PC1231xNSZ0F
Series
■ Features
DIP 4pin Reinforced Insulation Type,
High CMR, Low Input Current
Photocoupler
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Low input current type (IF=0.5mA)
4. High resistance to noise due to high common rejec-
tion voltage (CMR : MIN. 10kV/
m
s)
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
8. Lead-free and RoHS directive compliant
■ Description
PC1231xNSZ0F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
CTR is 50% to 400% at input current of 0.5mA.
1Sheet No.: D2-A02903EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC1231xNSZ0F Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC1231)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950, file No. 7409, (as model No. PC1231)
3. Approved by SEMCO, EN60065, EN60950, file No.
9933036 (as model No. PC1231)
4. Approved by DEMCO, EN60065, EN60950, file No.
99-03814 (as model No. PC1231)
5. Approved by NEMKO, EN60065, EN60950, file No.
P99102251 (as model No. PC1231)
6. Approved by FIMKO, EN60065, EN60950, file No.
13986 (as model No. PC1231)
7. Recognized by CSA file No. CA095323 (as model
No. PC1231)
8. Approved by VDE, DIN EN60747-5-2(
*
) (as an op-
tion), file No. 40008087(as model No. PC1231)
9. Package resin : UL flammability grade (94V-0)
(
*
)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Agency approvals/Compliance
1. Primary to secondary isolation in switch mode power
supply
2. Noise suppression in switching circuit
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection
■ Applications
■ Internal Connection Diagram
Anode
Cathode
Emitter
Collector
1
1
2
3
4
2
4
3
2
Sheet No.: D2-A02903EN
■ Outline Dimensions
PC1231xNSZ0F Series
(Unit : mm)
1. Through-Hole [ex. PC1231xNSZ0F] 2. Through-Hole (VDE option) [ex. PC1231xYSZ0F]
3.
Wide Through-Hole Lead-Form [ex. PC1231xNFZ0F]
4.
Wide Through-Hole Lead-Form
(VDE option)
[ex. PC1231xYFZ0F]
1231
4.58±0.3
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.3
7.62±0.3 4.58±0.3
3.5±0.5
3.4±0.5
2.7±0.5
0.5TYP.
Anode mark
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
1
2
4
3
Rank mark
Factory identification mark
Date code
0.26±0.1
1231
4.58±0.3
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.3
7.62±0.3 4.58±0.3
3.5±0.5
3.4±0.5
2.7±0.5
0.5TYP.
Anode mark
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
1
2
4
3
Rank mark
Factory identification mark
Date code
4
SHARP mark "S"
VDE
Indenfication mark
0.26±0.1
1.2±0.3
0.6±0.2
2.54±0.25
4.58±0.3
3.5±0.5
1.0±0.1
6.5±0.3
7.62±0.3
Epoxy resin
4.58±0.3
0.26±0.1
10.16±0.5
2.7MIN.
Anode mark
1
23
4
0.5±0.1
Rank mark Factory identification mark
Date code
1231
1.2±0.3
0.6±0.2
2.54±0.25
4.58±0.3
3.5±0.5
1.0±0.1
6.5±0.3
7.62±0.3
Epoxy resin
4.58±0.3
0.26±0.1
10.16±0.5
2.7MIN.
Anode mark
1
23
4
0.5±0.1
Rank mark Factory identification mark
SHARP mark "S"
Date code
VDE
Indenfication mark
4
1231
Product mass : approx. 0.23gProduct mass : approx. 0.23g
Product mass : approx. 0.23gProduct mass : approx. 0.23g
3
Sheet No.: D2-A02903EN
(Unit : mm)
5. SMT Gullwing Lead-Form [ex. PC1231xNIP0F] 6. SMT Gullwing Lead-Form (VDE option)
[ex. PC1231xYIP0F]
7.
Wide SMT Gullwing Lead-Form [ex. PC1231xNUP0F]
8.
Wide SMT Gullwing Lead-Form
(VDE option)
[ex. PC1231xYUP0F]
0.6±0.2
1.2±0.3
6.5±0.3
7.62±0.3
0.26±0.1
4.58±0.3
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.3
2.54±0.25
4
3
Anode mark
Rank mark Factory identification mark
Date code
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
1
2
0.35±0.25
1231
0.6±0.2
1.2±0.3
6.5±0.3
7.62±0.3
0.26±0.1
4.58±0.3
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.3
2.54±0.25
4
3
Anode mark
Rank mark Factory identification mark
Date code
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
1
2
4
0.35±0.25
SHARP mark "S"
VDE
Indenfication mark
1231
1231
0.6±0.2
1.2±0.3
1.0±0.1
6.5±0.3
10.16±0.5 0.75±0.25
0.75±0.25
4.58±0.3
2.54±0.25
Anode mark
Rank mark
Factory identification mark
Date code
4
3
7.62±0.3
12.0MAX
4.58±0.3
Epoxy resin
3.5±0.5
0.26±0.1
0.5±0.1
0.25±0.25
1
2
0.6±0.2
1.2±0.3
1.0±0.1
6.5±0.3
10.16±0.5 0.75±0.25
0.75±0.25
4.58±0.3
2.54±0.25
Anode mark
Rank mark
Factory identification mark
Date code
4
3
7.62±0.3
12.0MAX
4.58±0.3
Epoxy resin
3.5±0.5
0.26±0.1
0.5±0.1
0.25±0.25
1
2
4
SHARP mark "S" VDE
Indenfication mark
1231
PC1231xNSZ0F Series
Product mass : approx. 0.22gProduct mass : approx. 0.22g
Product mass : approx. 0.22gProduct mass : approx. 0.22g
Plating material : SnCu (Cu : TYP. 2%)
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
·
·
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actual status of the
production.
4
repeats in a 20 year cycle
Sheet No.: D2-A02903EN
PC1231xNSZ0F Series
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A02903EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Reverse current
Terminal capacitance
Collector dark current
Collector-emitter breakdown voltage
Transfer
charac-
teristics
Emitter-collector breakdown voltage
Collector current
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
MIN.
−
−
−
6
70
0.25
−
−
5×1010
−
−
−
TYP.
1.2
−
30
−
−
−
−
1×1011
0.6
4
3
MAX.
1.4
10
250
−
−
2.0
0.2
−
1.0
18
18
Unit
V
µA
pF
nA−100
V
V
mA
V
Ω
pF
µs
µs
10 −−kV/µs
Symbol
VF
IR
Ct
ICEO
BVCEO
BVECO
IC
VCE (sat)
Cf
tr
tf
RISO
CMR
Response time
Common mode
rejection voltage
Rise time
Fall time
Input
Output
IF=10mA
VR=4V
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=0.5mA, VCE=5V
IF=10mA, IC=1mA
V=0, f=1MHz
VCE=2V, IC=2mA, RL=100Ω
VCM=1.5kV(peak), IF=0
RL=470Ω, VCC=9V, Vnp=100mV
DC500V, 40 to 60%RH
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current mA
Power dissipation mW
Output
Collector-emitter voltage
V
Emitter-collector voltage
V
Collector current mA
Collector power dissipation
mW
Total power dissipation mW
*2 Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VCEO
VECO
IC
PC
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
Rating
10
200
15
Reverse voltage VVR6
70
6
50
150
170
−30 to +100
−55 to +125
260
5.0 kV
5
PC1231xNSZ0F Series
Sheet No.: D2-A02903EN
■ Model Line-up
6
Please contact a local SHARP sales representative to inquire about production status.
IC [mA]
(I
F
=0.5mA, V
CE
=5V, T
a
=25˚C)
Rank mark
Lead Form
Package
DIN EN60747-5-2
Model No.
Sleeve
100pcs/sleeve
−
Approved
Wide Trough-HoleTrough-Hole
0.25 to 2.0
0.5 to 1.25
PC12310NSZ0F
PC12311NSZ0F
PC12310YSZ0F
PC12311YSZ0F
−
Approved
PC12310NFZ0F
PC12311NFZ0F
PC12310YFZ0F
PC12311YFZ0F
−
with or without
A
IC [mA]
(I
F
=0.5mA, V
CE
=5V, T
a
=25˚C)
Rank mark
Lead Form
Package
DIN EN60747-5-2
Model No.
Taping
2 000pcs/reel
Wide SMT GullwingSMT Gullwing
0.25 to 2.0
0.5 to 1.25
−
Approved
PC12310NIP0F
PC12311NIP0F
PC12310YIP0F
PC12311YIP0F
−
Approved
PC12310NUP0F
PC12311NUP0F
−
with or without
A
PC12310YUP0F
PC12311YUP0F
PC1231xNSZ0F Series
Sheet No.: D2-A02903EN
Total power dissipation Ptot (mW)
Ambient temperature Ta (˚C)
0
250
200
150
170
100
50
−30 0 25 50 75 100 125
Fig.5 Total Power Dissipation vs. Ambient
Temperature
Forward current IF (mA)
Ambient temperature Ta (˚C)
0
15
10
5
−30 0 25 50 75 100 125
Fig.2 Forward Current vs. Ambient
Temperature
Diode power dissipation P (mW)
Ambient temperature Ta (˚C)
0
15
10
5
−30 0 25 50 75 100 125
Fig.3 Diode Power Dissipation vs. Ambient
Temperature
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
Fig.4 Collector Power Dissipation vs.
Ambient Temperature
7
Fig.1 Test Circuit for Common Mode Rejection Voltage
VCM
Vcp Vnp
VO
(dV/dt)
1)
RLVnp
VCC
VCM
VCM : High wave
pulse
RL=470Ω
VCC=9V
1) Vcp : Voltage which is generated by displacement current in floating
capacitance between primary and secondary side.
(Vcp Nearly = dV/dt×Cf×RL)
PC1231xNSZ0F Series
Sheet No.: D2-A02903EN
Relative current transfer ratio (%)
Ambient temperature Ta (˚C)
−30 1009080706050403020100−10−20
VCE=5V
IF=0.5mA
0
150
100
50
Fig.10 Relative Current Transfer Ratio vs.
Ambient Temperature
Collector-emitter saturation voltage VCE (sat) (V)
Ambient temperature Ta (˚C)
0
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
IF=10mA
IC=1mA
−30 1009080706050403020100−10−20
Fig.11 Collector - emitter Saturation Voltage
vs. Ambient Temperature
8
Collector current IC (mA)
Collector-emitter voltage VCE (V)
0
40
0246810
Ta=25˚C
30
20
10
PC (MAX.)
IF=7mA
IF=5mA
IF=3mA
IF=2mA
IF=1mA IF=0.5mA
Fig.9 Collector Current vs. Collector-emitter
Voltage
Current transfer ratio CTR (%)
Forward current IF (mA)
0.1 1 10
0
500
400
300
200
100
VCE=5V
Ta=25˚C
Fig.8 Current Transfer Ratio vs. Forward
Current
Forward current IF (mA)
0.1
1
10
100
0 0.5 1 1.5 2
Forward voltage VF (V)
Ta=25˚C
Ta=75˚C
Ta=100˚C
Ta=50˚C
Ta=0˚C
Ta=−25˚C
Fig.7 Forward Current vs. Forward Voltage
Peak forward current IFM (mA)
Duty ratio
10
1 000
100
10−2
10−310−11
Pulse width≤100µs
Ta=25˚C
Fig.6 Peak Forward Current vs. Duty Ratio
PC1231xNSZ0F Series
Sheet No.: D2-A02903EN
9
Ambient temperature Ta (˚C)
−30 1009080706050403020100−10−20
VCE=50V
10−11
10−5
10−6
10−7
10−8
10−9
10−10
Collector dark current ICEO (A)
Fig.12 Collector Dark Current vs. Ambient
Temperature
Fig.13 Response Time vs. Load Resistance
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
PC1231xNSZ0F Series
10%
Input
Output
Input Output
90%
ts
td
VCC
RDRL
tf
tr
Please refer to the conditions in Fig.13.
VCE
Fig.14 Test Circuit for Response Time
Voltage gain AV (dB)
−25
5
0.1 1 10 100 1 000
Frequency f (kHz)
VCE=2V
IC=2mA
Ta=25˚C
0
−5
−10
−15
−20
RL=10kΩ
1kΩ
100Ω
Fig.15 Frequency Response
Collector-emitter saturation voltage VCE (sat) (V)
Forward current IF (mA)
0
5
0246810
Ta=25˚C
4
3
2
1
IC=7mA
IC=5mA
IC=3mA
IC=2mA
IC=1mA
IC=0.5mA
Fig.16 Collector-emitter Saturation Voltage
vs. Forward Current
Load resistance RL (kΩ)
0.1
1
10
100 VCE=2V, IC=2mA
1
tf
ts
tr
td
10
Responce time (µs)
Sheet No.: D2-A02903EN
■ Design Considerations
While operating at IF<0.5mA, CTR variation may increase.
Please make design considering this fact.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
10
8.2
2.54
1.7
2.2
(Unit : mm)
● Design guide
PC1231xNSZ0F Series
10.2
2.54
1.7
2.2
SMT Gullwing lead-form Wide SMT Gullwing lead-form
Sheet No.: D2-A02903EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
11
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC1231xNSZ0F Series
Sheet No.: D2-A02903EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
● Presence of ODC
12
PC1231xNSZ0F Series
Sheet No.: D2-A02903EN
● Sleeve package
1. Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
■ Package specification
13
(Unit : mm)
12.0
6.7
5.8
10.8
520
±2
(Unit : mm)
2. Wide Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
520
±2
PC1231xNSZ0F Series
15.0
6.35
5.9
10.8
Sheet No.: D2-A02903EN
14
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
D J
G
B
H
H
A
C
5˚MAX.
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC1231xNSZ0F Series
Sheet No.: D2-A02903EN
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
15
Dimensions List
A
24.0±0.3
B
11.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
12.4±0.1
I
0.4±0.05
J
4.1±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
(Unit : mm)
J
GI
EC
B
A
H
H
5˚
MAX.
F D
K
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
22.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC1231xNSZ0F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
16
Sheet No.: D2-A02903EN
■ Important Notices
PC1231xNSZ0F Series
[E223]
