SFH 4232
1Version 1.5 | 2019-07-16
Discontinued
Produktdatenblatt | Version 1.1
www.osram-os.com
Applications
SFH 4232
Platinum DRAGON®
High Power Infrared Emitter (850 nm)
—3D Sensing
—CCTV Surveillance
—Safety and Security, CCTV
—VMS
Features:
—Package: clear silicone
—Corrosion Robustness Class: 3B
—Qualications: The product qualication test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Qualication for Automotive Grade Discrete Semiconductors.
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—IR lightsource with high eciency
—Low thermal resistance (Max. 9 K/W)
—Centroid wavelength 850 nm
—SMT package
Ordering Information
Type Total radiant ux 1) Total radiant ux 1) Ordering Code
typ.
IF = 1000 mA; tp = 10 ms IF = 1000 mA; tp = 10 ms
Φ
e
Φ
e
SFH 4232-Z 320 ... 800 mW 530 mW Q65110A8754
SFH 4232
2Version 1.5 | 2019-07-16
Discontinued
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating temperature Top min.
max.
-40 °C
125 °C
Storage temperature Tstg min.
max.
-40 °C
125 °C
Junction temperature Tjmax. 145 °C
Forward current IFmax. 1000 mA
Surge current
tp ≤ 200 µs; D = 0
IFSM max. 5 A
Reverse current 2) IRmax. 200 mA
Power consumption Ptot max. 1800 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
SFH 4232
3Version 1.5 | 2019-07-16
Discontinued
Characteristics
IF = 1000 mA; tp = 10 ms; TA = 25 °C
Parameter Symbol Values
Peak wavelength λpeak typ. 860 nm
Centroid wavelength λcentroid typ. 850 nm
Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 30 nm
Half angle φtyp. 60 °
Dimensions of active chip area L x W typ. 1 x 1
mm x mm
Rise time (10% / 90%)
IF = 5 A; RL = 50 Ω
trtyp. 7 ns
Fall time (10% / 90%)
IF = 5 A; RL = 50 Ω
tftyp. 14 ns
Forward voltage
IF = 1 A; tp = 100 µs
VFtyp.
max.
1.5 V
1.8 V
Forward voltage
IF = 5 A; tp = 100 µs
VFtyp.
max.
2 V
2.9 V
Reverse voltage 2)
IR = 20 mA
VRmax. 1.2 V
Reverse voltage (ESD device) 2) VR ESD min. 45 V
Radiant intensity 3)
IF = 1 A; tp = 100 µs
Ietyp. 180 mW/sr
Temperature coecient of voltage TCVtyp. -1 mV / K
Temperature coecient of brightness TCItyp. -0.3 % / K
Temperature coecient of wavelength TCλtyp. 0.3 nm / K
Thermal resistance junction solder point real 4) RthJS max. 9.0 K / W
SFH 4232
4Version 1.5 | 2019-07-16
Discontinued
Brightness Groups
TA = 25 °C
Group Total radiant ux 1) Total radiant ux 1)
IF = 1000 mA; tp = 10 ms IF = 1000 mA; tp = 10 ms
min. max.
Φ
e
Φ
e
CB 320 mW 500 mW
DA 400 mW 630 mW
DB 500 mW 800 mW
Only one group in one packing unit (variation lower 1.6:1)
Relative Spectral Emission 5), 6)
Ie,rel = f (λ); IF = 1000 mA; tp = 10 ms
700
0nm
%
OHF04132
20
40
60
80
100
950750 800 850
I
rel
λ
SFH 4232
5Version 1.5 | 2019-07-16
Discontinued
Radiation Characteristics 5), 6)
Ie,rel = f (φ)
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Forward current 5), 6)
IF = f (VF); single pulse; tp = 100 µs
OHF03847
V
F
0
10
10
1
10
-1
10
-2
F
I
A
0V
0.5 1 1.5 2 2.5
Relative Total Radiant Flux 5), 6)
Φe/Φe(1000mA) = f (IF); single pulse; tp = 100 µs
OHF03848
10
-3
A
10
1
0
10
5
5
10
-1
-2
5
10
I
F
10 10
0
10
1
1055
-2 -1
Φ
(1 A)
Φe
e
SFH 4232
6Version 1.5 | 2019-07-16
Discontinued
Max. Permissible Forward Current
IF,max = f (TS); Rthjs = 9K / Wsingle pulse
0
0˚C
T
I
F
A
OHF04369
S
20 40 60 80 100 130
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
Permissible Pulse Handling Capability
IF = f (tp); duty cycle D = parameter; TS = 85°C
0
-5
F
I
A
t
p
s
OHF04177
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
1010
P
t
=
DT
T
t
P
I
F
0.01
0.33
0.5
0.2
0.1
0.02
D
0.005
=
0.05
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
1
SFH 4232
7Version 1.5 | 2019-07-16
Discontinued
Dimensional Drawing 7)
Further Information
Approximate Weight: 219.0 mg
Package marking: Cathode
Corrosion test: Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)
ESD advice: The device is protected by ESD device which is connected in parallel to the
Chip.
SFH 4232
8Version 1.5 | 2019-07-16
Discontinued
Recommended Solder Pad 7)
Solder resist
Freies Kupfer
Bare Copper
Lötpasten Schablone
Solder paste stencil
Lötstopplack
OHAY0681
0.3 (0.012)
Kupfer
Copper
1.6 (0.063)
11.6 (0.457)
12.0 (0.472)
2.3 (0.091)
2.3 (0.091)
10 (0.394)
1.6 (0.063)
11.6 (0.457)
3 Lötstellen
3 solder points
Thermal enhanced PCB
Thermisch optimiertes PCB
ø4.0 (0.157)
Heatsink attach
ø4.0 (0.157)
ø2.5 (0.098)
Anode and heatsink are electrically connected.
SFH 4232
9Version 1.5 | 2019-07-16
Discontinued
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Prole Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the specied peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulllment for the whole T-range
SFH 4232
11 Version 1.5 | 2019-07-16
Discontinued
Tape and Reel 8)
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel Dimensions
A W Nmin W1W2 max Pieces per PU
180 mm 24 + 0.3 / - 0.1 mm 60/100 mm 24.4 + 2 mm 30.4 mm 800
SFH 4232
12 Version 1.5 | 2019-07-16
Discontinued
Barcode-Product-Label (BPL)
Dry Packing Process and Materials 7)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
SFH 4232
13 Version 1.5 | 2019-07-16
Discontinued
Schematic Transportation Box 7)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of Transportation Box
Width Length Height
195 ± 5 mm 195 ± 5 mm 42 ± 5 mm
SFH 4232
14 Version 1.5 | 2019-07-16
Discontinued
Notes
Depending on the mode of operation, these devices emit highly concentrated visible and non visible light
which can be hazardous to the human eye. Products which incorporate these devices have to follow the
safety precautions given in IEC 60825-1.
Subcomponents of this device contain, in addition to other substances, metal lled materials including silver.
Metal lled materials can be aected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
SFH 4232
15 Version 1.5 | 2019-07-16
Discontinued
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please nd the latest version on the OSRAM OS website.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales oce. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualied at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specic request between OSRAM OS and buyer and/or customer.
SFH 4232
16 Version 1.5 | 2019-07-16
Discontinued
Glossary
1) Total radiant ux: Measured with integrating sphere.
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr
4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)
5) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reect statistical gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
6) Testing temperature: TA = 25°C (unless otherwise specied)
7) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specied with ±0.1 and
dimensions are specied in mm.
8) Tape and Reel: All dimensions and tolerances are specied acc. IEC 60286-3 and specied in mm.
SFH 4232
17 Version 1.5 | 2019-07-16
Discontinued
Revision History
Version Date Change
1.5 2019-07-15 Discontinued
SFH 4232
18 Version 1.5 | 2019-07-16
Discontinued
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
