Small Surface-Mount
Rectifiers
US-FLATTM, S-FLATTMand M-FLATTMSeries
Power Zener Diodes
Today’s mobile and office automation equipment is becoming ever smaller and
slimmer. In response to this market trend, Toshiba have developed an ultra-small
surface-mount US-FLAT, S-FLAT, M-FLAT Series rectifier which allows high-density
mounting. US-FLAT Series is ultra-small package however, a 0.7-A class chip can
be mounted on this ultra-small package a 0.7-A class chip US-FLAT package is
achieved low power dissipation compare to other same size package.
Toshiba offer a slim, miniature S-FLAT package with a height of 0.98 mm (typ.)
and a mounting area 50% smaller than that of existing Toshiba products.
The M-FLAT package has been achieved the height of 0.98 mm (approximately
the half of existing I-FLAT package) and high current capacity (up to 5 A).
Applications
Features
Rectification
Reverse connection protection
Free-wheeling
Approx. 7.5 V: Voltage regulation
12 V~18 V: Gate protection for
power MOSFETs
24 V~47 V: Surge absorption
portable products
Reverse-current protection
Secondary rectification
DC-DC converter
S-FLATTM Features
Toshiba offer a slim, miniature S-FLAT package with a height of 0.98 mm (typ.) and a mounting area 50% smaller than an
existing I-FLAT packag.
M-FLATTM Features
The M-FLAT package has been developed the I-FLAT as a base. By reducing the height to 0.98 mm (approximately the
half of existing I-FLAT package) and optimizing the internal package frame, Toshiba have produced a device which offers
high current capacity (up to 5 A) and lower power dissipation.
Common Features
High surge current capability due to solder clamp structure.
Flat pins allow stable mounting on the PCB
New
Conventional
0.981.6
2.6
3.5
0.982.4
3.8
4.7
1.92.4
4.3
4.7
US-FLATTM S-FLATTM I-FLATTM
Package comparison (Toshiba products only) (Unit: mm)
M-FLATTM
S-FLAT
TM
US-FLAT
TM
M-FLAT
TM
2
0.61.25
1.9
2.5
CUS01
CUS02
Product
Number IF
CMS01
CMS02
CMS03
CMS04
CMS05
CMS06
CMS07
CMS08
CMS09
CMS10
CMS11
Product
Number IF
SBDs
HEDs
General-
purpose
recfifiers
CRS01
CRS02
CRS03
CRS04
CRS05
CRS06
CRS08
CRS09
CRS11
CRH01
CRG01
CRG02
Type Product
Number
CRY6.2
CRY6.8
CRY7.5
CRY8.2
CRY9.1
CRZ10
CRZ11
CRZ12
CRZ13
CRZ15
CRZ16
CRZ18
CRZ20
CRZ22
CRZ24
CRZ27
CRZ30
CRZ33
CRZ36
CRZ39
CRZ43
CRZ47
5
6
6
7
8
9
1
1
1
1
1
1
2
2
2
3
3
3
4
Product
Number m
General-Purpose SBD/HED
n
er Diodes
Voltage regulation
ate protection for
o
wer MOSFETs
u
rge absorption
% smaller than an
proximately the
e
vice which offers
(Unit: mm)
F
LAT
TM
M-FLAT
TM
3
CUS01
CUS02 0.7
0.7 30
30 10
10 -40~125
-40~150 -40~150
-40~150 0.37
0.45 0.7
0.7 1.5
0.1 30
30
Product
Number IF(AV)
(A) VRRM
(V) IFSM
(A) Tj
(˚C) Tstg
(˚C) VFM
(V) IFM(A) IRRM
(mA) VRRM(V)
Maximum Ratings Electrical Characteristics
US-FLAT
TM
SBDs Line-up
CMS01
CMS02
CMS03
CMS04
CMS05
CMS06
CMS07
CMS08
CMS09
CMS10
CMS11
3
3
3
5
5
2
2
1
1
1
2
30
30
30
30
30
30
30
30
30
40
40
40
40
40
70
70
40
40
30
30
25
30
-40~125
-40~125
-40~150
-40~125
-40~150
-40~125
-40~150
-40~125
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
0.37
0.4
0.45
0.37
0.45
0.37
0.45
0.37
0.45
0.55
0.55
3
3
3
5
5
2
2
1
1
1
2
5
0.5
0.5
8
0.8
3
0.5
1.5
0.5
0.5
0.5
30
30
30
30
30
30
30
30
30
40
40
Product
Number IF(AV)
(A) VRRM
(V) IFSM
(A) Tj
(˚C) Tstg
(˚C) VFM
(V) IFM(A) IRRM
(mA) VRRM(V)
Maximum Ratings Electrical Characteristics
M-FLAT
TM
SBDs Line-up
S-FLAT
TM
Rectifiers Line-up
SBDs
HEDs
General-
purpose
recfifiers
1
1
1
1
1
1
1.5
1.5
1
1
0.7
0.7
CRS01
CRS02
CRS03
CRS04
CRS05
CRS06
CRS08
CRS09
CRS11
CRH01
CRG01
CRG02
30
30
30
40
30
20
30
30
30
200
100
400
20
20
20
20
20
20
30
30
20
15
15
15
-40~125
-40~125
-40~150
-40~125
-40~150
-40~125
-40~125
-40~150
-40~125
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
0.37
0.4
0.45
0.49
0.45
0.36
0.36
0.46
0.36
0.98
1.1
1.1
0.7
0.7
0.7
0.7
1
1
1.5
1.5
1
1
0.7
0.7
1.5
0.05
0.1
0.1
0.005
1
1
0.05
1.5
0.01
0.01
0.01
-
-
-
-
-
-
-
-
-
35
-
-
30
30
30
40
5
20
30
30
30
200
100
400
Type Product
Number IF(AV)
(A) VRRM
(V) IFSM
(A) Tj
(˚C) Tstg
(˚C) VFM
(V) IFM(A) IRRM
(mA) trr
(ns)VRRM(V)
Maximum Ratings Electrical Characteristics
S-FLAT
TM
Zener Diodes Line-up
CRY6.2
CRY6.8
CRY7.5
CRY8.2
CRY9.1
CRZ10
CRZ11
CRZ12
CRZ13
CRZ15
CRZ16
CRZ18
CRZ20
CRZ22
CRZ24
CRZ27
CRZ30
CRZ33
CRZ36
CRZ39
CRZ43
CRZ47
5.6
6.2
6.75
7.38
8.19
9
9.9
10.8
11.7
13.5
14.4
16.2
18
19.8
21.6
24.3
27
29.7
32.4
35.1
38.7
42.3
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
6.8
7.4
8.25
9.02
10.01
11
12.1
13.2
14.3
16.5
17.6
19.8
22
24.2
26.4
29.7
33
36.3
39.6
42.9
47.3
51.7
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
9
8
7
6
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
2
3
4.5
4.9
5.5
6
7
8
9
10
11
13
14
16
17
19
21
26.4
28.8
31.2
34.4
37.6
Product
Number min typ. max
Zener Voltage
VZ
(V)
measuring current
IZ
(mA)
VF
(V)
max
measuring current
IF
(A)
IR
(µA)
max
measuring voltage
VR
(V)
Forward Voltage Reverse Current
4
IF - VF characteristic (Ta = 25˚C) Maximum IR - Tj
US-FLATTM SBD Characteristic Curves
S-FLAT SBD IR - Tj@VR = 5 V (Typical) (Typical)
(Typical)
S-FLAT SBD IR - Tj@VR = 10 V
Low - VF Type S-FLAT SBD
IF - VF characteristic (Ta = 25˚C) Maximum Low - IR Type S-FLAT SBD
IF - VF characteristic (Ta = 25˚C) Maximum
S-FLATTM SBD Characteristic Curves
0
0.1
1
10
0.2 0.4 0.6 0.8
VF (V)
IF (A)
1 1.2 1.4
CRS01
CRS02
CRS08
CRS06
CRS11
0
0.1
1
10
0.2 0.4 0.6 0.8
VF (V)
IF (A)
1 1.2 1.4
CRS04
CRS03
CRS05
CRS09
CRS02
M-FLA
1 A
IF - VF Chara
0 0.1 0
0.1
1
10
IF (A)
CM
(1-A lo
CMS0
(2-A low -
20
0.0001
0.001
0.01
0.1
1
10
100
Ju
Reverse Current IR (mA)
US-FLAT
TM
1.9 ± 0.1
1.4 ± 0.1
0.88 ± 0.1
0.6 ± 0.10.88 ± 0.1
1.25 +0.2
-0.1
2
2.5 ± 0.2
1.1
2.0
Soldering pad dimensions
(reference only)
20 40 60 80 100
0.0001
0.001
0.01
0.1
1
10
100
Junction Temperature Tj (˚C)
Reverse Current IR (mA)
CRS06
CRS05
CRS08
CRS04
CRS03
CRS02
CRS09
CRS11
CRS01
20 40 60 80 100
0.0001
0.001
0.01
0.1
1
10
100
Junction Temperature Tj (˚C)
Reverse Current IR (mA)
CRS06
CRS05
CRS08
CRS04
CRS03
CRS02
CRS09
CRS11
CRS01
1
0.1
10
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
VF (V)
IF (A)
CUS02
CUS01
CUS01 VR = 5 V
CUS02 VR = 5 V
CUS01 VR = 15 V
CUS02 VR = 15 V
20 40 60 80 100
100
10
1
0.1
0.01
0.001
0.0001
Junction Temperature Tj (˚C)
Reverse Currlent IR (mA)
5
(Typical)
(Typical)
= 10 V
SBD
C
) Maximum
1.2 1.4
2
M-FLAT SBD IR - Tj@VR = 5 V M-FLAT SBD IR - Tj@VR = 15 V
3 A to 5 A M-FLAT SBD
IF - VF Characteristic (Ta = 25˚C) Maximum
1 A to 2 A M-FLAT SBD
IF - VF Characteristic (Ta = 25˚C) Maximum
M-FLATTM SBD Characteristic Curves
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
0.1
1
10
VF (V)
IF (A)
CMS06
(2-A low - VF)
CMS08
(1-A low - VF)
CMS07
(2-A low - VF)
CMS10
(1 A / 40 V)
CMS09
(1-A low - IR)
CMS11
(2 A / 40 V)
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0.1
1
10
VF (V)
IF (A)
CMS05
(5-A low - IR)
CMS01
(3-A low - VF)
CMS04
(5-A low - VF)
CMS02
(3-A Trench)
CMS03
(3-A low - IR)
20 40 60 80 100
0.0001
0.001
0.01
0.1
1
10
100
Junction Temperature Tj (˚C)
Reverse Current IR (mA)
CMS06 (2-A Low - VF)
CMS07 (2-A Low - IR)
CMS05 (5-A Low - IR)
CMS04 (5-A Low - IR)
CMS03 (3-A Low - VF)
CMS02 (3-A Trench)
CMS08 (1-A Low - VF)
CMS09 (1-A Low - IR)
CMS01 (3-A Low - VF)
CMS11 (2 A - 40 V)
CMS10 (1 A - 40 V)
20 40 60 80 100
0.0001
0.001
0.01
0.1
1
10
100
Junction Temperature Tj (˚C)
Reverse Current IR (mA)
CMS06 (2-A Low - VF)
CMS07 (2-A Low - IR)
CMS05 (5-A Low - IR)
CMS04 (5-A Low - IR)
CMS03 (3-A Low - VF)
CMS02 (3-A Trench)
CMS08 (1-A Low - VF)
CMS09 (1-A Low - IR)
CMS01 (3-A Low - VF)
CMS11 (2 A - 40 V)
CMS10 (1 A - 40 V)
3.8 ± 0.1
1.75 ± 0.1
2.4 +0.2
-0.1 1
0.16
2
4.7 ± 0.2
0.65 ± 0.20.65 ± 0.2
0.98 ± 0.1
0~0.1
1: Anode
2: Cathode
Soldering pad dimensions
(reference only)
Unit: mm
1.4 3.0 1.4
1.4
Package Dimensions
S-FLAT
TM
US-FLAT
TM
M-FLAT
TM
2.6 ± 0.1
0.9 ± 0.1
1.6 +0.2
-0.1 1
0.16
2
3.5 ± 0.2
0.65 ± 0.20.65 ± 0.2
1.2
1.2 2.8
0.98 ± 0.1
0~0.1
1: Anode
2: Cathode
Soldering pad dimensions
(reference only)
Unit: mm
1.9 ± 0.1
1.4 ± 0.1 0.5 ± 0.1
0.6 ± 0.10.6 ± 0.1 0.13
0.88 ± 0.1
0.6 ± 0.10.88 ± 0.1
1.25 +0.2
-0.1
21
2.5 ± 0.2
1.1
0.8
2.0 0.5 0.8
1: Anode
2: Cathode
Soldering pad dimensions
(reference only)
Unit: mm
80 100
CRS06
CRS05
CRS08
CRS04
CRS03
CRS02
CRS09
CRS11
CRS01
CUS01 VR = 5 V
CUS02 VR = 5 V
CUS01 VR = 15 V
CUS02 VR = 15 V
80 100
(
˚C)
(Typical) (Typical)
6
US-FLATTM Embossed Tape Packing
Unit: mmUnit: mm
Unit: mm
Tape dimensions Reel dimensions
S-FLAT
TM
Embossed Tape Packing (TE85R,TE85L)
ø160
ø60 ± 1
13 ± 0.2
1.2 ± 0.5
9.0 ± 0.3
1.2 ± 0.5
Position of label
ø180 ± 3
3 ± 0.2
5 ± 0.2
18min
ø76
4 ± 0.2
*1 *3
*1 2 ± 0.2
*2 4 ± 0.5
*3 ø44
*2
ø180 ± 3
ø3
ø3ø10
110
85
F
HE
L
K
A
D
CL
R type
type
B
GI
J
M
NN
M
MM
N
N
Tepe feed direction
Unit: mmUnit: mm
Tape dimensions Reel dimensions
Leader and trailer dimensions
Item
Device Recess
L
C
Feed Hole
Center-line Gap
Carrier Tape
Leader and trailer
M-
Item
Device Recess
L
C
Feed Hole
Center-line Gap
Carrier Tape
GI
J
MM
N
N
Tepe
Tape dimensions
Leader and trailer
ø160
ø60 ± 1
13 ± 0.2
1.2 ± 0.5
9.0 ± 0.3
1.2 ± 0.5
Position of label
ø180 ± 3
3 ± 0.2
5 ± 0.2
18min
ø76
4 ± 0.2
*1 *3
*1 2 ± 0.2
*2 4 ± 0.5
*3 ø44
*2
ø180 ± 3
ø3
ø3ø10
110
85
A
1.65 R type
L type
E
PP1
P0 t
t1
t2 BH
W
C
G
Item Symbol
Device Recess
Length
Width
Diameter
Pitch
Diameter
Pitch
Lateral position
Lengthwise direction
Crosswise direction
Width
Thickness
Depth
Depth
Inside bottom surface
Inside bottom surface
Internal space
—
—
Cumulative pitch error rate: ± 0.2 mm max / 10 pitches
Distance between tape edge and center of the recess
Distance between recess center and feed hole center
Distance between recess center and feed hole center
—
—
—
—
A
B
C
P
E
P0
G
P1
H
W
t
t1
t2
Dimension Remarks
1.55 ± 0.1
2.8 ± 0.1
ø1.05 ± 0.1
4.0 ± 0.1
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.05
3.5 ± 0.05
8.0 ± 0.2
0.2 ± 0.05
0.8 ± 0.1
0.05 ± 0.05
Feed Hole
Center-line Gap
Carrier Tape
ø1.5
+0.1
-0
Trailing empty length
more than 10 pitches
Leading empty length: 200 mm(min)
Leader: 400 mm(min)
7
Unit: mm
Unit: mm
5
L)
Position of label
*3
ø180 ± 3
ø3
ø10
110
85
Unit: mm
Item Symbol
Device Recess
Length
Width
Diameter
Pitch
Diameter
Pitch
Lateral position
Lengthwise direction
Crosswise direction
Width
Thickness
Depth
Angle
Curvature
Inside bottom surface
Inside bottom surface
Internal space
—
—
Cumulative pitch error rate: ± 0.2 mm max / 10 pitches
Distance between tape edge and center of the recess
Distance between recess center and feed hole center
Distance between recess center and feed hole center
—
—
—
—
—
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Dimension Remarks
1.9 ± 0.1
3.8 ± 0.1
ø1.1 ± 0.1
4.0 ± 0.1
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.1
3.5 ± 0.1
8.0 ± 0.3
0.2 ± 0.05
1.25 ± 0.1
5˚max
R0.3 max
Feed Hole
Center-line Gap
Carrier Tape
ø1.5
+0.1
-0
Trailing empty length
more than 10 pitches
Leading empty length: 200 mm(min)
Leader: 400 mm(min)
Unit: mm
Leader and trailer dimensions
M-FLAT
TM
Embossed Tape Packing (TE12R,TE12L)
Item Symbol
Device Recess
Length
Width
Diameter
Pitch
Diameter
Pitch
Lateral position
Lengthwise direction
Crosswise direction
Width
Thickness
Depth
Angle
Curvature
Inside bottom surface
Inside bottom surface
Internal space
—
—
Cumulative pitch error rate: ± 0.2 mm max / 10 pitches
Distance between tape edge and center of the recess
Distance between recess center and feed hole center
Distance between recess center and feed hole center
—
—
—
—
—
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Dimension Remarks
2.7 ± 0.1
5.0 ± 0.1
ø1.5 ± 0.1
4.0 ± 0.1
ø1.5 + 0.1
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.05
5.5 ± 0.05
12.0 ± 0.3
0.3 ± 0.05
1.25 ± 0.1
2˚max
R0.2 max
Feed Hole
Center-line Gap
Carrier Tape
ø160
ø60 ± 1
13 ± 0.2
1.2 ± 0.5
13 ± 0.3
1.2 ± 0.5
Position of label
ø180 ± 3
3 ± 0.2
5 ± 0.2
18min
ø76
4 ± 0.2
*1 *3
*1 2 ± 0.2
*2 4 ± 0.5
*3 ø44
*2
ø180 ± 3
ø3
ø3ø10
110
85
F
HE
L
K
A
D
CL
R type
type
B
GI
J
M
NN
M
MM
N
N
Tepe feed direction
Unit: mmUnit: mm
Unit: mm
Tape dimensions Reel dimensions
Leader and trailer dimensions
Trailing empty length: 180 mm(min)
Leading empty length: 180 mm(min)
Leader: 400 mm(min)
Position of label
*3
ø180 ± 3
ø3
ø10
110
85
10 pitches
h
e recess
o
le center
o
le center
©2001 TOSHIBA CORPORATION
Printed in Japan
OVERSEAS SUBSIDIARIES AND AFFILIATES
Toshiba America
Electronic Components, Inc.
Headquarters-Irvine, CA
9775 Toledo Way, Irvine, CA 92618, U.S.A.
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Portland, OR
1700 NW 167th Place, #240,
Beaverton, OR 97006, U.S.A.
Tel: (503)629-0818 Fax: (503)629-0827
Raleigh, NC
5511 Capitol Center Dr., #114,
Raleigh, NC 27606, U.S.A.
Tel: (919)859-2800 Fax: (919)859-2898
Richardson, TX(Dallas)
777 East Campbell Rd., Suite 650, Richardson,
TX 75081, U.S.A.
Tel: (972)480-0470 Fax: (972)235-4114
San Jose Engineering Center, CA
1060 Rincon Circle, San Jose, CA 95131, U.S.A.
Tel: (408)526-2400 Fax:(408)526-2410
Wakefield, MA(Boston)
401 Edgewater Place, Suite #360, Wakefield,
MA 01880-6229, U.S.A.
Tel: (781)224-0074 Fax: (781)224-1095
Toshiba Do Brasil S.A.
Electronic Components Div.
Estrada Dos Alvarengas, 5. 500-Bairro Alvarenga
09850-550-Sao Bernardo do campo - SP
Tel: (011)7689-7171 Fax: (011)7689-7189
Toshiba Electronics Europe GmbH
Düsseldorf Head Office
Hansaallee 181, D-40549 Düsseldorf
Germany
Tel: (0211)5296-0 Fax: (0211)5296-400
München Office
Büro München Hofmannstrasse 52,
D-81378, München, Germany
Tel: (089)748595-0 Fax: (089)748595-42
Toshiba Electronics France SARL
Immeuble Robert Schumann 3 Rue de Rome,
F-93561, Rosny-Sous-Bois, Cedex, France
Tel: (1)48-12-48-12 Fax: (1)48-94-51-15
Toshiba Electronics Italiana S.R.L.
Centro Direzionale Colleoni
Palazzo Perseo Ingr. 2-Piano 6,
Via Paracelso n.12,
1-20041 Agrate Brianza Milan, Italy
Tel: (039)68701 Fax:(039)6870205
Toshiba Electronics España, S.A.
Parque Empresarial San Fernando Edificio Europa,
1a Planta, ES-28831 Madrid, Spain
Tel: (91)660-6700 Fax:(91)660-6799
Toshiba Electronics(UK) Limited
Riverside Way, Camberley Surrey,
GU15 3YA, U.K.
Tel: (01276)69-4600 Fax: (01276)69-4800
Toshiba Electronics Scandinavia AB
Gustavslundsvägen 12, 2nd Floor
S-161 15 Bromma, Sweden
Tel: (08)704-0900 Fax: (08)80-8459
Toshiba Electronics Asia
(Singapore) Pte. Ltd.
Singapore Head Office
438B Alexandra Road, #06-08/12 Alexandra
Technopark, Singapore 119968
Tel: (278)5252 Fax: (271)5155
Bangkok Office
135 Moo 5 Bangkadi Industrial Park, Tivanon Rd.,
Bangkadi Amphur Muang Pathumthani, Bangkok, 12000,
Thailand
Tel: (02)501-1635 Fax: (02)501-1638
Toshiba Electronics Trading
(Malaysia)Sdn. Bhd.
Kuala Lumpur Head Office
Suite W1203, Wisma Consplant, No.2,
Jalan SS 16/4, Subang Jaya, 47500 Petaling Jaya,
Selangor Darul Ehsan, Malaysia
Tel: (3)731-6311 Fax: (3)731-6307
Penang Office
Suite 13-1, 13th Floor, Menard Penang Garden,
42-A, Jalan Sultan Ahmad Shah,
100 50 Penang, Malaysia
Tel: 4-226-8523 Fax: 4-226-8515
Toshiba Electronics Philippines, Inc.
26th Floor, Citibank Tower, Valero Street, Makati,
Manila, Philippines
Tel: (02)750-5510 Fax: (02)750-5511
Toshiba Electronics Asia, Ltd.
Hong Kong Head Office
Level 11, Top Glory Insurance Building, Grand Century
Place, No.193, Prince Edward Road West,
Mong Kok, Kowloon, Hong Kong
Tel: 2375-6111 Fax: 2375-0969
Beijing Office
Rm 714, Beijing Fortune Building,
No.5 Dong San Huan Bei-Lu, Chao Yang District,
Beijing, 100004, China
Tel: (010)6590-8795 Fax: (010)6590-8791
Chengdu Office
Unit F, 18th Floor, New Times Plaza, 42 Wenwu Road,
Xinhua Avenue, Chengdu, 610017, China
Tel: (028)675-1773 Fax: (028)675-1065
Shenzhen Office
Rm 3010-3012, Office Tower Shun Hing Square,
Di Wang Commercial Centre, 333 ShenNan
East Road, Shenzhen, 518008, China
Tel: (0755)246-1582 Fax: (0755)246-1581
Toshiba Electronics Korea Corporation
Seoul Head Office
14/F, KEC B/D, 257-7 Yangjae-Dong,
Seocho-ku, Seoul, Korea
Tel: (02)589-4334 Fax: (02)589-4302
Gumi Office
6/F, Ssangyong Investment Securities B/D,
56 Songjung-Dong, Gumi City
Kyeongbuk, Korea
Tel: (82)54-456-7613 Fax: (82)54-456-7617
Toshiba Technology Development
(Shanghai) Co., Ltd.
23F, Shanghai Senmao International Building, 101
Yin Cheng East Road, Pudong New Area, Shanghai,
200120, China
Tel: (021)6841-0666 Fax: (021)6841-5002
Tsurong Xiamen Xiangyu Trading
Co., Ltd.
8N, Xiamen SEZ Bonded Goods Market Building,
Xiamen, Fujian, 361006, China
Tel: (0592)562-3798 Fax: (0592)562-3799
Toshiba Electronics Taiwan
Corporation
Taipei Head Office
17F, Union Enterprise Plaza Bldg. 109
Min Sheng East Rd., Section 3, 0446 Taipei,
Taiwan
Tel: (02)514-9988 Fax: (02)514-7892
Kaohsiung Office
16F-A, Chung-Cheng Bldg., Chung-Cheng 3Rd.,
80027, Kaohsiung, Taiwan
Tel: (07)222-0826 Fax: (07)223-0046
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in
general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the
responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for
the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of
human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used
within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind
the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor
Reliability Handbook" etc..
The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).
These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or
reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage
include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed
in this document shall be made at the customerís own risk.
Website: http://www.semicon.toshiba.co.jp/eng/index.html
Electronic Devices Sales & Marketing Division
1-1, Shibaura 1-chome, Minato-ku, Tokyo, 105-8001, Japan
Tel: +81-3-3457-3405 Fax: +81-3-5444-9431
010124 (D)
