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Chem-Wik®Rosin

The fast, safe rosin flux desoldering braid for

removing solder from leads and components

■Coated with ultra high purity rosin

■Quickly and thoroughly removes solder

■Noncorrosive Type R rosin flux

Chem-Wik®Rosin Gray .030"/0.8mm 2-25L 2-50L 2-100L 2-500L Micro-Circuits

Yellow .050"/1.3mm 5-25L 5-50L 5-100L 5-500L Small Pads

Green .075"/1.9mm 7-25L 7-50L 7-100L 7-500L Medium Pads

Blue .100"/2.5mm 10-25L 10-50L 10-100L 10-500L Large Pads

Chem-Wik®Rosin SD Gray .030"/0.8mm 2-5L Micro-Circuits

Yellow .050"/1.3mm 5-5L Small Pads

Green .075"/1.9mm 7-5L Medium Pads

Blue .100"/2.5mm 10-5L Large Pads

Chem-Wik®Rosin SD

The fast,safe rosin flux desoldering braid

packaged in static dissipative bobbins

■Reduces the risk of damage associated with

static electricity

■Coated with noncorrosive ultra high purity Type

R rosin flux

■Quickly and thoroughly removes solder

Chem-Wik®Desoldering Braid

As the standard desoldering braid for service and repair, Chem-Wik®Desoldering Braid ensures fast and safe desoldering.

The ultra-pure, oxygen free copper braid quickly and completely removes solder from circuit boards and components. Its fast

wicking action protects components from ha rm ful heat damage. PermaPak™Barrier Packaging ensures ultimate braid

freshness and speed by sealing out harmful effects of the environment and protecting against oxidation.

PermaPak™Barrier Packaging

contains 25 bobbins per package

The Leader in

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Chem-Wik®Desoldering Braid

Desoldering Applications

Cleaning Applications

Braid Sizes

Wire Wrap Pins

Desolder pins for easy removal. Removes solder buildup. Eliminates

potential intermittent problems.

Lugs/Posts

Wicks solder completely,

eliminating solder splash or

drip. Leaves terminal fluxed

and ready for resoldering.

Components

Easily removes solder from

components with straight or

clinched leads. Minimum

heat required. No damage

to board or components.

SMT Pads

Quickly and safely desolders

entire rows of SMT pads.

Applications-specific sizes

desolder individual fine-pitch

SMT pads.

BGA Pads

Safely removes solder from

BGA pads and chips in three

to four passes. Completely

removes all residual solder

and facilitates chip

repositioning.

Solder Bridges

Completely removes solder

bridges. Eliminates potential

shorts. No damage to

boards or circuitry.

Clean Script

Selectively retouches etched

script. Improves aesthetic

appearance. Eliminates

secondary identification.

Easy to use.

Blobs

Eliminates and removes

blobs as well as shorts and

icicles. Leaves circuitry

smooth. Cleans potential

problem areas.

Finger Connectors

Cleans finger connectors

and surface mount pads.

BGA Purple

.030”/0.8mm White

.060/”1.5mm Yellow

.080”/2.0mm Green

.110”/2.8mm Blue

.145”/3.7mm Brown

.210”/5.3mm Red

Chem-Wik®Desoldering Braid:

Meets or exceeds the greatest range of perfomance standards:

■MIL-F-14256F Type R

■NASA STD-8739.3 Soldered Electrical Connections

■ANSI/IPC J STD-004, Type ROL0

Static Dissipative Packaging:

■DOD Standard 1686C and MIL-HDBK-263B

■Mil-Std-2000A

■Mil-B-81705C Static Decay Rate Provision

Chem-Wik®Product Selection Guide

5' 25' 50' 100' 500'

PRODUCT COLOR SIZE 1.5m 7.5m 15.0m 30.5m 152.5m APPLICATION

Distributed by:

Soder-Wick®,Chem-Wik®and Chemtronics®are registered trademarks of ITW Chemtronics®.

ITW Chemtronics

8125 Cobb Center Drive

Kennesaw, GA 30152-4386

770-424-4888 •1-800-645-5244

Fax: 770-423-0748 •1-800-243-6003

www.chemtronics.com

Soder-Wick®2.060"/1.5mm Yellow 40-2-5 40-2-10 SW14025 Small Pads, SMDs

Lead-Free SD

3.080"/2.0mm Green 40-3-5 40-3-10 SW14035 Medium Pads

4.110"/2.8mm Blue 40-4-5 40-4-10 SW14045 Large Pads

Soder-Wick®BGA Purple 80-BGA-5 SW180BGA BGA Pads and Chips

BGA Rosin

Soder-Wick®BGA Purple 60-BGA-5 SW160BGA BGA Pads and Chips

BGA No Clean

Soder-Wick®Rosin 1.030"/0.8mm White 50-1-25 SMD, Micro-Circuits

2.060"/1.5mm Yellow 50-2-25 50-2-100 50-2-500 Small Pads, SMDs

3.080"/2.0mm Green 50-3-25 50-3-100 50-3-500 Medium Pads

4.110"/2.8mm Blue 50-4-25 50-4-100 50-4-500 Large Pads

5.145"/3.7mm Brown 50-5-25 Terminals

6.210"/5.3mm Red 50-6-25 Large Lugs

Soder-Wick®1.030"/0.8mm White 80-1-5 80-1-10 SW18015 SMD, Micro-Circuits

Rosin SD

2.060"/1.5mm Yellow 80-2-5 80-2-10 SW18025 Small Pads, SMDs

3.080"/2.0mm Green 80-3-5 80-3-10 SW18035 Medium Pads

4.110"/2.8mm Blue 80-4-5 80-4-10 SW18045 Large Pads

5.145"/3.7mm Brown 80-5-5 80-5-10 SW18055 Terminals

6.210"/5.3mm Red 80-6-5 Large Lugs

Soder-Wick®1.030"/0.8mm White 60-1-5 60-1-10 SW16015 SMD, Micro-Circuits

No Clean SD

2.060"/1.5mm Yellow 60-2-5 60-2-10 SW16025 Small Pads, SMDs

3.080"/2.0mm Green 60-3-5 60-3-10 SW16035 Medium Pads

4.110"/2.8mm Blue 60-4-5 60-4-10 SW16045 Large Pads

5.145"/3.7mm Brown 60-5-5 60-5-10 SW16055 Terminals

6.210"/5.3mm Red 60-6-5 Large Lugs

Soder-Wick®2.060"/1.5mm Yellow 70-2-25 Small Pads, SMDs

Unfluxed

3.080"/2.0mm Green 70-3-25 Medium Pads

Soder-Wick®2.060"/1.5mm Yellow 75-2-10 Small Pads, SMDs

Unfluxed SD

3.080"/2.0mm Green 75-3-10 Medium Pads

4.110"/2.8mm Blue 75-4-10 Large Pads

VacuPak™Vacuum Sealed Packaging

Guarantees Soder-Wick®Desoldering Braid to be as fast

and fresh as the day it was made. The VacuPak™can

contains 10 bobbins with 5 feet of braid on each bobbin.

Soder-Wick®Unfluxed

The unfluxed desoldering braid which can be

coated with any flux type

■Can be coated with any flux type

■Allows for a constant flux type throughout the

production process

■Provides quick and safe desoldering

Soder-Wick®Unfluxed SD

The unfluxed desoldering braid packaged in

static dissipative bobbins

■Soder-Wick®Unfluxed packaged in ESD-safe

static dissipative bobbins

■Minimizes the risk of damage associated with

static electricity

■Can be coated with any flux type

■Allows for a constant flux type throughout the

production process

■Provides quick and safe desoldering

Soder-Wick®Lead-Free SD

The fastest, safest desoldering braid

formulated specifically for use with lead-free

applications

■Engineered specifically for high temperature,

lead-free solders

■Transfers heat to the solder joint more quickly and

efficiently than conventional desoldering braids

■Specifically designed for all lead-free solders

■Can also be used with Tin/Lead solders

■Packaged in ESD-safe static dissipative bobbins

■Minimizes the risk of damage associated with

static electricity

■Noncorrosive ultra high purity no-clean flux

■Will not leave ionic contamination on the boards

■Especially effective at removing residual solder

from SMT pads

■RoHS compliant

Soder-Wick®BGA

The most effective, economical way to safely

and completely remove solder from BGA pads

and chips

■Sized and designed specifically for BGA pad and

chip rework/repair

■Entire BGA pads cleaned in three to four passes

■Available in rosin and no-clean fluxes

■Packaged in ESD-safe static dissipative bobbins

Soder-Wick®Rosin

The fastest, safest rosin flux desoldering braid

for removing solder from printed circuit boards

■Noncorrosive ultra high purity Type R rosin flux

■Minimizes the risk of heat damage to the board

■Will not leave ionic contamination on the boards

Soder-Wick®Rosin SD

The fastest, safest rosin flux desoldering braid

packaged in static dissipative bobbins

■Soder-Wick®Rosin packaged in ESD-safe static

dissipative bobbins

■Minimizes the risk of damage associated with

static electricity

■Noncorrosive ultra high purity Type R rosin flux

■Minimizes the risk of heat damage to the board

■Will not leave ionic contamination on the boards

Soder-Wick®No Clean SD

The fastest, cleanest no-clean flux desoldering

braid packaged in static dissipative bobbins

■Soder-Wick®No Clean packaged in ESD-safe

static dissipative bobbins

■Minimizes the risk of damage associated with

static electricity

■Patented noncorrosive, halide free, organic

no-clean flux

■Desolders up to 40% faster than competitive

no-clean braids and leaves boards cleaner

■Meets Bellcore TR-NWT-000078 and ANSI IPC

SF-818 for Surface Insulation Resistance

Soder-Wick® Desoldering Braid meets or exceeds

the greatest range of qualitative and performance

standards:

■MIL-F-14256 F type R flux

■NASA-STD-8739.3 Soldered Electrical Connections

■DOD-STD-883E, Method 2022

■ANSI/IPC J STD-004, Type ROL0

Static Dissipative Packaging:

■Qualifies under MIL-STD-1686C and MIL-HDBK-263B

as a non-ESD generator

■Meets the Static Decay Rate Provision of MIL-B-81705C

and MIL-STD-2000A

Soder-Wick®No Clean SD:

■Meets MIL-STD-883B, Bellcore TR-NWT-000078,

ANSI/IPC J SF-818

■Meets parameters tested by the Singapore Institute of

Standards and Industrial Research (SISIR) for

Solderability

■ ANSI/IPC J STD-004, Type ROL0

All 5’ and 10’ bobbins are offered on static dissipative

bobbins, and only Soder-Wick®static dissipative bobbins

are labeled by heat stamping. This eliminates paper

labels that increase the risk of ESD damage. Competitive

desoldering braid does not offer this increased level

of protection.

Soder-Wick®, the world's leading brand of

desoldering braid, is the fastest, cleanest and

safest braid in the industry.

It significantly reduces rework/repair time and minimizes

the risk of heat damage to the board. Its geometrically

precise weave design allows for maximum capillary action

and solder capacity. Soder-Wick®Desoldering Braid

optimizes heat transfer through the braid and into the

solder joint, resulting in faster wicking action than any other

competitive brand. Minimal flux residue on the board

speeds up the cleaning process, or eliminates it entirely.

Soder-Wick®Desoldering Braid is available in the

most comprehensive variety of widths, lengths and

flux types.

Application-specific sizes allow for precision solder removal

in a flash. Sealed in Performance Pak™Barrier Packaging

and VacuPak™Vacuum Sealed Packaging, Soder-Wick®

Desoldering Braid is completely protected from the harmful

effects of the environment. The VacuPak™vacuum-sealed

can guarantees the braid to be as fast and fresh as the day

it was made. The can serves as a protective storage

container once the pack has been opened and is also easily

stacked on the shelf. Its superior packaging provides

predictable quality and performance, time and time again.

Soder-Wick®— World’s Leading Brand of Desoldering Braid

Fastest, Cleanest and Safest Braid in the Industry

www.chemtronics.com

5' 10' 25' 100' 500'

PRODUCT SIZE COLOR 1.5m 3.0m 7.5m 30.5m 152.5m VACUPAK™ APPLICATION

Soder-Wick®Product Selection Guide

All 5’ and 10’ Soder-Wick®Desoldering Braid is offered on static dissipative bobbins. Performance Pak™Barrier Packaging contains 25 bobbins per package.