Small Surface-Mount Rectifiers US-FLAT TM, S-FLAT TM and M-FLAT TM Series Today's mobile and office automation equipment is becoming ever smaller and slimmer. In response to this market trend, Toshiba have developed an ultra-small surface-mount US-FLAT, S-FLAT, M-FLAT Series rectifier which allows high-density mounting. US-FLAT Series is ultra-small package however, a 0.7-A class chip can be mounted on this ultra-small package a 0.7-A class chip US-FLAT package is achieved low power dissipation compare to other same size package. Toshiba offer a slim, miniature S-FLAT package with a height of 0.98 mm (typ.) and a mounting area 50% smaller than that of existing Toshiba products. The M-FLAT package has been achieved the height of 0.98 mm (approximately the half of existing I-FLAT package) and high current capacity (up to 5 A). Product Number US-FLATTM CUS01 CUS02 S-FLATTM M-FLATTM Type Applications SBDs General-Purpose IF SBD/HED Power Zener Diodes Rectification portable products Approx. 7.5 V: Voltage regulation Reverse connection protection Reverse-current protection Free-wheeling Secondary rectification 12 V~18 V: Gate protection for power MOSFETs DC-DC converter 24 V~47 V: Surge absorption HEDs Generalpurpose recfifiers Product Number CRS01 CRS02 CRS03 CRS04 CRS05 CRS06 CRS08 CRS09 CRS11 CRH01 CRG01 CRG02 Product Number Features S-FLATTM Features Toshiba offer a slim, miniature S-FLAT package with a height of 0.98 mm (typ.) and a mounting area 50% smaller than an existing I-FLAT packag. M-FLATTM Features The M-FLAT package has been developed the I-FLAT as a base. By reducing the height to 0.98 mm (approximately the half of existing I-FLAT package) and optimizing the internal package frame, Toshiba have produced a device which offers high current capacity (up to 5 A) and lower power dissipation. Common Features High surge current capability due to solder clamp structure. Flat pins allow stable mounting on the PCB Package comparison (Toshiba products only) 1.9 Product Number 3.8 4.7 2.4 2.6 3.5 m 5 6 6 7 8 9 1 1 1 1 1 1 2 2 2 3 3 3 4 I-FLATTM Conventional 2.4 1.6 1.9 2.5 M-FLATTM 0.98 0.6 1.25 New 2 S-FLATTM 0.98 US-FLATTM (Unit: mm) CRY6.2 CRY6.8 CRY7.5 CRY8.2 CRY9.1 CRZ10 CRZ11 CRZ12 CRZ13 CRZ15 CRZ16 CRZ18 CRZ20 CRZ22 CRZ24 CRZ27 CRZ30 CRZ33 CRZ36 CRZ39 CRZ43 CRZ47 4.3 4.7 CMS01 CMS02 CMS03 CMS04 CMS05 CMS06 CMS07 CMS08 CMS09 CMS10 CMS11 IF US-FLATTM SBDs Line-up Product Number TM FLAT CUS01 CUS02 IF(AV) (A) 0.7 0.7 VRRM (V) 30 30 Maximum Ratings IFSM Tj (A) (C) 10 -40~125 10 -40~150 Tstg (C) -40~150 -40~150 Electrical Characteristics IRRM IFM(A) (mA) 0.7 1.5 0.7 0.1 VFM (V) 0.37 0.45 VRRM(V) 30 30 TM S-FLAT Rectifiers Line-up M-FLATTM Type SBDs ner Diodes Voltage regulation ate protection for ower MOSFETs HEDs Generalpurpose recfifiers Product Number CRS01 CRS02 CRS03 CRS04 CRS05 CRS06 CRS08 CRS09 CRS11 CRH01 CRG01 CRG02 IF(AV) (A) 1 1 1 1 1 1 1.5 1.5 1 1 0.7 0.7 Product Number proximately the evice which offers (Unit: mm) Tstg (C) -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 Electrical Characteristics IRRM IFM(A) (mA) VRRM(V) 1.5 0.7 30 0.05 0.7 30 0.1 0.7 30 0.1 0.7 40 0.005 1 5 1 1 20 1 1.5 30 0.05 1.5 30 1 1.5 30 1 0.01 200 0.7 0.01 100 0.7 0.01 400 VFM (V) 0.37 0.4 0.45 0.49 0.45 0.36 0.36 0.46 0.36 0.98 1.1 1.1 trr (ns) 35 - S-FLATTM Zener Diodes Line-up urge absorption % smaller than an Maximum Ratings VRRM IFSM Tj (V) (A) (C) 30 20 -40~125 30 20 -40~125 30 20 -40~150 40 20 -40~125 30 20 -40~150 20 20 -40~125 30 30 -40~125 30 30 -40~150 30 20 -40~125 200 15 -40~150 100 15 -40~150 400 15 -40~150 CRY6.2 CRY6.8 CRY7.5 CRY8.2 CRY9.1 CRZ10 CRZ11 CRZ12 CRZ13 CRZ15 CRZ16 CRZ18 CRZ20 CRZ22 CRZ24 CRZ27 CRZ30 CRZ33 CRZ36 CRZ39 CRZ43 CRZ47 min 5.6 6.2 6.75 7.38 8.19 9 9.9 10.8 11.7 13.5 14.4 16.2 18 19.8 21.6 24.3 27 29.7 32.4 35.1 38.7 42.3 Zener Voltage VZ (V) typ. 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 max 6.8 7.4 8.25 9.02 10.01 11 12.1 13.2 14.3 16.5 17.6 19.8 22 24.2 26.4 29.7 33 36.3 39.6 42.9 47.3 51.7 measuring current IZ (mA) 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 9 8 7 6 Forward Voltage VF measuring current (V) IF max (A) 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 0.2 1.0 Reverse Current IR measuring voltage (A) VR max (V) 2 10 3 10 4.5 10 4.9 10 5.5 10 6 10 7 10 8 10 9 10 10 10 11 10 13 10 14 10 16 10 17 10 19 10 21 10 26.4 10 28.8 10 31.2 10 34.4 10 37.6 10 M-FLATTM SBDs Line-up Product Number CMS01 CMS02 CMS03 CMS04 CMS05 CMS06 CMS07 CMS08 CMS09 CMS10 CMS11 IF(AV) (A) 3 3 3 5 5 2 2 1 1 1 2 VRRM (V) 30 30 30 30 30 30 30 30 30 40 40 Maximum Ratings IFSM (A) 40 40 40 70 70 40 40 30 30 25 30 Tj (C) -40~125 -40~125 -40~150 -40~125 -40~150 -40~125 -40~150 -40~125 -40~150 -40~150 -40~150 Tstg (C) -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 -40~150 VFM (V) 0.37 0.4 0.45 0.37 0.45 0.37 0.45 0.37 0.45 0.55 0.55 Electrical Characteristics IRRM IFM(A) (mA) 5 3 0.5 3 0.5 3 8 5 0.8 5 3 2 0.5 2 1.5 1 1 0.5 1 0.5 2 0.5 VRRM(V) 30 30 30 30 30 30 30 30 30 40 40 3 US-FLATTM SBD Characteristic Curves IF - VF characteristic (Ta = 25C) Maximum IR - Tj CUS02 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 VF (V) 10 10 1 CM IF (A) CUS01 Reverse Currlent IR (mA) IF (A) (Typical) 100 10 0.1 1A IF - VF Chara 0.1 (1-A lo 1 CMS0 (2-A low - 0.01 0.001 CUS01 VR = 5 V CUS02 VR = 5 V CUS01 VR = 15 V CUS02 VR = 15 V 0.0001 20 40 60 80 0.1 0 100 0.1 0 Junction Temperature Tj (C) M-FLA TM S-FLAT SBD Characteristic Curves 10 10 CRS08 CRS09 CRS02 CRS06 CRS11 CRS02 CRS05 CRS01 IF (A) IF (A) 100 Low - IR Type S-FLAT SBD IF - VF characteristic (Ta = 25C) Maximum Reverse Current IR (mA) Low - VF Type S-FLAT SBD IF - VF characteristic (Ta = 25C) Maximum 1 1 CRS04 CRS03 10 1 0.1 0.01 0.001 0.0001 20 Ju 0.1 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 0.2 0.4 VF (V) 0.6 0.8 1 1.2 1.4 VF (V) S-FLAT SBD IR - Tj@VR = 5 V S-FLAT SBD IR - Tj@VR = 10 V (Typical) (Typical) US-FLATTM 10 10 CRS01 CRS02 CRS03 CRS04 CRS05 CRS06 CRS08 CRS09 CRS11 0.01 0.001 0.0001 20 40 60 100 0.1 CRS01 CRS02 CRS03 CRS04 CRS05 CRS06 CRS08 CRS09 CRS11 0.01 0.001 0.0001 20 40 60 Junction Temperature Tj (C) 80 100 1.4 0.1 Soldering pad dimensions (reference only) 2.0 1.1 Junction Temperature Tj (C) 80 2 0.6 0.1 0.1 1 0.88 0.1 1 1.9 0.1 1.25 +0.2 -0.1 100 0.88 0.1 100 Reverse Current IR (mA) Reverse Current IR (mA) 2.5 0.2 4 M-FLATTM SBD Characteristic Curves 1 A to 2 A M-FLAT SBD IF - VF Characteristic (Ta = 25C) Maximum (Typical) 3 A to 5 A M-FLAT SBD IF - VF Characteristic (Ta = 25C) Maximum 10 10 CMS01 (3-A low - VF) CMS06 (2-A low - VF) CMS11 (2 A / 40 V) (1-A low - VF) CMS04 CMS09 IF (A) IF (A) CMS08 (1-A low - IR) 1 CMS07 (5-A low - VF) CMS05 1 (5-A low - IR) CMS02 (2-A low - VF) (3-A Trench) CMS03 CMS10 CUS01 VR = 5 V CUS02 VR = 5 V CUS01 VR = 15 V CUS02 VR = 15 V 80 (3-A low - IR) (1 A / 40 V) 0.1 0.1 0 100 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.1 0.2 M-FLAT SBD IR - Tj@VR = 5 V 2 100 100 10 10 1 0.1 CMS01 (3-A Low - VF) CMS02 (3-A Trench) CMS03 (3-A Low - VF) CMS04 (5-A Low - IR) CMS05 (5-A Low - IR) CMS06 (2-A Low - VF) CMS07 (2-A Low - IR) CMS08 (1-A Low - VF) CMS09 (1-A Low - IR) CMS10 (1 A - 40 V) CMS11 (2 A - 40 V) 0.01 0.001 0.0001 20 40 0.5 0.6 0.7 0.8 60 80 (Typical) 1 0.1 CMS01 (3-A Low - VF) CMS02 (3-A Trench) CMS03 (3-A Low - VF) CMS04 (5-A Low - IR) CMS05 (5-A Low - IR) CMS06 (2-A Low - VF) CMS07 (2-A Low - IR) CMS08 (1-A Low - VF) CMS09 (1-A Low - IR) CMS10 (1 A - 40 V) CMS11 (2 A - 40 V) 0.01 0.001 0.0001 20 100 40 60 80 100 Junction Temperature Tj (C) Junction Temperature Tj (C) 1.2 0.4 M-FLAT SBD IR - Tj@VR = 15 V (Typical) Reverse Current IR (mA) Reverse Current IR (mA) SBD C) Maximum 0.3 VF (V) VF (V) (C) 1.4 Package Dimensions 0.13 3.8 0.1 0.98 0.1 Soldering pad dimensions (reference only) 0.16 1: Anode 2: Cathode 1: Anode 2: Cathode 3.0 1.4 Soldering pad dimensions (reference only) 0.8 1.4 0.5 Unit: mm 1 2.4 +0.2 -0.1 1.2 2.0 1 0~0.1 0.6 0.1 0.88 0.1 Soldering pad dimensions (reference only) 2 1.75 0.1 1.6 +0.2 -0.1 1: Anode 2: Cathode Unit: mm 3.5 0.2 0.16 0.9 0.1 0.5 0.1 0.8 100 1.4 0.1 1.1 80 1 0.6 0.1 2 CRS01 CRS02 CRS03 CRS04 CRS05 CRS06 CRS08 CRS09 CRS11 2.6 0.1 0.6 0.1 0.88 0.1 1.25 +0.2 -0.1 1.9 0.1 0.65 0.2 2 0.65 0.2 Unit: mm 0.98 0.1 2.5 0.2 M-FLATTM 4.7 0.2 S-FLATTM 0~0.1 US-FLATTM 0.65 0.2 (Typical) 0.65 0.2 = 10 V 1.2 2.8 1.4 5 TM US-FLAT Embossed Tape Packing Tape dimensions E G Unit: mm P0 Item Reel dimensions Unit: mm Device Recess 9.0 0.3 t o180 3 o180 3 Feed Hole o3 85 o160 4 0.2 5 0.2 C H W 110 o60 1 B *1 13 0.2 18min *2 o76 P1 P R type 1.65 *3 o10 o3 Carrier Tape t2 L type 3 0.2 t1 L C Center-line Gap *1 *2 *3 A 2 0.2 4 0.5 o44 1.2 0.5 1.2 0.5 Position of label Leader and trailer Unit: mm Item Feed Hole Center-line Gap Carrier Tape Remarks Inside bottom surface Inside bottom surface Internal space -- -- Cumulative pitch error rate: 0.2 mm max / 10 pitches Distance between tape edge and center of the recess Distance between recess center and feed hole center Distance between recess center and feed hole center -- -- -- -- MTape dimensions G Length Width Diameter Pitch Diameter Pitch Lateral position Lengthwise direction Crosswise direction Width Thickness Depth Depth Device Recess Dimension 1.55 0.1 2.8 0.1 o1.05 0.1 4.0 0.1 o1.5 +0.1 -0 4.0 0.1 1.75 0.1 2.0 0.05 3.5 0.05 8.0 0.2 0.2 0.05 0.8 0.1 0.05 0.05 Symbol A B C P E P0 G P1 H W t t1 t2 J I Leader and trailer dimensions M Leading empty length: 200 mm(min) M N Leader: 400 mm(min) N Trailing empty length more than 10 pitches Tepe Item Device Recess S-FLATTM Embossed Tape Packing (TE85R,TE85L) Tape dimensions Unit: mm Feed Hole Center-line Gap Reel dimensions Unit: mm F L C 9.0 0.3 E K H o180 3 o180 3 Carrier Tape o3 N N B M D *2 N N Tepe feed direction 6 A 3 0.2 L C 13 0.2 M 18min o76 M 85 M I J *1 o60 1 G 110 o160 4 0.2 5 0.2 Leader and trailer *3 o3 o10 R type L type *1 *2 *3 2 0.2 4 0.5 o44 1.2 0.5 1.2 0.5 Position of label Unit: mm Item Unit: mm Length Width Diameter Pitch Diameter Pitch Lateral position Lengthwise direction Crosswise direction Width Thickness Depth Angle Curvature Device Recess o180 3 Feed Hole o3 85 110 Center-line Gap *3 o10 Carrier Tape Position of label Symbol A B C D E F G H I J K L M N Dimension 1.9 0.1 3.8 0.1 o1.1 0.1 4.0 0.1 o1.5 +0.1 -0 4.0 0.1 1.75 0.1 2.0 0.1 3.5 0.1 8.0 0.3 0.2 0.05 1.25 0.1 5max R0.3 max Remarks Inside bottom surface Inside bottom surface Internal space -- -- Cumulative pitch error rate: 0.2 mm max / 10 pitches Distance between tape edge and center of the recess Distance between recess center and feed hole center Distance between recess center and feed hole center -- -- -- -- -- Leader and trailer dimensions Unit: mm Leading empty length: 200 mm(min) Trailing empty length more than 10 pitches 10 pitches he recess ole center ole center Leader: 400 mm(min) TM M-FLAT Embossed Tape Packing (TE12R,TE12L) Tape dimensions Unit: mm F Reel dimensions Unit: mm 13 0.3 E K H o180 3 o180 3 o3 N 85 *1 B N J I M 5 0.2 o76 M M 3 0.2 L *3 o3 o10 R type C N 13 0.2 M 18min *2 A D o60 1 G 110 o160 4 0.2 L type *1 *2 *3 N Tepe feed direction 2 0.2 4 0.5 o44 1.2 0.5 1.2 0.5 Position of label Unit: mm Item Device Recess Feed Hole 5L) Center-line Gap Unit: mm o180 3 Carrier Tape o3 Dimension 2.7 0.1 5.0 0.1 o1.5 0.1 4.0 0.1 o1.5 + 0.1 4.0 0.1 1.75 0.1 2.0 0.05 5.5 0.05 12.0 0.3 0.3 0.05 1.25 0.1 2max R0.2 max Remarks Inside bottom surface Inside bottom surface Internal space -- -- Cumulative pitch error rate: 0.2 mm max / 10 pitches Distance between tape edge and center of the recess Distance between recess center and feed hole center Distance between recess center and feed hole center -- -- -- -- -- 85 110 Length Width Diameter Pitch Diameter Pitch Lateral position Lengthwise direction Crosswise direction Width Thickness Depth Angle Curvature Symbol A B C D E F G H I J K L M N Leader and trailer dimensions *3 o10 Leading empty length: 180 mm(min) Position of label Trailing empty length: 180 mm(min) Leader: 400 mm(min) 7 OVERSEAS SUBSIDIARIES AND AFFILIATES Toshiba America Electronic Components, Inc. Headquarters-Irvine, CA 9775 Toledo Way, Irvine, CA 92618, U.S.A. Tel: (949)455-2000 Fax: (949)859-3963 Boulder, CO 3100 Arapahoe Avenue, Ste. 500, Boulder, CO 80303, U.S.A. Tel: (303)442-3801 Fax: (303)442-7216 Boynton Beach, FL(Orlando) 11924 W. Forest Hill Blvd., Ste. 22-337, Boynton Beach, FL 33414, U.S.A. Tel: (561)374-6193 Fax: (561)374-6194 Deerfield, IL(Chicago) One Pkwy., North, Suite 500, Deerfield, IL 60015-2547, U.S.A. Tel: (847)945-1500 Fax: (847)945-1044 Duluth, GA(Atlanta) 3700 Crestwood Parkway, Ste. 460, Duluth, GA 30096, U.S.A. Tel: (770)931-3363 Fax: (770)931-7602 Edison, NJ 2035 Lincoln Hwy. Ste. #3000, Edison NJ 08817, U.S.A. Tel: (732)248-8070 Fax: (732)248-8030 Orange County, CA 2 Venture Plaza, #500 Irvine, CA 92618, U.S.A. Tel: (949)453-0224 Fax: (949)453-0125 Portland, OR 1700 NW 167th Place, #240, Beaverton, OR 97006, U.S.A. Tel: (503)629-0818 Fax: (503)629-0827 Toshiba Electronics Europe GmbH Toshiba Electronics Asia, Ltd. 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Level 11, Top Glory Insurance Building, Grand Century Place, No.193, Prince Edward Road West, Mong Kok, Kowloon, Hong Kong Tel: 2375-6111 Fax: 2375-0969 Beijing Office Rm 714, Beijing Fortune Building, No.5 Dong San Huan Bei-Lu, Chao Yang District, Beijing, 100004, China Tel: (010)6590-8795 Fax: (010)6590-8791 Chengdu Office Unit F, 18th Floor, New Times Plaza, 42 Wenwu Road, Xinhua Avenue, Chengdu, 610017, China Tel: (028)675-1773 Fax: (028)675-1065 Shenzhen Office Rm 3010-3012, Office Tower Shun Hing Square, Di Wang Commercial Centre, 333 ShenNan East Road, Shenzhen, 518008, China Tel: (0755)246-1582 Fax: (0755)246-1581 Toshiba Electronics Korea Corporation Seoul Head Office 14/F, KEC B/D, 257-7 Yangjae-Dong, Seocho-ku, Seoul, Korea Tel: (02)589-4334 Fax: (02)589-4302 Gumi Office 6/F, Ssangyong Investment Securities B/D, 56 Songjung-Dong, Gumi City Kyeongbuk, Korea Tel: (82)54-456-7613 Fax: (82)54-456-7617 Toshiba Technology Development (Shanghai) Co., Ltd. 23F, Shanghai Senmao International Building, 101 Yin Cheng East Road, Pudong New Area, Shanghai, 200120, China Tel: (021)6841-0666 Fax: (021)6841-5002 Tsurong Xiamen Xiangyu Trading Co., Ltd. 8N, Xiamen SEZ Bonded Goods Market Building, Xiamen, Fujian, 361006, China Tel: (0592)562-3798 Fax: (0592)562-3799 Toshiba Electronics Taiwan Corporation Taipei Head Office 17F, Union Enterprise Plaza Bldg. 109 Min Sheng East Rd., Section 3, 0446 Taipei, Taiwan Tel: (02)514-9988 Fax: (02)514-7892 Kaohsiung Office 16F-A, Chung-Cheng Bldg., Chung-Cheng 3Rd., 80027, Kaohsiung, Taiwan Tel: (07)222-0826 Fax: (07)223-0046 26th Floor, Citibank Tower, Valero Street, Makati, Manila, Philippines Tel: (02)750-5510 Fax: (02)750-5511 The information contained herein is subject to change without notice. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed in this document shall be made at the customeris own risk. Website: http://www.semicon.toshiba.co.jp/eng/index.html Electronic Devices Sales & Marketing Division 1-1, Shibaura 1-chome, Minato-ku, Tokyo, 105-8001, Japan Tel: +81-3-3457-3405 Fax: +81-3-5444-9431 (c)2001 TOSHIBA CORPORATION Printed in Japan