ISP1110VH-T - NXP Semiconductors / Philips Semiconductors

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1. General description

The ISP1110 is a Universal Serial Bus (USB) transceiver that supports Universal

Asynchronous Receiver-Transmitter (UART) signaling mode.

The ISP1110 USB transceiver is fully compliant with

Universal Serial Bus Speciﬁcation

Rev. 2.0

. The ISP1110 can transmit and receive USB data at full-speed (12 Mbit/s).

The ISP1110 transceiver allows USB Application Speciﬁc Integrated Circuits (ASICs) with

I/O power supply voltage from 1.65 V to 2.85 V to interface to the physical layer of the

USB. The transceiver has an integrated 5 V-to-3.3 V voltage regulator for direct powering

through USB supply line VBUS and an integrated voltage detector to detect the presence

of the VBUS voltage on the VCC(5V0) pin. When VBUS is present, the transceiver is in USB

mode. When VBUS is not present, the transceiver can be set to UART signaling mode.

The ISP1110 transceiver is available in HBCC16 lead-free and halogen-free package.

2. Features

nFully complies with

Universal Serial Bus Speciﬁcation Rev. 2.0

nSupports USB data transfer at full-speed (12 Mbit/s)

nIntegrated DP pull-up resistor to reduce external components

nImplemented internal DP pull-up resistor as described in

ECN_27%_Resistor

nIntegrated 5 V-to-3.3 V voltage regulator to power through USB line VBUS

nVBUS voltage presence is indicated on pin VBUSDET

nPins VP and VM function in bidirectional mode, allowing pin count saving for ASIC

interface

nUsed as a USB peripheral transceiver

nStable RCV output during Single-Ended Zero (SE0) condition

nTwo single-ended receivers with hysteresis

nLow-power operation

nSupports 2.8 V UART signaling mode on the DP and DM lines

nSupports VCC(I/O) voltage range from 1.65 V to 2.85 V

nSupports VCC(UART) voltage range from 2.7 V to 4.5 V

nOff-state supply current from VCC(UART) is less than 3 µA

nStatic current from VCC(I/O) is less than 3 µA (typical 1 µA)

nAvailable in small HBCC16 (3 mm ×3 mm) lead-free and halogen-free package

ISP1110

Universal Serial Bus transceiver with UART signaling

Rev. 02 — 19 March 2007 Product data sheet

Product data sheet Rev. 02 — 19 March 2007 2 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

3. Applications

nMobile phone

nPersonal Digital Assistant (PDA)

nOther portable devices

4. Ordering information

5. Block diagram

Table 1. Ordering information

Type

number Package

Name Description Version

ISP1110VH HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 ×3×0.65 mm SOT639-2

Fig 1. Block diagram

004aaa678

VCC(I/O)

VCC(5V0)

VOLTAGE

REGULATOR

LEVEL

SHIFTER

AND

CONTROL

LOGIC

ISP1110VH

SOFTCON

VREG

GND

OE_N

RCV

VP/VPO

VM/VMO

VBUSDET

SUSPEND

POWER

SELECTOR

VBUS

DETECTOR

VCC(UART)

DP PULL-UP

RESISTOR

RXD

TXD

UART_EN

Product data sheet Rev. 02 — 19 March 2007 3 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

6. Pinning information

6.1 Pinning

Fig 2. Pin conﬁguration HBCC16; top view

Fig 3. Pin conﬁguration HBCC16; bottom view

ISP1110VH

Transparent top view

RXD

UART_EN

VCC(I/O)

VREG

OE_N

SUSPEND

SOFTCON

TXD

RCV

VP/VPO

VM/VMO

VCC(UART)

VCC(5V0)

VBUSDET

004aaa683

ISP1110VH

Bottom view

VM/VMO

OE_N

SUSPEND

SOFTCON

UART_EN

VCC(I/O)

VREG

VP/VPO

RCV

TXD

RXD

VBUSDET

VCC(5V0)

VCC(UART)

004aaa684

GND (exposed

die pad)

Product data sheet Rev. 02 — 19 March 2007 4 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

6.2 Pin description

Table 2. Pin description

Symbol[1] Pin Type[2] Description

RXD 1 O UART RXD output to microcontroller (CMOS level with respect to

VCC(I/O)); driven LOW in USB mode

output pad; push pull; 4 mA output drive; CMOS

TXD 2 I UART TXD input from microcontroller (CMOS level with respect

to VCC(I/O))

input pad; push pull; CMOS

RCV 3 O differential data receiver output (CMOS level with respect to

VCC(I/O)); driven LOW when input SUSPEND is HIGH; the output

state of RCV is preserved and stable during an SE0 condition;

driven LOW when in UART mode

output pad; push pull; 4 mA output drive; CMOS

VP/VPO 4 I/O single-ended DP receiver output VP (CMOS level with respect to

VCC(I/O)); for external detection of SE0, error conditions and

speed of connected device; this pin also acts as drive data input

VPO; see Table 5 and Table 6

bidirectional pad; push-pull input; 3-state output; 4 mA output

drive; CMOS

VM/VMO 5 I/O single-ended DM receiver output VM (CMOS level with respect to

VCC(I/O)); for external detection of SE0, error conditions and

speed of connected device; this pin also acts as drive data input

VMO; see Table 5 and Table 6

bidirectional pad; push-pull input; 3-state output; 4 mA output

drive; CMOS

OE_N 6 I USB output enable (CMOS level with respect to VCC(I/O), active

LOW); enables the transceiver to transmit data on the USB bus

input pad; push pull; CMOS

SUSPEND 7 I suspend input (CMOS level with respect to VCC(I/O)); a HIGH level

enables low-power state while the USB bus is inactive and drives

output RCV to a LOW level; this pin is ignored when in UART

mode

input pad; push pull; CMOS

SOFTCON 8 I software controlled USB connection input; a HIGH level enables

the internal DP pull-up resistor when VBUSDET is HIGH; this pin

is ignored when in UART mode

input pad; push pull; CMOS

VBUSDET 9 O VBUS indicator output (CMOS level with respect to VCC(I/O)); when

VBUS > VCC(5V0)th, then VBUSDET = HIGH and when

VBUS <V

CC(5V0)th, then VBUSDET = LOW

output pad; push pull; 4 mA output drive; CMOS

DM 10 AI/O USB mode — Negative USB data bus connection (analog,

bidirectional, differential)

UART mode — UART TXD line (digital output)

DP 11 AI/O USB mode — Positive USB data bus connection (analog,

bidirectional, differential)

UART mode — UART RXD line (digital input)

Product data sheet Rev. 02 — 19 March 2007 5 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

[1] Symbol names ending with underscore N, for example, _N, indicate active LOW signals.

[2] I = input; O = output; I/O = digital input/output; AI/O = analog input/output.

VCC(5V0) 12 - supply voltage input (4.0 V to 5.5 V); can be directly connected to

USB line VBUS

VCC(UART) 13 - supply voltage input (2.7 V to 4.5 V) for the UART signaling

VREG 14 - internal regulator output; a decoupling capacitor of at least 0.1 µF

is required

VCC(I/O) 15 - supply voltage for digital I/O pins (1.65 V to 2.85 V). When

VCC(I/O) is not connected, the DP and DM pins are in off-state.

This supply pin is totally independent of VCC(5V0) and VREG, and

must never exceed VREG.

UART_EN 16 I enable UART signaling mode when VCC(5V0) is not present

input pad; push-pull; CMOS

GND exposed

die pad - ground supply; down bonded to the exposed die pad (heat sink);

to be connected to the PCB ground

Table 2. Pin description

…continued

Symbol[1] Pin Type[2] Description

Product data sheet Rev. 02 — 19 March 2007 6 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

7. Functional description

7.1 Modes of operation

The ISP1110 supports two modes of operation:

•USB mode (3.3 V signaling)

•UART mode (2.8 V signaling)

Table 3 shows the deﬁnition of various operating modes.

Table 4 shows the pin status in various operating modes.

7.1.1 USB mode

When the ISP1110 is in USB mode, pins DP and DM work as the USB D+ and D− lines,

respectively. The DP and DM driver is powered by VREG. The USB function is compatible

with the ISP1102 transceiver.

When the ISP1110 is in USB mode, the TXD input pin is ignored and the RXD output pin

is driven LOW.

The ISP1110 is in USB mode when VCC(5V0) > VCC(5V0)th and UART_EN is LOW. VCC(I/O)

must be on.

A short description of the USB detection sequence is:

1. The phone is connected to the USB port of a powered PC.

2. The ISP1110 detects VBUS is above VCC(5V0)th. The ISP1110 enters USB mode and

the Analog USB Transceiver (ATX) is powered by VREG.

Table 3. Operating modes: deﬁnition

VCC(I/O) VCC(UART) VCC(5V0) = VBUS UART_EN Mode

Off X X X not deﬁned

On X off LOW isolate mode

On on off HIGH UART mode

On X on LOW USB mode

Table 4. Pin status in various modes

Pin Isolate mode UART mode USB mode

DP not powered high-Z see Table 5

DM not powered driven (= TXD) see Table 5

VP/VPO, VM/VMO high-Z LOW when OE_N = HIGH see Table 5

high-Z when OE_N = LOW

RCV LOW LOW see Table 5

VBUSDET LOW LOW HIGH

RXD LOW driven (= DP) LOW

UART_EN, TXD, SUSPEND,

SOFTCON, OE_N high-Z high-Z high-Z

VREG not powered 2.8 V 3.3 V

Product data sheet Rev. 02 — 19 March 2007 7 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

3. If the phone is switched off (VCC(I/O) is not present), then the DP and DM pins of the

ISP1110 remain at high-impedance and the PC will not detect any device attachment.

4. If the phone is switched on (VCC(I/O) is present), then the ISP1110 will drive the

VBUSDET pin to a HIGH level.

5. The phone processor detects that pin VBUSDET is HIGH. If the phone system

software is ready for USB operation, the phone processor will assert pin SOFTCON.

6. The ISP1110 will enable the DP pull-up resistor (RPU(DP)).

7. The PC detects DP at the HIGH level and starts the USB full-speed enumeration.

8. The PC loads the driver for the phone, if enumeration is successful.

For the ﬂowchart, see Section 7.1.3.

7.1.2 UART mode

When the ISP1110 is in UART mode, the DP and DM driver is powered by 2.8 V. The

ISP1110 works as a level shifter between these pairs of pins:

•From TXD (VCC(I/O) level) to DM (2.8 V level).

•From DP (2.8 V level) to RXD (VCC(I/O) level).

When the ISP1110 is in UART mode, the USB differential receiver is disabled. The

SUSPEND and SOFTCON input pins are ignored. The RCV pin is driven LOW. The

VP/VPO and VM/VMO pins are driven LOW, if OE_N is HIGH. The VP/VPO and VM/VMO

pins are 3-state LOW, if OE_N is LOW.

The ISP1110 is in UART mode when VCC(5V0) < VCC(5V0)th and pin UART_EN is HIGH.

VCC(I/O) and VCC(UART) must be on.

A short description of the UART detection sequence is:

1. The phone is switched on (VCC(I/O) is present).

2. If VBUS is off, the ISP1110 will drive VBUSDET to a LOW level. The ATX is powered by

2.8 V.

3. The ISP1110 will enter UART signaling mode, if UART_EN is HIGH.

For the ﬂowchart, see Section 7.1.3.

Product data sheet Rev. 02 — 19 March 2007 8 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

7.1.3 Mode detection ﬂowchart

7.1.4 Mode switching time

When the USB cable is connected, the ISP1110 is in USB mode. When the USB cable is

removed and the UART cable is connected, the ISP1110 may switch to UART mode as

long as the VBUSDET output is LOW. On the other hand, if the UART cable is removed

and the USB cable is connected, the ISP1110 can switch to USB mode.

Fig 4. ISP1110 mode detection ﬂowchart

004aaa681

START

PHONE IS OFF

(VCC(I/O) IS NOT POWERED;

DP AND DM ARE OFF-STATE)

VCC(I/O) = ON?

VBUSDET = HIGH?

DP AND DM ARE

OFF-STATE AND

RXD = LOW

YES

UART_EN = HIGH?

UART MODE ENABLED;

(TXD → DM; DP → RXD)

YES

PHONE IN UART FUNCTION

PC IS CONNECTED;

ISP1110 IS IN

USB MODE

YES

UART_EN =

LOW

AND

SOFTCON

= HIGH?

YES

DP PULL-UP

RESISTOR ENABLED

PHONE IN USB FUNCTION

Product data sheet Rev. 02 — 19 March 2007 9 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

UART mode cannot be enabled until the voltage on VCC(5V0) drops below the VBUSDET

threshold (0.8 V to 4.0 V). Therefore, the time required to switch from USB mode to UART

mode is determined by the RC discharge time on the VBUS line. Given that

VCC(5V0) = 5.0 V, R = 100 kΩ and C = 1 µF, the discharge time is less than 200 ms (from

5 V to 0.8 V). Assume the detection of the UART cable connect or disconnect is very fast

(within 1 ms), the total switching time from the USB cable removal to entering UART mode

can be less than 200 ms. The total switching time from the UART cable removal to

entering USB mode can be less than 200 ms.

When VBUSDET becomes LOW, it is recommended that you wait for 50 ms before

asserting UART_EN. This is because there is no hysteresis built for the VBUSDET

threshold detector.

The time between VBUSDET going HIGH and SOFTCON assertion is 0 ms to 100 ms,

according to

Universal Serial Bus Speciﬁcation Rev. 2.0, Section 7.1.7.3

7.2 Analog USB Transceiver (ATX)

The ISP1110 ATX supports USB full-speed (12 Mbit/s) signaling. The ATX function is

compatible with the ISP1102 transceiver. Table 5 shows the function of the ATX.

[1] Signal levels on the DP and DM pins are determined by other USB devices and external pull-up or pull-down resistors.

[2] In suspend mode (SUSPEND = HIGH), the differential receiver is inactive and output RCV is always LOW. The resume signaling is

detected through single-ended receivers VP/VPO and VM/VMO.

[1] RCV* denotes the signal level on output RCV just before the SE0 state occurs. This level is stable during

the SE0 period.

Table 5. USB function

SUSPEND OE_N DP and DM RCV VP/VPO VM/VMO Function

LOW LOW driving/receiving active VPO input VMO input normal driving (differential

receiver active)

LOW HIGH receiving[1] active VP output VM output receiving

HIGH LOW driving inactive[2] VPO input VMO input driving during suspend

(differential receiver inactive)

HIGH HIGH high-Z[1] inactive[2] VP output VM output low-power state

Table 6. USB driving function (pin OE_N = LOW)

VM/VMO VP/VPO Data

LOW LOW SE0

LOW HIGH differential logic 1

HIGH LOW differential logic 0

HIGH HIGH illegal state

Table 7. USB receiving function (pin OE_N = HIGH)

DP, DM RCV VP/VPO VM/VMO

Differential logic 0 LOW LOW HIGH

Differential logic 1 HIGH HIGH LOW

SE0 RCV*[1] LOW LOW

Product data sheet Rev. 02 — 19 March 2007 10 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

7.3 VBUS detector

The VBUS detector provides voltage level detection on VBUS, if VBUS is connected to

VCC(5V0). If VBUS is greater than VBUS valid threshold VCC(5V0)th, pin VBUSDET will output

a HIGH level. Otherwise, pin VBUSDET will output a LOW level.

The VBUS detector is powered by VCC(I/O).

7.4 DP pull-up resistor

The internal DP pull-up resistor is connected between the VREG and DP pins, if

pin SOFTCON is a HIGH level.

The pull-up resistor is context variable, as described in document

ECN_27%_Resistor

The variable pull-up resistor hardware is implemented here to meet the

ECN_27%_Resistor

speciﬁcation.

7.5 DC-DC regulator

In USB mode, when VCC(5V0) = 4.0 V to 5.5 V, the regulator will output 3.0 V to 3.6 V. In

UART mode, when VCC(UART) = 2.7 V to 4.5 V, the regulator will output 2.35 V to 2.85 V.

A 0.1 µF capacitor is required to connect to the VREG pin.

7.6 Power selector

When VBUSDET = HIGH, the regulator will be powered by VCC(5V0). When

VBUSDET = LOW and UART_EN = HIGH, the regulator will be powered by VCC(UART).

When VCC(I/O) is not connected, the DP and DM output will be in off-state.

For proper operation, the VCC(I/O) voltage must not exceed VREG.

Product data sheet Rev. 02 — 19 March 2007 11 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

8. Limiting values

[1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor (Human Body Model).

9. Recommended operating conditions

10. Static characteristics

Table 8. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC(5V0) supply voltage (5.0 V) −0.5 +6.0 V

VCC(UART) supply voltage (UART) −0.5 +5.5 V

VCC(I/O) input/output supply voltage −0.5 +4.6 V

VIinput voltage −0.5 VCC(I/O) + 0.5 V V

Ilu latch-up current VI=−1.8 V to +5.4 V - 100 mA

VESD electrostatic discharge voltage all pins; ILI < 1 µA[1] −2000 +2000 V

pins DP, DM, VCC(5V0), GND;

ILI < 3 µA; 1 µF capacitor on

VCC(5V0)

[1] −3000 +3000 V

Tstg storage temperature −40 +125 °C

Table 9. Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

VCC(5V0) supply voltage (5.0 V) 4.0 5.0 5.5 V

VCC(UART) supply voltage (UART) 2.7 - 4.5 V

VCC(I/O) input/output supply voltage 1.65 1.8 2.85 V

VIinput voltage 0 - VCC(I/O) V

VIA(I/O) input voltage on analog I/O pins pins DP and DM 0 - 3.6 V

Tamb ambient temperature −40 - +85 °C

Tjjunction temperature −40 - +125 °C

Table 10. Static characteristics: supply pins

CC(5V0)

= 4.0 V to 5.5 V; V

CC(UART)

= 2.7 V to 4.5 V; V

CC(I/O)

= 1.65 V to 2.85 V; T

amb

−

C to +85

Typical values are at V

CC(5V0)

= 5.0 V; V

CC(UART)

= 2.8 V; V

CC(I/O)

= 1.8 V; T

amb

= +25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VO(VREG) output voltage on pin VREG USB mode [1] 3.0 3.3 3.6 V

UART mode 2.35 2.6 2.85 V

ICC(5V0) supply current (5.0 V) USB mode; transmitting and

receiving at 12 Mbit/s;

CL= 50 pF on pins DP and DM

[2] - 48mA

ICC(UART) supply current (UART) UART mode; 921.6 kbit/s - - 4 mA

ICC(I/O) supply current on pin VCC(I/O) transmitting and receiving at

12 Mbit/s [2] - 12mA

Product data sheet Rev. 02 — 19 March 2007 12 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

[1] The minimum voltage is 2.7 V in suspend mode.

[2] Maximum value characterized only, not tested in production.

[3] Excluding any load current and source current to the DP/DM pull-up and pull-down resistors (200 µA typical).

ICC(5V0)(idle) idle and SE0 supply current

(5.0 V) USB mode; idle: VDP > 2.7 V,

VDM < 0.3 V; SE0: VDP < 0.3 V,

VDM < 0.3 V

[3] - - 300 µA

ICC(I/O)(static) static supply current on

pin VCC(I/O)

--3µA

ICC(5V0)(susp) suspend mode supply current

(5.0 V) USB mode SUSPEND = HIGH [3] --35µA

ICC(UART)(off) off-state supply current

(UART) USB mode or UART_EN = LOW - - 3 µA

VCC(5V0)th supply voltage detection

threshold (5.0 V) 1.65 V ≤ VCC(I/O) ≤ 2.85 V 0.8 - 4.0 V

VCC(I/O)th supply voltage detection

threshold (I/O) 0.5 - 1.4 V

Table 10. Static characteristics: supply pins

…continued

CC(5V0)

= 4.0 V to 5.5 V; V

CC(UART)

= 2.7 V to 4.5 V; V

CC(I/O)

= 1.65 V to 2.85 V; T

amb

−

C to +85

Typical values are at V

CC(5V0)

= 5.0 V; V

CC(UART)

= 2.8 V; V

CC(I/O)

= 1.8 V; T

amb

= +25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 11. Static characteristics: digital pins

CC(5V0)

= 4.0 V to 5.5 V; V

CC(UART)

= 2.7 V to 4.5 V; V

CC(I/O)

= 1.65 V to 2.85 V; T

amb

−

C to +85

Typical values are at V

CC(5V0)

= 5.0 V; V

CC(UART)

= 2.8 V; V

CC(I/O)

= 1.8 V; T

amb

= +25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VCC(I/O) = 1.65 V to 2.85 V

Input levels

VIL LOW-level input voltage - - 0.3VCC(I/O) V

VIH HIGH-level input voltage 0.7VCC(I/O) -- V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µAV

CC(I/O) − 0.15 V - - V

IOH = 2 mA VCC(I/O) − 0.4 V - - V

Leakage current

ILI input leakage current [1] −1-+1µA

Capacitance

Cin input capacitance pin to GND - - 10 pF

Example 1: VCC(I/O) = 1.8 V ± 0.15 V

Input levels

VIL LOW-level input voltage - - 0.5 V

VIH HIGH-level input voltage 1.2 - - V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

Product data sheet Rev. 02 — 19 March 2007 13 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

[1] If VCC(I/O) ≥ VCC(UART), then the leakage current will be higher than the speciﬁed value when in UART mode.

VOH HIGH-level output voltage IOH = 100 µA 1.5 - - V

IOH = 2 mA 1.25 - - V

Example 2: VCC(I/O) = 2.775 V ± 0.075 V

Input levels

VIL LOW-level input voltage - - 0.8 V

VIH HIGH-level input voltage 3.0 - - V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µA 2.55 - - V

IOH = 2 mA 2.3 - - V

Table 11. Static characteristics: digital pins

…continued

CC(5V0)

= 4.0 V to 5.5 V; V

CC(UART)

= 2.7 V to 4.5 V; V

CC(I/O)

= 1.65 V to 2.85 V; T

amb

−

C to +85

Typical values are at V

CC(5V0)

= 5.0 V; V

CC(UART)

= 2.8 V; V

CC(I/O)

= 1.8 V; T

amb

= +25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 12. Static characteristics: analog I/O pins DP and DM

CC(5V0)

= 4.0 V to 5.5 V; V

CC(UART)

= 2.7 V to 4.5 V; V

CC(I/O)

= 1.65 V to 2.85 V; T

amb

−

C to +85

Typical values are at V

CC(5V0)

= 5.0 V; V

CC(UART)

= 2.8 V; V

CC(I/O)

= 1.8 V; T

amb

= +25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Input levels (USB mode)

Differential receiver

VDI differential input sensitivity |VDP − VDM|0.2 - - V

VCM differential common mode

voltage range includes VDI range 0.8 - 2.5 V

Single-ended receiver

VIL LOW-level input voltage - - 0.8 V

VIH HIGH-level input voltage 2.0 - - V

Vhys hysteresis voltage 0.4 - 0.7 V

Input levels (UART mode)

VIL LOW-level input voltage −0.3 - +0.8 V

VIH HIGH-level input voltage 2.0 - 3.0 V

Vhys hysteresis voltage 0.4 - 0.7 V

Output levels (USB mode)

VOL LOW-level output voltage RL= 1.5 kΩ to 3.6 V - - 0.3 V

VOH HIGH-level output voltage RL= 15 kΩ to GND [1] 2.8 - 3.6 V

Output levels (UART mode)

VOL LOW-level output voltage IOL = 4 mA −0.1 - +0.37 V

VOH HIGH-level output voltage IOH = 4 mA 2.16 - 2.85 V

Leakage current

ILZ off-state leakage current −1- +1µA

Capacitance

Cin input capacitance pin to GND - - 10 pF

Product data sheet Rev. 02 — 19 March 2007 14 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

[1] VOH(min) = VREG − 0.2 V.

[2] Includes external resistors of 33 Ω± 1 % on pins DP and DM.

[3] This voltage is available at pin VREG.

[4] The minimum voltage is 2.7 V in suspend mode.

11. Dynamic characteristics

Resistance

ZDRV driver output impedance steady-state drive [2] 34 39 44 Ω

ZINP input impedance 10 - - MΩ

RPU(DP) pull-up resistance on pin DP bus idle 900 - 1575 Ω

bus active 1425 - 3090 Ω

Termination

VTERM termination voltage for upstream port pull-up

(RPU(DP))[3][4] 3.0 - 3.6 V

Table 12. Static characteristics: analog I/O pins DP and DM

…continued

CC(5V0)

= 4.0 V to 5.5 V; V

CC(UART)

= 2.7 V to 4.5 V; V

CC(I/O)

= 1.65 V to 2.85 V; T

amb

−

C to +85

Typical values are at V

CC(5V0)

= 5.0 V; V

CC(UART)

= 2.8 V; V

CC(I/O)

= 1.8 V; T

amb

= +25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 13. Dynamic characteristics: analog I/O pins DP and DM

CC(5V0)

= 4.0 V to 5.5 V; V

CC(UART)

= 2.7 V to 4.5 V; V

CC(I/O)

= 1.65 V to 2.85 V; T

amb

−

C to +85

Typical values are at V

CC(5V0)

= 5.0 V; V

CC(UART)

= 2.8 V; V

CC(I/O)

= 1.8 V; T

amb

= +25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Driver characteristics (UART mode)

tLR transition time: rise time CL< 250 pF; 10 % to 90 % of

|VOH − VOL|; see Figure 5 [1] 50 - 200 ns

tLF transition time: fall time CL< 250 pF; 90 % to 10 % of

|VOH − VOL|; see Figure 5 [1] 50 - 200 ns

Driver characteristics (USB mode)

tFR rise time CL= 50 pF to 125 pF; 10 % to

90 % of |VOH − VOL|; see Figure 5 4 - 20 ns

tFF fall time CL= 50 pF to 125 pF; 90 % to

10 % of |VOH − VOL|; see Figure 5 4 - 20 ns

FRFM differential rise time/fall

time matching excluding the ﬁrst transition from

Idle state [2] 90 - 111.1 %

VCRS output signal crossover

voltage excluding the ﬁrst transition from

Idle state; see Figure 6 [3] 1.3 - 2.0 V

Driver timing

tPLH(drv) driver propagation delay

(LOW to HIGH) VPO, VMO to DP, DM; see

Figure 6 and Figure 9 --18ns

tPHL(drv) driver propagation delay

(HIGH to LOW) VPO, VMO to DP, DM; see

Figure 6 and Figure 9 --18ns

tPHZ driver disable delay from

HIGH level OE_N to DP, DM; see Figure 7

and Figure 10 --15ns

tPLZ driver disable delay from

LOW level OE_N to DP, DM; see Figure 7

and Figure 10 --15ns

Product data sheet Rev. 02 — 19 March 2007 15 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

[1] For UART TXD on pin DM.

[2] tFR / tFF.

[3] Characterized only, not tested. Limits guaranteed by design.

tPZH driver enable delay to

HIGH level OE_N to DP, DM; see Figure 7

and Figure 10 --15ns

tPZL driver enable delay to LOW

level OE_N to DP, DM; see Figure 7

and Figure 10 --15ns

Receiver timings

Differential receiver

tPLH(rcv) receiver propagation delay

(LOW to HIGH) DP, DM to RCV; see Figure 8 and

Figure 11 --15ns

tPHL(rcv) receiver propagation delay

(HIGH to LOW) DP, DM to RCV; see Figure 8 and

Figure 11 --15ns

Single-ended receiver

tPLH(se) single-ended propagation

delay (LOW to HIGH) DP, DM to VP/VPO, VM/VMO;

see Figure 8 and Figure 11 --18ns

tPHL(se) single-ended propagation

delay (HIGH to LOW) DP, DM to VP/VPO, VM/VMO;

see Figure 8 and Figure 11 --18ns

Table 13. Dynamic characteristics: analog I/O pins DP and DM

…continued

CC(5V0)

= 4.0 V to 5.5 V; V

CC(UART)

= 2.7 V to 4.5 V; V

CC(I/O)

= 1.65 V to 2.85 V; T

amb

−

C to +85

Typical values are at V

CC(5V0)

= 5.0 V; V

CC(UART)

= 2.8 V; V

CC(I/O)

= 1.8 V; T

amb

= +25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Fig 5. Rise time and fall time Fig 6. Timing of VPO and VMO to DP and DM

Fig 7. Timing of OE_N to DP and DM Fig 8. Timing of DP and DM to RCV, VP/VPO and

VM/VMO

004aaa572

VOL

tFR, tLR tFF, tLF

VOH 90 %

10 % 10 %

90 %

004aaa573

VOL

VOH

tPHL(drv)

tPLH(drv)

VCRS VCRS

0.9 V

1.8 V

0 V

logic input

differential

data lines

004aaa574

VOL

VOH

tPZH

tPZL tPHZ

tPLZ

VOH − 0.3 V

VOL + 0.3 V

VCRS

0.9 V

1.8 V

0 V

logic

input

differential

data lines

tPLH(se) tPHL(se)

004aaa575

VOL

VOH

tPHL(rcv)

tPLH(rcv)

VCRS VCRS

0.9 V

2.0 V

0.8 V

logic output

differential

data lines

Product data sheet Rev. 02 — 19 March 2007 16 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

12. Test information

Load capacitance CL= 50 pF (minimum or maximum timing)

Fig 9. Load on pins DP and DM

V = 0 V for tPZH and tPHZ

V = VREG for tPZL and tPLZ

Fig 10. Load on pins DP and DM for enable time and disable time

Fig 11. Load on pins VM/VMO, VP/VPO and RCV

004aaa680

test point

15 kΩ

DP or DM

33 Ω

D.U.T.

33 Ω

D.U.T. 500 Ω

50 pF

004aaa517

DP or

test point

004aaa709

25 pF

test point

D.U.T.

Product data sheet Rev. 02 — 19 March 2007 17 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

13. Package outline

Fig 12. Package outline SOT639-2 (HBCC16)

2.5

A1bA2

UNIT DEhe1

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

01-11-13

03-03-12

IEC JEDEC JEITA

mm 0.8 0.10

0.05 0.7

0.6 3.1

2.9 1.45

1.35

3.1

2.9

1.45

1.35

0.33

0.27

DIMENSIONS (mm are the original dimensions)

SOT639-2 MO-217

0.33

0.27

0.38

0.32

0.38

0.32

2.45

0.23

0.17

0.5

we yy

0.1 0.05 0.2

2.5

2.45

0.08

0 2.5 5 mm

scale

SOT639-2

HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm

max.

detail X

y1C

113

1/2 e3

1/2 e4

terminal 1

index area

Product data sheet Rev. 02 — 19 March 2007 18 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

14. Packing information

The ISP1110VH (HBCC16 package) is delivered on a Type A carrier tape, see Figure 13.

The tape dimensions are given in Table 14.

The reel diameter is 330 mm. The reel is made of polystyrene and is not designed for use

in a baking process.

The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber must

not exceed 1 mm in 100 mm.

15. Soldering

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note

AN10365 “Surface mount reﬂow

soldering description”

Fig 13. Carrier tape dimensions

Table 14. Type A carrier tape dimensions for the ISP1110VH

Dimension Value Unit

A0 3.3 mm

B0 3.3 mm

K0 1.1 mm

P1 8.0 mm

W 12.0 ± 0.3 mm

004aaa728

type B

type A

4K0

elongated

sprocket hole

direction of feed

Product data sheet Rev. 02 — 19 March 2007 19 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

15.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

15.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

•Board speciﬁcations, including the board ﬁnish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus PbSn soldering

15.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath speciﬁcations, including temperature and impurities

15.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

•Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 14) than a PbSn process, thus

reducing the process window

Product data sheet Rev. 02 — 19 March 2007 20 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 15 and 16

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 14.

Table 15. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 16. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

MSL: Moisture Sensitivity Level

Fig 14. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 02 — 19 March 2007 21 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”

16. Abbreviations

17. References

[1] Universal Serial Bus Speciﬁcation Rev. 2.0

[2] ECN_27%_Resistor (Pull-up/pull-down Resistors ECN)

18. Revision history

Table 17. Abbreviations

Acronym Description

ASIC Application Speciﬁc Integrated Circuits

ATX Analog USB Transceiver

CMOS Complementary Metal-Oxide Semiconductor

HBM Human Body Model

PDA Personal Digital Assistant

RXD Receive Data

SE0 Single-Ended Zero

TXD Transmit Data

UART Universal Asynchronous Receiver-Transmitter

USB Universal Serial Bus

Table 18. Revision history

Document ID Release date Data sheet status Change notice Supersedes

ISP1110_2 20070319 Product data sheet - ISP1110_1

Modiﬁcations: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Table 2 “Pin description”: updated description for pin 6.

•Section 7.1 “Modes of operation”: updated Table 3 and added Table 4.

•Section 7.1.1 “USB mode”: updated third paragraph.

•Section 7.1.2 “UART mode”: updated fourth paragraph.

•Table 9 “Recommended operating conditions”: added Tj.

ISP1110_1 20060323 Product data sheet - -

Product data sheet Rev. 02 — 19 March 2007 22 of 25

NXP Semiconductors ISP1110

USB transceiver with UART signaling

19. Legal information

19.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

19.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

19.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of a NXP Semiconductors product can reasonably be expected to

result in personal injury, death or severe property or environmental damage.

NXP Semiconductors accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or applications and therefore

such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

19.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

20. Contact information

For additional information, please visit: http://www.nxp.com

For sales ofﬁce addresses, send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

Product data sheet Rev. 02 — 19 March 2007 23 of 25

continued >>

NXP Semiconductors ISP1110

USB transceiver with UART signaling

21. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2

Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4

Table 3. Operating modes: deﬁnition . . . . . . . . . . . . . . . .6

Table 4. Pin status in various modes . . . . . . . . . . . . . . . .6

Table 5. USB function . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Table 6. USB driving function (pin OE_N = LOW) . . . . . .9

Table 7. USB receiving function (pin OE_N = HIGH) . . .9

Table 8. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .11

Table 9. Recommended operating conditions . . . . . . . .11

Table 10. Static characteristics: supply pins . . . . . . . . . .11

Table 11. Static characteristics: digital pins . . . . . . . . . . .12

Table 12. Static characteristics: analog I/O pins

DP and DM . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Table 13. Dynamic characteristics: analog I/O pins

DP and DM . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Table 14. Type A carrier tape dimensions for the

ISP1110VH . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Table 15. SnPb eutectic process (from J-STD-020C) . . .20

Table 16. Lead-free process (from J-STD-020C) . . . . . .20

Table 17. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .21

Table 18. Revision history . . . . . . . . . . . . . . . . . . . . . . . .21

Product data sheet Rev. 02 — 19 March 2007 24 of 25

continued >>

NXP Semiconductors ISP1110

USB transceiver with UART signaling

22. Figures

Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

Fig 2. Pin conﬁguration HBCC16; top view . . . . . . . . . . .3

Fig 3. Pin conﬁguration HBCC16; bottom view . . . . . . . .3

Fig 4. ISP1110 mode detection ﬂowchart . . . . . . . . . . . .8

Fig 5. Rise time and fall time . . . . . . . . . . . . . . . . . . . . .15

Fig 6. Timing of VPO and VMO to DP and DM . . . . . . .15

Fig 7. Timing of OE_N to DP and DM . . . . . . . . . . . . . .15

Fig 8. Timing of DP and DM to RCV, VP/VPO and

VM/VMO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Fig 9. Load on pins DP and DM. . . . . . . . . . . . . . . . . . .16

Fig 10. Load on pins DP and DM for enable time and

disable time . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Fig 11. Load on pins VM/VMO, VP/VPO and RCV . . . . .16

Fig 12. Package outline SOT639-2 (HBCC16). . . . . . . . .17

Fig 13. Carrier tape dimensions. . . . . . . . . . . . . . . . . . . .18

Fig 14. Temperature proﬁles for large and small

components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

NXP Semiconductors ISP1110

USB transceiver with UART signaling

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 19 March 2007

Document identifier: ISP1110_2

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

23. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 6

7.1 Modes of operation. . . . . . . . . . . . . . . . . . . . . . 6

7.1.1 USB mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.1.2 UART mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.1.3 Mode detection ﬂowchart . . . . . . . . . . . . . . . . . 8

7.1.4 Mode switching time. . . . . . . . . . . . . . . . . . . . . 8

7.2 Analog USB Transceiver (ATX). . . . . . . . . . . . . 9

7.3 VBUS detector . . . . . . . . . . . . . . . . . . . . . . . . . 10

7.4 DP pull-up resistor . . . . . . . . . . . . . . . . . . . . . 10

7.5 DC-DC regulator. . . . . . . . . . . . . . . . . . . . . . . 10

7.6 Power selector . . . . . . . . . . . . . . . . . . . . . . . . 10

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11

9 Recommended operating conditions. . . . . . . 11

10 Static characteristics. . . . . . . . . . . . . . . . . . . . 11

11 Dynamic characteristics . . . . . . . . . . . . . . . . . 14

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 16

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17

14 Packing information. . . . . . . . . . . . . . . . . . . . . 18

15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 19

15.2 Wave and reﬂow soldering . . . . . . . . . . . . . . . 19

15.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 19

15.4 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 19

16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 21

17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21

19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22

19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22

19.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 22

19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22

20 Contact information. . . . . . . . . . . . . . . . . . . . . 22

21 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

22 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

23 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25