
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-17xx-2400-102
REV.
1.9
SUBJECT CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE PAGE 2 of 35
CUSTOMER’S CODE
PAN172x / PAN171x
PANASONIC’S CODE
ENW89820AxKF / ENW89835AxKF DATE 05.08.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
TABLE OF CONTENTS
1. ..................................................................................................4 Scope of this Document
2. Difference PAN1720 / PAN1721.....................................................................................4
3. Difference PAN172x / PAN171x .....................................................................................4
4. Key Features...................................................................................................................4
5. Bluetooth Low Energy.....................................................................................................6
6. Applications for the Module.............................................................................................6
7. Description for the Module ..............................................................................................6
8. Detailed Description........................................................................................................7
8.1. PAN172x Terminal Layout.....................................................................................7
8.2. Crossreference GPIO PAN-Module to BlueRadios-Module ..................................9
9. Bluetooth Features........................................................................................................10
10. PAN172x Block Diagram...............................................................................................10
11. Test Conditions .............................................................................................................11
12. General Device Requirements and Operation .............................................................. 11
12.1. Absolute Maximum Ratings ................................................................................. 11
12.2. Recommended Operating Conditions..................................................................11
12.3. PAN1720 Current Consumption ..........................................................................12
13. Bluetooth RF Performance............................................................................................13
13.1. PAN1720 Bluetooth Characteristics ....................................................................13
13.2. PAN1721 Bluetooth Characteristics ....................................................................13
13.3. PAN17XX Spurious Emission..............................................................................13
14. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 14
14.1. For lead solder.....................................................................................................14
14.2. For leadfree solder...............................................................................................14
15. PAN172x Module Dimension ........................................................................................15
16. PAN171x Module Dimension ........................................................................................16
17. PAN172x FootPrint of the Module................................................................................. 17
18. PAN171x FootPrint of the Module................................................................................. 18
19. Case Marking................................................................................................................19
19.1. Example for Marking............................................................................................ 19
19.2. Marking Definition ................................................................................................19
20. Mechanical Requirements............................................................................................. 19
21. Development of Applications.........................................................................................20
22. Reliability Tests.............................................................................................................20
23. Cautions........................................................................................................................ 20
23.1. Design Notes .......................................................................................................20
23.2. Installation Notes .................................................................................................21
23.3. Usage Conditions Notes ......................................................................................21
23.4. Storage Notes......................................................................................................22