A
B
C
D
F max.
G max.
Series Tip temperature Soldering time
RDC50, RDC90, RDC80 350±5℃ 3 s
RDC10, RD7 350℃ max. 3s max.
Series
Preheating Dip soldering
No. of solders
Soldering surface
temperature Heating time Soldering
temperature Soldering time
RDC501, RDC502 10 0 t o 15 0 ℃ 1minute max. 260±5℃ 10 ±1s 1 time
RD7 10 0℃ ma x . 1minute max. 260℃ max. 5s max. 1 time
+1
0
1. Cleaning Cleaning should not be attempted.
2. Type of solder to be used Use cream solder that contains 10 to 15 %wt flux.
3. Number of solder applications - apply solder only once
4. Recommended reflow conditions
1. When using an infrared reflow oven, solder may not always be applied as intended.
Be sure to use a hot air reflow oven or a type that uses infrared rays in combination with hot air.
2. The temperatures given above are the maximum temperatures at the terminals of the sensor when employing a hot air
reflow method. The temperature of the PC board and the surface temperature of the sensor may vary greatly depending
on the PC board material, its size and thickness. Ensure that the surface temperature of the sensor does not rise to 250℃
or greater.
3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.
Notes
Resistive Position Sensors / Soldering Conditions
Series A B C D E F G H I No. of
reflows
RDC503
RDC506 250℃ 230℃ 18 0 ℃ 15 0 ℃ 2min. ー5s 40s 4min. 1 time
RDC90 255℃ 230℃ ーーー2min. 10 s 1m i n . 4min. 1 time
RDC80 250℃ ー18 0 ℃ 15 0 ℃ 90±30s ー10 ±1s ー ー 1 time