Document Number: 31003 For technical questions, contact: filmresistors.thickfilmchip@vishay.com www.vishay.com
Revision: 13-Oct-08 263
CRA12E, CRA12S
Thick Film Resistor Array Vishay
Notes
(1) Figures are given for a single element
(2) Solderability is specified for 2 years after production or requalification. Permitted storage time is 20 years
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
TEST
(clause) CONDITIONS OF TEST
REQUIREMENTS (1)
STABILITY
CLASS 1 OR BETTER
STABILITY
CLASS 2 OR BETTER
Stability for product types:
10 Ω to 1 MΩ10 Ω to 1 MΩ
CRA12E/CRA12S
Resistance (4.5) - ± 1 %± 2 %; ± 5 %
Temperature coefficient (4.8.4.2) 20/- 55/20 °C and
20/125/20 °C ± 100 ppm/K ± 200 ppm/K
Overload (4.13) U = 2.5 × (P70 x R)1/2
≤ 2 x Umax.; 1 s ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
Solderability (4.17.5) (2)
Aging 4 h at 155 °C, dryheat
Solder bath method; 235 °C; 1 s
Visual examination
Good tinning (≥ 95 % covered)
no visible damage
Resistance to soldering heat (4.18.2) Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
Rapid change of temperature (4.19) 30 min. at LCT = - 55 °C;
30 min. at UCT = 125 °C; 5 cycles ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
Damp heat, steady state (4.24) (40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
Climatic sequence (4.23)
16 h at UCT = 125 °C; 1 cycle at 55 °C;
2 h at LCT = - 55 °C;
1 h/1 kPa at 15 °C to 35 °C;
5 cycles at 55 °C
U = (P70 x R)1/2
U = Umax.; whichever is less severe
± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
Endurance at 70 °C (4.25.1)
U = (P70 x R)1/2
U = Umax.; whichever is less severe
1.5 h ON; 0.5 h OFF;
70 °C; 1000 h
± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
Extended endurance (4.25.1.8) Duration extended to 8000 h ± (2 % R + 0.1 Ω)± (4 % R + 0.1 Ω)
Endurance at upper category
temperature (4.25.3) UCT = 125 °C; 1000 h ± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
APPLICABLE SPECIFICATIONS
• EN 60115-1 Generic Specification
• EN 140400 Sectional Specification
• EN 140401-802 Detail Specification
• IEC 60068-2-X Variety of environmental test procedures
• EIA 481 Packaging of SMD components