LM4880 www.ti.com SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 LM4880 Dual 250 mW Audio Power Amplifier with Shutdown Mode Check for Samples: LM4880 FEATURES DESCRIPTION * The LM4880 is a dual audio power amplifier capable of delivering typically 250mW per channel of continuous average power to an 8 load with 0.1% THD+N using a 5V power supply. 1 2 * * * No Bootstrap Capacitors or Snubber Circuits are Necessary Small Outline (SOIC) and PDIP Packaging Unity-Gain Stable External Gain Configuration Capability APPLICATIONS Boomer audio power amplifiers were designed specifically to provide high quality output power with a minimal amount of external components using surface mount packaging. * * * Headphone Amplifier Personal Computers CD-ROM Players Since the LM4880 does not require bootstrap capacitors or snubber networks, it is optimally suited for low-power portable systems. KEY SPECIFICATIONS The LM4880 features an externally controlled, lowpower consumption shutdown mode, as well as an internal thermal shutdown protection mechanism. * * * * * THD+N at 1kHz at 200mW Continuous Average Output Power into 8: 0.1% (max) THD+N at 1kHz at 85mW Continuous Average Output Power into 32: 0.1% (typ) Output Power at 10% THD+N at 1kHz into 8 325 mW (typ) Shutdown Current 0.7 A (typ) 2.7V to 5.5V Supply Voltage Range The unity-gain stable LM4880 can be configured by external gain-setting resistors. Connection Diagram Figure 1. Small Outline and PDIP Packages- Top View See Package Number D0008A for SOIC or Package Number P0008E for PDIP 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1995-2013, Texas Instruments Incorporated LM4880 SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 www.ti.com Typical Application *Refer to Application Information for information concerning proper selection of the input and output coupling capacitors. Figure 2. Typical Audio Amplifier Application Circuit These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 6.0V -65C to +150C Storage Temperature -0.3V to VDD + 0.3V Input Voltage Power Dissipation (3) Internally limited ESD Susceptibility (4) 2000V ESD Susceptibility (5) 200V Junction Temperature Soldering Information 150C Small Outline Package Vapor Phase (60 sec.) Infrared (15 sec.) Thermal Resistance (1) (2) (3) (4) (5) 2 215C 220C JC (PDIP) 37C/W JA (PDIP) 107C/W JC (SOIC) 35C/W JA (SOIC) 170C/W Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication of device performance. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, JA, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX = (TJMAX - TA)/JA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4880, TJMAX = 150C, and the typical junction-to-ambient thermal resistance is 170C/W for package D0008A and 107C/W for package P0008E. Human body model, 100 pF discharged through a 1.5 k resistor. Machine model, 220 pF-240 pF discharged through all pins. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 LM4880 www.ti.com SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 Operating Ratings TMINTATMAX Temperature Range -40CTA+85C 2.7VVDD5.5V Supply Voltage Electrical Characteristics (1) (2) The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA = 25C. Symbol Parameter Conditions LM4880 Typical (3) Limit Units (Limits) (4) VDD Supply Voltage 2.7 V (min) 5.5 V (max) IDD Quiescent Power Supply Current VIN=0V, IO=0A 3.6 6.0 mA (max) ISD Shutdown Current VPIN5=VDD 0.7 5 A (max) VOS Output Offset Voltage VIN=0V 5 50 mV (max) PO Output Power THD=0.1% (max); f=1 kHz; RL=8 250 200 mW (min) RL=32 85 mW RL=8 325 mW RL=32 110 mW RL=8, PO=200 mW; 0.03 % RL=32, PO=75 mW; 0.02 % 50 dB THD+N=10%; f=1 kHz THD+N Total Harmonic Distortion+Noise f=1 kHz PSRR (1) (2) (3) (4) CB = 1.0 F, VRIPPLE=200 mVrms, f = 100 Hz Power Supply Rejection Ratio All voltages are measured with respect to the ground pin, unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication of device performance. Typicals are measured at 25C and represent the parametric norm. Limits are ensured to TI's AOQL (Average Outgoing Quality Level). Automatic Shutdown Circuit Figure 3. Automatic Shutdown Circuit Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 3 LM4880 SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 www.ti.com Automatic Switching Circuit Figure 4. Automatic Switching Circuit External Components Description (Figure 2) Components Functional Description 1. Ri Inverting input resistance which sets the closed-loop gain in conjunction with RF. This resistor also forms a high pass filter with Ci at fc = 1/(2RiCi). 2. Ci Input coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a high pass filter with Ri at fc = 1/(2RiCi). Refer to PROPER SELECTION OF EXTERNAL COMPONENTS for an explanation of how to determine the value of Ci. 3. RF Feedback resistance which sets closed-loop gain in conjunction with Ri. 4. CS Supply bypass capacitor which provides power supply filtering. Refer to Application Information for proper placement and selection of the supply bypass capacitor. 5. CB Bypass pin capacitor which provides half-supply filtering. Refer to PROPER SELECTION OF EXTERNAL COMPONENTS for information concerning proper placement and selection of CB. 6. Co Output coupling capacitor which blocks the DC voltage at the amplifier's output. Forms a high pass filter with RL at fo = 1/(2RLCo). 4 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 LM4880 www.ti.com SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 Typical Performance Characteristics THD + N vs Output Power THD + N vs Output Power Figure 5. Figure 6. THD + N vs Output Power THD + N vs Output Power Figure 7. Figure 8. THD + N vs Output Power THD + N vs Output Power Figure 9. Figure 10. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 5 LM4880 SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) 6 THD + N vs Frequency THD + N vs Frequency Figure 11. Figure 12. THD + N vs Frequency THD + N vs Frequency Figure 13. Figure 14. Output Power vs Load Resistance Output Power vs Load Resistance Figure 15. Figure 16. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 LM4880 www.ti.com SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 Typical Performance Characteristics (continued) Output Power vs Supply Voltage Output Power vs Supply Voltage Figure 17. Figure 18. Output Power vs Supply Voltage Clipping Voltage vs Supply Voltage Figure 19. Figure 20. Clipping Voltage vs Supply Voltage Power Dissipation vs Output Power Figure 21. Figure 22. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 7 LM4880 SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) 8 Channel Separation Output Attenuation in Shutdown Mode Figure 23. Figure 24. Noise Floor Power Supply Rejection Ratio Figure 25. Figure 26. Open Loop Frequency Response Supply Current vs Supply Voltage Figure 27. Figure 28. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 LM4880 www.ti.com SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 Typical Performance Characteristics (continued) Frequency Response vs Output Capacitor Size Frequency Response vs Output Capacitor Size Figure 29. Figure 30. Frequency Response vs Input Capacitor Size Typical Application Frequency Response Figure 31. Figure 32. Typical Application Frequency Response Power Derating Curve Figure 33. Figure 34. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 9 LM4880 SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 www.ti.com APPLICATION INFORMATION SHUTDOWN FUNCTION In order to reduce power consumption while not in use, the LM4880 contains a shutdown pin to externally turn off the amplifier's bias circuitry. This shutdown feature turns the amplifier off when a logic high is placed on the shutdown pin. The trigger point between a logic low and logic high level is typically half supply. It is best to switch between ground and the supply to provide maximum device performance. By switching the shutdown pin to VDD, the LM4880 supply current draw will be minimized in idle mode. While the device will be disabled with shutdown pin voltages less than VDD, the idle current may be greater than the typical value of 0.7 A. In either case, the shutdown pin should be tied to a definite voltage because leaving the pin floating may result in an unwanted shutdown condition. In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry which provides a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in conjunction with an external pull-up resistor. When the switch is closed, the shutdown pin is connected to ground and enables the amplifier. If the switch is open, then the external pull-up resistor will disable the LM4880. This scheme ensures that the shutdown pin will not float which will prevent unwanted state changes. POWER DISSIPATION Power dissipation is a major concern when using any power amplifier and must be thoroughly understood to ensure a successful design. Equation 1 states the maximum power dissipation point for a single-ended amplifier operating at a given supply voltage and driving a specified output load. PDMAX = (VDD)2/(22RL) (1) Since the LM4880 has two operational amplifiers in one package, the maximum internal power dissipation point is twice that of the number which results from Equation 1. Even with the large internal power dissipation, the LM4880 does not require heat sinking over a large range of ambient temperatures. From Equation 1, assuming a 5V power supply and an 8 load, the maximum power dissipation point is 158 mW per amplifier. Thus the maximum package dissipation point is 317 mW. The maximum power dissipation point obtained must not be greater than the power dissipation that results from Equation 2: PDMAX = (TJMAX-TA)/JA (2) For the LM4880 surface mount package, JA = 170 C/W and TJMAX = 150C. Depending on the ambient temperature, TA, of the system surroundings, Equation 2 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 1 is greater than that of Equation 2, then either the supply voltage must be decreased, the load impedance increased, or the ambient temperature reduced. For the typical application of a 5V power supply, with an 8 load, the maximum ambient temperature possible without violating the maximum junction temperature is approximately 96C provided that device operation is around the maximum power dissipation point. Power dissipation is a function of output power and thus, if typical operation is not around the maximum power dissipation point, the ambient temperature may be increased accordingly. Refer to Typical Performance Characteristics for power dissipation information for lower output powers. POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as possible. As displayed in Typical Performance Characteristics, the effect of a larger half supply bypass capacitor is improved low frequency PSRR due to increased half-supply stability. Typical applications employ a 5V regulator with 10 F and a 0.1 F bypass capacitors which aid in supply stability, but do not eliminate the need for bypassing the supply nodes of the LM4880. The selection of bypass capacitors, especially CB, is thus dependant upon desired low frequency PSRR, click and pop performance as explained in PROPER SELECTION OF EXTERNAL COMPONENTS, system cost, and size constraints. 10 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 LM4880 www.ti.com SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 AUTOMATIC SHUTDOWN CIRCUIT As shown in Figure 3, the LM4880 can be set up to automatically shutdown when a load is not connected. This circuit is based upon a single control pin common in many headphone jacks. This control pin forms a normally closed switch with one of the output pins. The output of this circuit (the voltage on pin 5 of the LM4880) has two states based on the state of the switch. When the switch is open, signifying that headphones are inserted, the LM4880 should be enabled. When the switch is closed, the LM4880 should be off to minimize power consumption. The operation of this circuit is rather simple. With the switch closed, Rp and Ro form a resistor divider which produces a gate voltage of less than 5 mV. This gate voltage keeps the NMOS inverter off and Rsd pulls the shutdown pin of the LM4880 to the supply voltage. This places the LM4880 in shutdown mode which reduces the supply current to 0.7 A typically. When the switch is open, the opposite condition is produced. Resistor Rp pulls the gate of the NMOS high which turns on the inverter and produces a logic low signal on the shutdown pin of the LM4880. This state enables the LM4880 and places the amplifier in its normal mode of operation. This type of circuit is clearly valuable in portable products where battery life is critical, but is also beneficial for power conscious designs such as "Green PC's". AUTOMATIC SWITCHING CIRCUIT A circuit closely related to Automatic Shutdown Circuit is Automatic Switching Circuit. Automatic Switching Circuit utilizes both the input and output of the NMOS inverter to toggle the states of two different audio power amplifiers. The LM4880 is used to drive stereo single ended loads, while the LM4861 drives bridged internal speakers. In this application, the LM4880 and LM4861 are never on at the same time. When the switch inside the headphone jack is open, the LM4880 is enabled and the LM4861 is disabled since the NMOS inverter is on. If a headphone jack is not present, it is assumed that the internal speakers should be on and thus the voltage on the LM4861 shutdown pin is low and the voltage at the LM4880 pin is high. This results in the LM4880 being shutdown and the LM4861 being enabled. Only one channel of this circuit is shown in Figure 4 to keep the drawing simple but the typical application would a LM4880 driving a stereo external headphone jack and two LM4861's driving the internal stereo speakers. If only one internal speaker is required, a single LM4861 can be used as a summer to mix the left and right inputs into a single mono channel. PROPER SELECTION OF EXTERNAL COMPONENTS Selection of external components when using integrated power amplifiers is critical to optimize device and system performance. While the LM4880 is tolerant of external component combinations, care must be exercised when choosing component values. The LM4880 is unity-gain stable which gives a designer maximum system flexibility. The LM4880 should be used in low gain configurations to minimize THD + N values, and maximize the signal to noise ratio. Low gain configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1 Vrms are available from sources such as audio codecs. Please refer to AUDIO POWER AMPLIFIER DESIGN for a more complete explanation of proper gain selection. Besides gain, one of the major design considerations is the closed-loop bandwidth of the amplifier. To a large extent, the bandwidth is dictated by the choice of external components shown in Figure 2. Both the input coupling capacitor, Ci, and the output coupling capacitor, Co, form first order high pass filters which limit low frequency response. These values should be chosen based on needed frequency response for a few distinct reasons. Selection of Input and Output Capacitor Size Large input and output capacitors are both expensive and space hungry for portable designs. Clearly a certain sized capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the transducers used in portable systems, whether internal or external, have little ability to reproduce signals below 100 Hz-150 Hz. Thus using large input and output capacitors may not increase system performance. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 11 LM4880 SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 www.ti.com In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (normally 1/2 VDD.) This charge comes from the output via the feedback and is apt to create pops upon device enable. Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be minimized. Besides minimizing the input and output capacitor sizes, careful consideration should be paid to the bypass capacitor size. The bypass capacitor, CB, is the most critical component to minimize turn-on pops since it determines how fast the LM4880 turns on. The slower the LM4880's outputs ramp to their quiescent DC voltage (nominally 1/2 VDD), the smaller the turn-on pop. Choosing CB equal to 1.0 F along with a small value of Ci (in the range of 0.1 F to 0.39 F), should produce a virtually clickless and popless shutdown function. While the device will function properly, (no oscillations or motorboating), with CB equal to 0.1 F, the device will be much more susceptible to turn-on clicks and pops. Thus, a value of CB equal to 1.0 F or larger is recommended in all but the most cost sensitive designs. AUDIO POWER AMPLIFIER DESIGN Design a Dual 200 mW/8 Audio Amplifier Given: Power Output: 200 mWrms Load Impedance: 8 Input Level: 1 Vrms (max) Input Impedance: 20 k Bandwidth: 100 Hz-20 kHz 0.50 dB A designer must first determine the needed supply rail to obtain the specified output power. Calculating the required supply rail involves knowing two parameters, Vopeak and also the dropout voltage. As shown in Typical Performance Characteristics, the dropout voltage is typically 0.5V. Vopeak can be determined from Equation 3. (3) For 200 mW of output power into an 8 load, the required Vopeak is 1.79V. Since this is a single supply application, the minimum supply voltage is twice the sum of Vopeak and Vod. Since 5V is a standard supply voltage in most applications, it is chosen for the supply rail. Extra supply voltage creates headroom that allows the LM4880 to reproduce peaks in excess of 200 mW without clipping the signal. At this time, the designer must make sure that the power supply choice along with the output impedance does not violate the conditions explained in POWER DISSIPATION. Remember that the maximum power dissipation value from Equation 1 must be multiplied by two since there are two independent amplifiers inside the package. Once the power dissipation equations have been addressed, the required gain can be determined from Equation 4. (4) (5) AV = -RF/Ri From Equation 4, the minimum gain is: AV = -1.26 Since the desired input impedance was 20 k, and with a gain of -1.26, a value of 27 k is designated for Rf, assuming 5% tolerance resistors. This combination results in a nominal gain of -1.35. The final design step is to address the bandwidth requirements which must be stated as a pair of -3 dB frequency points. Five times away from a -3 dB point is 0.17 dB down from passband response assuming a single pole roll-off. As stated in External Components Description, both Ri in conjunction with Ci, and Co with RL, create first order high pass filters. Thus to obtain the desired frequency low response of 100 Hz within 0.5 dB, both poles must be taken into consideration. The combination of two single order filters at the same frequency forms a second order response. This results in a signal which is down 0.34 dB at five times away from the single order filter -3 dB point. Thus, a frequency of 20 Hz is used in the following equations to ensure that the response if better than 0.5 dB down at 100 Hz. Ci 1/(2*20k*20Hz) = 0.397 F; use 0.39 F 12 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 LM4880 www.ti.com SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 Co 1/(2*8*20Hz) = 995 F; use 1000 F The high frequency pole is determined by the product of the desired high frequency pole, fH, and the closed-loop gain, AV. With a closed-loop gain magnitude of 1.35 and fH = 100 kHz, the resulting GBWP = 135 kHz which is much smaller than the LM4880 GBWP of 12.5 MHz. This figure displays that if a designer has a need top design an amplifier with a higher gain, the LM4880 can still be used without running into bandwidth limitations. LM4880 MDA MWA DUAL 250 MW AUDIO POWER AMPLIFIER WITH SHUTDOWN MODE Figure 35. Die Layout (B - Step) Table 1. Die/Wafer Characteristics Fabrication Attributes General Die Information Physical Die Identification LM4880B Bond Pad Opening Size (min) 86m x 86m Die Step B Bond Pad Metalization ALUMINUM Passivation NITRIDE Physical Attributes Wafer Diameter 150mm Back Side Metal Bare Back Dise Size (Drawn) 952m x 1283m 37mils x 51mils Back Side Connection GND Thickness 254m Nominal Min Pitch 117m Nominal Special Assembly Requirements: Note: Actual die size is rounded to the nearest micron. Die Bond Pad Coordinate Locations (B - Step) (Referenced to die center, coordinates in m) NC = No Connection SIGNAL NAME PAD# NUMBER X/Y COORDINATES PAD SIZE X Y X BYPASS 1 -322 523 86 x 86 Y GND 2 -359 259 86 x 188 NC 3 -359 5 86 x 86 GND 4 -359 -259 86 x 188 SHUTDOWN 5 -323 -523 86 x 86 INPUT B 6 -109 -523 86 x 86 OUTPUT B 7 8 -523 86 x 86 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 13 LM4880 SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 www.ti.com VDD 8 358 -78 86 x 188 GND 9 358 141 86 x 188 OUTPUT A 10 359 406 86 x 86 INPUT A 11 323 523 86 x 86 NC 12 8 523 86 x 86 NC 13 -109 523 86 x 86 14 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 LM4880 www.ti.com SNAS103C - NOVEMBER 1995 - REVISED MAY 2013 REVISION HISTORY Changes from Revision B (May 2013) to Revision C * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 14 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM4880 15 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM4880M ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM 4880M LM4880M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LM 4880M LM4880MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LM 4880M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM4880MX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM4880MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI's products are provided subject to TI's Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI's provision of these resources does not expand or otherwise alter TI's applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2020, Texas Instruments Incorporated