2
CM200TU-5F
Trench Gate Design Six IGBTMOD™
200 Amperes / 250 Volts
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM200TU-5F Units
Junction Temperature Tj-40 to 150 °C
Storage Temperature Tstg -40 to 125 °C
Collector-Emitter Voltage (G-E SHORT) VCES 250 Volts
Gate-Emitter Voltage (C-E SHORT) VGES ±20 Volts
Collector Current (Tc = 25°C) IC200 Amperes
Peak Collector Current (Tj ≤ 150°C) ICM 400* Amperes
Emitter Current** IE200 Amperes
Peak Emitter Current** IEM 400* Amperes
Maximum Collector Dissipation (Tj < 150°C) Pc600 Watts
Mounting Torque, M5 Main Ter minal – 31 in-lb
Mounting Torque, M5 Mounting – 31 in-lb
Weight – 680 Grams
Isolation Voltage (Main Ter minal to Baseplate, AC 1 min.) Viso 2500 Volts
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current ICES VCE = VCES, VGE = 0V – – 1 mA
Gate Leakage Voltage IGES VGE = VCES, VCE = 0V – – 0.5 µA
Gate-Emitter Threshold V oltage VGE(th) IC = 20mA, VCE = 10V 3.0 4.0 5.0 Volts
Collector-Emitter Saturation Voltage VCE(sat) IC = 200A, VGE = 10V, Tj = 25°C – 1.2 1.7 Volts
IC = 200A, VGE = 10V, Tj = 125°C – 1.1 – Volts
Total Gate Charge QGVCC = 100V, IC = 200A, VGE = 10V – – nC
Emitter-Collector Voltage** VEC IE = 200A, VGE = 0V – – 2.0 Volts
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance Cies ––66nf
Output Capacitance Coes VCE = 10V, VGE = 0V – – 3.0 nf
Re verse Transfer Capacitance Cres – – 2.3 nf
Resistive Turn-on Delay Time td(on) VCC = 100V, IC = 200A, – – 700 ns
Load Rise Time trVGE1 = VGE2 = 10V, – – 1800 ns
Switch Tur n-off Delay Time td(off) RG = 13V, Resistive – – 700 ns
Times Fall Time tfLoad Switching Operation – – 500 ns
Diode Reverse Recovery Time** trr IE = 200A, diE/dt = -400A/µs––300ns
Diode Reverse Recovery Charge** Qrr IE = 200A, diE/dt = -400A/µs– –µC
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case R th(j-c)Q Per IGBT 1/6 Module – – 0.21 °C/W
Thermal Resistance, Junction to Case Rth(j-c)R Per Free-Wheel Diode 1/6 Module – – 0.47 °C/W
Contact Thermal Resistance Rth(c-f) Per 1/6 Module, Thermal Grease Applied – 0.09 – °C/W
* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tj(max) rating.
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
2http://store.iiic.cc/