Functional Description
The LM3526-H and LM3526-L are high side P-Channel
switches with active-high and active-low enable inputs, re-
spectively. Fault conditions turn-off and inhibit turn-on of the
output transistor and activate the open-drain error flag tran-
sistor sinking current to the ground.
INPUT AND OUTPUT
IN (Input) is the power supply connection to the control cir-
cuitry and the source of the output MOSFET.
OUT (Output) is the connection to the drain of the output
MOSFET. In a typical application circuit, current flows through
the switch from IN to OUT towards the load.
If VOUT is greater than VIN when the switch is enabled, current
will flow from OUT to IN since the MOSFET is bidirectional.
THERMAL SHUTDOWN
The LM3526 is internally protected against excessive power
dissipation by a two-stage thermal protection circuit. If the
device temperature rises to approximately 145°C, the thermal
shutdown circuitry turns off any switch that is current limited.
Non-overloaded switches continue to function normally. If the
die temperature rises above 150°C, both switches are turned
off and both fault flag outputs are activated. Hysteresis en-
sures that a switch turned off by thermal shutdown will not be
turned on again until the die temperature is reduced to 135°
C. Shorted switches will continue to cycle off and on, due to
the rising and falling die temperature, until the short is re-
moved.
UNDERVOLTAGE LOCKOUT
UVLO prevents the MOSFET switch from turning on until in-
put voltage exceeds 1.8V (typical).
If input voltage drops below 1.8V (typical), UVLO shuts off the
MOSFET switch and signals the fault flag. UVLO functions
only when device is enabled.
CURRENT LIMIT
The current limit circuit is designed to protect the system sup-
ply, the MOSFET switches and the load from damage caused
by excessive currents. The current limit threshold is set inter-
nally to allow a minimum of 500 mA through the MOSFET but
limits the output current to approximately 1.0A typical.
FAULT FLAG
The fault flag is an open-drain output capable of sinking
10 mA load current to typically 100 mV above ground.
A parasitic diode exists between the flag pins and VIN pin.
Pulling the flag pins to voltages higher than VIN will forward
bias this diode and will cause an increase in supply current.
This diode will also clamp the voltage on the flag pins to a
diode drop above VIN.
The fault flag is active (pulled low) when any of the following
conditions are present: under-voltage, current limit, or thermal
shutdown.
A 1ms (typ.) delay in reporting the fault condition prevents
erroneous fault flags and eliminates the need for an external
RC delay network.
Application Information
FILTERING
The USB specification indicates that “no less than 120 µF
tantalum capacitors” must be used on the output of each
downstream port. This bulk capacitance provides the short-
term transient current needed during a hot plug-in. Current
surges caused by the input capacitance of the down stream
device could generate undesirable EMI signals. Ferrite beads
in series with all power and ground lines are recommended
to eliminate or significantly reduce EMI.
In selecting a ferrite bead, the DC resistance of the wire used
must be kept to a minimum to reduce the voltage drop.
A 0.01 µF ceramic capacitor is recommended on each port
directly between the Vbus and ground pins to prevent EMI
damage to other components during the hot-detachment.
Adequate capacitance must be connected to the input of the
device to limit the input voltage drop during a hot-plug event
to less than 330 mV. For a few tens of µs, the host must supply
the in-rush current to the peripheral, charging its bulk capac-
itance to Vbus. This current is initially supplied by the input
capacitor. A 33 µF 16V tantalum capacitor is recommended.
In choosing the capacitors, special attention must be paid to
the Effective Series Resistance, ESR, of the capacitors to
minimize the IR drop across the capacitor's ESR.
SOFT START
To eliminate the upstream voltage droop caused by the high
in-rush current drawn by the output capacitors, the maximum
in-rush current is internally limited to 1.5A.
TRANSIENT OVER-CURRENT DELAY
High transient current is also generated when the switch is
enabled and large values of capacitance at the output have
to be rapidly charged. The in-rush currents created could ex-
ceed the short circuit current limit threshold of the device
forcing it into the current limit mode. The capacitor is charged
with the maximum available short circuit current set by the
LM3526. The duration of the in-rush current depends on the
size of the output capacitance and load current. Since this is
not a valid fault condition, the LM3526 delays the generation
of the fault flag for 1 ms. If the condition persists due to other
causes such as a short, a fault flag is generated after a 1 ms
delay has elapsed.
The LM3526's 1 ms delay in issuing the fault flag is adequate
for most applications. If longer delays are required, an RC
filter as shown in Figure 1 may be used.
10109724
FIGURE 1.
PCB LAYOUT CONSIDERATIONS
In order to meet the USB requirements for voltage drop, droop
and EMI, each component used in this circuit must be evalu-
ated for its contribution to the circuit performance. The PCB
layout rules and guidelines must be followed.
•Place the switch as close to the USB connector as
possible. Keep all Vbus traces as short as possible and use
at least 50-mil, 1 ounce copper for all Vbus traces. Solder
plating the traces will reduce the trace resistance.
www.national.com 8
LM3526