PC1231xNSZ0F Series PC1231xNSZ0F Series DIP 4pin Reinforced Insulation Type, High CMR, Low Input Current Photocoupler Description Agency approvals/Compliance PC1231xNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 50% to 400% at input current of 0.5mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC1231) 2. Approved by BSI, BS-EN60065, file No. 7087, BSEN60950, file No. 7409, (as model No. PC1231) 3. Approved by SEMCO, EN60065, EN60950, file No. 9933036 (as model No. PC1231) 4. Approved by DEMCO, EN60065, EN60950, file No. 99-03814 (as model No. PC1231) 5. Approved by NEMKO, EN60065, EN60950, file No. P99102251 (as model No. PC1231) 6. Approved by FIMKO, EN60065, EN60950, file No. 13986 (as model No. PC1231) 7. Recognized by CSA file No. CA095323 (as model No. PC1231) 8. Approved by VDE, DIN EN60747-5-2 (*) (as an option), file No. 40008087(as model No. PC1231) 9. Package resin : UL flammability grade (94V-0) Features 1. 4pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Low input current type (IF=0.5mA) 4. High resistance to noise due to high common rejection voltage (CMR : MIN. 10kV/ms) 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output (Viso(rms) : 5.0kV) 8. Lead-free and RoHS directive compliant (*) DIN EN60747-5-2 : successor standard of DIN VDE0884 Applications 1. Primary to secondary isolation in switch mode power supply 2. Noise suppression in switching circuit 3. Signal transmission between circuits of different potentials and impedances 4. Over voltage detection Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A02903EN Date Jun. 30. 2005 (c) SHARP Corporation PC1231xNSZ0F Series Internal Connection Diagram 1 1 4 2 3 2 3 4 Anode Cathode Emitter Collector Outline Dimensions (Unit : mm) Rank mark 1.20.3 3 4 1 2 3 1 4 2 2.540.25 SHARP mark "S" 7.620.3 3.50.5 Epoxy resin 3.40.5 3.50.5 3.40.5 2.7 0.5 Epoxy resin 0.260.1 4.580.3 0.5TYP. 4.580.3 7.620.3 VDE Indenfication mark 0.260.1 0.50.1 0.50.1 : 0 to 13 : 0 to 13 Product mass : approx. 0.23g Product mass : approx. 0.23g 3. Wide Through-Hole Lead-Form [ex. PC1231xNFZ0F] 0.25 1 2 3 1 0.3 4 4.58 4.58 3 0.1 4 1.0 0.3 2.54 0.3 0.2 0.6 1 2 0.25 1.0 6.50.3 3 2.54 1 2 3 1 Date code 0.3 4 0.1 2 1.2 1 Factory identification mark Rank mark Anode mark Date code 0.2 0.6 0.3 1.2 4. Wide Through-Hole Lead-Form (VDE option) [ex. PC1231xYFZ0F] Factory identification mark Rank mark Anode mark SHARP mark "S" 0.3 6.5 VDE Indenfication mark 0.3 7.62 4.58 0.3 0.3 4.58 2.7MIN. 3.5 3.5 0.5 0.5 7.62 2.7MIN. 0.5TYP. 6.50.3 2.7 6.50.3 3 0.5 2 Date code 1 4.580.3 4 1 2 3 1 Factory identification mark 2.540.25 0.60.2 Date code 1 Rank mark Anode mark Factory identification mark 0.60.2 Anode mark 1.20.3 2. Through-Hole (VDE option) [ex. PC1231xYSZ0F] 4.580.3 1. Through-Hole [ex. PC1231xNSZ0F] Epoxy resin Epoxy resin 0.1 0.1 0.26 0.26 0.5 10.16 0.5 0.1 10.16 0.5 Product mass : approx. 0.23g 0.1 0.5 Product mass : approx. 0.23g Sheet No.: D2-A02903EN 2 PC1231xNSZ0F Series (Unit : mm) Rank mark Anode mark 6.50.3 0.60.2 1.20.3 SHARP mark "S" 0.1 0.26 3.50.5 2.540.25 1.0+0.4 -0 10.0+0 -0.5 Product mass : approx. 0.22g 7. Wide SMT Gullwing Lead-Form [ex. PC1231xNUP0F] 8. Wide SMT Gullwing Lead-Form (VDE option) [ex. PC1231xYUP0F] Rank mark Factory identification mark 1 2 3 1 3 2.540.25 4 6.50.3 SHARP mark "S" VDE Indenfication mark 0.50.1 0.25 4.580.3 3.50.5 0.250.25 3.50.5 0.260.1 0.25 0.25 10.16 4 7.620.3 Epoxy resin 0.5 0.6 2 4.580.3 7.620.3 Date code 1 0.260.1 3 1.0 6.50.3 0.2 1.20.3 4.580.3 1 2 3 1 0.1 1.00.1 4 2.540.25 0.60.2 1.20.3 Date code 1 Factory identification mark Anode mark 4.580.3 Rank mark Anode mark 0.75 2.540.25 1.0+0.4 -0 Epoxy resin 1.0+0.4 -0 Product mass : approx. 0.22g 0.25 4.580.3 0.350.25 7.620.3 10.0+0 -0.5 2 VDE Indenfication mark 6.5 4.580.3 Epoxy resin 3 4 0.350.25 0.260.1 1 2 3 1 2 0.3 7.620.3 1.0+0.4 -0 4 1 2.540.25 3 Date code 3.50.5 1 2 3 1 2 4.580.3 4 1 Factory identification mark 4.580.3 Factory identification mark Date code 0.60.2 1.20.3 Rank mark Anode mark 6. SMT Gullwing Lead-Form (VDE option) [ex. PC1231xYIP0F] 2.540.25 5. SMT Gullwing Lead-Form [ex. PC1231xNIP0F] Epoxy resin 0.75 12.0MAX 0.750.25 10.160.5 0.50.1 0.750.25 12.0MAX Product mass : approx. 0.22g Product mass : approx. 0.22g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A02903EN 3 PC1231xNSZ0F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ** * repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. Rank mark Refer to the Model Line-up table Sheet No.: D2-A02903EN 4 PC1231xNSZ0F Series Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation *2 Isolation voltage Viso (rms) Topr Operating temperature Tstg Storage temperature *3 Soldering temperature Tsol Rating 10 200 6 15 70 6 50 150 170 5.0 -30 to +100 -55 to +125 260 (Ta=25C) Unit mA mA V mW V V mA mW mW kV C C C *1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF IR Reverse current Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Floating capacitance Cf Rise time tr Response time Fall time tf Common mode CMR rejection voltage Conditions IF=10mA VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=0.5mA, VCE=5V IF=10mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=2V, IC=2mA, RL=100 VCM=1.5kV(peak), IF=0 RL=470, VCC=9V, Vnp=100mV MIN. - - - - 70 6 0.25 - 5x1010 - - - TYP. 1.2 - 30 - - - - - 1x1011 0.6 4 3 MAX. 1.4 10 250 100 - - 2.0 0.2 - 1.0 18 18 (Ta=25C) Unit V A pF nA V V mA V pF s s 10 - - kV/s Sheet No.: D2-A02903EN 5 PC1231xNSZ0F Series Model Line-up Lead Form Trough-Hole Lead Form SMT Gullwing Wide Trough-Hole IC [mA] Rank mark Sleeve (I =0.5mA, VCE=5V, Ta=25C) Package F 100pcs/sleeve DIN EN60747-5-2 - Approved - Approved - 0.25 to 2.0 PC12310NSZ0F PC12310YSZ0F PC12310NFZ0F PC12310YFZ0F with or without Model No. 0.5 to 1.25 PC12311NSZ0F PC12311YSZ0F PC12311NFZ0F PC12311YFZ0F A Wide SMT Gullwing IC [mA] Rank mark Taping (IF=0.5mA, VCE=5V, Ta=25C) 2 000pcs/reel DIN EN60747-5-2 - Approved - Approved - 0.25 to 2.0 PC12310NIP0F PC12310YIP0F PC12310NUP0F PC12310YUP0F with or without Model No. 0.5 to 1.25 PC12311NIP0F PC12311YIP0F PC12311NUP0F PC12311YUP0F A Package Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A02903EN 6 PC1231xNSZ0F Series Fig.1 Test Circuit for Common Mode Rejection Voltage (dV/dt) VCM RL 1) VCC Vnp VCM : High wave pulse RL=470 VCC=9V VCM Vnp Vcp VO (Vcp Nearly = dV/dtxCfxRL) 1) Vcp : Voltage which is generated by displacement current in floating capacitance between primary and secondary side. Fig.3 Diode Power Dissipation vs. Ambient Temperature Fig.2 Forward Current vs. Ambient Temperature Diode power dissipation P (mW) Forward current IF (mA) 15 10 5 0 -30 0 25 50 75 100 15 10 5 0 -30 125 0 Fig.4 Collector Power Dissipation vs. Ambient Temperature 75 100 125 250 Total power dissipation Ptot (mW) Collector power dissipation PC (mW) 50 Fig.5 Total Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 -30 25 Ambient temperature Ta (C) Ambient temperature Ta (C) 0 25 50 75 100 200 170 150 100 50 0 -30 125 Ambient temperature Ta (C) 0 25 50 75 100 125 Ambient temperature Ta (C) Sheet No.: D2-A02903EN 7 PC1231xNSZ0F Series Fig.7 Forward Current vs. Forward Voltage Fig.6 Peak Forward Current vs. Duty Ratio 100 Pulse width100s Ta=25C Forward current IF (mA) Peak forward current IFM (mA) 1 000 100 10 10-3 10-2 10 Ta=25C Ta=100C Ta=0C Ta=75C 1 Ta=-25C Ta=50C 0.1 10-1 1 0 0.5 Duty ratio 1 2 1.5 Forward voltage VF (V) Fig.8 Current Transfer Ratio vs. Forward Current Fig.9 Collector Current vs. Collector-emitter Voltage 40 500 Ta=25C PC (MAX.) 400 Collector current IC (mA) Current transfer ratio CTR (%) VCE=5V Ta=25C 300 200 30 IF=7mA 20 IF=5mA IF=3mA 10 IF=2mA 100 IF=1mA 0 0.1 0 1 0 10 2 4 6 8 10 Collector-emitter voltage VCE (V) Forward current IF (mA) Fig.10 Relative Current Transfer Ratio vs. Ambient Temperature Fig.11 Collector - emitter Saturation Voltage vs. Ambient Temperature Collector-emitter saturation voltage VCE (sat) (V) 150 Relative current transfer ratio (%) IF=0.5mA VCE=5V IF=0.5mA 100 50 0 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature Ta (C) 0.16 IF=10mA IC=1mA 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature Ta (C) Sheet No.: D2-A02903EN 8 PC1231xNSZ0F Series Fig.12 Collector Dark Current vs. Ambient Temperature 100 VCE=50V VCE=2V, IC=2mA 10-6 10-7 Responce time (s) Collector dark current ICEO (A) 10-5 Fig.13 Response Time vs. Load Resistance 10-8 10-9 tr 10 tf td ts 10-10 10-11 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 1 0.1 1 Ambient temperature Ta (C) Fig.14 Test Circuit for Response Time Fig.15 Frequency Response 5 VCC RL Output Input Output Input VCE=2V IC=2mA Ta=25C 0 10% Voltage gain AV (dB) RD 10 Load resistance RL (k) VCE ts tf td tr 90% Please refer to the conditions in Fig.13. RL=10k -5 1k -10 100 -15 -20 -25 0.1 1 10 100 1 000 Frequency f (kHz) Collector-emitter saturation voltage VCE (sat) (V) Fig.16 Collector-emitter Saturation Voltage vs. Forward Current 5 IC=7mA Ta=25C IC=5mA 4 IC=3mA IC=2mA 3 IC=1mA IC=0.5mA 2 1 0 0 2 4 6 8 10 Forward current IF (mA) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A02903EN 9 PC1231xNSZ0F Series Design Considerations Design guide While operating at IF<0.5mA, CTR variation may increase. Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through IRED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of IRED. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Recommended Foot Print (reference) SMT Gullwing lead-form Wide SMT Gullwing lead-form 8.2 1.7 1.7 2.54 2.54 10.2 2.2 2.2 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A02903EN 10 PC1231xNSZ0F Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A02903EN 11 PC1231xNSZ0F Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A02903EN 12 PC1231xNSZ0F Series Package specification Sleeve package 1. Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 2 5.8 10.8 520 6.7 (Unit : mm) 2. Wide Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 15.0 2 5.9 10.8 520 6.35 (Unit : mm) Sheet No.: D2-A02903EN 13 PC1231xNSZ0F Series Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions D F J G I H X. MA H A B C E 5 K Dimensions List A B 0.3 16.0 7.50.1 H I 0.1 10.4 0.40.05 C 1.750.1 J 4.20.1 D 8.00.1 K 5.10.1 E 2.00.1 F 4.00.1 (Unit : mm) G +0.1 1.5-0 Reel structure and Dimensions e d g c Dimensions List a b 330 17.51.5 e f 231.0 2.00.5 f a (Unit : mm) c d 1.0 100 130.5 g 2.00.5 b Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Sheet No.: D2-A02903EN 14 PC1231xNSZ0F Series 2. Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D G E I J 5 M . AX H H A B C K Dimensions List A B 0.3 24.0 11.50.1 H I 0.1 12.4 0.40.05 C 1.750.1 J 4.10.1 D 8.00.1 K 5.10.1 E 2.00.1 F 4.00.1 (Unit : mm) G +0.1 1.5-0 Reel structure and Dimensions e d g c Dimensions List a b 330 22.51.5 e f 1.0 23 2.00.5 f a (Unit : mm) c d 1.0 100 130.5 g 2.00.5 b Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Sheet No.: D2-A02903EN 15 PC1231xNSZ0F Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E223] Sheet No.: D2-A02903EN 16