11
Product family data sheet
Copyright © 2011-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-DS46 REV 4G
Cree® XLamp® ML-C LEDs
PRODUCT DESCRIPTION
The Cree XLamp® ML-C LED brings
lighting-class reliability and performance
to 1/3-watt LEDs. The XLamp ML-C LED
expands Cree’s lighting-class leadership
to LED bulbs and linear and distributed
lighting applications. With XLamp
LED lighting-class reliability, a wide
viewing angle, uniform light output, and
industry-leading chromaticity binning in
a 3.5-mm X 3.5-mm package, the XLamp
ML-C LED continues Cree’s history of
segment-focused product innovation in
LEDs for lighting applications.
The XLamp ML-C LED brings high
performance and a smooth look to a
wide range of lighting applications,
including linear lighting, uorescent
retrots and retail-display lighting.
FEATURES
• Available in white (2600K to 8300K
CCT), 80-, 85- and 90-CRI minimum
and royal blue
• White LEDs available in both parallel
and series
• ANSI-compatible sub-bins
• Maximum drive current: 350mA for
parallel, 175mA for series, 250mA
for royal blue
• 120° viewing angle, uniform
chromaticity prole
• Electrically neutral thermal path
• RoHS and REACh compliant
• UL® recognized component
(E349212)
TABLE OF CONTENTS
Characteristics ............................................2
Flux Characteristics ....................................3
Relative Spectral Power Distribution .........6
Relative Luminous Flux vs. Junction
Temperature ................................................7
Relative Radiant Flux vs. Junction
Temperature ................................................7
Electrical Characteristics ............................8
Relative Luminous Flux vs. Current ............9
Relative Radiant Flux vs. Current ............ 10
Typical Spatial Distribution ...................... 11
Thermal Design ........................................ 12
Reow Soldering Characteristics ............ 14
Notes ........................................................ 15
Mechanical Dimensions .......................... 17
Tape and Reel ........................................... 18
Packaging ................................................. 19