Chem-Wik Desoldering Braid (R) Chem-Wik(R) Desoldering Braid Desoldering Applications As the standard desoldering braid for service and repair, Chem-Wik(R) Desoldering Braid ensures fast and safe desoldering. The ultra-pure, oxygen free copper braid quickly and completely removes solder from circuit boards and components. Its fast wicking action protects components from harmful heat damage. PermaPakTM Barrier Packaging ensures ultimate braid freshness and speed by sealing out harmful effects of the environment and protecting against oxidation. Chem-Wik(R) Desoldering Braid: Meets or exceeds the greatest range of perfomance standards: MIL-F-14256F Type R NASA STD-8739.3 Soldered Electrical Connections ANSI/IPC J STD-004, Type ROL0 Wire Wrap Pins Lugs/Posts Components Desolder pins for easy removal. Removes solder buildup. Eliminates potential intermittent problems. Wicks solder completely, eliminating solder splash or drip. Leaves terminal fluxed and ready for resoldering. Easily removes solder from components with straight or clinched leads. Minimum heat required. No damage to board or components. Cleaning Applications Static Dissipative Packaging: DOD Standard 1686C and MIL-HDBK-263B Mil-Std-2000A Mil-B-81705C Static Decay Rate Provision Chem-Wik(R) Rosin Chem-Wik(R) Rosin SD The fast, safe rosin flux desoldering braid for removing solder from leads and components The fast, safe rosin flux desoldering braid packaged in static dissipative bobbins Coated with ultra high purity rosin Quickly and thoroughly removes solder Noncorrosive Type R rosin flux Reduces the risk of damage associated with static electricity Coated with noncorrosive ultra high purity Type R rosin flux Quickly and thoroughly removes solder SMT Pads BGA Pads Solder Bridges Clean Script Quickly and safely desolders entire rows of SMT pads. Applications-specific sizes desolder individual fine-pitch SMT pads. Safely removes solder from BGA pads and chips in three to four passes. Completely removes all residual solder and facilitates chip repositioning. Completely removes solder bridges. Eliminates potential shorts. No damage to boards or circuitry. Selectively retouches etched script. Improves aesthetic appearance. Eliminates secondary identification. Easy to use. Braid Sizes Chem-Wik Product Selection Guide (R) PRODUCT Chem-Wik(R) Rosin Chem-Wik Rosin SD (R) BGA Purple .030"/0.8mm White .060/"1.5mm Yellow Blobs Finger Connectors .080"/2.0mm Green Eliminates and removes blobs as well as shorts and icicles. Leaves circuitry smooth. Cleans potential problem areas. Cleans finger connectors and surface mount pads. .110"/2.8mm Blue .145"/3.7mm Brown .210"/5.3mm Red PermaPakTM Barrier Packaging contains 25 bobbins per package 25' 7.5m 50' 15.0m 100' 30.5m 500' 152.5m APPLICATION .030"/0.8mm 2-25L 2-50L 2-100L 2-500L Micro-Circuits Yellow .050"/1.3mm 5-25L 5-50L 5-100L 5-500L Small Pads Green .075"/1.9mm 7-25L 7-50L 7-100L 7-500L Medium Pads Blue .100"/2.5mm 10-25L 10-50L 10-100L 10-500L Large Pads Gray .030"/0.8mm 2-5L Micro-Circuits Yellow .050"/1.3mm 5-5L Small Pads Green .075"/1.9mm 7-5L Medium Pads Blue .100"/2.5mm 10-5L Large Pads COLOR SIZE Gray 5' 1.5m Distributed by: ITW Chemtronics 8125 Cobb Center Drive Kennesaw, GA 30152-4386 770-424-4888 * 1-800-645-5244 Fax: 770-423-0748 * 1-800-243-6003 www.chemtronics.com Soder-Wick(R), Chem-Wik(R) and Chemtronics(R) are registered trademarks of ITW Chemtronics(R). VacuPakTM, Performance PakTM and PermaPakTM are trademarks of ITW Chemtronics(R). (c)2005 ITW Chemtronics(R) all rights reserved SW CAT 0010.02 Rev. 5026 5M The Leader in Desoldering Technology Soder-Wick Product Selection Guide (R) Soder-Wick -- World's Leading Brand of Desoldering Braid (R) Soder-Wick(R), the world's leading brand of desoldering braid, is the fastest, cleanest and safest braid in the industry. It significantly reduces rework/repair time and minimizes the risk of heat damage to the board. Its geometrically precise weave design allows for maximum capillary action and solder capacity. Soder-Wick(R) Desoldering Braid optimizes heat transfer through the braid and into the solder joint, resulting in faster wicking action than any other competitive brand. Minimal flux residue on the board speeds up the cleaning process, or eliminates it entirely. Soder-Wick(R) Desoldering Braid is available in the most comprehensive variety of widths, lengths and flux types. Application-specific sizes allow for precision solder removal in a flash. Sealed in Performance PakTM Barrier Packaging and VacuPakTM Vacuum Sealed Packaging, Soder-Wick(R) Desoldering Braid is completely protected from the harmful effects of the environment. The VacuPakTM vacuum-sealed can guarantees the braid to be as fast and fresh as the day it was made. The can serves as a protective storage container once the pack has been opened and is also easily stacked on the shelf. Its superior packaging provides predictable quality and performance, time and time again. Soder-Wick(R) Desoldering Braid meets or exceeds the greatest range of qualitative and performance standards: MIL-F-14256 F type R flux NASA-STD-8739.3 Soldered Electrical Connections DOD-STD-883E, Method 2022 ANSI/IPC J STD-004, Type ROL0 All 5' and 10' bobbins are offered on static dissipative bobbins, and only Soder-Wick(R) static dissipative bobbins are labeled by heat stamping. This eliminates paper labels that increase the risk of ESD damage. Competitive desoldering braid does not offer this increased level of protection. Pb The fastest, safest desoldering braid formulated specifically for use with lead-free applications Engineered specifically for high temperature, lead-free solders Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids Specifically designed for all lead-free solders Can also be used with Tin/Lead solders Packaged in ESD-safe static dissipative bobbins Minimizes the risk of damage associated with static electricity Noncorrosive ultra high purity no-clean flux Will not leave ionic contamination on the boards Especially effective at removing residual solder from SMT pads RoHS compliant Fastest, Cleanest and Safest Braid in the Industry www.chemtronics.com 25' 7.5m 100' 30.5m 500' 152.5m VACUPAKTM APPLICATION 40-2-10 SW14025 Small Pads, SMDs 40-3-5 40-3-10 SW14035 Medium Pads 40-4-5 40-4-10 SW14045 Large Pads Soder-Wick BGA Rosin BGA Purple 80-BGA-5 SW180BGA BGA Pads and Chips Soder-Wick(R) BGA No Clean BGA Purple 60-BGA-5 SW160BGA BGA Pads and Chips Soder-Wick(R) Rosin 1 .030"/0.8mm White 50-1-25 2 .060"/1.5mm Yellow 50-2-25 50-2-100 50-2-500 Small Pads, SMDs SMD, Micro-Circuits 3 .080"/2.0mm Green 50-3-25 50-3-100 50-3-500 Medium Pads 4 .110"/2.8mm Blue 50-4-25 50-4-100 50-4-500 Large Pads 5 .145"/3.7mm Brown 50-5-25 Terminals 6 .210"/5.3mm Red 50-6-25 Large Lugs 1 .030"/0.8mm White 80-1-5 80-1-10 SW18015 SMD, Micro-Circuits 2 .060"/1.5mm Yellow 80-2-5 80-2-10 SW18025 Small Pads, SMDs 3 .080"/2.0mm Green 80-3-5 80-3-10 SW18035 Medium Pads Soder-Wick Unfluxed 4 .110"/2.8mm Blue 80-4-5 80-4-10 SW18045 Large Pads The fastest, safest rosin flux desoldering braid for removing solder from printed circuit boards The unfluxed desoldering braid which can be coated with any flux type 5 .145"/3.7mm Brown 80-5-5 80-5-10 SW18055 Terminals 6 .210"/5.3mm Red 80-6-5 1 .030"/0.8mm White 60-1-5 60-1-10 SW16015 SMD, Micro-Circuits 2 .060"/1.5mm Yellow 60-2-5 60-2-10 SW16025 Small Pads, SMDs 3 .080"/2.0mm Green 60-3-5 60-3-10 SW16035 Medium Pads 4 .110"/2.8mm Blue 60-4-5 60-4-10 SW16045 Large Pads 5 .145"/3.7mm Brown 60-5-5 60-5-10 SW16055 Terminals 6 .210"/5.3mm Red 60-6-5 2 .060"/1.5mm Yellow 70-2-25 Small Pads, SMDs 3 .080"/2.0mm Green 70-3-25 Medium Pads 2 .060"/1.5mm Yellow 75-2-10 Small Pads, SMDs 3 .080"/2.0mm Green 75-3-10 Medium Pads 4 .110"/2.8mm Blue 75-4-10 Large Pads (R) Soder-Wick No Clean SD (R) Noncorrosive ultra high purity Type R rosin flux Minimizes the risk of heat damage to the board Will not leave ionic contamination on the boards Soder-Wick(R) Rosin SD The fastest, safest rosin flux desoldering braid packaged in static dissipative bobbins Soder-Wick(R) Rosin packaged in ESD-safe static dissipative bobbins Minimizes the risk of damage associated with static electricity Noncorrosive ultra high purity Type R rosin flux Minimizes the risk of heat damage to the board Will not leave ionic contamination on the boards Can be coated with any flux type Allows for a constant flux type throughout the production process Provides quick and safe desoldering Soder-Wick(R) Unfluxed SD The unfluxed desoldering braid packaged in static dissipative bobbins Soder-Wick(R) BGA The most effective, economical way to safely and completely remove solder from BGA pads and chips Soder-Wick No Clean SD Sized and designed specifically for BGA pad and chip rework/repair Entire BGA pads cleaned in three to four passes Available in rosin and no-clean fluxes Packaged in ESD-safe static dissipative bobbins Soder-Wick No Clean packaged in ESD-safe static dissipative bobbins Minimizes the risk of damage associated with static electricity Patented noncorrosive, halide free, organic no-clean flux Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance Blue COLOR Soder-Wick Rosin (R) .110"/2.8mm 4 Soder-Wick Rosin SD Soder-Wick Lead-Free SD Green 3 (R) (R) .080"/2.0mm .060"/1.5mm Soder-Wick(R) No Clean SD: Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818 Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderability ANSI/IPC J STD-004, Type ROL0 40-2-5 2 Yellow Soder-Wick(R) Lead-Free SD Static Dissipative Packaging: Qualifies under MIL-STD-1686C and MIL-HDBK-263B as a non-ESD generator Meets the Static Decay Rate Provision of MIL-B-81705C and MIL-STD-2000A 10' 3.0m SIZE (R) 5' 1.5m PRODUCT Soder-Wick(R) Unfluxed packaged in ESD-safe static dissipative bobbins Minimizes the risk of damage associated with static electricity Can be coated with any flux type Allows for a constant flux type throughout the production process Provides quick and safe desoldering Soder-Wick Unfluxed (R) Soder-Wick Unfluxed SD (R) Large Lugs Large Lugs All 5' and 10' Soder-Wick(R) Desoldering Braid is offered on static dissipative bobbins. Performance PakTM Barrier Packaging contains 25 bobbins per package. (R) The fastest, cleanest no-clean flux desoldering braid packaged in static dissipative bobbins (R) VacuPakTM Vacuum Sealed Packaging Guarantees Soder-Wick(R) Desoldering Braid to be as fast and fresh as the day it was made. The VacuPakTM can contains 10 bobbins with 5 feet of braid on each bobbin.