FIGURE 1
DESIGN DATA
CASE: Hermetically sealed glass
case. DO-7 outline
LEAD MATERIAL: Copper clad steel
LEAD FINISH: Tin / Lead
THERMAL RESISTANCE: (ROJEC):
200 ˚C/W maximum
THERMAL IMPEDANCE: (ZOJX): 70
˚C/W maximum
POLARITY: Cathode end is banded.
MOUNTING POSITION: Any.
22 COREY STREET, MELROSE, MASSACHUSETTS 02176
PHONE (781) 665-1071 FAX (781) 665-7379
WEBSITE: http://www.cdi-diodes.com E-mail: mail@cdi-diodes.com
• AVAILABLE IN JAN, JANTX, AND JANTXV
PER MIL-PRF-19500/118
GENERAL PURPOSE SILICON DIODES
METALLURGICALLY BONDED
1N483B
1N485B
1N486B
ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise specified
MAXIMUM RATINGS
Operating Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
Operating Current: 200 mA
Derating: 1.2 mA/°C From 25°C to 150°C
1.0 mA/°C From 150°C to 175°C
Forward Current: 650 mA
TYPE VRM V RWM I OI OI FSM
TA= 150°C TP= 1/120 s
TA= 25°C
V (pk) V (pk) mA mA A
1N483B 80 70 200 50 2
1N485B 180 180 200 50 2
1N486B 250 225 200 50 2
TYPE VF I R1 at V RWM I R2 at V RM I R3 at V RWM
@100mA TA= 25°C TA= 25°C TA= 150°C
V dc nA dc µA µA dc
1N483B 0.8 - 1.0 25 100 5
1N485B 0.8 - 1.0 25 100 5
1N486B 0.8 - 1.0 25 100 5
0.085/0.125
2.16/3.18
IN483B, IN485B and IN486B
.3 .4 .5 .6 .7 .8 .9 1.0 1.1 1.2 1.3
VF - Forward Voltage (V)
FIGURE 2
Typical Forward Current
vs Forward Voltage
IF- Forward Current - (mA)
1000
100
10
1
0.1
150ºC
100ºC
25ºC
-65ºC
20 40 60 80 100 120 140
Percent of Reverse Working Voltage (%)
FIGURE 3
Typical Reverse Current
vs Reverse Voltage
IR- Reverese Current - (µA)
1000
100
10
1
0.1
.01
.001
150ºC
100ºC
25ºC
-65ºC
NOTE : All temperatures shown on graphs are
junction temperatures