Description
The A6265 is a DC-to-DC converter controller, providing a
programmable constant current output for driving high power
LEDs in series. Driving the LEDs in series ensures identical
currents and uniform brightness. For automotive applications,
optimum performance is achieved when driving between
2 and 10 LEDs at currents up to 1 A.
The A6265 provides a cost-effective solution using an external
logic-level MOSFET and minimum additional external
components. The maximum LED current is set with a single
external sense resistor and can be modified using a current
reference input. Direct PWM control is possible via the Enable
input, which also provides a shutdown mode.
This DC-DC converter can be configured as a ground-referenced
boost converter or as a supply-referenced boost converter
providing buck-boost capability. The buck-boost topology used
ensures that there is no leakage path through the LEDs when
in shutdown and no inrush current at power-up.
Integrated diagnostics and two fault outputs give indication of
undervoltage, chip overtemperature, output open circuit, LED
short circuit and LED undercurrent, and can be configured to
provide short to supply and short to ground protection for the
LED connections. A unique feature is the ability to detect one
or more shorted LEDs.
The device is provided in a 16-pin TSSOP package with exposed
thermal pad (suffix LP). It is lead (Pb) free, with 100% matte
tin leadframe plating.
A6265-DS, Rev. 5
Features and Benefits
AEC Q100 Grade 0 Automotive Qualified
Constant current LED drive
6.5 to 50 V supply
Boost or buck-boost modes
Drives between 2 and 10 LEDs in series
Programmable switching frequency 100 to 700 kHz
Open LED overvoltage indication and protection
Single and multiple LED short indication
LED short to ground and supply protection
PWM dimming control
10 A shutdown current including LED leakage
Automotive High Current LED Controller
Package: 16-pin TSSOP with exposed
thermal pad (suffix LP)
Applications:
Typical Application Diagrams
Not to scale
A6265
Buck-Boost Mode
(Supply-referenced boost)
Boost Mode
Automotive high power LED lighting systems
Fog lights, reversing lights, daytime running lights
Headlights
LN
LP
LF
SG
SP
SN
GND LA
Fault
Flags
VBAT 12 V or 24 V
Power net
(50 V max)
VREG
FF1
FF2
EN
IREF
CKOUT
OSC
Enable
A
6265
VIN
GND LA
VBAT 12 V or 24 V (50 V max)
LN
LP
LF
SG
SP
SN
Fault
Flags
Power net
FF1
FF2
EN
IREF
CKOUT
OSC
Enable
A
6265
VREG
VIN
Boost Mode
VBAT(min)
(V)
Maximum
Quantity of
LEDs
712
813
915
Vf of each LED = 3.5 V,
D(max) = 85%
Buck Boost Mode
VBAT(min)
(V)
Maximum
Quantity of
LEDs
710
811
913
Vf of each LED = 3.5 V,
D(max) = 85%
Automotive High Current LED Controller
A6265
2
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Absolute Maximum Ratings With respect to GND at TA = 25°C, unless otherwise specified
Characteristic Symbol Notes Rating Unit
Load Supply Voltage VIN –0.3 to 50 V
Pins FF1, EN –0.3 to 50 V
Pins FF2, CKOUT –0.3 to 6.5 V
Pin OSC –0.3 to 6.5 V
Pin SG –0.3 to 6.5 V
Pins LA, LN –0.3 to 50 V
Pin LF With respect to LA –6 to 6 V
Pin LP With respect to LN –6 to 6 V
Pin SP, SN –0.3 to 5 V
Pin VREG –0.3 to 7 V
Pin IREF –0.3 to 7 V
Junction Temperature TJ(max) 150 °C
Storage Temperature Range Tstg –55 to 150 °C
Operating Temperature Range TA Range K –40 to 150 °C
Selection Guide
Part Number Packing Package
A6265KLPTR-T 4000 pieces per 13-in. reel 16-pin TSSOP with exposed thermal pad
Thermal Characteristics may require derating at maximum conditions, see application information
Characteristic Symbol Test Conditions* Value Unit
Package Thermal Resistance
(Junction to Ambient) RJA
On 4-layer PCB based on JEDEC standard 34 ºC/W
On 2-layer PCB with 3.8 in.2 of copper area each side 43 ºC/W
Package Thermal Resistance
(Junction to Exposed Pad) RJP 2 ºC/W
*Additional thermal information available on the Allegro website
Automotive High Current LED Controller
A6265
3
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Pin-out Diagram
EN
FF1
FF2
CKOUT
IREF
OSC
SN
SP
LF
LA
LN
LP
VIN
VREG
GND
SG
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
PAD
Terminal List Table
Number Name Function
1 EN Enable chip
2 FF1 Fault flag
3 FF2 Fault flag
4 CKOUT Oscillator output, with phase shift
5 IREF Current reference
6 OSC Oscillator input/frequency set
7 SN Switch current sense –ve input
8 SP Switch current sense +ve input
9 SG Switch gate drive
10 GND Ground
11 VREG Internal regulator capacitor
12 VIN Main supply
13 LP Load current sense +ve input
14 LN Load current sense –ve input
15 LA LED string voltage sense
16 LF Reference LED voltage sense
PAD Exposed thermal pad
Automotive High Current LED Controller
A6265
4
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Functional Block Diagrams
SG
VIN
GND
VREG
Slope
Gen
OSC
Osc
EN
FF1
VREG
Fault
Detect
SP
SN
LN LP LA
Shut-
down
Control
Logic
RSL
RSS
ROSC
VBAT
LF
LED Open and
Short Detect
IREF
Q
R
S
Temp
Monitor
IREF CKOUT
FF2
Buck-Boost
Boost
SG
VIN
GND
Slope
Gen
OSC
Osc
EN
FF1
VREG
Fault
Detect
SP
SN
LN LP LA
Shut-
down
Control
Logic RSS
ROSC
VBAT
LF
LED Open and
Short Detect
Temp
Monitor
IREF
See Functional Description section.
CKOUT
FF2
RSL
IREF
VREG
AL
AE
AC
AS
AL
AE
AC
AS
AL AE AC AS
Q
R
S
Automotive High Current LED Controller
A6265
5
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Supply and Reference
VIN Functional Operating Range2 6.5 – 50 V
VIN Quiescent Current IINQ SG open circuit 8 mA
IINS EN = GND 4 10 A
VREG Output Voltage VREG I
REG = 0 to 2 mA 4.75 5 5.25 V
Gate Output Drive
Turn-On Time trCLOAD = 1 nF, 20% to 80% 35 ns
Turn-Off Time tfCLOAD = 1 nF, 80% to 20% 35 ns
Maximum Duty Cycle D tON × fOSC 80 85 %
Pull-Up On Resistance RDS(on)UP TJ = 25°C, IGHx = –100 mA 1.7
TJ = 150°C, IGHx = –100 mA 3.5
Pull-Down On Resistance RDS(on)DN TJ = 25°C, IGLx = 100 mA 1
TJ = 150°C, IGLx = 100 mA 2
Output High Voltage VSGH I
SG = –100 A VREG
0.1 – V
REG V
Output Low Voltage VSGL I
SG = 100 A 0.1 V
Logic Inputs and Outputs
Fault Output (Open Drain) VOL I
OL = 1 mA, fault not asserted 0.4 V
Fault Output FF1 Sink Current1 I
OH(snk) 0.4 V < VO < 50 V, fault not asserted 1.3 mA
Fault Output FF1 Leakage Current1IOH1(lkg) VO = 12 V, fault asserted –1 1 A
Fault Output FF2 Leakage Current1 I
OH2(lkg) VO = 5 V, fault asserted –5 5 A
Input Low Voltage VIL 0.8 V
Input High Voltage VIH 2 – – V
Input Hysteresis VIhys 225 330 mV
Enable Input Internal Clamp Voltage VENC 8.4 – V
Enable Input Current Limit Resistor REN Between EN and internal clamp 200 k
Boost Mode Select Voltage VLNB Defined by VLN1.2 V
Buck-Boost Mode Select Voltage VLNBB Defined by VLN 4.0 V
Disable Time tDIS fOSC = 350 kHz 94 ms
Oscillator
Oscillator Frequency fOSC
ROSC = 43 k 500 kHz
ROSC = 62 k315 350 385 kHz
ROSC = VREG 350 kHz
OSC Pin Voltage VOSC R
OSC = 62 k 1.15 1.2 1.25 V
CKOUT Output Delay tDC OSC input rise to CKOUT rise 150 ns
OSC Input Low Voltage VOIL 0.8 V
OSC Input High Voltage VOIH 3.5 V
OSC Input Hysteresis VOihys 300 600 mV
ELECTRICAL CHARACTERISTICS1 Valid at TJ = –40°C to 150°C, VIN = 8 to 40 V; unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
Continued on the next page…
Automotive High Current LED Controller
A6265
6
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ELECTRICAL CHARACTERISTICS1 (continued) Valid at TJ = –40°C to 150°C, VIN = 8 to 40 V; unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
Oscillator (continued)
OSC Watchdog Period tOSWD Between successive rising edges 7 s
CKOUT Output High Voltage VCOH I
OH = –1 mA VREG – 1 VREG V
CKOUT Output Low Voltage VCOL I
OL = 1 mA 0.4 V
LED Current Sense
Input Bias Current LN (BB mode)3 I
LN LP = LN = VIN 6 A
Input Bias Current LP (BB mode)3 I
LP LP = LN = VIN 220 A
Input Bias Current LN (B mode)3 I
LN LP = LN = 0 V –2 A
Input Bias Current LP (B mode)3 I
LP LP = LN = 0 V –25 A
Differential Input Voltage (Active) VIDL EN = High, VIDL = VLP – VLN 100 mV
Differential Input Voltage (PWM off) VIDLO EN = Low, VIDL = VLP – VLN 8 mV
Input Common-Mode Range (BB mode)3 VCMLH VLP = VLN VIN –V
IN + 1 V
Input Common-Mode Range (B mode)3 VCMLL VLP = VLN 0 1 V
Current Error EISL [(10 × ILED × RSL) – 1] × 100 –5 5 %
Switch Current Sense
Input Bias Current IBIASS SP = SN = 0 to 2 V –30 A
Maximum Differential Input Voltage4 V
IDS VIDS = VSP – VSN with D = 50% 330 410 490 mV
Input Source Current IINS V
IDS = 400 mV 400 A
Input Common-Mode Range VCMS VSP = VSN 0 2 V
Diagnostics and Protection
Fault Blank Timer5tFB Start-up 3 ms
VREG Undervoltage Turn-Off VREGUV Decreasing VREG 4.1 4.3 4.5 V
VREG Undervoltage Hysteresis VREGUVhys 130 150 160 mV
LED String Short Voltage VSCL 430 505 580 mV
Non-Reference LED Short Offset
Voltage VSCO 160 200 240 mV
Reference LED Short Offset Voltage VSCOR 430 505 580 mV
LED Open Voltage VOCL 5 5.5 6 V
LF Bias Current (BB mode)3 I
LF LF = LA = VIN + 1.7 V 46 A
LA Bias Current (BB mode)3 I
LA LF = LA = VIN + 1.7 V 170 A
LF Bias Current (B mode)3ILF LF = 1.7 V 8 A
LA Bias Current (B mode)3 I
LA LA = 1.7 V 34 A
LED Undercurrent Voltage Difference6 VUCL 1 mV
Open Fault Time-Out tOTO fOSC = 350 kHz 94 ms
Overtemperature Warning Threshold TJF Temperature increasing 170 ºC
Overtemperature Hysteresis TJhys Recovery = TJFTJhys –15– ºC
1For input and output current specifications, negative current is defined as coming out of (sourcing) the specified device pin.
2Function is correct but parameters are not guaranteed below the general limit (8 V).
3BB mode = buck-boost (supply-referenced) mode, B mode = boost (ground-referenced) mode.
4Parameters guaranteed by design.
5Fault Blank timer not enabled for open-LED condition.
6Undercurrent when VSENSEL < VIDL– VUCL
, where VSENSEL is the voltage across the LED current sense resistor RSL.
Automotive High Current LED Controller
A6265
7
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Functional Description
The A6265 is a DC-DC converter controller that is designed to
drive series-connected high power LEDs in automotive applica-
tions. It provides programmable constant current output at load
voltages and currents limited only by the external components.
For automotive applications optimum performance is achieved
when driving between two and ten LEDs at currents up to 1 A.
The A6265 can be configured as a standard boost converter or
as a supply referenced boost converter. In the supply referenced
configuration the load voltage is the difference between the boost
voltage and the supply voltage. This difference can be greater
than, equal to, or less than the supply voltage, effectively provid-
ing a buck-boost capability. This configuration provides seam-
less, uninterrupted operation over the wide supply voltage range
possible in automotive applications and, because the output is ref-
erenced to the positive supply, there is no load current to ground.
This ensures that there is no leakage path through the LEDs when
in shutdown and no inrush current at power-up.
The A6265 integrates all necessary control elements to pro-
vide a cost-effective solution using a single external logic-level
MOSFET and minimum additional external passive components.
The LED current is set by selecting an appropriate value for the
sense resistor value and using the EN input to provide simple
on-off control or for PWM brightness control using a suitable
externally generated PWM signal. The LED current can be
reduced in a single step by reducing the voltage between the
IREF pin and GND to less than 1 V.
The pin functions and circuit operation are described in detail in
the following sections.
Pin Functions
VIN Supply to the control circuit. A bypass capacitor must be
connected between this pin and GND.
GND Ground reference connection. This pin should be connected
directly to the negative supply.
EN Logic input to enable operation. Can be used as direct PWM
input. Chip enters low power sleep mode when low for longer
than the disable time, tDIS.
FF1 Fault Flag output and isolation control. Open drain current
sink output, when high impedance indicates detection of a critical
circuit fault. An external pull-up resistor should be connected to a
suitable logic supply for simple logic fault flag operation or to the
source of the PMOS FET used to isolate the load from the supply.
Table 1 defines when FF1 is active. If FF1 is pulled low when
an output short fault is indicated then the output disable will be
overridden.
FF2 Fault Flag output. Open drain output, when high impedance
indicates detection of a circuit fault. An external pull-up resistor
should be connected to a suitable logic supply. If VREG is not
used, then the logic supply should not be pulled 300 mV above
VREG. Table 1 defines when FF2 is active. If FF2 is pulled low
when an open LED fault is indicated then the output disable will
be overridden.
OSC Resistor to ground to set the internal oscillator or clock
input from external oscillator. When connected to VREG the
oscillator runs at typically 350 kHz. Higher accuracy in the
frequency is possible by connecting a resistor from this pin to
ground or by driving this pin with an external precision oscillator.
CKOUT Logic output at the oscillator frequency with phase
shift. Used to drive succeeding controllers to interleave switching
instants.
IREF LED current reference modifier. A voltage input that can be
used to reduce the LED current sense voltage. When connected to
VREG, the current sense voltage, VIDL, and the value of the sense
resistor, RSL , define the maximum LED current.
SG Gate drive for external logic-level MOSFET low-side switch
that connects the inductor to ground.
SP, SN Sense amplifier connections for switch current limit
sense resistor, RSS .
LP Positive sense amplifier connection for LED current limit
sense resistor, RSL . This pin is also the bias supply for the LED
current sense amplifier.
LN Negative sense amplifier connection for LED current limit
sense resistor, RSL . The voltage at LN also determines whether
the boost or buck-boost mode is configured.
VREG Compensation capacitor for internal 5 V regulator.
LA Anode reference connection to LEDs. Using an external resis-
tor divider with the same ratio as the number of LEDs provides
a measurement of the voltage across all LEDs in the load. This
is compared to the voltage on the LF pin to provide shorted LED
detection. In addition, it is compared against voltage references to
Automotive High Current LED Controller
A6265
8
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
provide open circuit or shorted LED string detection.
LF Single diode forward voltage reference input. Measures the
forward voltage of the first LED. This value is used as a reference
against the voltage on the LA pin to detect possible shorted LEDs
in the LED string.
Circuit Operation
Converter A constant frequency, current mode control scheme
is used to regulate the current through the LEDs. There are two
control loops within the regulator. The inner loop formed by the
amplifier, AS (see the Functional Block Diagram for AS, AC, AE,
and AL), comparator, AC, and the RS bistable, controls the induc-
tor current as measured through the switch by the switch sense
resistor, RSS .
The outer loop including the amplifier, AL, and the integrating
error amplifier, AE, controls the average LED current by provid-
ing a setpoint reference for the inner loop.
The LED current is measured by the LED sense resistor, RSL ,
and compared to the internal reference current to produce an
integrated error signal at the output of AE. This error signal sets
the average amount of energy required from the inductor by the
LEDs. The average inductor energy transferred to the LEDs is
defined by the average inductor current as determined by the
inner control loop.
The inner loop establishes the average inductor current by
controlling the peak switch current on a cycle-by-cycle basis.
Because the relationship between peak current and average cur-
rent is non-linear, depending on the duty cycle, the reference
level for the peak switch current is modified by a slope generator.
This compensation reduces the peak switch current measurement
by a small amount as the duty cycle increases (refer to figure 1).
The slope compensation also removes the instability inherent in a
fixed frequency current control scheme.
The control loops work together as follows: the switch current,
sensed by the switch current sense resistor, RSS , is compared
to the LED current error signal. As the LED current increases
the output of AE will reduce, reducing the peak switch current
and thus the current delivered to the LEDs. As the LED current
decreases the output of AE increases, increasing the peak switch
current and thus increasing the current delivered to the LEDs.
Under some conditions, especially when the LED current is set to
a low value, the energy required in the inductor may result in the
inductor current dropping to zero for part of each cycle. This is
known as discontinuous mode operation, and results in some low
frequency ripple. The average LED current, however, remains
regulated down to zero. In discontinuous mode, when the induc-
tor current drops to zero, the voltage at the drain of the external
MOSFET rings, due to the resonant LC circuit formed by the
inductor, and the switch and diode capacitance. This ringing is
low frequency and is not harmful.
Switch Current Limit The switch current is measured by the
switch sense resistor, RSS , and the switch sense amplifier, AS
(see the Functional Block Diagram). The input limit of the sense
amplifier, VIDS
, and the maximum switch current, ISMAX , define
the maximum value of the sense resistor as:
R
SS = VIDS / ISMAX (1)
This defines the maximum measurable value of the switch (and
inductor) current.
The maximum switch current is modulated by the on-time of the
switch. An internal slope compensation signal is subtracted from
the voltage sense signal to produce a peak sense voltage which
effectively defines the current limit. This signal is applied at a
rate of –50 mV / s starting with no contribution (t = 0 s) at the
beginning of each switching cycle. Figure 1 illustrates how the
peak sense voltage (typical values) changes over a period of 3 s.
For example, the maximum current (typical) through the switch
at t = 1.5 s (D = 50%) would be 410 mV/RSS
, however, if the
switch remained on for a further 1 s, the maximum current
through the switch would be 360 mV/RSS .
500
450
400
350
300
250
200
150
100
50
001
Period (s)
Peak Sense Votlage (mV)
23
Figure 1. Slope compensation for peak switch current control.
Automotive High Current LED Controller
A6265
9
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
LED Current Level The LED current is determined by a
combination of the LED sense resistor, RSL , the LED current
threshold voltage, VIDL , and the voltage between the IREF pin
and GND ( VIREF
).
The 100% current level, when the IREF pin is connected to
VREG, is defined as:
ILED(max) = VIDL / RSL (2)
If VIREF is less than 1 V then the 100% current level is defined as:
ILED(max) = VIREF
/ (10 × RSL
) (3)
This feature provides direct analog dimming using a voltage from
0 to 1 V. This can be used to provide intensity-matching between
modules or groups of LEDs in critical display or backlighting
applications. It can also be used to provide a soft start, by con-
necting a capacitor from IREF to GND and a resistor from IREF
to VREG, or one-step dimming by use of a single logic control.
LED Brightness: PWM Dimming LED brightness can
be controlled by changing the current, which affects the light
intensity. However in some applications, for example with amber
LEDs, this will have some effect on the color of the LEDs.
In these cases it is more desirable to control the brightness by
switching the fixed LED current with a pulse width modulated
signal. This allows the LED brightness to be set with little effect
on the LED color and intensity and allows direct digital control
of the LED brightness.
A PWM signal can be applied to the EN input to enable PWM
dimming. The period of this signal should be less than the
minimum disable time, tDIS . During PWM dimming, the A6265
switches the LED current between 100% and typically 8% of
the full current. This ensures that the voltage change across the
LED string is limited to a few volts, depending on the number
of LEDs. This limits the stress on the load capacitor (across
the string of LEDs) due to large changes in voltage. If the load
capacitor is a multilayer ceramic type, then this will reduce any
audible noise due to the piezoelectric effect of the capacitor.
The rate of change of the LED current is also limited, to reduce
any large variations in the input current.
Sleep Mode If EN is held low for longer than the disable time,
tDIS , then the A6265 will shut down and put all sections into a
low-power sleep mode. In this mode the bias current is typically
less than 4 A. In the buck-boost configuration the only leakage
path remaining will be the path through the MOSFET.
Provided this is low, then the complete circuit may remain con-
nected to the power supply under all conditions. Note that the
disable time is derived from the oscillator period by a ratio of
32,768, so any variation in the oscillator frequency will change
the disable time.
Oscillator The main oscillator may be configured as a clock
source or it may be driven by an external clock signal. The oscil-
lator is designed to run between 100 and 700 kHz.
When the oscillator is configured as a clock source, the frequency
is controlled by a single external resistor, ROSC (k), between the
OSC pin and the GND pin. The oscillator frequency is approxi-
mately:
fOSC = 21700 / ROSC (kHz) (4)
Figure 2 shows the resulting fOSC for various values of ROSC.
If the OSC pin is connected to VREG or GND, the oscillator
frequency will be set internally to approximately 350 kHz.
When an external clock source is used to drive the OSC pin, it
can synchronize a number of A6265s operating together. This
ensures that only a single fundamental frequency is detectable
on the supply line, thus simplifying the design of any required
EMC filter. The disadvantage of using a single external clock
source is that all controllers will be switching current from the
supply at the same time. However, this effect may be reduced,
and the EMC performance may be further enhanced, by using
the CKOUT pin of another A6265 as the external clock source.
In this case the switching point of each subsequent A6265 in the
chain will be delayed from that of the previous A6265, and the
current pulses will be spread across the oscillator period.
700
600
500
400
300
200
100
30 50 70 11090 130 150 170 190 210
External Resistor Value, ROSC (k)
Oscillator Frequency, fOSC (kHz)
Figure 2. Internal oscillator frequency when set by ROSC
Automotive High Current LED Controller
A6265
10
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Diagnostics
The circuit includes several diagnostic and safety functions to
assist in ensuring safe operation of the LEDs, the A6265, and the
external components. When any fault is detected, one or both of
the fault flag outputs, FF1 and FF2, will be inactive (high imped-
ance, open drain) until the fault is removed. The action taken by
the A6265 when a fault occurs is defined in table 1. To be able to
monitor the state of FF1 and FF2, add a suitable external pull-up
resistor.
The A6265 will continue to drive the LEDs under most fault con-
ditions and will only disable the drive to the LEDs when a high
voltage hazard is present or the external components are likely to
be over-stressed. For output short circuits or open LED condi-
tions, the fault status is latched until EN is taken low or a power
cycle occurs. For output short circuits or a shorted LED string,
the fault status is latched until either EN is taken low for a period
greater than the disable time, or a power cycle occurs.
At start-up, a Fault Blank period, tFB , occurs before the fault
detection circuitry becomes active. This period allows steady
state conditions to be established before fault monitoring takes
place.
Note that no fault blanking is applied to open LED faults. This
is generally not an issue because the charging of the output filter
capacitor provides a degree of filtering. In addition, extremely
high voltages are prevented from causing potential device break-
down, for example in the external switching MOSFET.
VREG Undervoltage If the voltage at VREG, VREG , drops
below the specified turnoff voltage, VREGUV , the gate drive
output, SG, will be driven low and both fault flags, FF1 and
FF2, will be high impedance. VREG must rise above the turn-on
threshold, VREGUV + VREGUV
, before the output circuits are
activated. This ensures that the external FET is operating in its
fully enhanced state and avoids permanent damage to the FET,
caused by overheating.
LED Undercurrent Under some circuit conditions, particularly
during a low input voltage condition, it is possible that there
could be insufficient drive to maintain the current to the LEDs
at the required level. If the voltage across the LED current sense
resistor, RSS , falls below the target sense voltage, VIDL , by an
amount that is more than the LED undercurrent voltage differ-
ence, VUCL
, the A6265 will indicate an LED undercurrent condi-
tion by setting FF2 to high impedance. However, the A6265 will
continue to drive the output. When the output again reaches the
required current level, FF2 will go low.
Overtemperature Warning If the chip temperature exceeds
the overtemperature threshold, TJF , fault flag FF2 will be high
impedance. No action will be taken by the A6265 to limit the
chip temperature. An external control circuit must take action
to avoid permanent damage to the A6265 and/or the LEDs. The
temperature will continue to be monitored and the fault flags will
be deactivated when the temperature drops below the recovery
threshold provided by the hysteresis, TJhys .
LED Diagnostics The status of the LEDs in the load can be
determined by monitoring the voltage with respect to ground at
the three pins LP, LF, and LA, namely VLP , VLF , and VLA . These
voltages provide two differential voltage measurements:
• the voltage across a single reference LED:
V
LED = VLFVLP (5)
• the ratio of the voltage across all LEDs in a single string:
VSTR = VLAVLP (6)
The voltage, VSTR , is derived from the voltage across all LEDs in
the string, by an external resistor divider with a ratio equal to the
quantity of LEDs in the string. To minimize the effects of the bias
currents introducing an offset voltage, it is recommended that the
resistor between LP and LA should be approximately 560 .
So for example, if eight LEDs were used, the ratio required
would be an eighth, therefore the resistor connected between LA
and the anode end of the LED string would be 3.9 k;
560 / [560 + 3900] = 1/8 .
Table 1. Fault Table
Fault Pin Action Latched
FF1 FF2
No Fault L L No Action
VREG Undervoltage Z Z Disable* No
Output Short Z L Disable* Yes
LED Undercurrent L Z No Action No
Overtemperature L Z No Action No
Open LED L Z Disable* Yes
Shorted LED L Z No Action No
Shorted LED String Z L Disable* Yes
* SG low, MOSFET off
L = active pull-down, Z = inactive, open drain
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These measurements are used to determine if there is an open
circuit, if one or more LEDs are shorted, if the output is shorted,
or if there is a short across the LED string. Each condition is
described in turn in the following sections.
Open LED–An open circuit is evaluated when:
VSTR > VOCL (7)
where VOCL is the LED open circuit voltage defined in the Elec-
trical Characteristics table.
Because the output is current-controlled it is possible for an open
circuit on the output to cause extremely high voltages to be pres-
ent. Therefore, to prevent any hazardous voltages or damage to
the circuits, the gate drive output, SG, is immediately driven low
when an open circuit is detected. After an open circuit fault has
been detected, FF2 will become high impedance, and the open
circuit fault state will remain until the open fault time-out period
toto, expires. When the gate drive output is re-enabled at the end
of the open fault time-out period, the output is again monitored
for an open circuit. If the open circuit is still present, then the
fault will again be flagged and the switch drive disabled. This
cycle will continue, as long as the open circuit condition is pres-
ent.
Note that the Fault Blank timer is not used when an open LED
fault occurs. This is to avoid potentially damaging voltages
appearing in the power circuitry.
Shorted LEDA short circuit on one or more LEDs is detected
when:
• for the first (reference) LED:
VSTR > VLED + VSCOR (8)
• for other than the first (reference) LED:
VLED > VSTR + VSCO (9)
where VSTR and VLED are as defined above, VSCO is the nonrefer-
ence LED short offset voltage, and VSCOR is the reference LED
short offset voltage. VSCO and VSCOR are defined in the Electrical
Characteristics table.
When a short is present, the fault flag FF2 is high impedance, but
the regulator continues to operate and drives the remaining LEDs
with the correct regulated current. FF2 will remain high imped-
ance while the short circuit condition is present.
A short circuit on one or more LEDs will not cause a hazard
because the output is current-controlled. If one LED fails and
becomes a short circuit, then the remaining LEDs will continue
to be lit with the same current through, and voltage across,
each LED.
Note—Accuracy: The output status monitor relies on all the
LEDs in the load having a similar forward voltage drop. Where
possible all the LEDs forming the load for a single controller
should be taken from the same voltage bin. With only two or
three LEDs a wider variation in forward voltage is acceptable,
but the selection of LEDs from the same bin is more critical when
higher numbers of LEDs are used in a single string.
Shorted LED String or Output ShortA short circuit across
the LED string, is detected when:
VSTR < VSCL (10)
An output short can consist of the LP, LN, or LF terminals of
the LED string being shorted, either to the battery terminal or
to ground. Either a shorted LED string or output short will be
latched and will only be cleared by pulling EN low for a period
greater than the disable time, or by cycling the power.
If either a shorted LED string, or an output short is detected, the
A6265 will stop the switching action by pulling SG low. The
fault flag FF1 will go high impedance and should be pulled up to
the supply with suitable external pull-up resistors to indicate the
fault. Either a shorted LED string or output short will be latched
and will only be cleared by pulling EN low for a period greater
than the disable time, or by cycling the power.
The FF1 output can also be used with pull-up resistors and a
P-channel MOSFET in the supply, to isolate the switching ele-
ments and the load from the supply. This MOSFET should be
connected, as shown in figure 3, with the source connected to the
supply and the drain connected to the inductor of the converter.
To FF1
VBAT
To VIN
Figure 3. Example of a supply isolation MOSFET
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Worcester, Massachusetts 01615-0036 U.S.A.
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Two pull-up resistors are used to limit the voltage across the gate-
source junction during high input voltages or load dump condi-
tions. If the battery voltage is restricted, one resistor across the
gate-source junction can be used. The FF1 provides a sink current
of up to 1.3 mA.
This circuit can be used to avoid most hazardous conditions and
protect the circuit components from over-stress. Note that under
extreme cases, the circuit cannot protect against certain fault con-
ditions. For example, when any of the following occurs:
• In boost mode:
If the cathode end of the LED string is shorted to VBAT, the
LED sense resistor effectively appears between VBAT and
ground. Depending on the current limit of the source supply or
the input fuse rating, the fault current may damage the resistor.
If the LF node is shorted to VBAT, the reference LED and
the LED sense resistor effectively appear between VBAT and
ground. Depending on the current limit of the source supply or
the input fuse rating, the fault current may damage the resistor
and /or the reference LED.
If the cathode end of the LED string is shorted to ground. A
fault current determined by the impedance of the shorting link
(now effectively the LED sense resistor) flows through the
power circuit. The fault current will either: be limited by the
maximum switch current sense, VIDS
, or if the source supply
cannot maintain this current, be limited by the source supply.
(The source supply will either: fold back, or if the current
exceeds the input fuse rating, the fuse will blow, creating an
open circuit).
• In buck-boost mode:
If the cathode end of the LED string is shorted to ground, the
LED sense resistor effectively appears between VBAT and
ground. Depending on the current limit of the source supply or
the input fuse rating, the fault current may damage the resistor.
If the LF node is shorted to ground, the reference LED and
the LED sense resistor effectively appear between VBAT and
ground. The reference LED will be reversed biased and will
probably be damaged.
If the cathode end of the LED string (LP) is shorted to VBAT,
the impedance of the short appears in parallel with the series
combination of the series protection MOSFET and the LED
sense resistor. This will tend to reduce the effective impedance
of the LED sense resistor and correspondingly increase the
LED current.
To ensure the A6265 inputs (LP and LN) are not damaged dur-
ing any of the above faults, it is necessary to add a differential
resistor in series with the LN connection (between the sense
resistor and the LN pin). This resistor value should be approxi-
mately 150 .
If an output short is detected but it is necessary to keep the output
active, the FF1 output can be pulled low. This will override the
output disable but will not clear the fault.
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A6265
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Application Information
Component Selection
External component selection is critical to the successful appli-
cation of the LED driver. Although the inductor, the switching
MOSFET, and the output capacitor are the most critical elements,
the specification of the rectifying diode and sense resistors should
also be carefully considered.
The starting point for component selection is to define the maxi-
mum LED current, the voltage across the LEDs, and the input
operating voltage range. This then allows the average inductor
current under worst case conditions to be calculated. The induc-
tor value is then selected based on the acceptable inductor ripple
current. The amount of ripple current will then determine the
maximum inductor current under worst case conditions. From
this current the switch current sense resistor can be calculated.
LED Current Sense Resistor (RLS) If the voltage at the
IREF pin, VIREF
, is greater than 1V, or if IREF is tied to VREG,
then the value of the LED current sense resistor, RLS , can be
calculated from:
RLS = VIDL / ILED(max) (11)
where VIDL is the differential voltage across the LED current
sense amplifier and ILED(max) is the maximum LED current.
If VIREF is less than 1 V, then the value of the LED current sense
resistor can be calculated from:
RLS = VIREF / (10 × ILED(max) ) (12)
The typical value for VIDL is 100 mV. Examples of various sense
resistor values are given in table 2.
In boost mode, the power loss in the current sense resistor is
worse at the lowest input voltage:
PLOSS = (VLED / VIN(min)
) × RLS × I 2
LED (13)
In buck-boost mode, the power loss in the current sense resistor is
worse at the lowest input voltage:
P
LOSS = ( [ VIN + VLED
] / VIN ) × RLS × I 2
LED (14)
The resistors should be of a low inductance construction. Surface
mount chip resistors are usually the most suitable, however, axial
or radial leaded resistors can be used provided that the lead length
is kept to a minimum.
Inductor Selection Selecting the correct inductance is a
balance between choosing a value that is small enough to help
reduce size and cost, but high enough to ensure that the inductor
current ripple is kept to an acceptable level. A reasonable target
for the ripple current is 20% of the maximum average current.
The inductor current equations differ slightly depending on
whether the A6265 is configured as a boost or as a buck-boost
converter.
• In a boost converter configuration:
The maximum average inductor current is approximately:
IL(av)(max) = ILED(max) × VLED / VIN(min) (15)
The inductor current ripple is approximately:
ILRIP = VIN × (VLED VIN
) / (fOSC × L × VLED
) (16)
The inductor value is therefore:
L = VIN × ( VLED VIN
) / (fOSC × ILRIP × VLED ) (17)
• In a buck-boost configuration:
The maximum average inductor current is approximately:
IL(av)(max) = ILED(max) × ( VIN(min) + VLED) / VIN(min) (18)
The inductor current ripple is approximately:
ILRIP = VIN × VLED / (fOSC × L × [VIN + VLED
] ) (19)
The inductor value is therefore:
L = VIN × VLED / (fOSC × ILRIP × [ VIN
+ VLED ] ) (20)
where:
VLED is the voltage across the LED string,
VIN is the supply voltage,
VIN(min) is the minimum supply voltage,
L is the inductor value, and
fOSC is the oscillator frequency.
With an internal oscillator frequency of 350 kHz, the value of
the inductor for most cases will be between 20 and 50 H. The
maximum inductor current can then be calculated as:
IL(PK) = IL(av)(max) + (IRIP / 2) (21)
Table 2. Sense Resistor Values
ILED(max)
(mA)
RLS
(mΩ)
350 286
700 143
1000 100
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This defines the minimum peak switch current as set by the
switch current sense resistor.
The current rating for the inductor should be greater, by some
margin, than the peak value above, IL(PK)
. When selecting an
inductor from manufacturers datasheets, there are two current
levels usually defined, the smallest value being the figure to work
with:
• Saturation level, where the inductance value typically drops by
10%, or
• Temperature rise, where the part experiences a certain rise in
temperature at full rated current. This parameter can be defined
between a 20°C and 50°C rise in temperature. It is important to
understand how manufacturers define the maximum operating
temperature, because this can often incorporate the self-heating
temperature rise.
In most cases the limiting current is usually the saturation value.
To improve efficiency, the inductor should also have low winding
resistance, typically < 50 m, and the core material will usually
be ferrite, with low losses at the oscillator frequency.
Recommended inductor manufacturers/series are:
• Coilcraft/ MSS1278T
• TDK/ SLF12575 type H
Diode The diode should have a low forward voltage, to reduce
conduction losses, and a low capacitance, to reduce switching
losses. Schottky diodes can provide both these features if care-
fully selected. The forward voltage drop is a natural advantage
for Schottky diodes and reduces as the current rating increases.
However, as the current rating increases, the diode capacitance
also increases so the optimum selection is usually the lowest cur-
rent rating above the required maximum, in this case IL(PK).
Switch Current Sense Resistor (RSS) Neither the absolute
value of the switch current nor the accuracy of the measurement
is important, because the regulator will continuously adjust the
switch current, within a closed loop, to provide sufficient energy
for the output. For maximum accuracy the switch sense resistor
value should be chosen to maximize the differential signal seen
by the sense amplifier. The input limit of the sense amplifier,
VIDS
, and the maximum switch current, IS(max), therefore define
the maximum value of the sense resistor as:
RSS = VIDS / IS(max) (22)
Where IS(max) is the maximum switch current and should be set
above the maximum inductor current, IL(PK) .
This represents the maximum measurable value of the switch
(and inductor) current; however, the peak switch current will
always be less than this, set by the control circuit, depending on
the input voltage and the required load conditions. Because the
switch current control is within a closed loop, it is possible to
reduce the value of the sense resistor to reduce its power dissipa-
tion. However this will reduce the accuracy of the regulated LED
current.
In Boost mode, the power loss in the switch sense resistor is
worse at the lowest input voltage:
PLOSS = (VLED [VLEDVIN(min)] / VIN(min)2) × RSS × I 2
LED (23)
In Buck Boost mode, the power loss in the switch sense resistor
is worse at the lowest input voltage:
PLOSS = (VLED / VIN(min))(VLED + VIN(min)) × RSS × I 2
LED (24)
External Switch MOSFET A logic-level N-channel MOSFET
is used as the switch for the DC-to-DC converter. In the boost
configuration the voltage at the drain of the MOSFET is equal
to the maximum voltage across the string of LEDs. In the
buck-boost configuration the output voltage is referenced to
the positive supply. This means that the voltage at the drain of
the MOSFET will reach a voltage equal to the sum of the LED
voltage and the supply voltage. Under load dump conditions,
up to 90 V may be present on this node. In this case the external
MOSFET should therefore be rated at greater than 100 V.
The peak switch current is defined by the maximum inductor cur-
rent, IL(PK) . However in most cases the MOSFET will be chosen
by selecting low on-resistance, which usually results in a current
rating of several times the required peak current.
In addition to minimizing cost, the choice of MOSFET should
consider both the on-resistance and the total gate charge. The
total gate charge will determine the average current required from
the internal regulator and thus the power dissipation.
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Output Capacitor There are several points to consider when
selecting the output capacitor.
Unlike some switch-mode regulators, the value of the output
capacitor in this case is not critical for output stability. The
capacitor value is only limited by the required maximum ripple
voltage.
Due to the switching topology used, the ripple current for this
circuit is high because the output capacitor provides the LED
current when the switch is active. The capacitor is then recharged
each time the inductor passes energy to the output. The ripple
current on the output capacitor will be equal to the peak inductor
current.
Normally this large ripple current, in conjunction with the
requirement for a larger capacitance value for stability, would
dictate the use of large electrolytic capacitors. However in this
case stability is not a consideration, and the capacitor value can
be low, allowing the use of ceramic capacitors.
To minimize self-heating effects and voltage ripple, the equiva-
lent series resistance (ESR), and the equivalent series inductance
(ESL) should be kept as low as possible. This can be achieved by
multilayer ceramic chip (MLCC) capacitors. To reduce perfor-
mance variation over temperature, low drift types such as X7R
and X5R should be used.
The value of the output capacitor will typically be about 10 F
and it should be rated above the maximum voltage defined by the
series output LEDs.
Reverse Supply Protection Protection for the A6265 is
provided by an external low current diode between the supply
and the VIN pin, as shown in the Functional Block Diagrams
section. The isolation MOSFET shown in figure 3 is only able to
provide isolation when the supply polarity is correct. However,
with an additional P-channel MOSFET, it is also possible to
provide reverse battery protection to the switching elements and
the LEDs. The additional FET should be connected, as shown in
figure 4, with the drain to the supply and the source to the source
connection of the original isolation MOSFET.
In the complete circuit, consideration should be given to limiting
the maximum gate-source voltage of the FET. If the supply volt-
age is likely to exceed 20 V, then either: a Zener clamp must be
added in parallel with the gate-source resistor to prevent damage
to the FET, or a second resistor added as shown in figure 3.
To FF1
VBAT
To VIN
Figure 4. Example of a supply isolation MOSFET
Automotive High Current LED Controller
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Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Package LP 16-Pin TSSOP with Exposed Thermal Pad
A
1.20 MAX
0.15
0.00
0.30
0.19
0.20
0.09
0.60 ±0.15
1.00 REF
C
SEATING
PLANE
C0.10
16X
0.65 BSC
0.25 BSC
21
16
5.00±0.10
4.40±0.10 6.40±0.20
GAUGE PLANE
SEATING PLANE
ATerminal #1 mark area
B
For Reference Only; not for tooling use (reference MO-153 ABT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
B
C
Exposed thermal pad (bottom surface); dimensions may vary with device
6.10
0.65
0.45
1.70
3.00
3.00
16
21
Reference land pattern layout (reference IPC7351
SOP65P640X110-17M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
PCB Layout Reference View
C
Branded Face
3 NOM
3 NOM
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Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
For the latest version of this document, visit our website:
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Copyright ©2012, Allegro MicroSystems, Inc.
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information being relied upon is current.
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Revision History
Revision Revision Date Description of Revision
Rev. 5 July 26, 2012 Update application information