STPS30L60C Power Schottky rectifier Features Low forward voltage drop Negligible switching losses Low thermal resistance Avalanche capability specified A1 K A2 A2 K A1 TO-220FPAB STPS30L60CFP Description These dual center tap Schottky rectifiers are suited for switched mode power supplies and high frequency DC to DC converters. Packaged in TO-220FPAB, TO-220, D2PAK, I2PAK and TO-247, this device is intended for use in high frequency inverters. A2 A2 K K TO-220AB STPS30L60CT I2PAK STPS30L60CR A1 A1 Electrical characteristics (a) Figure 1. I V K "Forward" I 2 x IO X A2 IF VRRM VR VAR A1 IO A2 K A1 X V IR D2PAK STPS30L60CG TO-247 STPS30L60CW VTo VF(Io) VF VF(2xIo) "Reverse" Table 1. IAR Device summary Symbol Value IF(AV) 2 x 15 A VRRM 60 V Tj (max) 150 C VF (max) 0.56 V a. VARM and IARM must respect the reverse safe operating area defined in Figure 14 VAR and IAR are pulse measurements (tp < 1 s). VR, IR, VRRM and VF, are static characteristics February 2011 Doc ID 6479 Rev 9 1/12 www.st.com 12 Characteristics STPS30L60C 1 Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current I2 IF(AV) IFSM IRRM PARM (1) Average forward current Value Unit 60 V 30 A TO-220AB, PAK, T = 130 C D2PAK, TO-247, = 0.5 c Per diode Per device 15 30 TO-220FPAB, = 0.5 Per diode Per device 15 30 Tc = 110 C Surge non repetitive forward current tp = 10 ms, sinusoidal Repetitive peak reverse current tp = 2 s square, F = 1 kHz Repetitive peak avalanche power tp = 1 s, Tj = 25 C A 230 A 2 A 7800 W VARM (2) Maximum repetitive peak avalanche voltage tp < 1 s, Tj < 150 C, IAR < 29 A 80 V VASM (2) Maximum single pulse peak avalanche voltage tp < 1 s, Tj < 150 C, IAR < 29 A 80 V -65 to + 175 C 150 C 10000 V/s Tstg Tj dV/dt Storage temperature range Maximum operating junction temperature(3) Critical rate of rise reverse voltage 1. For temperature or pulse time duration deratings, refer to Figure 4 and Figure 5. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the application notes AN1768 and AN2025. 2. Refer to Figure 14. 3. 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistances Symbol Parameter TO-220AB, I2PAK, D2PAK, TO-247 Rth(j-c) Junction to case TO-220FPAB Rth(c) Coupling Per diode 1.5 Total 0.8 Per diode 4.7 Total 3.95 TO-220AB, I2PAK, D2PAK, TO-247 0.1 TO-220FPAB 3.2 When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) 2/12 Value Doc ID 6479 Rev 9 Unit C/W STPS30L60C Table 4. Characteristics Static electrical characteristics (per diode) Symbol IR (1) Parameter Tests conditions Tj = 25 C Reverse leakage current Min. Typ. VR = VRRM 77 Tj = 125 C VF (1) Forward voltage drop Tj = 25 C IF = 15 A Tj = 125 C IF = 15 A Tj = 25 C IF = 30 A Tj = 125 C IF = 30 A Max. Unit 480 A 130 mA 0.6 0.5 0.56 V 0.75 0.65 0.7 1. Pulse test : tp = 380 s, < 2% To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.009x IF2(RMS) Figure 2. 12 Average forward power dissipation Figure 3. versus average forward current (per diode) PF(av)(W) 18 = 0.1 10 =1 = 0.5 = 0.2 Average forward current versus ambient temperature ( = 0.5, per diode) IF(av)(A) Rth(j-a)=Rth(j-c) 16 = 0.05 14 12 8 TO-220FPAB 10 6 8 4 T T 4 2 IF(av) (A) 0 Rth(j-a)=15 C/W 6 0 2 4 6 8 10 =tp/T 12 14 16 2 tp 18 20 =tp/T 0 Figure 4. Normalized avalanche power derating versus pulse duration Tamb(C) tp 0 25 Figure 5. PARM(tp) PARM(1 s) 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 Tj(C) tp(s) 0.1 1 0 10 100 1000 25 Doc ID 6479 Rev 9 50 75 100 125 150 3/12 Characteristics Figure 6. 250 STPS30L60C Non repetitive surge peak forward current versus overload duration Figure 7. 120 IM(A) Non repetitive surge peak forward current versus overload duration (TO-220FPAB) IM(A) maximum values, per diode TO-220AB, TO-247, D2PAK, I2PAK maximum values, per diode 200 100 80 150 TC=50 C Tc=25C 100 60 Tc=75C 40 50 TC=75 C Tc=125C IM 20 t 0 1E-3 IM t(s) =0.5 1E-2 1E-1 1E+0 0 1.E-03 Figure 8. 1.0 TC=125 C t(s) t =0.5 1.E-02 Relative variation of thermal Figure 9. impedance junction to case versus pulse duration 1.E-01 1.E+00 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 TO-220FPAB 0.9 TO-220AB, TO-247, D2PAK, I2PAK 0.8 0.8 0.7 0.6 = 0.5 =0.5 0.6 0.5 0.4 = 0.2 0.4 = 0.1 0.3 0.2 =0.2 Single pulse 0.0 1E-4 tp(s) 0.1 Single pulse 1E-3 1E-2 1E-1 1E+0 Figure 10. Reverse leakage current versus reverse voltage applied (typical values, per diode) tp(s) 1.E-02 1.E-01 1.E+00 1.E+01 Figure 11. Junction capacitance versus reverse voltage applied (typical values, per diode) 2.0 F=1MHz Tj=25C Tj=150C Tj=125C 1E+1 tp C(nF) IR(mA) 1E+2 =tp/T 0.0 1.E-03 5E+2 T =0.1 0.2 1.0 Tj=100C 0.5 Tj=75C 1E+0 Tj=50C 1E-1 1E-2 4/12 0.2 Tj=25C VR(V) VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 0.1 1 Doc ID 6479 Rev 9 10 100 STPS30L60C Characteristics Figure 12. Forward voltage drop versus forward current (maximum values, per diode) Figure 13. Thermal resistance junction to ambient versus copper surface under tab for D2PAK Rth(j-a)(C/W) 200 IFM(A) 80 Epoxy printed circuit board copper thickness = 35 m 70 100 Typical values Tj=150C Tj=25C 60 50 40 10 30 Tj=125C 20 VFM(V) 10 1 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 S(cm) 0 0 5 10 15 20 25 30 35 40 Figure 14. Reverse safe operating area (tp < 1 s, Tj < 150 C) 40 38 36 34 32 30 28 26 24 22 20 IARM (A) Forbidden area Operating area VARM (V) 60 65 70 75 80 Doc ID 6479 Rev 9 85 90 5/12 Package information 2 STPS30L60C Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque values: TO-220AB and TO-220FPAB 0.4 to 0.6 N*m, TO-247 0.55 N*m (1.0 N*m maximum) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 5. TO-220FPAB dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 A B H Dia L6 L2 L7 L3 L5 F1 L4 D F2 F L2 E G1 G 6/12 Doc ID 6479 Rev 9 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 STPS30L60C Package information Table 6. TO-220AB dimensions Dimensions Ref. A H2 Dia C L5 L7 L6 L2 F2 F1 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.06e G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 D L9 L4 F L2 M G1 E G 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. Doc ID 6479 Rev 9 16.4 typ. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 7/12 Package information Table 7. STPS30L60C D2PAK dimensions Dimensions Ref. A E C2 L2 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. V2 0 Figure 15. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 8/12 Doc ID 6479 Rev 9 3.70 0.016 typ. 8 0 8 STPS30L60C Package information Devices in I2PAK with nickel-plated back frame must NOT be mounted by frame soldering like SMDs. Such devices are intended to be through-hole mounted ONLY and in no circumstances shall ST be held liable for any lack of performance or damage arising out of soldering of nickel-plated back frames. Table 8. I2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 A E c2 L2 D L1 A1 b1 L b c e e1 Doc ID 6479 Rev 9 9/12 Package information STPS30L60C Table 9. TO-247 dimensions Dimensions Ref. Millimeters Min. V V Dia A H L5 L2 Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F1 3.00 0.118 F2 2.00 0.078 F3 2.00 2.40 0.078 0.094 F4 3.00 3.40 0.118 0.133 G L Typ. Inches 10.90 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.169 L4 F2 F1 L3 L1 F3 V2 D F4 F(x3) M G L2 E L3 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5 5 V2 60 60 Dia. 10/12 0.145 Doc ID 6479 Rev 9 3.55 3.65 0.139 0.143 STPS30L60C 3 Ordering information Ordering information Table 10. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS30L60CW STPS30L60CW TO-247 4.4 g 30 Tube STPS30L60CT STPS30L60CT TO-220AB 2.3 g 50 Tube 2 STPS30L60CG STPS30L60CG D PAK 1.5 g 50 Tube STPS30L60CG-TR STPS30L60CG D2PAK 1.5 g 1000 Tape and reel STPS30L60CR STPS30L60CR I2 1.49 g 50 Tube STPS30L60CFP STPS30L60CFP 2.0 g 50 Tube PAK TO-220FPAB Revision history Table 11. Document revision history Date Revision Description of changes July-2003 3B 16-Oct-2006 4 Reformatted to current standards. Corrected dimensions for I2PAK in Table 5. 28-Nov-2006 5 Added TO-220FPAB package. Added STPS30L60CG-TR to ordering information. 07-Mar-2007 6 Updated thermal parameters in Table 2. 31-Mar-2007 7 Updated TC = 110 C in Table 1. 25-Aug-2008 8 Reformated to current standards. Updated ECOPACK statement. Updated torque values and dimension illustration for TO-247 in Section 2. 07-Feb-2011 9 Added electrical diagram on first page. Added parameters VARM and VASM to Table 2. Added Figure 14. Updated and added warning paragraph above Table 8. Updated Table 10. Initial release Doc ID 6479 Rev 9 11/12 STPS30L60C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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