX16 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros use tPD1 + tRD1 + taped, to + tRD1 + taped, or tPD1 + tRD1 + tusk, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-62 v6.1

Table 36 • A42MX24 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Functions1

tPD Internal Array Module Delay 1.2 1.3 1.5 1.8 2.5 ns

tPDD Internal Decode Module Delay 1.4 1.6 1.8 2.1 3.0 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 0.8 0.9 1.0 1.2 1.7 ns

tRD2 FO=2 Routing Delay 1.0 1.2 1.3 1.5 2.1 ns

tRD3 FO=3 Routing Delay 1.3 1.4 1.6 1.9 2.6 ns

tRD4 FO=4 Routing Delay 1.5 1.7 1.9 2.2 3.1 ns

tRD5 FO=8 Routing Delay 2.4 2.7 3.0 3.6 5.0 ns

Logic Module Sequential Timing3, 4

tCO Flip-Flop Clock-to-Output 1.3 1.4 1.6 1.9 2.7 ns

tGO Latch Gate-to-Output 1.2 1.3 1.5 1.8 2.5 ns

tSUD Flip-Flop (Latch) Set-Up Time 0.3 0.4 0.4 0.5 0.7 ns

tHD Flip-Flop (Latch) Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRO Flip-Flop (Latch) Reset-to-Output 1.4 1.6 1.8 2.1 2.9 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 0.4 0.5 0.5 0.6 0.8 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

3.3 3.7 4.2 4.9 6.9 ns

tWASYN Flip-Flop (Latch) Asynchronous

Pulse Width

4.4 4.8 5.3 6.5 9.0

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1.0 1.1 1.3 1.5 2.1 ns

tINGO Input Latch Gate-to-Output 1.3 1.4 1.6 1.9 2.6 ns

tINH Input Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Latch Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tILA Latch Active Pulse Width 4.7 5.2 5.9 6.9 9.7 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-63

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 1.8 2.0 2.3 2.7 3.8 ns

tIRD2 FO=2 Routing Delay 2.1 2.3 2.6 3.1 4.3 ns

tIRD3 FO=3 Routing Delay 2.3 2.5 2.9 3.4 4.8 ns

tIRD4 FO=4 Routing Delay 2.5 2.8 3.2 3.7 5.2 ns

tIRD8 FO=8 Routing Delay 3.4 3.8 4.3 5.1 7.1 ns

Global Clock Network

tCKH Input LOW to HIGH FO=32

FO=486

2.6

2.9

3.2

3.3

3.6

3.9

4.3

5.4

5.9

tCKL Input HIGH to LOW FO=32

FO=486

3.7

4.3

4.1

4.7

4.6

5.4

6.3

7.6

8.8

tPWH Minimum Pulse

Width HIGH

FO=32

FO=486

2.2

2.4

2.6

2.7

3.0

3.2

3.5

4.5

4.9

tPWL Minimum Pulse

Width LOW

FO=32

FO=486

2.2

2.4

2.6

2.7

3.0

3.2

3.5

4.5

4.9

tCKSW Maximum Skew FO=32

FO=486

0.5

0.6

0.7

0.8

1.1

tSUEXT Input Latch External

Set-Up

FO=32

FO=486

0.0

tHEXT Input Latch External

Hold

FO=32

FO=486

2.8

3.3

3.1

3.7

3.5

4.2

4.1

4.9

5.7

6.9

tPMinimum Period

(1/fMAX)

FO=32

FO=486

4.7

5.1

5.2

5.7

6.2

6.5

7.1

10.9

11.9

Table 36 • A42MX24 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-64 v6.1

TTL Output Module Timing5

tDLH Data-to-Pad HIGH 2.4 2.7 3.1 3.6 5.1 ns

tDHL Data-to-Pad LOW 2.8 3.2 3.6 4.2 5.9 ns

tENZH Enable Pad Z to HIGH 2.5 2.8 3.2 3.8 5.3 ns

tENZL Enable Pad Z to LOW 2.8 3.1 3.5 4.2 5.9 ns

tENHZ Enable Pad HIGH to Z 5.2 5.7 6.5 7.6 10.7 ns

tENLZ Enable Pad LOW to Z 4.8 5.3 6.0 7.1 9.9 ns

tGLH G-to-Pad HIGH 2.9 3.2 3.6 4.3 6.0 ns

tGHL G-to-Pad LOW 2.9 3.2 3.6 4.3 6.0 ns

tLSU I/O Latch Output Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tLH I/O Latch Output Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out

(Pad-to-Pad) 32 I/O

5.6 6.1 6.9 8.1 11.4 ns

tACO Array Latch Clock-to-Out

(Pad-to-Pad) 32 I/O

10.6 11.8 13.4 15.7 22.0 ns

dTLH Capacitive Loading, LOW to HIGH 0.04 0.04 0.04 0.05 0.07 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.03 0.03 0.03 0.04 0.06 ns/pF

Table 36 • A42MX24 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-65

CMOS Output Module Timing5

tDLH Data-to-Pad HIGH 3.1 3.5 3.9 4.6 6.4 ns

tDHL Data-to-Pad LOW 2.4 2.6 3.0 3.5 4.9 ns

tENZH Enable Pad Z to HIGH 2.5 2.8 3.2 3.8 5.3 ns

tENZL Enable Pad Z to LOW 2.8 3.1 3.5 4.2 5.8 ns

tENHZ Enable Pad HIGH to Z 5.2 5.7 6.5 7.6 10.7 ns

tENLZ Enable Pad LOW to Z 4.8 5.3 6.0 7.1 9.9 ns

tGLH G-to-Pad HIGH 4.9 5.4 6.2 7.2 10.1 ns

tGHL G-to-Pad LOW 4.9 5.4 6.2 7.2 10.1 ns

tLSU I/O Latch Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tLH I/O Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad) 32 I/O

5.5 6.1 6.9 8.1 11.3 ns

tACO Array Latch Clock-to-Out (Pad-

to-Pad) 32 I/O

10.6 11.8 13.4 15.7 22.0 ns

dTLH Capacitive Loading, LOW to HIGH 0.04 0.04 0.04 0.05 0.07 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.03 0.03 0.03 0.04 0.06 ns/pF

Table 36 • A42MX24 Timing Characteristics (Nominal 5.0V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-66 v6.1

Table 37 • A42MX24 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Logic Module Combinatorial Functions1

tPD Internal Array Module Delay 2.0 1.8 2.1 2.5 3.4 ns

tPDD Internal Decode Module Delay 1.1 2.2 2.5 3.0 4.2 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.7 1.3 1.4 1.7 2.3 ns

tRD2 FO=2 Routing Delay 2.0 1.6 1.8 2.1 3.0 ns

tRD3 FO=3 Routing Delay 1.1 2.0 2.2 2.6 3.7 ns

tRD4 FO=4 Routing Delay 1.5 2.3 2.6 3.1 4.3 ns

tRD5 FO=8 Routing Delay 1.8 3.7 4.2 5.0 7.0 ns

Logic Module Sequential Timing3, 4

tCO Flip-Flop Clock-to-Output 2.1 2.0 2.3 2.7 3.7 ns

tGO Latch Gate-to-Output 3.4 1.9 2.1 2.5 3.4 ns

tSUD Flip-Flop (Latch) Set-Up Time 0.4 0.5 0.6 0.7 0.9 ns

tHD Flip-Flop (Latch) Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRO Flip-Flop (Latch) Reset-to-Output 2.0 2.2 2.5 2.9 4.1 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 0.6 0.6 0.7 0.8 1.2 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

4.6 5.2 5.8 6.9 9.6 ns

tWASYN Flip-Flop (Latch) Asynchronous

Pulse Width

6.1 6.8 7.7 9.0 12.6

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1.4 1.6 1.8 2.2 3.0 ns

tINGO Input Latch Gate-to-

Output

1.8 1.9 2.2 2.6 3.6 ns

tINH Input Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Latch Set-Up 0.7 0.7 0.8 1.0 1.4 ns

tILA Latch Active Pulse Width 6.5 7.3 8.2 9.7 13.5 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-67

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 2.6 2.9 3.2 3.8 5.3 ns

tIRD2 FO=2 Routing Delay 2.9 3.2 3.6 4.3 6.0 ns

tIRD3 FO=3 Routing Delay 3.2 3.6 4.0 4.8 6.6 ns

tIRD4 FO=4 Routing Delay 3.5 3.9 4.4 5.2 7.3 ns

tIRD8 FO=8 Routing Delay 4.8 5.3 6.1 7.1 10.0 ns

Global Clock Network

tCKH Input LOW to HIGH FO=32

FO=486

4.4

4.8

5.3

5.5

6.0

6.5

7.1

9.1

10.0

tCKL Input HIGH to LOW FO=32

FO=486

5.1

6.0

5.7

6.6

6.4

7.5

7.6

8.8

10.6

12.4

tPWH Minimum Pulse

Width HIGH

FO=32

FO=486

3.0

3.3

3.7

3.8

4.2

4.5

4.9

6.3

6.9

tPWL Minimum Pulse

Width LOW

FO=32

FO=486

3.0

3.3

3.4

3.7

3.8

4.2

4.5

4.9

6.3

6.9

tCKSW Maximum Skew FO=32

FO=486

0.8

1.0

1.1

1.6

tSUEXT Input Latch External

Set-Up

FO=32

FO=486

0.0

TTL Output Module Timing5

tDLH Data-to-Pad HIGH 3.4 3.8 4.3 5.0 7.1 ns

tDHL Data-to-Pad LOW 4.0 4.4 5.0 5.9 8.3 ns

tENZH Enable Pad Z to HIGH 3.6 4.0 4.5 5.3 7.4 ns

tENZL Enable Pad Z to LOW 3.9 4.4 5.0 5.8 8.2 ns

tENHZ Enable Pad HIGH to Z 7.2 8.0 9.1 10.7 14.9 ns

tENLZ Enable Pad LOW to Z 6.7 7.5 8.5 9.9 13.9 ns

tGLH G-to-Pad HIGH 4.8 5.3 6.0 7.2 10.0 ns

tGHL G-to-Pad LOW 4.8 5.3 6.0 7.2 10.0 ns

tLSU I/O Latch Output Set-Up 0.7 0.7 0.8 1.0 1.4 ns

Table 37 • A42MX24 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-68 v6.1

TTL Output Module Timing5 (Continued)

tLH I/O Latch Output Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out

(Pad-to-Pad) 32 I/O

7.7 8.5 9.6 11.3 15.9 ns

tACO Array Latch Clock-to-Out

(Pad-to-Pad) 32 I/O

14.8 16.5 18.7 22.0 30.8 ns

dTLH Capacitive Loading, LOW to HIGH 0.05 0.05 0.06 0.07 0.10 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.04 0.04 0.05 0.06 0.08 ns/pF

CMOS Output Module Timing5

tDLH Data-to-Pad HIGH 4.8 5.3 5.5 6.4 9.0 ns

tDHL Data-to-Pad LOW 3.5 3.9 4.1 4.9 6.8 ns

tENZH Enable Pad Z to HIGH 3.6 4.0 4.5 5.3 7.4 ns

tENZL Enable Pad Z to LOW 3.4 4.0 5.0 5.8 8.2 ns

tENHZ Enable Pad HIGH to Z 7.2 8.0 9.0 10.7 14.9 ns

tENLZ Enable Pad LOW to Z 6.7 7.5 8.5 9.9 13.9 ns

tGLH G-to-Pad HIGH 6.8 7.6 8.6 10.1 14.2 ns

tGHL G-to-Pad LOW 6.8 7.6 8.6 10.1 14.2 ns

tLSU I/O Latch Set-Up 0.7 0.7 0.8 1.0 1.4 ns

tLH I/O Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out

(Pad-to-Pad) 32 I/O

7.7 8.5 9.6 11.3 15.9 ns

tACO Array Latch Clock-to-Out

(Pad-to-Pad) 32 I/O

14.8 16.5 18.7 22.0 30.8 ns

dTLH Capacitive Loading, LOW to HIGH 0.05 0.05 0.06 0.07 0.10 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.04 0.04 0.05 0.06 0.08 ns/pF

tHEXT Input Latch External

Hold

FO=32

FO=486

3.9

4.6

4.3

5.2

4.9

5.8

5.7

6.9

8.1

9.6

tPMinimum Period

(1/fMAX)

FO=32

FO=486

7.8

8.6

8.7

9.5

10.4

10.8

11.9

18.2

19.9

Table 37 • A42MX24 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

UnitsParameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-69

Table 38 • A42MX36 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Functions1

tPD Internal Array Module Delay 1.3 1.5 1.7 2.0 2.7 ns

tPDD Internal Decode Module Delay 1.6 1.8 2.0 2.4 3.3 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 0.9 1.0 1.2 1.4 2.0 ns

tRD2 FO=2 Routing Delay 1.3 1.4 1.6 1.9 2.7 ns

tRD3 FO=3 Routing Delay 1.6 1.8 2.0 2.4 3.4 ns

tRD4 FO=4 Routing Delay 2.0 2.2 2.5 2.9 4.1 ns

tRD5 FO=8 Routing Delay 3.3 3.7 4.2 4.9 6.9 ns

tRDD Decode-to-Output Routing Delay 0.3 0.4 0.4 0.5 0.7 ns

Logic Module Sequential Timing3, 4

tCO Flip-Flop Clock-to-Output 1.3 1.4 1.6 1.9 2.7 ns

tGO Latch Gate-to-Output 1.3 1.4 1.6 1.9 2.7 ns

tSUD Flip-Flop (Latch) Set-Up Time 0.3 0.3 0.4 0.5 0.7 ns

tHD Flip-Flop (Latch) Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRO Flip-Flop (Latch) Reset-to-Output 1.6 1.7 2.0 2.3 3.2 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 0.7 0.8 0.9 1.0 1.4 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

3.3 3.7 4.2 4.9 6.9 ns

tWASYN Flip-Flop (Latch) Asynchronous

Pulse Width

4.4 4.8 5.5 6.4 9.0

Synchronous SRAM Operations

tRC Read Cycle Time 6.8 7.5 8.5 10.0 14.0 ns

tWC Write Cycle Time 6.8 7.5 8.5 10.0 14.0 ns

tRCKHL Clock HIGH/LOW Time 3.4 3.8 4.3 5.0 7.0 ns

tRCO Data Valid After Clock HIGH/LOW 3.4 3.8 4.3 5.0 7.0 ns

tADSU Address/Data Set-Up Time 1.6 1.8 2.0 2.4 3.4 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-70 v6.1

Synchronous SRAM Operations (Continued)

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRENSU Read Enable Set-Up 0.6 0.7 0.8 0.9 1.3 ns

tRENH Read Enable Hold 3.4 3.8 4.3 5.0 7.0 ns

tWENSU Write Enable Set-Up 2.7 3.0 3.4 4.0 5.6 ns

tWENH Write Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tBENS Block Enable Set-Up 2.8 3.1 3.5 4.1 5.7 ns

tBENH Block Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

Asynchronous SRAM Operations

tRPD Asynchronous Access Time 8.1 9.0 10.2 12.0 16.8 ns

tRDADV Read Address Valid 8.8 9.8 11.1 13.0 18.2 ns

tADSU Address/Data Set-Up Time 1.6 1.8 2.0 2.4 3.4 ns

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRENSUA Read Enable Set-Up to Address

Valid

0.6 0.7 0.8 0.9 1.3 ns

tRENHA Read Enable Hold 3.4 3.8 4.3 5.0 7.0 ns

tWENSU Write Enable Set-Up 2.7 3.0 3.4 4.0 5.6 ns

tWENH Write Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tDOH Data Out Hold Time 1.2 1.3 1.5 1.8 2.5 ns

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1.0 1.1 1.3 1.5 2.1 ns

tINGO Input Latch Gate-to-Output 1.4 1.6 1.8 2.1 2.9 ns

tINH Input Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Latch Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tILA Latch Active Pulse Width 4.7 5.2 5.9 6.9 9.7 ns

Table 38 • A42MX36 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-71

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 2.0 2.2 2.5 2.9 4.1 ns

tIRD2 FO=2 Routing Delay 2.3 2.6 2.9 3.4 4.8 ns

tIRD3 FO=3 Routing Delay 2.6 2.9 3.3 3.9 5.5 ns

tIRD4 FO=4 Routing Delay 3.0 3.3 3.8 4.4 6.2 ns

tIRD8 FO=8 Routing Delay 4.3 4.8 5.5 6.4 9.0 ns

Global Clock Network

tCKH Input LOW to HIGH FO=32

FO=635

2.7

3.0

3.3

3.4

3.8

4.0

4.4

5.6

6.2

tCKL Input HIGH to LOW FO=32

FO=635

3.8

4.9

4.2

5.4

4.8

6.1

5.6

7.2

7.8

10.1

tPWH Minimum Pulse

Width HIGH

FO=32

FO=635

1.8

2.0

2.2

2.5

2.6

2.9

3.6

4.1

tPWL Minimum Pulse

Width LOW

FO=32

FO=635

1.8

2.0

2.2

2.5

2.6

2.9

3.6

4.1

tCKSW Maximum Skew FO=32

FO=635

0.8

0.9

1.0

1.4

tSUEXT Input Latch External

Set-Up

FO=32

FO=635

0.0

tHEXT Input Latch External

Hold

FO=32

FO=635

2.8

3.3

3.2

3.7

3.6

4.2

4.9

5.9

6.9

tPMinimum Period

(1/fMAX)

FO=32

FO=635

5.5

6.0

6.1

6.6

7.2

7.6

8.3

12.7

13.8

fMAX Maximum Datapath

Frequency

FO=32

FO=635

180

166

164

151

139

131

121

MHz

TTL Output Module Timing5

tDLH Data-to-Pad HIGH 2.6 2.8 3.2 3.8 5.3 ns

tDHL Data-to-Pad LOW 3.0 3.3 3.7 4.4 6.2 ns

tENZH Enable Pad Z to HIGH 2.7 3.0 3.3 3.9 5.5 ns

tENZL Enable Pad Z to LOW 3.0 3.3 3.7 4.3 6.1 ns

tENHZ Enable Pad HIGH to Z 5.3 5.8 6.6 7.8 10.9 ns

Table 38 • A42MX36 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-72 v6.1

TTL Output Module Timing5 (Continued)

tENLZ Enable Pad LOW to Z 4.9 5.5 6.2 7.3 10.2 ns

tGLH G-to-Pad HIGH 2.9 3.3 3.7 4.4 6.1 ns

tGHL G-to-Pad LOW 2.9 3.3 3.7 4.4 6.1 ns

tLSU I/O Latch Output Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tLH I/O Latch Output Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad) 32 I/O

5.7 6.3 7.1 8.4 11.8 ns

tACO Array Latch Clock-to-Out (Pad-

to-Pad) 32 I/O

7.8 8.6 9.8 11.5 16.1 ns

dTLH Capacitive Loading, LOW to HIGH 0.07 0.08 0.09 0.10 0.14 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.07 0.08 0.09 0.10 0.14 ns/pF

CMOS Output Module Timing5

tDLH Data-to-Pad HIGH 3.5 3.9 4.5 5.2 7.3 ns

tDHL Data-to-Pad LOW 2.5 2.7 3.1 3.6 5.1 ns

tENZH Enable Pad Z to HIGH 2.7 3.0 3.3 3.9 5.5 ns

tENZL Enable Pad Z to LOW 2.9 3.3 3.7 4.3 6.1 ns

tENHZ Enable Pad HIGH to Z 5.3 5.8 6.6 7.8 10.9 ns

tENLZ Enable Pad LOW to Z 4.9 5.5 6.2 7.3 10.2 ns

tGLH G-to-Pad HIGH 5.0 5.6 6.3 7.5 10.4 ns

tGHL G-to-Pad LOW 5.0 5.6 6.3 7.5 10.4 ns

tLSU I/O Latch Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tLH I/O Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad) 32 I/O

5.7 6.3 7.1 8.4 11.8 ns

tACO Array Latch Clock-to-Out (Pad-

to-Pad) 32 I/O

7.8 8.6 9.8 11.5 16.1 ns

dTLH Capacitive Loading, LOW to HIGH 0.07 0.08 0.09 0.10 0.14 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.07 0.08 0.09 0.10 0.14 ns/pF

Table 38 • A42MX36 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-73

Table 39 • A42MX36 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Functions1

tPD Internal Array Module Delay 1.9 2.1 2.3 2.7 3.8 ns

tPDD Internal Decode Module Delay 2.2 2.5 2.8 3.3 4.7 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.3 1.5 1.7 2.0 2.7 ns

tRD2 FO=2 Routing Delay 1.8 2.0 2.3 2.7 3.7 ns

tRD3 FO=3 Routing Delay 2.3 2.5 2.8 3.4 4.7 ns

tRD4 FO=4 Routing Delay 2.8 3.1 3.5 4.1 5.7 ns

tRD5 FO=8 Routing Delay 4.6 5.2 5.8 6.9 9.6 ns

tRDD Decode-to-Output Routing Delay 0.5 0.5 0.6 0.7 1.0 ns

Logic Module Sequential Timing3, 4

tCO Flip-Flop Clock-to-Output 1.8 2.0 2.3 2.7 3.7 ns

tGO Latch Gate-to-Output 1.8 2.0 2.3 2.7 3.7 ns

tSUD Flip-Flop (Latch) Set-Up Time 0.4 0.5 0.6 0.7 0.9 ns

tHD Flip-Flop (Latch) Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRO Flip-Flop (Latch) Reset-to-Output 2.2 2.4 2.7 3.2 4.5 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 1.0 1.1 1.2 1.4 2.0 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active

Pulse Width

4.6 5.2 5.8 6.9 9.6 ns

tWASYN Flip-Flop (Latch) Asynchronous

Pulse Width

6.1 6.8 7.7 9.0 12.6 ns

Synchronous SRAM Operations

tRC Read Cycle Time 9.5 10.5 11.9 14.0 19.6 ns

tWC Write Cycle Time 9.5 10.5 11.9 14.0 19.6 ns

tRCKHL Clock HIGH/LOW Time 4.8 5.3 6.0 7.0 9.8 ns

tRCO Data Valid After Clock HIGH/LOW 4.8 5.3 6.0 7.0 9.8 ns

tADSU Address/Data Set-Up Time 2.3 2.5 2.8 3.4 4.8 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-74 v6.1

Synchronous SRAM Operations (Continued)

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRENSU Read Enable Set-Up 0.9 1.0 1.1 1.3 1.8 ns

tRENH Read Enable Hold 4.8 5.3 6.0 7.0 9.8 ns

tWENSU Write Enable Set-Up 3.8 4.2 4.8 5.6 7.8 ns

tWENH Write Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tBENS Block Enable Set-Up 3.9 4.3 4.9 5.7 8.0 ns

tBENH Block Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

Asynchronous SRAM Operations

tRPD Asynchronous Access Time 11.3 12.6 14.3 16.8 23.5 ns

tRDADV Read Address Valid 12.3 13.7 15.5 18.2 25.5 ns

tADSU Address/Data Set-Up Time 2.3 2.5 2.8 3.4 4.8 ns

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRENSUA Read Enable Set-Up to Address

Valid

0.9 1.0 1.1 1.3 1.8 ns

tRENHA Read Enable Hold 4.8 5.3 6.0 7.0 9.8 ns

tWENSU Write Enable Set-Up 3.8 4.2 4.8 5.6 7.8 ns

tWENH Write Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tDOH Data Out Hold Time 1.8 2.0 2.1 2.5 3.5 ns

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1.4 1.6 1.8 2.1 3.0 ns

tINGO Input Latch Gate-to-

Output

2.0 2.2 2.5 2.9 4.1 ns

tINH Input Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Latch Set-Up 0.7 0.7 0.8 1.0 1.4 ns

tILA Latch Active Pulse Width 6.5 7.3 8.2 9.7 13.5 ns

Table 39 • A42MX36 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-75

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 2.8 3.1 3.5 4.1 5.7 ns

tIRD2 FO=2 Routing Delay 3.2 3.5 4.1 4.8 6.7 ns

tIRD3 FO=3 Routing Delay 3.7 4.1 4.7 5.5 7.7 ns

tIRD4 FO=4 Routing Delay 4.2 4.6 5.3 6.2 8.7 ns

tIRD8 FO=8 Routing Delay 6.1 6.8 7.7 9.0 12.6 ns

Global Clock Network

tCKH Input LOW to HIGH FO=32

FO=635

4.6

5.0

5.1

5.6

5.7

6.3

6.7

7.4

9.3

10.3

tCKL Input HIGH to LOW FO=32

FO=635

5.3

6.8

5.9

7.6

6.7

8.6

7.8

10.1

11.0

14.1

tPWH Minimum Pulse

Width HIGH

FO=32

FO=635

2.5

2.8

2.7

3.1

3.5

3.6

4.1

5.1

5.7

tPWL Minimum Pulse

Width LOW

FO=32

FO=635

2.5

2.8

2.7

3.1

3.5

3.6

4.1

5.1

5.7

tCKSW Maximum Skew FO=32

FO=635

1.0

1.2

1.3

1.5

2.2

tSUEXT Input Latch

External Set-Up

FO=32

FO=635

0.0

tHEXT Input Latch

External Hold

FO=32

FO=635

4.0

4.6

4.4

5.2

5.0

5.9

6.9

8.2

9.6

tPMinimum Period

(1/fMAX)

FO=32

FO=635

9.2

9.9

10.2

11.0

11.1

12.0

12.7

13.8

21.2

23.0

fMAX Maximum Datapath

Frequency

FO=32

FO=635

108

100

MHz

TTL Output Module Timing5

tDLH Data-to-Pad HIGH 3.6 4.0 4.5 5.3 7.4 ns

tDHL Data-to-Pad LOW 4.2 4.6 5.2 6.2 8.6 ns

tENZH Enable Pad Z to HIGH 3.7 4.2 4.7 5.5 7.7 ns

tENZL Enable Pad Z to LOW 4.1 4.6 5.2 6.1 8.5 ns

tENHZ Enable Pad HIGH to Z 7.34 8.2 9.3 10.9 15.3 ns

Table 39 • A42MX36 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

1-76 v6.1

TTL Output Module Timing5

tENLZ Enable Pad LOW to Z 6.9 7.6 8.7 10.2 14.3 ns

tGLH G-to-Pad HIGH 4.9 5.5 6.2 7.3 10.2 ns

tGHL G-to-Pad LOW 4.9 5.5 6.2 7.3 10.2 ns

tLSU I/O Latch Output Set-Up 0.7 0.7 0.8 1.0 1.4 ns

tLH I/O Latch Output Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad) 32 I/O

7.9 8.8 10.0 11.8 16.5 ns

tACO Array Latch Clock-to-Out (Pad-

to-Pad) 32 I/O

10.9 12.1 13.7 16.1 22.5 ns

dTLH Capacitive Loading, LOW to HIGH 0.10 0.11 0.12 0.14 0.20 ns/pF

dTHL Capacitive Loading, HIGH to LOW 0.10 0.11 0.12 0.14 0.20 ns/pF

CMOS Output Module Timing5

tDLH Data-to-Pad HIGH 4.9 5.5 6.2 7.3 10.3 ns

tDHL Data-to-Pad LOW 3.4 3.8 4.3 5.1 7.1 ns

tENZH Enable Pad Z to HIGH 3.7 4.1 4.7 5.5 7.7 ns

tENZL Enable Pad Z to LOW 4.1 4.6 5.2 6.1 8.5 ns

tENHZ Enable Pad HIGH to Z 7.4 8.2 9.3 10.9 15.3 ns

tENLZ Enable Pad LOW to Z 6.9 7.6 8.7 10.2 14.3 ns

tGLH G-to-Pad HIGH 7.0 7.8 8.9 10.4 14.6 ns

tGHL G-to-Pad LOW 7.0 7.8 8.9 10.4 14.6 ns

tLSU I/O Latch Set-Up 0.7 0.7 0.8 1.0 1.4 ns

tLH I/O Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-

Pad) 32 I/O

7.9 8.8 10.0 11.8 16.5 ns

Table 39 • A42MX36 Timing Characteristics (Nominal 3.3V Operation) (Continued)

(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating

device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be

obtained from the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/

hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to

the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

40MX and 42MX FPGA Families

v6.1 1-77

Pin Descriptions

CLK/A/B, I/O Global Clock

Clock inputs for clock distribution networks. CLK is for

40MX while CLKA and CLKB are for 42MX devices. The

clock input is buffered prior to clocking the logic

modules. This pin can also be used as an I/O.

DCLK, I/O Diagnostic Clock

Clock input for diagnostic probe and device

programming. DCLK is active when the MODE pin is

HIGH. This pin functions as an I/O when the MODE pin is

LOW.

GND Ground

Input LOW supply voltage.

I/O Input/Output

Input, output, tristate or bi-directional buffer. Input and

output levels are compatible with standard TTL and

CMOS specifications. Unused I/Os pins are configured by

the Designer software as shown in Table 40.

In all cases, it is recommended to tie all unused MX I/O

pins to LOW on the board. This applies to all dual-

purpose pins when configured as I/Os as well.

LP Low Power Mode

Controls the low power mode of all 42MX devices. The

device is placed in the low power mode by connecting

the LP pin to logic HIGH. In low power mode, all I/Os are

tristated, all input buffers are turned OFF, and the core

of the device is turned OFF. To exit the low power mode,

the LP pin must be set LOW. The device enters the low

power mode 800ns after the LP pin is driven to a logic

HIGH. It will resume normal operation in 200µs after the

LP pin is driven to a logic LOW.

MODE Mode

Controls the use of multifunction pins (DCLK, PRA, PRB,

SDI, TDO). The MODE pin is held HIGH to provide

verification capability. The MODE pin should be

terminated to GND through a 10kΩ resistor so that the

MODE pin can be pulled HIGH when required.

NC No Connection

This pin is not connected to circuitry within the device.

These pins can be driven to any voltage or can be left

floating with no effect on the operation of the device.

PRA, I/O

PRB, I/O Probe A/B

The Probe pin is used to output data from any user-

defined design node within the device. Each diagnostic

pin can be used in conjunction with the other probe pin

to allow real-time diagnostic output of any signal path

within the device. The Probe pin can be used as a user-

defined I/O when verification has been completed. The

pin's probe capabilities can be permanently disabled to

protect programmed design confidentiality. The Probe

pin is accessible when the MODE pin is HIGH. This pin

functions as an I/O when the MODE pin is LOW.

QCLKA/B/C/D, I/O Quadrant Clock

Quadrant clock inputs for A42MX36 devices. When not

used as a register control signal, these pins can function

as user I/Os.

SDI, I/O Serial Data Input

Serial data input for diagnostic probe and device

programming. SDI is active when the MODE pin is HIGH.

This pin functions as an I/O when the MODE pin is LOW.

SDO, I/O Serial Data Output

Serial data output for diagnostic probe and device

programming. SDO is active when the MODE pin is HIGH.

This pin functions as an I/O when the MODE pin is LOW.

SDO is available for 42MX devices only.

When Silicon Explorer II is being used, SDO will act as an

output while the "checksum" command is run. It will

return to user I/O when "checksum" is complete.

TCK, I/O Test Clock

Clock signal to shift the Boundary Scan Test (BST) data

into the device. This pin functions as an I/O when

"Reserve JTAG" is not checked in the Designer Software.

BST pins are only available in A42MX24 and A42MX36

devices.

TDI, I/O Test Data In

Serial data input for BST instructions and data. Data is

shifted in on the rising edge of TCK. This pin functions as

an I/O when "Reserve JTAG" is not checked in the

Designer Software. BST pins are only available in

A42MX24 and A42MX36 devices.

TDO, I/O Test Data Out

Serial data output for BST instructions and test data. This

pin functions as an I/O when "Reserve JTAG" is not

checked in the Designer Software. BST pins are only

available in A42MX24 and A42MX36 devices.

Table 40 • Configuration of Unused I/Os

Device Configuration

A40MX02, A40MX04 Pulled LOW

A42MX09, A42MX16 Pulled LOW

A42MX24, A42MX36 Tristated

40MX and 42MX FPGA Families

1-78 v6.1

TMS, I/O Test Mode Select

The TMS pin controls the use of the IEEE 1149.1

Boundary Scan pins (TCK, TDI, TDO). In flexible mode

when the TMS pin is set LOW, the TCK, TDI and TDO pins

are boundary scan pins. Once the boundary scan pins are

in test mode, they will remain in that mode until the

internal boundary scan state machine reaches the "logic

reset" state. At this point, the boundary scan pins will be

released and will function as regular I/O pins. The "logic

reset" state is reached 5 TCK cycles after the TMS pin is

set HIGH. In dedicated test mode, TMS functions as

specified in the IEEE 1149.1 specifications. IEEE JTAG

specification recommends a 10kΩ pull-up resistor on the

pin. BST pins are only available in A42MX24 and

A42MX36 devices.

VCC Supply Voltage

Input supply voltage for 40MX devices

VCCA Supply Voltage

Supply voltage for array in 42MX devices

VCCI Supply Voltage

Supply voltage for I/Os in 42MX devices

WD, I/O Wide Decode Output

When a wide decode module is used in a 42MX device

this pin can be used as a dedicated output from the wide

decode module. This direct connection eliminates

additional interconnect delays associated with regular

logic modules. To implement the direct I/O connection,

connect an output buffer of any type to the output of

the wide decode macro and place this output on one of

the reserved WD pins.

40MX and 42MX FPGA Families

v6.1 2-1

Package Pin Assignments

44-Pin PLCC

Figure 2-1 • 44-Pin PLCC

44-Pin

PLCC

44-pin PLCC

Pin Number A40MX02 Function A40MX04 Function

1I/O I/O

2I/O I/O

CC VCC

4I/O I/O

5I/O I/O

6I/O I/O

7I/O I/O

8I/O I/O

9I/O I/O

10 GND GND

11 I/O I/O

12 I/O I/O

13 I/O I/O

14 VCC VCC

15 I/O I/O

16 VCC VCC

17 I/O I/O

18 I/O I/O

19 I/O I/O

20 I/O I/O

21 GND GND

22 I/O I/O

23 I/O I/O

24 I/O I/O

25 VCC VCC

26 I/O I/O

27 I/O I/O

28 I/O I/O

29 I/O I/O

30 I/O I/O

31 I/O I/O

32 GND GND

33 CLK, I/O CLK, I/O

34 MODE MODE

35 VCC VCC

36 SDI, I/O SDI, I/O

37 DCLK, I/O DCLK, I/O

38 PRA, I/O PRA, I/O

39 PRB, I/O PRB, I/O

40 I/O I/O

41 I/O I/O

42 I/O I/O

43 GND GND

44 I/O I/O

44-pin PLCC

Pin Number A40MX02 Function A40MX04 Function

40MX and 42MX FPGA Families

2-2 v6.1

68-Pin PLCC

Figure 2-2 • 68-Pin PLCC

1 68

68-Pin

PLCC

44-pin PLCC

Number

A40MX02

Function

A40MX04

Function

1I/OI/O

2I/OI/O

3I/OI/O

CC VCC

5I/OI/O

6I/OI/O

7I/OI/O

8I/OI/O

9I/OI/O

10 I/O I/O

11 I/O I/O

12 I/O I/O

13 I/O I/O

14 GND GND

15 GND GND

16 I/O I/O

17 I/O I/O

18 I/O I/O

19 I/O I/O

20 I/O I/O

21 VCC VCC

22 I/O I/O

23 I/O I/O

24 I/O I/O

25 VCC VCC

26 I/O I/O

27 I/O I/O

28 I/O I/O

29 I/O I/O

30 I/O I/O

31 I/O I/O

32 GND GND

33 I/O I/O

34 I/O I/O

35 I/O I/O

36 I/O I/O

37 I/O I/O

38 VCC VCC

39 I/O I/O

40 I/O I/O

41 I/O I/O

42 I/O I/O

43 I/O I/O

44 I/O I/O

45 I/O I/O

46 I/O I/O

44-pin PLCC

Number

A40MX02

Function

A40MX04

Function

47 I/O I/O

48 I/O I/O

49 GND GND

50 I/O I/O

51 I/O I/O

52 CLK, I/O CLK, I/O

53 I/O I/O

54 MODE MODE

55 VCC VCC

56 SDI, I/O SDI, I/O

57 DCLK, I/O DCLK, I/O

58 PRA, I/O PRA, I/O

59 PRB, I/O PRB, I/O

60 I/O I/O

61 I/O I/O

62 I/O I/O

63 I/O I/O

64 I/O I/O

65 I/O I/O

66 GND GND

67 I/O I/O

68 I/O I/O

44-pin PLCC

Number

A40MX02

Function

A40MX04

Function

40MX and 42MX FPGA Families

v6.1 2-3

84-Pin PLCC

Figure 2-3 • 84-Pin PLCC

184

84-Pin

PLCC

40MX and 42MX FPGA Families

2-4 v6.1

84-Pin PLCC

Number

A40MX04

Function

A42MX09

Function

A42MX16

Function

A42MX24

Function

1I/OI/OI/OI/O

2 I/O CLKB, I/O CLKB, I/O CLKB, I/O

3I/OI/OI/OI/O

CC PRB, I/O PRB, I/O PRB, I/O

5 I/O I/O I/O WD, I/O

6 I/O GND GND GND

7I/OI/OI/OI/O

8 I/O I/O I/O WD, I/O

9 I/O I/O I/O WD, I/O

10 I/O DCLK, I/O DCLK, I/O DCLK, I/O

11 I/O I/O I/O I/O

12 NC MODE MODE MODE

13 I/O I/O I/O I/O

14 I/O I/O I/O I/O

15 I/O I/O I/O I/O

16 I/O I/O I/O I/O

17 I/O I/O I/O I/O

18 GND I/O I/O I/O

19 GND I/O I/O I/O

20 I/O I/O I/O I/O

21 I/O I/O I/O I/O

22 I/O VCCA VCCI VCCI

23 I/O VCCI VCCA VCCA

24 I/O I/O I/O I/O

25 VCC I/O I/O I/O

26 VCC I/O I/O I/O

27 I/O I/O I/O I/O

28 I/O GND GND GND

29 I/O I/O I/O I/O

30 I/O I/O I/O I/O

31 I/O I/O I/O I/O

32 I/O I/O I/O I/O

33 VCC I/O I/O I/O

34 I/O I/O I/O TMS, I/O

35 I/O I/O I/O TDI, I/O

36 I/O I/O I/O WD, I/O

37 I/O I/O I/O I/O

38 I/O I/O I/O WD, I/O

39 I/O I/O I/O WD, I/O

40 GND I/O I/O I/O

41 I/O I/O I/O I/O

42 I/O I/O I/O I/O

43 I/O VCCA VCCA VCCA

44 I/O I/O I/O WD, I/O

45 I/O I/O I/O WD, I/O

46 VCC I/O I/O WD, I/O

47 I/O I/O I/O WD, I/O

48 I/O I/O I/O I/O

49 I/O GND GND GND

50 I/O I/O I/O WD, I/O

51 I/O I/O I/O WD, I/O

52 I/O SDO, I/O SDO, I/O SDO, TDO, I/O

53 I/O I/O I/O I/O

54 I/O I/O I/O I/O

55 I/O I/O I/O I/O

56 I/O I/O I/O I/O

57 I/O I/O I/O I/O

58 I/O I/O I/O I/O

59 I/O I/O I/O I/O

60 GND I/O I/O I/O

61 GND I/O I/O I/O

62 I/O I/O I/O TCK, I/O

63 I/O LP LP LP

64 CLK, I/O VCCA VCCA VCCA

65 I/O VCCI VCCI VCCI

66 MODE I/O I/O I/O

67 VCC I/O I/O I/O

68 VCC I/O I/O I/O

69 I/O I/O I/O I/O

70 I/O GND GND GND

84-Pin PLCC

Number

A40MX04

Function

A42MX09

Function

A42MX16

Function

A42MX24

Function

40MX and 42MX FPGA Families

v6.1 2-5

71 I/O I/O I/O I/O

72 SDI, I/O I/O I/O I/O

73 DCLK, I/O I/O I/O I/O

74 PRA, I/O I/O I/O I/O

75 PRB, I/O I/O I/O I/O

76 I/O SDI, I/O SDI, I/O SDI, I/O

77 I/O I/O I/O I/O

84-Pin PLCC

Number

A40MX04

Function

A42MX09

Function

A42MX16

Function

A42MX24

Function

78 I/O I/O I/O WD, I/O

79 I/O I/O I/O WD, I/O

80 I/O I/O I/O WD, I/O

81 I/O PRA, I/O PRA, I/O PRA, I/O

82 GND I/O I/O I/O

83 I/O CLKA, I/O CLKA, I/O CLKA, I/O

84 I/O VCCA VCCA VCCA

84-Pin PLCC

Number

A40MX04

Function

A42MX09

Function

A42MX16

Function

A42MX24

Function

40MX and 42MX FPGA Families

2-6 v6.1

100-Pin PQFP Package

Figure 2-4 • 100-Pin PQFP Package (Top View)

100

100-Pin

PQFP

40MX and 42MX FPGA Families

v6.1 2-7

100-Pin PQFP

Number

A40MX02

Function

A40MX04

Function

A42MX09

Function

A42MX16

Function

1NCNCI/OI/O

2 NC NC DCLK, I/O DCLK, I/O

3NCNCI/OI/O

4 NC NC MODE MODE

5NCNCI/OI/O

6 PRB, I/O PRB, I/O I/O I/O

7 I/O I/O I/O I/O

8 I/O I/O I/O I/O

9I/OI/OGNDGND

10 I/O I/O I/O I/O

11 I/O I/O I/O I/O

12 I/O I/O I/O I/O

13 GND GND I/O I/O

14 I/O I/O I/O I/O

15 I/O I/O I/O I/O

16 I/O I/O VCCA VCCA

17 I/O I/O VCCI VCCA

18 I/O I/O I/O I/O

19 VCC VCC I/O I/O

20 I/O I/O I/O I/O

21 I/O I/O I/O I/O

22 I/O I/O GND GND

23 I/O I/O I/O I/O

24 I/O I/O I/O I/O

25 I/O I/O I/O I/O

26 I/O I/O I/O I/O

27 NC NC I/O I/O

28 NC NC I/O I/O

29 NC NC I/O I/O

30 NC NC I/O I/O

31 NC I/O I/O I/O

32 NC I/O I/O I/O

33 NC I/O I/O I/O

34 I/O I/O GND GND

35 I/O I/O I/O I/O

36 GND GND I/O I/O

37 GND GND I/O I/O

38 I/O I/O I/O I/O

39 I/O I/O I/O I/O

40 I/O I/O VCCA VCCA

41 I/O I/O I/O I/O

42 I/O I/O I/O I/O

43 VCC VCC I/O I/O

44 VCC VCC I/O I/O

45 I/O I/O I/O I/O

46 I/O I/O GND GND

47 I/O I/O I/O I/O

48 NC I/O I/O I/O

49 NC I/O I/O I/O

50 NC I/O I/O I/O

51 NC NC I/O I/O

52 NC NC SDO, I/O SDO, I/O

53 NC NC I/O I/O

54 NC NC I/O I/O

55 NC NC I/O I/O

56 VCC VCC I/O I/O

57 I/O I/O GND GND

58 I/O I/O I/O I/O

59 I/O I/O I/O I/O

60 I/O I/O I/O I/O

61 I/O I/O I/O I/O

62 I/O I/O I/O I/O

63 GND GND I/O I/O

64 I/O I/O LP LP

65 I/O I/O VCCA VCCA

66 I/O I/O VCCI VCCI

67 I/O I/O VCCA VCCA

68 I/O I/O I/O I/O

69 VCC VCC I/O I/O

70 I/O I/O I/O I/O

100-Pin PQFP

Number

A40MX02

Function

A40MX04

Function

A42MX09

Function

A42MX16

Function

40MX and 42MX FPGA Families

2-8 v6.1

71 I/O I/O I/O I/O

72 I/O I/O GND GND

73 I/O I/O I/O I/O

74 I/O I/O I/O I/O

75 I/O I/O I/O I/O

76 I/O I/O I/O I/O

77 NC NC I/O I/O

78 NC NC I/O I/O

79 NC NC SDI, I/O SDI, I/O

80 NC I/O I/O I/O

81 NC I/O I/O I/O

82 NC I/O I/O I/O

83 I/O I/O I/O I/O

84 I/O I/O GND GND

85 I/O I/O I/O I/O

100-Pin PQFP

Number

A40MX02

Function

A40MX04

Function

A42MX09

Function

A42MX16

Function

86 GND GND I/O I/O

87 GND GND PRA, I/O PRA, I/O

88 I/O I/O I/O I/O

89 I/O I/O CLKA, I/O CLKA, I/O

90 CLK, I/O CLK, I/O VCCA VCCA

91 I/O I/O I/O I/O

92 MODE MODE CLKB, I/O CLKB, I/O

93 VCC VCC I/O I/O

94 VCC VCC PRB, I/O PRB, I/O

95 NC I/O I/O I/O

96 NC I/O GND GND

97 NC I/O I/O I/O

98 SDI, I/O SDI, I/O I/O I/O

99 DCLK, I/O DCLK, I/O I/O I/O

100 PRA, I/O PRA, I/O I/O I/O

100-Pin PQFP

Number

A40MX02

Function

A40MX04

Function

A42MX09

Function

A42MX16

Function

40MX and 42MX FPGA Families

v6.1 2-9

160-Pin PQFP Package

Figure 2-5 • 160-Pin PQFP Package (Top View)

160

160-Pin

PQFP

40MX and 42MX FPGA Families

2-10 v6.1

160-Pin PQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

1 I/O I/O I/O

2 DCLK, I/O DCLK, I/O DCLK, I/O

3NCI/OI/O

4I/OI/OWD, I/O

5I/OI/OWD, I/O

6NCV

CCI VCCI

7 I/O I/O I/O

8 I/O I/O I/O

9 I/O I/O I/O

10 NC I/O I/O

11 GND GND GND

12 NC I/O I/O

13 I/O I/O WD, I/O

14 I/O I/O WD, I/O

15 I/O I/O I/O

16 PRB, I/O PRB, I/O PRB, I/O

17 I/O I/O I/O

18 CLKB, I/O CLKB, I/O CLKB, I/O

19 I/O I/O I/O

20 VCCA VCCA VCCA

21 CLKA, I/O CLKA, I/O CLKA, I/O

22 I/O I/O I/O

23 PRA, I/O PRA, I/O PRA, I/O

24 NC I/O WD, I/O

25 I/O I/O WD, I/O

26 I/O I/O I/O

27 I/O I/O I/O

28 NC I/O I/O

29 I/O I/O WD, I/O

30 GND GND GND

31 NC I/O WD, I/O

32 I/O I/O I/O

33 I/O I/O I/O

34 I/O I/O I/O

35 NC VCCI VCCI

36 I/O I/O WD, I/O

37 I/O I/O WD, I/O

38 SDI, I/O SDI, I/O SDI, I/O

39 I/O I/O I/O

40 GND GND GND

41 I/O I/O I/O

42 I/O I/O I/O

43 I/O I/O I/O

44 GND GND GND

45 I/O I/O I/O

46 I/O I/O I/O

47 I/O I/O I/O

48 I/O I/O I/O

49 GND GND GND

50 I/O I/O I/O

51 I/O I/O I/O

52 NC I/O I/O

53 I/O I/O I/O

54 NC VCCA VCCA

55 I/O I/O I/O

56 I/O I/O I/O

57 VCCA VCCA VCCA

58 VCCI VCCI VCCI

59 GND GND GND

60 VCCA VCCA VCCA

61 LP LP LP

62 I/O I/O TCK, I/O

63 I/O I/O I/O

64 GND GND GND

65 I/O I/O I/O

66 I/O I/O I/O

67 I/O I/O I/O

68 I/O I/O I/O

69 GND GND GND

70 NC I/O I/O

160-Pin PQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

40MX and 42MX FPGA Families

v6.1 2-11

71 I/O I/O I/O

72 I/O I/O I/O

73 I/O I/O I/O

74 I/O I/O I/O

75 NC I/O I/O

76 I/O I/O I/O

77 NC I/O I/O

78 I/O I/O I/O

79 NC I/O I/O

80 GND GND GND

81 I/O I/O I/O

82 SDO, I/O SDO, I/O SDO, TDO, I/O

83 I/O I/O WD, I/O

84 I/O I/O WD, I/O

85 I/O I/O I/O

86 NC VCCI VCCI

87 I/O I/O I/O

88 I/O I/O WD, I/O

89 GND GND GND

90 NC I/O I/O

91 I/O I/O I/O

92 I/O I/O I/O

93 I/O I/O I/O

94 I/O I/O I/O

95 I/O I/O I/O

96 I/O I/O WD, I/O

97 I/O I/O I/O

98 VCCA VCCA VCCA

99 GND GND GND

100 NC I/O I/O

101 I/O I/O I/O

102 I/O I/O I/O

103 NC I/O I/O

104 I/O I/O I/O

105 I/O I/O I/O

160-Pin PQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

106 I/O I/O WD, I/O

107 I/O I/O WD, I/O

108 I/O I/O I/O

109 GND GND GND

110 NC I/O I/O

111 I/O I/O WD, I/O

112 I/O I/O WD, I/O

113 I/O I/O I/O

114 NC VCCI VCCI

115 I/O I/O WD, I/O

116 NC I/O WD, I/O

117 I/O I/O I/O

118 I/O I/O TDI, I/O

119 I/O I/O TMS, I/O

120 GND GND GND

121 I/O I/O I/O

122 I/O I/O I/O

123 I/O I/O I/O

124 NC I/O I/O

125 GND GND GND

126 I/O I/O I/O

127 I/O I/O I/O

128 I/O I/O I/O

129 NC I/O I/O

130 GND GND GND

131 I/O I/O I/O

132 I/O I/O I/O

133 I/O I/O I/O

134 I/O I/O I/O

135 NC VCCA VCCA

136 I/O I/O I/O

137 I/O I/O I/O

138 NC VCCA VCCA

139 VCCI VCCI VCCI

140 GND GND GND

160-Pin PQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

40MX and 42MX FPGA Families

2-12 v6.1

141 NC I/O I/O

142 I/O I/O I/O

143 I/O I/O I/O

144 I/O I/O I/O

145 GND GND GND

146 NC I/O I/O

147 I/O I/O I/O

148 I/O I/O I/O

149 I/O I/O I/O

150 NC VCCA VCCA

160-Pin PQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

151 NC I/O I/O

152 NC I/O I/O

153 NC I/O I/O

154 NC I/O I/O

155 GND GND GND

156 I/O I/O I/O

157 I/O I/O I/O

158 I/O I/O I/O

159 MODE MODE MODE

160 GND GND GND

160-Pin PQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

40MX and 42MX FPGA Families

v6.1 2-13

208-Pin PQFP Package

Figure 2-6 • 208-Pin PQFP Package (Top View)

208-Pin PQFP

1208

40MX and 42MX FPGA Families

2-14 v6.1

208-Pin PQFP

Pin Number

A42MX16

Function

A42MX24

Function

A42MX36

Function

1 GND GND GND

2NCV

CCA VCCA

3 MODE MODE MODE

4 I/O I/O I/O

5 I/O I/O I/O

6 I/O I/O I/O

7 I/O I/O I/O

8 I/O I/O I/O

9NCI/OI/O

10 NC I/O I/O

11 NC I/O I/O

12 I/O I/O I/O

13 I/O I/O I/O

14 I/O I/O I/O

15 I/O I/O I/O

16 NC I/O I/O

17 VCCA VCCA VCCA

18 I/O I/O I/O

19 I/O I/O I/O

20 I/O I/O I/O

21 I/O I/O I/O

22 GND GND GND

23 I/O I/O I/O

24 I/O I/O I/O

25 I/O I/O I/O

26 I/O I/O I/O

27 GND GND GND

28 VCCI VCCI VCCI

29 VCCA VCCA VCCA

30 I/O I/O I/O

31 I/O I/O I/O

32 VCCA VCCA VCCA

33 I/O I/O I/O

34 I/O I/O I/O

35 I/O I/O I/O

36 I/O I/O I/O

37 I/O I/O I/O

38 I/O I/O I/O

39 I/O I/O I/O

40 I/O I/O I/O

41 NC I/O I/O

42 NC I/O I/O

43 NC I/O I/O

44 I/O I/O I/O

45 I/O I/O I/O

46 I/O I/O I/O

47 I/O I/O I/O

48 I/O I/O I/O

49 I/O I/O I/O

50 NC I/O I/O

51 NC I/O I/O

52 GND GND GND

53 GND GND GND

54 I/O TMS, I/O TMS, I/O

55 I/O TDI, I/O TDI, I/O

56 I/O I/O I/O

57 I/O WD, I/O WD, I/O

58 I/O WD, I/O WD, I/O

59 I/O I/O I/O

60 VCCI VCCI VCCI

61 NC I/O I/O

62 NC I/O I/O

63 I/O I/O I/O

64 I/O I/O I/O

65 I/O I/O QCLKA, I/O

66 I/O WD, I/O WD, I/O

67 NC WD, I/O WD, I/O

68 NC I/O I/O

69 I/O I/O I/O

70 I/O WD, I/O WD, I/O

208-Pin PQFP

Pin Number

A42MX16

Function

A42MX24

Function

A42MX36

Function

40MX and 42MX FPGA Families

v6.1 2-15

71 I/O WD, I/O WD, I/O

72 I/O I/O I/O

73 I/O I/O I/O

74 I/O I/O I/O

75 I/O I/O I/O

76 I/O I/O I/O

77 I/O I/O I/O

78 GND GND GND

79 VCCA VCCA VCCA

80 NC VCCI VCCI

81 I/O I/O I/O

82 I/O I/O I/O

83 I/O I/O I/O

84 I/O I/O I/O

85 I/O WD, I/O WD, I/O

86 I/O WD, I/O WD, I/O

87 I/O I/O I/O

88 I/O I/O I/O

89 NC I/O I/O

90 NC I/O I/O

91 I/O I/O QCLKB, I/O

92 I/O I/O I/O

93 I/O WD, I/O WD, I/O

94 I/O WD, I/O WD, I/O

95 NC I/O I/O

96 NC I/O I/O

97 NC I/O I/O

98 VCCI VCCI VCCI

99 I/O I/O I/O

100 I/O WD, I/O WD, I/O

101 I/O WD, I/O WD, I/O

102 I/O I/O I/O

103 SDO, I/O SDO, TDO, I/O SDO, TDO, I/O

104 I/O I/O I/O

105 GND GND GND

208-Pin PQFP

Pin Number

A42MX16

Function

A42MX24

Function

A42MX36

Function

106 NC VCCA VCCA

107 I/O I/O I/O

108 I/O I/O I/O

109 I/O I/O I/O

110 I/O I/O I/O

111 I/O I/O I/O

112 NC I/O I/O

113 NC I/O I/O

114 NC I/O I/O

115 NC I/O I/O

116 I/O I/O I/O

117 I/O I/O I/O

118 I/O I/O I/O

119 I/O I/O I/O

120 I/O I/O I/O

121 I/O I/O I/O

122 I/O I/O I/O

123 I/O I/O I/O

124 I/O I/O I/O

125 I/O I/O I/O

126 GND GND GND

127 I/O I/O I/O

128 I/O TCK, I/O TCK, I/O

129LPLPLP

130 VCCA VCCA VCCA

131 GND GND GND

132 VCCI VCCI VCCI

133 VCCA VCCA VCCA

134 I/O I/O I/O

135 I/O I/O I/O

136 VCCA VCCA VCCA

137 I/O I/O I/O

138 I/O I/O I/O

139 I/O I/O I/O

140 I/O I/O I/O

208-Pin PQFP

Pin Number

A42MX16

Function

A42MX24

Function

A42MX36

Function

40MX and 42MX FPGA Families

2-16 v6.1

141 NC I/O I/O

142 I/O I/O I/O

143 I/O I/O I/O

144 I/O I/O I/O

145 I/O I/O I/O

146 NC I/O I/O

147 NC I/O I/O

148 NC I/O I/O

149 NC I/O I/O

150 GND GND GND

151 I/O I/O I/O

152 I/O I/O I/O

153 I/O I/O I/O

154 I/O I/O I/O

155 I/O I/O I/O

156 I/O I/O I/O

157 GND GND GND

158 I/O I/O I/O

159 SDI, I/O SDI, I/O SDI, I/O

160 I/O I/O I/O

161 I/O WD, I/O WD, I/O

162 I/O WD, I/O WD, I/O

163 I/O I/O I/O

164 VCCI VCCI VCCI

165 NC I/O I/O

166 NC I/O I/O

167 I/O I/O I/O

168 I/O WD, I/O WD, I/O

169 I/O WD, I/O WD, I/O

170 I/O I/O I/O

171 NC I/O QCLKD, I/O

172 I/O I/O I/O

173 I/O I/O I/O

174 I/O I/O I/O

208-Pin PQFP

Pin Number

A42MX16

Function

A42MX24

Function

A42MX36

Function

175 I/O I/O I/O

176 I/O WD, I/O WD, I/O

177 I/O WD, I/O WD, I/O

178 PRA, I/O PRA, I/O PRA, I/O

179 I/O I/O I/O

180 CLKA, I/O CLKA, I/O CLKA, I/O

181 NC I/O I/O

182 NC VCCI VCCI

183 VCCA VCCA VCCA

184 GND GND GND

185 I/O I/O I/O

186 CLKB, I/O CLKB, I/O CLKB, I/O

187 I/O I/O I/O

188 PRB, I/O PRB, I/O PRB, I/O

189 I/O I/O I/O

190 I/O WD, I/O WD, I/O

191 I/O WD, I/O WD, I/O

192 I/O I/O I/O

193 NC I/O I/O

194 NC WD, I/O WD, I/O

195 NC WD, I/O WD, I/O

196 I/O I/O QCLKC, I/O

197 NC I/O I/O

198 I/O I/O I/O

199 I/O I/O I/O

200 I/O I/O I/O

201 NC I/O I/O

202 VCCI VCCI VCCI

203 I/O WD, I/O WD, I/O

204 I/O WD, I/O WD, I/O

205 I/O I/O I/O

206 I/O I/O I/O

207 DCLK, I/O DCLK, I/O DCLK, I/O

208 I/O I/O I/O

208-Pin PQFP

Pin Number

A42MX16

Function

A42MX24

Function

A42MX36

Function

40MX and 42MX FPGA Families

v6.1 2-17

240-Pin PQFP Package

Figure 2-7 • 240-Pin PQFP Package (Top View)

•

240-Pin

PQFP

240

40MX and 42MX FPGA Families

2-18 v6.1

240-Pin PQFP

Number

A42MX36

Function

1I/O

2 DCLK, I/O

3I/O

4I/O

5I/O

6WD, I/O

7WD, I/O

CCI

9I/O

10 I/O

11 I/O

12 I/O

13 I/O

14 I/O

15 QCLKC, I/O

16 I/O

17 WD, I/O

18 WD, I/O

19 I/O

20 I/O

21 WD, I/O

22 WD, I/O

23 I/O

24 PRB, I/O

25 I/O

26 CLKB, I/O

27 I/O

28 GND

29 VCCA

30 VCCI

31 I/O

32 CLKA, I/O

33 I/O

34 PRA, I/O

35 I/O

36 I/O

37 WD, I/O

38 WD, I/O

39 I/O

40 I/O

41 I/O

42 I/O

43 I/O

44 I/O

45 QCLKD, I/O

46 I/O

47 WD, I/O

48 WD, I/O

49 I/O

50 I/O

51 I/O

52 VCCI

53 I/O

54 WD, I/O

55 WD, I/O

56 I/O

57 SDI, I/O

58 I/O

59 VCCA

60 GND

61 GND

62 I/O

63 I/O

64 I/O

65 I/O

66 I/O

67 I/O

68 I/O

69 I/O

70 I/O

240-Pin PQFP

Number

A42MX36

Function

71 VCCI

72 I/O

73 I/O

74 I/O

75 I/O

76 I/O

77 I/O

78 I/O

79 I/O

80 I/O

81 I/O

82 I/O

83 I/O

84 I/O

85 VCCA

86 I/O

87 I/O

88 VCCA

89 VCCI

90 VCCA

91 LP

92 TCK, I/O

93 I/O

94 GND

95 I/O

96 I/O

97 I/O

98 I/O

99 I/O

100 I/O

101 I/O

102 I/O

103 I/O

104 I/O

105 I/O

240-Pin PQFP

Number

A42MX36

Function

106 I/O

107 I/O

108 VCCI

109 I/O

110 I/O

111 I/O

112 I/O

113 I/O

114 I/O

115 I/O

116 I/O

117 I/O

118 VCCA

119 GND

120 GND

121 GND

122 I/O

123 SDO, TDO, I/O

124 I/O

125 WD, I/O

126 WD, I/O

127 I/O

128 VCCI

129 I/O

130 I/O

131 I/O

132 WD, I/O

133 WD, I/O

134 I/O

135 QCLKB, I/O

136 I/O

137 I/O

138 I/O

139 I/O

140 I/O

240-Pin PQFP

Number

A42MX36

Function

40MX and 42MX FPGA Families

v6.1 2-19

141 I/O

142 WD, I/O

143 WD, I/O

144 I/O

145 I/O

146 I/O

147 I/O

148 I/O

149 I/O

150 VCCI

151 VCCA

152 GND

153 I/O

154 I/O

155 I/O

156 I/O

157 I/O

158 I/O

159 WD, I/O

160 WD, I/O

161 I/O

162 I/O

163 WD, I/O

164 WD, I/O

165 I/O

166 QCLKA, I/O

167 I/O

168 I/O

169 I/O

170 I/O

171 I/O

172 VCCI

173 I/O

174 WD, I/O

175 WD, I/O

240-Pin PQFP

Number

A42MX36

Function

176 I/O

177 I/O

178 TDI, I/O

179 TMS, I/O

180 GND

181 VCCA

182 GND

183 I/O

184 I/O

185 I/O

186 I/O

187 I/O

188 I/O

189 I/O

190 I/O

191 I/O

192 VCCI

193 I/O

194 I/O

195 I/O

196 I/O

197 I/O

198 I/O

199 I/O

200 I/O

201 I/O

202 I/O

203 I/O

204 I/O

205 I/O

206 VCCA

207 I/O

208 I/O

209 VCCA

210 VCCI

240-Pin PQFP

Number

A42MX36

Function

211 I/O

212 I/O

213 I/O

214 I/O

215 I/O

216 I/O

217 I/O

218 I/O

219 VCCA

220 I/O

221 I/O

222 I/O

223 I/O

224 I/O

225 I/O

226 I/O

227 VCCI

228 I/O

229 I/O

230 I/O

231 I/O

232 I/O

233 I/O

234 I/O

235 I/O

236 I/O

237 GND

238 MODE

239 VCCA

240 GND

240-Pin PQFP

Number

A42MX36

Function

40MX and 42MX FPGA Families

2-20 v6.1

80-Pin VQFP

Figure 2-8 • 80-Pin VQFP

80-Pin

VQFP

40MX and 42MX FPGA Families

v6.1 2-21

80-Pin VQFP

Number

A40MX02

Function

A40MX04

Function

1I/OI/O

2NCI/O

3NCI/O

4NCI/O

5I/OI/O

6I/OI/O

7GNDGND

8I/OI/O

9I/OI/O

10 I/O I/O

11 I/O I/O

12 I/O I/O

13 VCC VCC

14 I/O I/O

15 I/O I/O

16 I/O I/O

17 NC I/O

18 NC I/O

19 NC I/O

20 VCC VCC

21 I/O I/O

22 I/O I/O

23 I/O I/O

24 I/O I/O

25 I/O I/O

26 I/O I/O

27 GND GND

28 I/O I/O

29 I/O I/O

30 I/O I/O

31 I/O I/O

32 I/O I/O

33 VCC VCC

34 I/O I/O

35 I/O I/O

36 I/O I/O

37 I/O I/O

38 I/O I/O

39 I/O I/O

40 I/O I/O

41 NC I/O

42 NC I/O

43 NC I/O

44 I/O I/O

45 I/O I/O

46 I/O I/O

47 GND GND

48 I/O I/O

49 I/O I/O

50 CLK, I/O CLK, I/O

51 I/O I/O

52 MODE MODE

53 VCC VCC

54 NC I/O

80-Pin VQFP

Number

A40MX02

Function

A40MX04

Function

55 NC I/O

56 NC I/O

57 SDI, I/O SDI, I/O

58 DCLK, I/O DCLK, I/O

59 PRA, I/O PRA, I/O

60 NC NC

61 PRB, I/O PRB, I/O

62 I/O I/O

63 I/O I/O

64 I/O I/O

65 I/O I/O

66 I/O I/O

67 I/O I/O

68 GND GND

69 I/O I/O

70 I/O I/O

71 I/O I/O

72 I/O I/O

73 I/O I/O

74 VCC VCC

75 I/O I/O

76 I/O I/O

77 I/O I/O

78 I/O I/O

79 I/O I/O

80 I/O I/O

80-Pin VQFP

Number

A40MX02

Function

A40MX04

Function

40MX and 42MX FPGA Families

2-22 v6.1

100-Pin VQFP Package

Figure 2-9 • 100-Pin VQFP Package (Top View)

100-Pin

VQFP

100

40MX and 42MX FPGA Families

v6.1 2-23

100-Pin VQFP Package

Number

A42MX09

Function

A42MX16

Function

1I/OI/O

2 MODE MODE

3I/OI/O

4I/OI/O

5I/OI/O

6I/OI/O

7GNDGND

8I/OI/O

9I/OI/O

10 I/O I/O

11 I/O I/O

12 I/O I/O

13 I/O I/O

14 VCCA NC

15 VCCI VCCI

16 I/O I/O

17 I/O I/O

18 I/O I/O

19 I/O I/O

20 GND GND

21 I/O I/O

22 I/O I/O

23 I/O I/O

24 I/O I/O

25 I/O I/O

26 I/O I/O

27 I/O I/O

28 I/O I/O

29 I/O I/O

30 I/O I/O

31 I/O I/O

32 GND GND

33 I/O I/O

34 I/O I/O

35 I/O I/O

36 I/O I/O

37 I/O I/O

38 VCCA VCCA

39 I/O I/O

40 I/O I/O

41 I/O I/O

42 I/O I/O

43 I/O I/O

44 GND GND

45 I/O I/O

46 I/O I/O

47 I/O I/O

48 I/O I/O

49 I/O I/O

50 SDO, I/O SDO, I/O

51 I/O I/O

52 I/O I/O

53 I/O I/O

54 I/O I/O

55 GND GND

56 I/O I/O

57 I/O I/O

58 I/O I/O

59 I/O I/O

60 I/O I/O

61 I/O I/O

62 LP LP

63 VCCA VCCA

64 VCCI VCCI

65 VCCA VCCA

66 I/O I/O

67 I/O I/O

68 I/O I/O

69 I/O I/O

70 GND GND

100-Pin VQFP Package

Number

A42MX09

Function

A42MX16

Function

71 I/O I/O

72 I/O I/O

73 I/O I/O

74 I/O I/O

75 I/O I/O

76 I/O I/O

77 SDI, I/O SDI, I/O

78 I/O I/O

79 I/O I/O

80 I/O I/O

81 I/O I/O

82 GND GND

83 I/O I/O

84 I/O I/O

85 PRA, I/O PRA, I/O

86 I/O I/O

87 CLKA, I/O CLKA, I/O

88 VCCA VCCA

89 I/O I/O

90 CLKB, I/O CLKB, I/O

91 I/O I/O

92 PRB, I/O PRB, I/O

93 I/O I/O

94 GND GND

95 I/O I/O

96 I/O I/O

97 I/O I/O

98 I/O I/O

99 I/O I/O

100 DCLK, I/O DCLK, I/O

100-Pin VQFP Package

Number

A42MX09

Function

A42MX16

Function

40MX and 42MX FPGA Families

2-24 v6.1

176-Pin TQFP Package

Figure 2-10 • 176-Pin TQFP Package (Top View)

176-Pin

TQFP

176

40MX and 42MX FPGA Families

v6.1 2-25

176-Pin TQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

1 GND GND GND

2 MODE MODE MODE

3 I/O I/O I/O

4 I/O I/O I/O

5 I/O I/O I/O

6 I/O I/O I/O

7 I/O I/O I/O

8NCNCI/O

9 I/O I/O I/O

10 NC I/O I/O

11 NC I/O I/O

12 I/O I/O I/O

13 NC VCCA VCCA

14 I/O I/O I/O

15 I/O I/O I/O

16 I/O I/O I/O

17 I/O I/O I/O

18 GND GND GND

19 NC I/O I/O

20 NC I/O I/O

21 I/O I/O I/O

22 NC I/O I/O

23 GND GND GND

24 NC VCCI VCCI

25 VCCA VCCA VCCA

26 NC I/O I/O

27 NC I/O I/O

28 VCCI VCCA VCCA

29 NC I/O I/O

30 I/O I/O I/O

31 I/O I/O I/O

32 I/O I/O I/O

33 NC NC I/O

34 I/O I/O I/O

35 I/O I/O I/O

36 I/O I/O I/O

37 NC I/O I/O

38 NC NC I/O

39 I/O I/O I/O

40 I/O I/O I/O

41 I/O I/O I/O

42 I/O I/O I/O

43 I/O I/O I/O

44 I/O I/O I/O

45 GND GND GND

46 I/O I/O TMS, I/O

47 I/O I/O TDI, I/O

48 I/O I/O I/O

49 I/O I/O WD, I/O

50 I/O I/O WD, I/O

51 I/O I/O I/O

52 NC VCCI VCCI

53 I/O I/O I/O

54 NC I/O I/O

55 NC I/O WD, I/O

56 I/O I/O WD, I/O

57 NC NC I/O

58 I/O I/O I/O

59 I/O I/O WD, I/O

60 I/O I/O WD, I/O

61 NC I/O I/O

62 I/O I/O I/O

63 I/O I/O I/O

64 NC I/O I/O

65 I/O I/O I/O

66 NC I/O I/O

67 GND GND GND

68 VCCA VCCA VCCA

69 I/O I/O WD, I/O

70 I/O I/O WD, I/O

176-Pin TQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

40MX and 42MX FPGA Families

2-26 v6.1

71 I/O I/O I/O

72 I/O I/O I/O

73 I/O I/O I/O

74 NC I/O I/O

75 I/O I/O I/O

76 I/O I/O I/O

77 NC NC WD, I/O

78 NC I/O WD, I/O

79 I/O I/O I/O

80 NC I/O I/O

81 I/O I/O I/O

82 NC VCCI VCCI

83 I/O I/O I/O

84 I/O I/O WD, I/O

85 I/O I/O WD, I/O

86 NC I/O I/O

87 SDO, I/O SDO, I/O SDO, TDO, I/O

88 I/O I/O I/O

89 GND GND GND

90 I/O I/O I/O

91 I/O I/O I/O

92 I/O I/O I/O

93 I/O I/O I/O

94 I/O I/O I/O

95 I/O I/O I/O

96 NC I/O I/O

97 NC I/O I/O

98 I/O I/O I/O

99 I/O I/O I/O

100 I/O I/O I/O

101 NC NC I/O

102 I/O I/O I/O

103 NC I/O I/O

104 I/O I/O I/O

105 I/O I/O I/O

176-Pin TQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

106 GND GND GND

107 NC I/O I/O

108 NC I/O TCK, I/O

109LPLPLP

110 VCCA VCCA VCCA

111 GND GND GND

112 VCCI VCCI VCCI

113 VCCA VCCA VCCA

114 NC I/O I/O

115 NC I/O I/O

116 NC VCCA VCCA

117 I/O I/O I/O

118 I/O I/O I/O

119 I/O I/O I/O

120 I/O I/O I/O

121 NC NC I/O

122 I/O I/O I/O

123 I/O I/O I/O

124 NC I/O I/O

125 NC I/O I/O

126 NC NC I/O

127 I/O I/O I/O

128 I/O I/O I/O

129 I/O I/O I/O

130 I/O I/O I/O

131 I/O I/O I/O

132 I/O I/O I/O

133 GND GND GND

134 I/O I/O I/O

135 SDI, I/O SDI, I/O SDI, I/O

136 NC I/O I/O

137 I/O I/O WD, I/O

138 I/O I/O WD, I/O

139 I/O I/O I/O

140 NC VCCI VCCI

176-Pin TQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

40MX and 42MX FPGA Families

v6.1 2-27

141 I/O I/O I/O

142 I/O I/O I/O

143 NC I/O I/O

144 NC I/O WD, I/O

145 NC NC WD, I/O

146 I/O I/O I/O

147 NC I/O I/O

148 I/O I/O I/O

149 I/O I/O I/O

150 I/O I/O WD, I/O

151 NC I/O WD, I/O

152 PRA, I/O PRA, I/O PRA, I/O

153 I/O I/O I/O

154 CLKA, I/O CLKA, I/O CLKA, I/O

155 VCCA VCCA VCCA

156 GND GND GND

157 I/O I/O I/O

158 CLKB, I/O CLKB, I/O CLKB, I/O

176-Pin TQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

159 I/O I/O I/O

160 PRB, I/O PRB, I/O PRB, I/O

161 NC I/O WD, I/O

162 I/O I/O WD, I/O

163 I/O I/O I/O

164 I/O I/O I/O

165 NC NC WD, I/O

166 NC I/O WD, I/O

167 I/O I/O I/O

168 NC I/O I/O

169 I/O I/O I/O

170 NC VCCI VCCI

171 I/O I/O WD, I/O

172 I/O I/O WD, I/O

173 NC I/O I/O

174 I/O I/O I/O

175 DCLK, I/O DCLK, I/O DCLK, I/O

176 I/O I/O I/O

176-Pin TQFP

Pin Number

A42MX09

Function

A42MX16

Function

A42MX24

Function

40MX and 42MX FPGA Families

2-28 v6.1

208-Pin CQFP

)

Figure 2-11 • 208-Pin CQFP (Top View)

A42MX36

208-Pin

CQFP

Pin #1

Index

208 207 206 205 204 203 202 201 200 164 163 162 161 160 159 158 157

53 54 55 56 57 58 59 60 61 97 98 99 100101 102 103104

111

151

40MX and 42MX FPGA Families

v6.1 2-29

208-Pin CQFP

Number

A42MX36

Function

1GND

CCA

3MODE

4I/O

5I/O

6I/O

7I/O

8I/O

9I/O

10 I/O

11 I/O

12 I/O

13 I/O

14 I/O

15 I/O

16 I/O

17 VCCA

18 I/O

19 I/O

20 I/O

21 I/O

22 GND

23 I/O

24 I/O

25 I/O

26 I/O

27 GND

28 VCCI

29 VCCA

30 I/O

31 I/O

32 VCCA

33 I/O

34 I/O

35 I/O

36 I/O

37 I/O

38 I/O

39 I/O

40 I/O

41 I/O

42 I/O

43 I/O

44 I/O

45 I/O

46 I/O

47 I/O

48 I/O

49 I/O

50 I/O

51 I/O

52 GND

53 GND

54 TMS, I/O

55 TDI, I/O

56 I/O

57 WD, I/O

58 WD, I/O

59 I/O

60 VCCI

61 I/O

62 I/O

63 I/O

64 I/O

65 QCLKA, I/O

66 WD, I/O

67 WD, I/O

68 I/O

69 I/O

70 WD, I/O

208-Pin CQFP

Number

A42MX36

Function

71 WD, I/O

72 I/O

73 I/O

74 I/O

75 I/O

76 I/O

77 I/O

78 GND

79 VCCA

80 VCCI

81 I/O

82 I/O

83 I/O

84 I/O

85 WD, I/O

86 WD, I/O

87 I/O

88 I/O

89 I/O

90 I/O

91 QCLKB, I/O

92 I/O

93 WD, I/O

94 WD, I/O

95 I/O

96 I/O

97 I/O

98 VCCI

99 I/O

100 WD, I/O

101 WD, I/O

102 I/O

103 TDO, I/O

104 I/O

105 GND

208-Pin CQFP

Number

A42MX36

Function

106 VCCA

107 I/O

108 I/O

109 I/O

110 I/O

111 I/O

112 I/O

113 I/O

114 I/O

115 I/O

116 I/O

117 I/O

118 I/O

119 I/O

120 I/O

121 I/O

122 I/O

123 I/O

124 I/O

125 I/O

126 GND

127 I/O

128 TCK, I/O

129 LP

130 VCCA

131 GND

132 VCCI

133 VCCA

134 I/O

135 I/O

136 VCCA

137 I/O

138 I/O

139 I/O

140 I/O

208-Pin CQFP

Number

A42MX36

Function

40MX and 42MX FPGA Families

2-30 v6.1

141 I/O

142 I/O

143 I/O

144 I/O

145 I/O

146 I/O

147 I/O

148 I/O

149 I/O

150 GND

151 I/O

152 I/O

153 I/O

154 I/O

155 I/O

156 I/O

157 GND

208-Pin CQFP

Number

A42MX36

Function

158 I/O

159 SDI, I/O

160 I/O

161 WD, I/O

162 WD, I/O

163 I/O

164 VCCI

165 I/O

166 I/O

167 I/O

168 WD, I/O

169 WD, I/O

170 I/O

171 QCLKD, I/O

172 I/O

173 I/O

174 I/O

208-Pin CQFP

Number

A42MX36

Function

175 I/O

176 WD, I/O

177 WD, I/O

178 PRA, I/O

179 I/O

180 CLKA, I/O

181 I/O

182 VCCI

183 VCCA

184 GND

185 I/O

186 CLKB, I/O

187 I/O

188 PRB, I/O

189 I/O

190 WD, I/O

191 WD, I/O

208-Pin CQFP

Number

A42MX36

Function

192 I/O

193 I/O

194 WD, I/O

195 WD, I/O

196 QCLKC, I/O

197 I/O

198 I/O

199 I/O

200 I/O

201 I/O

202 VCCI

203 WD, I/O

204 WD, I/O

205 I/O

206 I/O

207 DCLK, I/O

208 I/O

208-Pin CQFP

Number

A42MX36

Function

40MX and 42MX FPGA Families

v6.1 2-31

256-Pin CQFP

Figure 2-12 • 256-Pin CQFP (Top View)

A42MX36

256-Pin

CQFP

Pin #1

Index

256 255 254 253 252 251 250 249 248 200 199 198 197 196 195 194 193

65 66 67 68 69 70 71 72 73 121 122 123 124 125 126 127 128

129

131

132

133

135

137

191

40MX and 42MX FPGA Families

2-32 v6.1

256-Pin CQFP

Number

A42MX36

Function

1NC

2GND

3I/O

4I/O

5I/O

6I/O

7I/O

8I/O

9I/O

10 GND

11 I/O

12 I/O

13 I/O

14 I/O

15 I/O

16 I/O

17 I/O

18 I/O

19 I/O

20 I/O

21 I/O

22 I/O

23 I/O

24 I/O

25 I/O

26 VCCA

27 I/O

28 I/O

29 VCCA

30 VCCI

31 GND

32 VCCA

33 LP

34 TCK, I/O

35 I/O

36 GND

37 I/O

38 I/O

39 I/O

40 I/O

41 I/O

42 I/O

43 I/O

44 I/O

45 I/O

46 I/O

47 I/O

48 GND

49 I/O

50 I/O

51 I/O

52 I/O

53 I/O

54 I/O

55 I/O

56 I/O

57 I/O

58 I/O

59 I/O

60 VCCA

61 GND

62 GND

63 NC

64 NC

65 NC

66 I/O

67 SDO, TDO, I/O

68 I/O

69 WD, I/O

70 WD, I/O

256-Pin CQFP

Number

A42MX36

Function

71 I/O

72 VCCI

73 I/O

74 I/O

75 I/O

76 WD, I/O

77 GND

78 WD, I/O

79 I/O

80 QCLKB, I/O

81 I/O

82 I/O

83 I/O

84 I/O

85 I/O

86 I/O

87 WD, I/O

88 WD, I/O

89 I/O

90 I/O

91 I/O

92 I/O

93 I/O

94 I/O

95 VCCI

96 VCCA

97 GND

98 GND

99 I/O

100 I/O

101 I/O

102 I/O

103 I/O

104 I/O

105 WD, I/O

256-Pin CQFP

Number

A42MX36

Function

106 WD, I/O

107 I/O

108 I/O

109 WD, I/O

110 WD, I/O

111 I/O

112 QCLKA, I/O

113 I/O

114 GND

115 I/O

116 I/O

117 I/O

118 I/O

119 VCCI

120 I/O

121 WD, I/O

122 WD, I/O

123 I/O

124 I/O

125 I/O

126 I/O

127 GND

128 NC

129 NC

130 NC

131 GND

132 I/O

133 I/O

134 I/O

135 I/O

136 I/O

137 I/O

138 I/O

139 GND

140 I/O

256-Pin CQFP

Number

A42MX36

Function

40MX and 42MX FPGA Families

v6.1 2-33

141 I/O

142 I/O

143 I/O

144 I/O

145 I/O

146 I/O

147 I/O

148 I/O

149 I/O

150 I/O

151 I/O

152 I/O

153 I/O

154 I/O

155 VCCA

156 I/O

157 I/O

158 VCCA

159 VCCI

160 GND

161 I/O

162 I/O

163 I/O

164 I/O

165 GND

166 I/O

167 I/O

168 I/O

169 I/O

170 VCCA

171 I/O

172 I/O

173 I/O

174 I/O

175 I/O

256-Pin CQFP

Number

A42MX36

Function

176 I/O

177 I/O

178 I/O

179 I/O

180 GND

181 I/O

182 I/O

183 I/O

184 I/O

185 I/O

186 I/O

187 I/O

188 MODE

189 VCCA

190 GND

191 NC

192 NC

193 NC

194 I/O

195 DCLK, I/O

196 I/O

197 I/O

198 I/O

199 WD, I/O

200 WD, I/O

201 VCCI

202 I/O

203 I/O

204 I/O

205 I/O

206 GND

207 I/O

208 I/O

209 QCLKC, I/O

210 I/O

256-Pin CQFP

Number

A42MX36

Function

211 WD, I/O

212 WD, I/O

213 I/O

214 I/O

215 WD, I/O

216 WD, I/O

217 I/O

218 PRB, I/O

219 I/O

220 CLKB, I/O

221 I/O

222 GND

223 GND

224 VCCA

225 VCCI

226 I/O

227 CLKA, I/O

228 I/O

229 PRA, I/O

230 I/O

231 I/O

232 WD, I/O

233 WD, I/O

234 I/O

235 I/O

236 I/O

237 I/O

238 I/O

239 I/O

240 QCLKD, I/O

241 I/O

242 WD, I/O

243 GND

244 WD, I/O

245 I/O

256-Pin CQFP

Number

A42MX36

Function

246 I/O

247 I/O

248 VCCI

249 I/O

250 WD, I/O

251 WD, I/O

252 I/O

253 SDI, I/O

254 I/O

255 GND

256 NC

256-Pin CQFP

Number

A42MX36

Function

40MX and 42MX FPGA Families

2-34 v6.1

272-Pin BGA Package

Figure 2-13 • 272-Pin BGA Package (Top View)

272-Pin PBGA

2019181716151413121110987654321

40MX and 42MX FPGA Families

v6.1 2-35

272-Pin PBGA

Number

A42MX36

Function

A1 GND

A2 GND

A3 I/O

A4 WD, I/O

A5 I/O

A6 I/O

A7 WD, I/O

A8 WD, I/O

A9 I/O

A10 I/O

A11 CLKA

A12 I/O

A13 I/O

A14 I/O

A15 I/O

A16 WD, I/O

A17 I/O

A18 I/O

A19 GND

A20 GND

B1 GND

B2 GND

B3 DCLK, I/O

B4 I/O

B5 I/O

B6 I/O

B7 WD, I/O

B8 I/O

B9 PRB, I/O

B10 I/O

B11 I/O

B12 WD, I/O

B13 I/O

B14 I/O

B15 WD, I/O

B16 I/O

B17 WD, I/O

B18 I/O

B19 GND

B20 GND

C1 I/O

C2 MODE

C3 GND

C4 I/O

C5 WD, I/O

C6 I/O

C7 QCLKC, I/O

C8 I/O

C9 I/O

C10 CLKB

C11 PRA, I/O

C12 WD, I/O

C13 I/O

C14 QCLKD, I/O

C15 I/O

C16 WD, I/O

C17 SDI, I/O

C18 I/O

C19 I/O

C20 I/O

D1 I/O

D2 I/O

D3 I/O

D4 I/O

D5 VCCI

D6 I/O

D7 I/O

D8 VCCA

D9 WD, I/O

D10 VCCI

272-Pin PBGA

Number

A42MX36

Function

D11 I/O

D12 VCCI

D13 I/O

D14 VCCI

D15 I/O

D16 VCCA

D17 GND

D18 I/O

D19 I/O

D20 I/O

E1 I/O

E2 I/O

E3 I/O

E4 VCCA

E17 VCCI

E18 I/O

E19 I/O

E20 I/O

F1 I/O

F2 I/O

F3 I/O

F4 VCCI

F17 I/O

F18 I/O

F19 I/O

F20 I/O

G1 I/O

G2 I/O

G3 I/O

G4 VCCI

G17 VCCI

G18 I/O

G19 I/O

G20 I/O

H1 I/O

272-Pin PBGA

Number

A42MX36

Function

H2 I/O

H3 I/O

H4 VCCA

H17 I/O

H18 I/O

H19 I/O

H20 I/O

J1 I/O

J2 I/O

J3 I/O

J4 VCCI

J9 GND

J10 GND

J11 GND

J12 GND

J17 VCCA

J18 I/O

J19 I/O

J20 I/O

K1 I/O

K2 I/O

K3 I/O

K4 VCCI

K9 GND

K10 GND

K11 GND

K12 GND

K17 I/O

K18 VCCA

K19 VCCA

K20 LP

L1 I/O

L2 I/O

L3 VCCA

L4 VCCA

272-Pin PBGA

Number

A42MX36

Function

40MX and 42MX FPGA Families

2-36 v6.1

L9 GND

L10 GND

L11 GND

L12 GND

L17 VCCI

L18 I/O

L19 I/O

L20 TCK, I/O

M1 I/O

M2 I/O

M3 I/O

M4 VCCI

M9 GND

M10 GND

M11 GND

M12 GND

M17 I/O

M18 I/O

M19 I/O

M20 I/O

N1 I/O

N2 I/O

N3 I/O

N4 VCCI

N17 VCCI

N18 I/O

N19 I/O

N20 I/O

P1 I/O

P2 I/O

P3 I/O

P4 VCCA

P17 I/O

P18 I/O

P19 I/O

272-Pin PBGA

Number

A42MX36

Function

P20 I/O

R1 I/O

R2 I/O

R3 I/O

R4 VCCI

R17 VCCI

R18 I/O

R19 I/O

R20 I/O

T1 I/O

T2 I/O

T3 I/O

T4 I/O

T17 VCCA

T18 I/O

T19 I/O

T20 I/O

U1 I/O

U2 I/O

U3 I/O

U4 I/O

U5 VCCI

U6 WD, I/O

U7 I/O

U8 I/O

U9 WD, I/O

U10 VCCA

U11 VCCI

U12 I/O

U13 I/O

U14 QCLKB, I/O

U15 I/O

U16 VCCI

U17 I/O

U18 GND

272-Pin PBGA

Number

A42MX36

Function

U19 I/O

U20 I/O

V1 I/O

V2 I/O

V3 GND

V4 GND

V5 I/O

V6 I/O

V7 I/O

V8 WD, I/O

V9 I/O

V10 I/O

V11 I/O

V12 I/O

V13 WD, I/O

V14 I/O

V15 WD, I/O

V16 I/O

V17 I/O

V18 SDO, TDO,

I/O

V19 I/O

V20 I/O

W1 GND

W2 GND

W3 I/O

W4 TMS, I/O

W5 I/O

W6 I/O

W7 I/O

W8 WD, I/O

W9 WD, I/O

W10 I/O

W11 I/O

W12 I/O

272-Pin PBGA

Number

A42MX36

Function

W13 WD, I/O

W14 I/O

W15 I/O

W16 WD, I/O

W17 I/O

W18 WD, I/O

W19 GND

W20 GND

Y1 GND

Y2 GND

Y3 I/O

Y4 TDI, I/O

Y5 WD, I/O

Y6 I/O

Y7 QCLKA, I/O

Y8 I/O

Y9 I/O

Y10 I/O

Y11 I/O

Y12 I/O

Y13 I/O

Y14 I/O

Y15 I/O

Y16 I/O

Y17 I/O

Y18 WD, I/O

Y19 GND

Y20 GND

272-Pin PBGA

Number

A42MX36

Function

FPGA Families 40MX and 42MX

v6.1 3-1

Datasheet Information

List of Changes

The following table lists critical changes that were made in the current version of the document.

Previous version Changes in current version (v6.1 ) Page

v6.0

(January 2004)

In Table 14 • Absolute Maximum Ratings*, the limits in VI were changed from -0.5 to VCCI+0.5

to -0.5 to VCCA+0.5.

1-18

In Table 16 • Mixed 5.0V/3.3V Electrical Specifications, VOH was changed from 3.7 to 2.4 for the

min in industrial and military. VIH had VCCI and that was changed to VCCA.

1-18

v5.1 The "Ease of Integration" section was updated. 1-i

The "Temperature Grade Offerings" section is new. 1-iii

The "Speed Grade Offerings" section is new. 1-iii

The "General Description" section was updated. 1-1

The "MultiPlex I/O Modules" section was updated. 1-6

The "User Security" section was updated. 1-6

Table 1 • Voltage Support of MX Devices was updated. 1-7

The "Power Dissipation" section was updated. 1-8

The "Static Power Component" section was updated. 1-8

The "Equivalent Capacitance" section was updated. 1-8

Figure 1-13 • Silicon Explorer II Setup with 42MX was updated. 1-10

Table 4 • Supported BST Public Instructions was updated. 1-11

Figure 1-14 • 42MX IEEE 1149.1 Boundary Scan Circuitry was updated. 1-11

Table 5 • Boundary Scan Pin Configuration and Functionality was updated. 1-12

The "Development Tool Support" section was updated. 1-13

The Table 7 • Absolute Maximum Ratings for 42MX Devices* and the Table 6 • Abs olut e

Maximum Ratings for 40MX Devices* were updated.

1-14

The Table 9 • 5V TTL Electrical Specifications was updated. 1-15

The Table 13 • 3.3V LVTTL Electrical Specifications was updated. 1-17

In the "Mixed 5.0V/3.3V Electrical Specifications" section, Table 14 • Absolute Maximum

Ratings*, Table 15 • Recommended Operating Conditions, and Table 16 • Mixed 5.0V/3.3V

Electrical Specificationswere updated.

1-18

The Table 17 • DC Specification (5.0V PCI Signaling)1 was updated. 1-19

The Table 19 • DC Specification (3.3V PCI Signaling)1 was updated. 1-20

The <zBlue>Junction Temperature (TJ) section, "Package Thermal Characteristics" section, and the

tables were updated.

1-22

Figure 1-17 • 40MX Timing Model* was updated. 1-23

Figure 1-19 • 42MX Timing Model (Logic Functions Using Quadrant Clocks) 1-24

The Figure 1-20 • 42MX Timing Model (SRAM Functions) was updated. 1-24

The Figure 1-27 • Output Buffer Latches was updated. 1-27

The Table 22 • 42MX Temperature and Voltage Derating Factors is new. 1-31

The Table 23 • 40MX Temperature and Voltage Derating Factors is new. 1-32

The "Pin Descriptions" section was updated. 1-77

FPGA Families 40MX and 42MX

3-2 v6.1

Datasheet Categories

In order to provide the latest information to designers, some datasheets are published before data has been fully

characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet

Supplement." The definitions of these categories are as follows:

Product Brief

The product brief is a summarized version of a datasheet (advanced or production) containing general product

information. This brief gives an overview of specific device and family information.

Advanced

This datasheet version contains initial estimated information based on simulation, other products, devices, or speed

grades. This information can be used as estimates, but not for production.

Unmarked (production)

This datasheet version contains information that is considered to be final.

Datasheet Supplement

The datasheet supplement gives specific device information for a derivative family that differs from the general family

datasheet. The supplement is to be used in conjunction with the datasheet to obtain more detailed information and

for specifications that do not differ between the two families.

5.1

(continued)

In the 100-Pin PQFP table, the following pins changed:

Pin 64 (42MX09 and 42MX16) has changed to LP

2-7

In the 160-Pin PQFP table, the following pins changed:

Pin 61 (42MX09, 42MX16, and 42MX64) has changed to LP

2-10

In the 208-Pin PQFP table, the following pins changed:

Pin 129 (42MX09, 42MX16, and 42MX64) has changed to LP

Pin 198 (42MX09) has changed to I/O

2-14

The n the 240-Pin PQFP table, the following pins changed:

Pin 91 (42MX36) has changed to LP

2-18

In the 100-Pin VQFP Package table, the following pins changed:

Pin 62 (42MX09 and 42MX16) has changed to LP

2-23

In the 176-Pin TQFP table, the following pins changed:

Pin 109 (42MX09 and 42MX16) has changed to LP

2-25

In the 272-Pin PBGA table, the following pins changed:

Pin K20 (42MX36) has changed to LP

2-35

v5.0 The "Low Power Mode" section was updated. 1-7

Footnote 8 in the Table 9 • 5V TTL Electrical Specifications was updated. 1-15

Footnote 8 in the Table 13 • 3.3V LVTTL Electrical Specifications was updated. 1-17

v4.0.1 Because the changes in this data sheet are extensive and technical in nature, this should be viewed

as a new document. Please read it as you would a data sheet that is published for the first time.

ALL

Note that the “Package Characteristics and Mechanical Drawings” section has been eliminated

from the data sheet. The mechanical drawings are now contained in a separate document,

“Package Characteristics and Mechanical Drawings,” available on the Actel web site.

Previous version Changes in current version (v6.1 ) Page

5172136-9/4.09

Actel Corporation

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Phone 650.318.4200

Fax 650.318.4600

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Fax +852 2185 6488

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Actel and the Actel logo are registered trademarks of Actel Corporation.

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Actel is the leader in low-power and mixed-signal FPGAs and offers the most comprehensive portfolio of

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