MPC17510EJR2 - Freescale Semiconductor / Motorola

Document Number: MPC17510

Rev. 3.0, 1/2007

Freescale Semiconductor

Advance Information

* This document contains certain information on a new product.

Specifications and information herein are subject to change without notice.

1.2 A 15 V H-Bridge Motor

Driver IC

The 17510 is a monolithic H-Bridge designed to be used in

portable electronic applications such as digital and SLR cameras to

control small DC motors.

The 17510 can operate efficiently with supply voltages as low as

2.0 V to as high as 1 5 V. Its low RDS(ON) H-Bridge output MOSFETs

(0.45 Ω typical) can provide continuous motor drive currents of 1.2 A

and handle peak currents up to 3.8 A. It is easily interfaced to low-

cost MCUs via parallel 5.0 V compatible logic. The device can be

pulse width modulated (PWM-ed) at up to 200 kHz.

This device contains an integrated charge pump and level shifter

(for gate drive voltages), integrated shoot-through current protection

(cross-conduction suppression logic and timing), and undervoltage

detection and shutdown circuitry.

The 17510 has four operating modes: Forward, Reverse, Brake,

and Tri-Stated (High Impedance).

Features

•2.0 V to 15 V Continuous Operation

• Output Current 1.2 A (DC), 3.8 A (Peak)

• 450 mΩ RDS(ON) H-Bridge MOSFETs

•5.0 V TTL- / CMOS-Compatible In pu ts

• PWM Frequencies up to 200 kHz

• Undervoltage Shutdown

• Cross-Conduction Suppression

• Pb-Free Packaging Designated by Suffix Cod e EJ

Figure 1. 17510 Simplified Application Diagra m

H-BRIDGE MOTOR DRIVER

MTB SUFFIX

EJ SUFFIX (Pb-FREE)

98ASH70455A

24-LEAD TSSOP

17510

ORDERING INFORMATION

Device Temperature

Range (TA)Package

MPC17510EJ/R2

-30°C to 65°C 24 TSSOPWMPC17510MTB

MPC17510MTBEL

VDD

CRES

C1L

C1H

C2L

C2H

IN2

IN1

OUT2

OUT1

GOUT

GND

MCU GIN

MOTOR

5.0 V 15 V

17510

Analog Integrated Circuit Device Data

2Freescale Semiconductor

17510

INTERNAL BLOCK DIAGRAM

Figure 2. 17510 Simplified Internal Block Diagram

4 7 20 22

Charge Pump

H-Bridge

Level

Shifter

Predriver

Control

Logic

Low Voltage

Detector

TOUT

VM1

VM2

OUTA

OUTA'

OUTB'

OUTB

PGND1

PGND2

CRES

VDD

LGND

TINB

IN2

IN1

C1L

C1H

C2L

C2H

Analog Integrated Circuit Device Data

Freescale Semiconductor 3

17510

PIN CONNECTIONS

Figure 3. 17510 Pin Conne ctions

Table 1. 17510 Pin Definitions

A functional description of each pin can be found in the Functional Pin Description section beginning on page 8.

Pin Number Pin Name Formal Name Definition

1, 5 OUT1 Output 1 Driver output 1 pins.

2LGND Logic Ground Logic ground.

3CRES Charge Pump Output

Capacitor Connection Charge pump reservoir capacitor pin.

4, 7,

20, 22 NC No Connect No connection to these pins.

17, 18 OUT2 Output 2 Driver output 2 pins.

6, 19 PGND Power Ground Power ground.

8, 21 VM Motor Drive Power

Supply Motor power supply voltage input pins.

9IN1 Input Control 1 Control signal input 1 pin.

10 IN2 Input Control 2 Control signal input 2 pin.

11 C1H Charge Pump 1H Charge pump bucket capacitor 1 (positive pole).

12 C1L Charge Pump 1L Charge pump bucket capacitor 1 (negative pole).

13 C2L Charge Pump 2L Charge pump bucket capacitor 2 (negative pole).

14 C2H Charge Pump 2H Charge pump bucket capacitor 2 (positive pole).

15 GOUT Gate Driver Output Output gate driver signal to external MOSFET switch.

16 EN Enable Control Enable control signal input pin.

23 VDD Logic Supply Control circuit power supply pin.

24 GIN Gate Driver Input LOW = True control signal for GOUT pin.

GIN

PGND

OUT2

GOUT

C2H

C2L

VDD

OUT1

PGND

IN1

IN2

C1L

LGND

CRES

C1H

Analog Integrated Circuit Device Data

4Freescale Semiconductor

17510

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings Symbol Value Unit

Motor Supply Voltage VM- 0.5 – - 16 V

Charge Pump Output Voltage (1) VCRES -0.5 to 13 V

Logic Supply Voltage VDD -0.5 to 16 V

Signal Input Voltage (EN, IN1, IN2, GIN)VIN -0.5 to VDD + 0.5 V

Driver Output Current

Continuous

Peak (2) IO

IOPK

1.2

3.8

ESD Voltage (3)

Human Body Model

Machine Model VESD1

VESD2

±1900

± 130

Storage Temperature TSTG -65 to 150 °C

Operating Junction Temperature TJ-30 to 150 °C

Operating Ambient Temperature TA-30 to 65 °C

Power Dissipation (4) PD1.0 W

Thermal Resistance RθJA 120 °C/W

Soldering Temperature (5) TSOLDER 260 °C

Notes

1. When supplied externally, connect via 3.0 kΩ resistor.

2. TA = 25°C, 10 ms pulse at 200 ms interval.

3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in

accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

4. TA = 25°C, RθJA = 120°C/W, 37 mm x 50 mm Cu area (1.6 mm FR-4 PCB).

5. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

Analog Integrated Circuit Device Data

Freescale Semiconductor 5

17510

ELECTRICAL CHARACTERISTICS

STATIC ELECTRICAL CHARACTERISTICS

Table 3. Static Electrical Characteristics

Characteristics noted under conditions TA = 25°C, VM = 15 V, VDD = 5.0 V, GND = 0 V unless otherwise noted. Typical values

noted reflect the approximate parameter means at TA = 25°C under nominal condition s un less otherwise noted.

Characteristic Symbol Min Typ Max Unit

POWER

Motor Supply Voltage VM2.0 –15 V

Logic Supply Voltage VDD 4.0 –5.5 V

Capacitor for Charge Pump C1, C2, C3 0.001 –0.1 µF

Standby Power Supply Current (6)

Motor Supply Standby Current

Logic Supply Standby Current

I VMSTBY

I VDDSTBY

–

––

0.3 1.0

1.0

µA

Logic Supply Current (7) I VDD –3.3 4.0 mA

Low-Voltage Detection Circuit

Detection Voltage (VDD) (8)

Detection Voltage (VM)

VDDDET

VMDET 1.5

4.0 2.5

5.0 3.5

6.0

Driver Output ON Resistance (9)

VM = 2.0 V, 8.0 V, 15 V RDS(ON) –0.45 0.55

Ω

GATE DRIVE

Gate Drive Voltage (10)

No Current Load

VCRES 12 13 13.5 V

Gate Drive Ability (Internally Supplied)

ICRES = -1.0 mA

VCRESLOAD 10 11.2 –V

Gate Drive Output

IOUT = -50 µA

IIN = 50 µAVGOUTHIGH

VGOUTLOW

VCRES -

0.5

LGND

VCRES -

0.1

LGND + 0.1

VCRES

LGND +0.5

CONTROL LOGIC

Logic Input Voltage (EN, IN1, IN2, GIN)VIN 0 – VDD V

Logic Input Function (4.0 V < VDD < 5.5 V)

High-Level Input Voltage

Low-Level Input Voltage

High-Level Input Current

Low-Level Input Current

EN / GIN Pin

VIH

VIL

IIH

IIL

VDD x 0.7

–

-1.0

- 200

–

- 50

–

VDD x 0.3

1.0

–

µA

Notes

6. Excluding pull-up resistor current, including current of gate-drive circuit.

7. fIN = 100 kHz.

8. Detection voltage is defined as when the output becomes high-impedance after VDD drops below the detection threshold. When the gate

voltage VCRES is applied from an external source, VCRES = 7.5 V.

9. IO = 1.2 A source + sink.

10. Input logic signal not present.

Analog Integrated Circuit Device Data

6Freescale Semiconductor

17510

ELECTRICAL CHARACTERISTICS

DYNAMIC ELECTRICAL CHARACTERISTICS

Table 4. Dynamic Electrical Characteristics

Characteristics noted under conditions TA = 25°C, VM = 15 V, VDD = 5.0 V, GND = 0 V unless otherwise noted. Typical values

noted reflect the approximate parameter means at TA = 25°C under nominal condition s un less otherwise noted.

Characteristic Symbol Min Typ Max Unit

INPUT (EN, IN1, IN2, GIN)

Pulse Input Frequency fIN – – 200 kHz

Input Pulse Rise Time (11) tR– – 1.0

(12) µs

Input Pulse Fall Time (13) tF– – 1.0

(12) µs

OUTPUT

Propagation Delay Time

Turn-ON Time

Turn-OFF Time

tPZH

tPLH

tPHL

–

0.3

1.2

0.5

1.0

2.0

1.0

µs

GOUT Output Delay Time (14)

Turn-ON Time

Turn-OFF Time tTON

tTOFF

–

––

–10

µs

Charge Pump Circuit

Oscillator Frequency

Rise Time (15) fOSC

tVCRESON

100

–200

0.1 400

1.0 kHz

Low-Voltage Detection Time tVDDDET – – 10 ms

Notes

11. Time is defined between 10% and 90%.

12. That is, the input waveform slope must be steeper than this.

13. Time is defined between 90% and 10%.

14. Load is 500 pF.

15. Time to charge CRES to 11 V after application of VDD.

Analog Integrated Circuit Device Data

Freescale Semiconductor 7

17510

ELECTRICAL CHARACTERISTICS

TIMING DIAGRAMS

Figure 4. tPLH, tPHL, and tPZH Timing Figure 5. Low-Vo ltag e Detectio n Timi ng

tPZH*,

10%

IN1, IN2, EN

OUTn

50%

90%

tPHL

tPLH

*The last state is “Z”.

(GIN)

(GOUT)

(tTON) (tTOFF) tVDDDET

VDD

3.5 V

90%

tVDDDET

VDDDETON VDDDETOFF

(<1.0 µA

)

50%

1.5 V

Table 5. Truth Table

INPUT OUTPUT

EN IN1 IN2 GIN OUT1 OUT2 GOUT

H L L X Z Z X

H H L X H L X

H L H X L H X

H H H X L L X

L X X X L L L

H X X L X X H

H X X H X X L

H = High.

L = Low.

Z = High impedance.

X = Don’t care.

The GIN pin and EN pin are pulled up to V DD with inter nal resistance.

Analog Integrated Circuit Device Data

8Freescale Semiconductor

17510

FUNCTIONAL DESCRIPTION

INTRODUCTION

FUNCTIONAL DESCRIPTION

INTRODUCTION

The 17510 is a monolithic H-Bridge power IC applicable to

small DC motors used in portable electronics. The 17510 can

operate efficiently with supply voltages as low as 2.0 V to as

high as 15 V, and it can provide continuos motor drive

currents of 1.2 A while handling peak currents up to 3.8 A. It

is easily interfaced to lo w-cost MCUs via parallel 5.0 V-

compatible logic. The device can be pulse width modulated

(PWM-ed) at up to 200 kHz. The 17510 has four operating

modes: Forward, Reverse, Brake, and Tri-Stated (High

Impedance).

Basic protection and operational features (direction,

dynamic braking, PWM control of spe ed and torque, main

power supply undervoltage detection and shutdown, logic

power supply undervoltage detection and sh utdown), in

addition to the 1.0 A rms output current capability, make the

17510 a very attractive, cost-effective solution for controlling

a broad range of small DC motors. In addition, a pair of 17510

devices can be used to control bipolar stepper motors. The

17510 can also be used to excite transformer primary

windings with a switched square wave to produce secondary

winding AC currents.

As shown in Figure 2, 17510 Simplifi ed Internal Block

Diagram, page 2, the 17510 is a monolithic H-Bridge with

built-in charge pump circuitry. For a DC motor to run, the

input conditions need to be set as follows: ENable input logic

HIGH, one INput logic LOW, and the other INput logic HIGH

(to define output polarity). The 17510 can execute dynamic

braking by setting both IN1 and IN2 logic HIGH, causing both

low-side MOSFETs in the output H-Bridge to turn ON.

Dynamic braking can also implemented by taking the ENable

logic LOW. The output of the H-Bridge can be set to an open-

circuit high-impedance (Z) condition by taking both IN1 and

IN2 logic LOW. (refer to Table 5, Truth Table, page 7).

The 17510 outputs are capable of providing a continuous

DC load current of up to 1.2 A. An internal charge pump

supports PWM frequencies to 200 kHz. The EN pin al so

controls the charge pump, turning it off when EN = LOW, thus

allowing the 17510 to be placed in a power-conserving sleep

mode.

FUNCTIONAL PIN DESCRIPTION

OUTPUT 1 AND OUTPUT2 (OUT1, OUT2)

The OUT1 and OUT2 pins provide the connectio n to the

internal power MOSFET H-Bridge of the IC. A typical load

connected between these pins would be a small DC motor.

These outputs will connect to either VM or PGND, depending

on the states of the control inputs (refer to Table 5, Truth

Table, page 7).

POWER GROUND AND LOGIC GROUND (PGND,

LGND)

The power and logic ground pins (PGND and LGND)

should be connected together with a very low-impedan ce

connection.

CHARGE PUMP RESERVOIR CAPACITOR (CRES)

The CRES pin provides the connection for the external

reservoir capacitor (output of the charge pump). Alternatively

this pin can also be used as an input to supply gate-drive

voltage from an external source via a series current-limiting

resistor. The voltage at the CRES pin will be approximately

three times the VDD voltage, as the internal charge pump

utilizes a voltage tripler circuit. The VCRES voltage is used by

the IC to supply gate drive for the intern al power MOSFET

H-Bridge.

MOTOR SUPPLY VOLTAGE INPUT (VM)

The VM pins carry the main supply voltage and current into

the power sections of the IC. This supply then becomes

controlled and/or modulated by the IC as it delivers the power

to the load attached between OUT1 and OUT2. All VM pins

must be connected together on the printed circuit board with

as short as possible traces offering as low impedance as

possible between pins.

VM has an undervoltage threshold. If the supply voltage

drops below the undervoltage threshold, the output power

stage switches to a tri-state condition. When the supply

voltage returns to a level that is above the threshold, the

power stage automatically resumes normal operation

according to the established condition of the input pins.

CONTROL SIGNAL INPUT AND ENABLE CONTROL

SIGNAL INPUT (IN1, IN2, EN)

The IN1, IN2, and EN pins are input control pins use d to

control the outputs. These pins are 5.0 V CMOS-compatible

inputs with hysteresis. The IN1, IN2, and EN work together to

control OUT1 and OUT2 (refer to Table 5, Trut h Table).

GATE DRIVER INPUT (GIN)

The GIN input controls the GOUT pin. When GIN is set

logic LOW, GOUT supplies a level-shifted high-side gate

drive signal to an external MOSFET. When GIN is set logic

HIGH, GOUT is set to GND potential.

Analog Integrated Circuit Device Data

Freescale Semiconductor 9

17510

FUNCTIONAL DESCRIPTION

FUNCTIONAL PIN DESCRIPTION

CHARGE PUMP BUCKET CAPACITOR (C1L, C1H,

C2L, C2H)

These two pairs of pins, the C1L and C1H and the C2L and

C2H, connect to the external bucket capacitors required by

the internal charge pump. The typical value for the bucket

capacitors is 0.1 µF.

GATE DRIVER OUTPUT (GOUT)

The GOUT output pin provide s a level-shifted, high-side

gate drive signal to an external MOSFET with CISS up to

500 pF.

CONTROL CIRCUIT POWER SUPPLY (VDD)

The VDD pin carries the 5.0 V supply voltage and current

into the logic sections of the IC. VDD has an undervoltage

threshold. If the supply voltage drops below the undervoltage

threshold, th e ou t pu t po w e r stage switches to a tri-state

condition. When the supply voltage returns to a level th at is

above the threshold, the power stage automatically resumes

normal operation according to the established condition of

the input pins.

Analog Integrated Circuit Device Data

10 Freescale Semiconductor

17510

TYPICAL APPLICATIONS

FUNCTIONAL PIN DESCRIPTION

TYPICAL APPLICATIONS

Figure 6 shows a typical applica tion for the 17510.

Figure 6. 17510 Typical Application Diagram

CEMF SNUBBING TECHNIQUES

Care must be taken to protect the IC from potentially

damaging CEMF spikes induced when commutating currents

in inductive loads. Typical practice is to provide snubbing of

voltage transients by placing a capacitor or zener at the

supply pin (VM) (see Figure 7).

Figure 7. CEMF Snubbing Tec h niq ue s

MCU

17510

5.0 V

GND

C1L

C1H

C2L

C2H

CRES

GIN

IN1

IN2

VDD

Motor

GOUT

Solenoid

OUT1

OUT2

17510

5.0 V 15 V

C1L

C1H

C2L

C2H

CRES

VDD

OUT1

OUT2

GND

17510

5.0 V 15 V

C1L

C1H

C2L

C2H

CRES

VDD

OUT1

OUT2

GND

Analog Integrated Circuit Device Data

Freescale Semiconductor 11

17510

PACKAGING

PACKAGE DIMENSIONS

PACKAGING

PACKAGE DIMENSIONS

For the most current pack age revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.

MTB SUFFIX

EJ SUFFIX (PB-FREE)

24-PIN

PLASTIC PACKAGE

98ASH70455A

ISSUE B

Analog Integrated Circuit Device Data

12 Freescale Semiconductor

17510

PACKAGING

PACKAGE DIMENSIONS (CONTINUED)

PACKAGE DIMENSIONS (continued)

MTB SUFFIX

EJ SUFFIX (PB-FREE)

24-PIN

PLASTIC PACKAGE

98ASH70455A

ISSUE B

Analog Integrated Circuit Device Data

Freescale Semiconductor 13

17510

REVISION HISTORY

REVISION DATE DESCRIPTION OF CHANGES

2.0 7/2006 • Implemented a Revisio n History page.

• Converted to Freescale format, and up dated to the prevaiing form and style

• Added EJ Pb-FREE package

3.0 1/2007 • Corrected symbol in Table 3, Driver Output ON Resistance from “W” to "Ω"

MPC17510

Rev. 3.0

1/2007

RoHS-compliant and/or Pb-fre e versions of Freescale products have the functionality

and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free

counterparts. For further information, see http://www.freescale.com or contact your

Freescale sales representative.

For information on Freescale’s Environmental Products program, go to http://

www.freescale.com/epp.

Information in this document is provided solely to enable system and software

implementers to use Freescale Semiconduct or products. There are no express or

implied copyright licenses granted hereunder to design or fabricate any integrated

circuits or integrated circuits based on the inform ation in this document.

Freescale Semiconductor reserves the ri ght to make changes without further notice to

any products herein. Freescale Semiconductor makes no warranty, repre sentation or

guarantee regarding the suitability of its products for any particular purpose, nor does

Freescale Semiconductor assume any liability arising out of the application or use of any

product or circuit, and specifically disclaims any and all liability, including without

limitation consequen tial or incidental damages. “Typical” parameters that may be

provided in Freescale Se miconductor data sheets and/or specifications can and do vary

in different applications and actual performance may vary over time. All operating

parameters, includin g “Typicals”, must be validated for each customer application by

customer’s technical experts . Freescale Semiconductor does not convey any license

under its patent rights nor the rights of others. Freescale Semiconductor products are

not designed, intended, or authorized for use as components in systems intended for

surgical implant into the body, or other applications intended to support or sustain life,

or for any other application in which th e failure of th e Freescale Semiconductor product

could create a situation where personal injury or death may occur. Should Buyer

purchase or use Freescale Semiconductor products for any such unintended or

unauthorized application, Buyer shall indemn ify and hold Freescale Semiconductor and

its officers, employees, subsidiaries, affiliates, and distributors harmless against all

claims, costs, damages, and expenses, and reasonable at torney fees arising out of,

directly or indirectly, any claim of personal injury or death associated with such

unintended or unauthorized use, even if such claim alleges that Fr eescale

Semiconductor was negligent regarding the design or manufacture of the part.

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.

All other product or service names are the property of their respective owners.

How to Reach Us:

Home Page:

www.freescale.com

Web Support:

http://www.freescale.com/support

USA/Europe or Locations Not Listed:

Freescale Semiconductor, Inc.

Technical Information Center, EL516

2100 East Elliot Road

Tempe, Arizona 85284

+1-800-521-6274 or +1-480-768-2130

www.freescale.com/support

Europe, Middle East, and Africa:

Freescale Halbleiter Deutschland GmbH

Technical Information Center

Schatzbogen 7

81829 Muenchen, Germany

+44 1296 380 456 (English)

+46 8 52200080 (English)

+49 89 92103 559 (German)

+33 1 69 35 48 48 (French)

www.freescale.com/support

Japan:

Freescale Semiconductor Japan Ltd.

Headquarters

ARCO Tower 15F

1-8-1, Shimo-Meguro, Meguro-ku,

Tokyo 153-0064

Japan

0120 191014 or +81 3 5437 9125

support.japan@freescale.com

Asia/Pacific:

Freescale Semiconductor Hong Kong Ltd.

Technical Information Center

2 Dai King Street

Tai Po Industrial Estate

Tai Po, N.T., Hong Kong

+800 2666 8080

support.asia@freescale.com

For Literature Requests Only:

Freescale Semiconductor Literature Distribution Center

P.O. Box 5405

Denver, Colorado 80217

1-800-441-2447 or 303-675-2140

Fax: 303-675-2150

LDCForFreescaleSemiconductor@hibbertgroup.com