Darlington Output
These devices consist of a gallium arsenide infrared emitting diode optically
coupled to a monolithic silicon photodarlington detector , in a surface mountable,
small outline, plastic package. They are ideally suited for high density
applications, and eliminate the need for through–the–board mounting.
•Convenient Plastic SOIC–8 Surface Mountable Package Style
•High Current Transfer Ratio (CTR) at Low LED Input Current, for Easier Logic
Interfacing
•Standard SOIC–8 Footprint, with 0.050″ Lead Spacing
•Available in Tape and Reel
•Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
•High Input–Output Isolation of 3000 Vac (rms) Guaranteed
•UL Recognized File #E90700, Volume 2
Ordering Information:
•To obtain MOC223 in Tape and Reel, add R2 suffix to device numbers:
R2 = 2500 units on 13″ reel
•To obtain MOC223 in quantities of 50 (shipped in sleeves) — No Suffix
Marking Information:
•MOC223 = 223
Applications:
•Low power Logic Circuits
•Interfacing and coupling systems of different potentials and impedances
•Telecommunications equipment
•Portable electronics
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
INPUT LED
Forward Current — Continuous IF60 mA
Forward Current — Peak (PW = 100 µs, 120 pps) IF(pk) 1.0 A
Reverse Voltage VR6.0 V
LED Power Dissipation @ TA = 25°C
Derate above 25°CPD90
0.8 mW
mW/°C
OUTPUT DARLINGTON
Collector–Emitter V oltage VCEO 30 V
Collector–Base Voltage VCBO 70 V
Emitter–Collector V oltage VECO 7.0 V
Collector Current — Continuous IC150 mA
Detector Power Dissipation @ TA = 25°C
Derate above 25°CPD150
1.76 mW
mW/°C
SMALL OUTLINE
OPTOISOLATORS
DARLINGTON OUTPUT
SCHEMATIC
1. LED ANODE
2. LED CATHODE
3. NO CONNECTION
4. NO CONNECTION
5. EMITTER
6. COLLECTOR
7. BASE
8. NO CONNECTION
1
2
3
8
6
5
4
7
MAXIMUM RATINGS — continued (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
TOTAL DEVICE
Input–Output Isolation Voltage(1,2)
(60 Hz, 1.0 sec. duration) VISO 3000 Vac(rms)
Total Device Power Dissipation @ TA = 25°C
Derate above 25°CPD250
2.94 mW
mW/°C
Ambient Operating Temperature Range(3) TA–45 to +100 °C
Storage Temperature Range(3) Tstg –45 to +125 °C
Lead Soldering Temperature
(1/16″ from case, 10 sec. duration) — 260 °C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)(4)
Characteristic Symbol Min Typ(4) Max Unit
INPUT LED
Forward Voltage (IF = 1.0 mA) VF— 1.05 1.3 V
Reverse Leakage Current (VR = 6.0 V) IR— 0.1 100
m
A
Capacitance C — 18 — pF
OUTPUT DARLINGTON
Collector–Emitter Dark Current (VCE = 5.0 V, TA = 25°C) ICEO1 — 1.0 50 nA
(VCE = 5.0 V, TA = 100°C) ICEO2 — 1.0 — µA
Collector–Emitter Breakdown Voltage (IC = 100 µA) V(BR)CEO 30 90 — V
Emitter–Collector Breakdown Voltage (IE = 100 µA) V(BR)ECO 7.0 7.8 — V
Collector–Emitter Capacitance (f = 1.0 MHz, VCE = 0) CCE —5.5 — pF
COUPLED
Output Collector Current
(IF = 1.0 mA, VCE = 5.0 V) IC (CTR)(5) 5.0 (500) 10 (1000) — mA (%)
Collector–Emitter Saturation V oltage (IC = 500 µA, IF = 1.0 mA) VCE(sat) — — 1.0 V
T urn–On Time (IF = 5.0 mA, VCC = 10 V, RL = 100 Ω) ton —3.5 — µs
Turn–Off Time (IF = 5.0 mA, VCC = 10 V, RL = 100 Ω) toff —95 — µs
Rise T ime (IF = 5.0 mA, VCC = 10 V, RL = 100 Ω) tr— 1.0 — µs
Fall T ime (IF = 5.0 mA, VCC = 10 V, RL = 100 Ω) tf— 2.0 — µs
Input–Output Isolation Voltage (f = 60 Hz, t = 1.0 sec.)(1,2) VISO 3000 — — Vac(rms)
Isolation Resistance (VI–O = 500 V)(2) RISO 1011 — — Ω
Isolation Capacitance (VI–O = 0, f = 1.0 MHz)(2) CISO —0.2 — pF
1. Input–Output Isolation Voltage, VISO, is an internal device dielectric breakdown rating.
2. For this test, pins 1 and 2 are common, and pins 5, 6 and 7 are common.
3. Refer to Quality and Reliability Section in Opto Data Book for information on test conditions.
4. Always design to the specified minimum/maximum electrical limits (where applicable).
5. Current Transfer Ratio (CTR) = IC/IF x 100%.
MOC223
C
Figure 1. LED Forward Voltage versus Forward Current
IF, LED FORW ARD CURRENT (mA)
101
2
1000100
1
1.2
1.4
1.6
1.8
Figure 2. Output Current versus Input Current
VF, FORW ARD VOLTAGE (VOLTS)
I , OUTPUT COLLECTOR CURRENT (NORMALIZED)
PULSE ONLY
PULSE OR DC
TYPICAL CHARACTERISTICS
100
10
1
0.1 1100.1 IF, LED INPUT CURRENT (mA) 100
NORMALIZED TO:
IF = 1 mA
TA = –45
°
C
25
°
C
100
°
C
10
1
0.1 100 120–60 –40
Figure 3. Output Current versus
Collector–Emitter Voltage
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS) 10987012345
14
6
0
2
4
6
8
10
12
TA, AMBIENT TEMPERATURE (
°
C) 806040200–20
IC, OUTPUT COLLECTOR CURRENT (mA)
IC, OUTPUT COLLECTOR CURRENT (NORMALIZED)
Figure 4. Output Current versus
Ambient Temperature
V, VOLTAGE (VOLTS)
0.01 0.1 1 10
20080
Figure 5. Dark Current versus Ambient Temperature
20
1000
40 60 100
0
2
4
6
8
10
12
14
16
18
TA, AMBIENT TEMPERATURE (
°
C)
0.1
1
10
100
100
C, CAPACITANCE (pF)
ICEO, COLLECTOR–EMITTER DARK CURRENT
(NORMALIZED)
Figure 6. Capacitance versus Voltage
NORMALIZED TO:
TA = 25
°
C
IF = 1 mA
NORMALIZED TO:
VCE = 5 V
TA = 25
°
C
VCE = 30 V
10 V
CLED
CCE
f = 1 MHz
5 V
CCB
CEB
MOC223
PACKAGE DIMENSIONS
STYLE 1:
PIN 1. ANODE
2. CATHODE
3. NC
4. NC
5. EMITTER
6. COLLECTOR
7. BASE
8. NC
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.182 0.202 4.63 5.13
INCHES
B0.144 0.164 3.66 4.16
C0.123 0.143 3.13 3.63
D0.011 0.021 0.28 0.53
G0.050 BSC 1.27 BSC
H0.003 0.008 0.08 0.20
J0.006 0.010 0.16 0.25
K0.224 0.244 5.69 6.19
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
B
K
D
G
8 PL
0.13 (0.005) MTAM
J
H
C
SEATING
PLANE
0.038 (0.0015)
1
85
4
–A–
-T-
MOC223
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
www.fairchildsemi.com © 2000 Fairchild Semiconductor Corporation
