WF121 Wi-Fi MODULE
DATA SHEET
Thursday, 02 October 2014
Version 1.5.2
Bluegiga Technologies Oy
Copyright © 2000-2014 Bluegiga Technologies
All rights reserved.
Bluegiga Technologies assumes no responsibility for any errors which may appear in this manual.
Furthermore, Bluegiga Technologies reserves the right to alter the hardware, software, and/or specifications
detailed here at any time without notice and does not make any commitment to update the information
contained here. Bluegiga’s products are not authorized for use as critical components in life support devices
or systems.
The WRAP, Bluegiga Access Server, Access Point and iWRAP are registered trademarks of Bluegiga
Technologies.
The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA and is licensed to Bluegiga Technologies.
All other trademarks listed herein are owned by their respective owners.
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VERSION HISTORY
Version
Comment
1.0
First version
1.1
FCC and IC information added
1.2
WF121-N layout guide
1.3
Added power consumption measurements, regulatory info and some
corrections
1.4
Added unassociated idle consumption and a chapter about power saving
modes
1.4.1
Added CE information
1.4.2
Removed details from the regulatory info
1.4.3
Corrected typos in the pad function tables
1.4.4
Reduced the list of supported coexistence schemes
1.4.5
Added links to Microchip reference guide, some notes on the coexistence
1.4.6
Added inversion notices to RTS/CTS for unambiguity
1.4.7
Added notes on the USB data pins GPIO use being input only to pin function
table
1.4.8
Added note on the engineering sample order codes
1.4.9
Additions to power supply description, rewrote power consumption section
1.4.10
Removed references to parallel port and C-libraries
1.4.11
Added recommendations for unconnected GPIO pins
1.4.12
Added notes on Ethernet PHY, various small edits
1.5
Design guidelines, supply voltage limitations
1.5.1
Fixed typos & support/sales contact information
1.5.2
CE info updated
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TABLE OF CONTENTS
1 Design guidelines ..........................................................................................................................................7
2 Ordering Information......................................................................................................................................8
3 Pin-out and Terminal Descriptions ................................................................................................................9
4 Power control .............................................................................................................................................. 11
4.1 Power supply requirements ............................................................................................................... 11
4.2 Power saving functionality ................................................................................................................. 11
4.3 Reset .................................................................................................................................................. 12
4.4 Microcontroller ................................................................................................................................... 12
5 Interfaces .................................................................................................................................................... 13
5.1 General Purpose I/O pins .................................................................................................................. 13
5.2 Serial ports ......................................................................................................................................... 13
5.3 I2C/SPI ............................................................................................................................................... 14
5.4 USB On-The-Go ................................................................................................................................ 14
5.5 Ethernet ............................................................................................................................................. 15
5.6 Analog inputs ..................................................................................................................................... 16
5.7 Microcontroller programming interface .............................................................................................. 16
5.8 RF Debug Interface ........................................................................................................................... 17
5.9 Bluetooth co-existence ...................................................................................................................... 17
5.10 Antenna switch for Bluetooth coexistence ......................................................................................... 17
5.11 CPU Clock ......................................................................................................................................... 18
5.12 32.768 kHz External Reference Clock ............................................................................................... 19
6 Example schematic .................................................................................................................................... 20
7 802.11 Radio .............................................................................................................................................. 21
7.1 Wi-Fi Receiver ................................................................................................................................... 21
7.2 Wi-Fi Transmitter ............................................................................................................................... 21
7.3 Regulatory domains ........................................................................................................................... 21
8 Firmware ..................................................................................................................................................... 22
9 Host interfaces ............................................................................................................................................ 23
9.1 UART ................................................................................................................................................. 23
9.2 USB .................................................................................................................................................... 23
9.3 SPI ..................................................................................................................................................... 23
10 Electrical characteristics ........................................................................................................................ 24
10.1 Absolute maximum ratings ................................................................................................................ 24
10.2 Recommended operating conditions ................................................................................................. 24
10.3 Input/output terminal characteristics .................................................................................................. 25
10.4 Digital ................................................................................................................................................. 25
10.5 Reset .................................................................................................................................................. 25
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10.6 Power consumption ........................................................................................................................... 26
11 RF Characteristics ................................................................................................................................. 28
12 Physical dimensions .............................................................................................................................. 30
13 Layout guidelines ................................................................................................................................... 31
13.1 WF121-E ............................................................................................................................................ 31
13.2 WF121-N............................................................................................................................................ 31
13.3 WF121-A ............................................................................................................................................ 32
13.4 Thermal considerations ..................................................................................................................... 33
13.5 EMC considerations ........................................................................................................................... 33
14 Soldering recommendations .................................................................................................................. 35
15 Certifications .......................................................................................................................................... 36
15.1 CE ...................................................................................................................................................... 36
15.2 FCC and IC ........................................................................................................................................ 36
15.2.1 FCC et IC ................................................................................................................................... 38
16 Qualified Antenna Types for WF121-E .................................................................................................. 41
17 Contact information ................................................................................................................................ 42
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DESCRIPTION
WF121 is a self-contained Wi-Fi module
providing a fully integrated 2.4GHz 802.11
b/g/n radio and a 32-bit microcontroller (MCU)
platform, making it an ideal product for
embedded applications requiring simple, low-
cost and low-power wireless TCP/IP
connectivity. WF121 also provides flexible
interfaces for connecting to various
peripherals.
WF121 allows end user applications to be
embedded onto the on-board 32-bit
microcontroller using a simple BGScriptTM
scripting. This cuts out the need of an
external MCU and allows the development of
smaller and lower-cost products. However
WF121 can also be used in modem-like mode
in applications where the external MCU is
needed.
With an integrated 802.11 radio, antenna,
single power supply, and regulatory
certifications, WF121 provides a low-risk and
fast time-to-market for applications requiring
Internet connectivity. This combined with
Bluegiga’s excellent customer service will turn
your Internet-of-Things applications into
reality.
APPLICATIONS:
PoS terminals
RFID and laser scanners
Wi-Fi internet radios and audio
streaming products
Wireless cameras
Video streaming
Portable navigation devices
Portable handheld devices
Wi-Fi medical sensors
Wireless picture frames
KEY FEATURES:
2.4GHz band IEEE 802.11 b/g/n radio
Excellent radio performance:
TX power: +17 dBm
RX sensitivity: -97 dBm
Host interfaces:
20Mbps UART
USB on-the-go
Peripheral interfaces:
GPIO, AIO and timers
I2C, SPI and UART
Ethernet
Embedded TCP/IP and 802.11 MAC
stacks:
IP, TCP, UDP, DHCP and DNS
protocols
BGAPI host protocol for modem
like usage
BGScriptTM scripting language
32-bit embedded microcontroller
80MHz, 128kB RAM and 512kB
Flash
MIPS architecture
Temperature range: -40oC to +85oC
Fully CE, FCC, IC, South Korea and
Japan qualified
PHYSICAL OUTLOOK:
WF121-A
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1 Design guidelines
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2 Ordering Information
Product code
Description
WF121-A
WF121 module with integrated antenna
WF121-E
WF121 module with U.FL connector
WF121-N
WF121 module with RF pin.
Non-standard product, so minimum order quantity applies.
Please contact Bluegiga sales through: www.bluegiga.com
DKWF121
WF121 development kit
Note: Modules with order code ending in –v1 are sold as engineering samples, while those with code –v2 are
production units. The difference between the two is in the microcontroller version used, the –v2 version fixes a
hardware bug that in some circumstances may cause rare bit errors. The modules differ in outlook in that the
–v1 only has the Bluegiga logo and text “WF121” while –v2 versions also have FCC/IC ID codes and CE logo.
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3 Pin-out and Terminal Descriptions
Figure 1: WF121 pinout
Pad number
Function
Description
9
VDD_3.3V
Module power supply
8
VDD_PA
RF power amplifier power supply
1, 16, 26, 45,
48, 50
GND
Ground, connected together internally but should all be connected directly to a solid ground plane
51
GNDPAD
Thermal ground pad, should be connected to a solid ground plane with multiple vias for improved
thermal conductance
40
BT_RF
Bluetooth coexistence antenna connection, leave floating or connect to ground through a 51ohm
resistor for slightly reduced unwanted emissions if coexistence is not used
49
ANT
Antenna connection pad in N variant of the module, in other variants not connected
25
VBUS
USB VBUS input
13
MCLR
Module reset, also used for programming using a Microchip tool. Internal pull-up, can be left
floating or connected to ground through a 100nF capacitor for delayed power-up reset (note:
Microchip ICSP programming tools will not work with a capacitor)
Table 1: Single function pad descriptions
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PAD#
I2C
SPI
UART
Ethernet
Timer
USB
Analog
Prog.
Other
2
EMDC
OCFB
AN15
3
ERXD1
4
ERXD0
5
ECRSDV
6
EREFCL
K
7
ERXERR
10
ETXEN
11
ETXD0
12
ETXD1
14
AN1
PGEC1
15
AN0
PGED1
17
SS4
nU2CTS
U5RX
C1OUT
AN8
18
OTG_ID
19
SCK4
nU2RTS
U5TX
AN14
20
AN13
TDI
21
AN12
TCK
22
AN11
TDO
23
AN10
TMS
24
VBUSON
AN5
27
D-
28
D+
29
SCL3
SDO3
U1TX
OC4
30
OSC1
31
OSC2
32
SDA3
SDI3
U1RX
OC3
33
SOSCI
34
T1CK
SOSCO
35
SDA5
SDI4
U2RX
36
SCL5
SDO4
U2TX
37
IC4
BT_PERIODIC
38
OC1
WLAN_DENY
39
IC5/OC5
BT_STATUS
41
BT_ACTIVE
42
ETXERR
43
44
SDA1
SS3
nU1CTS
U4RX
IC2
46
SCL1
IC3
47
SCK3
nU1RTS
U4TX
EMDIO
OC2
Table 2: Multifunction pad descriptions
Note: 5V tolerant pads are marked with orange. CN pins support pull-up, pull-down and GPIO notifications
Note: Unused pins should be set up as outputs to reduce leakage currents
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4 Power control
4.1 Power supply requirements
WF121 consists of two separate internal blocks, the microcontroller and the radio part. The blocks have
separate supply voltage inputs and the microcontroller can disable the radio part supply internally.
WF121 is designed to operate with a 3.3V nominal input voltage supplied to the two supply inputs. The
VDD_3.3V pad can be fed with a voltage between 2.3V and 3.6V and is used to power the internal
microcontroller. However, when the VDD_3.3V line is below 3.0V, the microcontroller can no longer write to its
internal flash memory, and is incapable of updating any settings. The VDD_PA pad can be supplied with a
voltage between 2.7V and 4.8V and supplies the RF power amplifier and the internal switch-mode converter
powering the Wi-Fi digital core.
In lithium battery powered applications, VDD_PA can be connected directly to the battery, while a regulator is
needed to supply the VDD_3.3V with a lower voltage, as needed by the design.
The VDD_PA supply should be capable of providing at least 350mA, though the average consumption of the
module will be much less than that. The VDD_3.3V supply will draw a peak current of less than 100mA, not
including current drawn from the GPIO pins. The PA supply should preferably be bypassed with a 10 to 100µF
capacitor to smooth out the current spikes drawn by the Wi-Fi power amplifier, unless powered by a
sufficiently fast regulator. Other bypass capacitors are not needed for either supply line, the module contains
the needed supply filtering capacitors.
Note that there are about 20µF worth of ceramic capacitors on the VDD_PA line inside the module. When
using low drop linear regulators (LDO) to generate a regulated supply for the VDD_PA line, the stability of the
regulator with the low ESR provided by these capacitors should be checked. Many linear regulators (and
some switched mode ones) are not stable with ceramic output capacitors.
4.2 Power saving functionality
In Wi-Fi client mode, the WF121 radio core automatically powers on the RF circuitry only when needed. The
Wi-Fi core processors support automatic sleep modes when not communicating actively, allowing very low
idle consumption. When used as an access point, the radio core must receive constantly and cannot enter
sleep modes.
The WF121 main processor automatically enters an idle mode after a timeout period whenever it is not
actively executing anything, lowering its consumption to about a third of the full while allowing instant wakeup.
When the power saving functions are enabled in the hardware configuration script, the processor will after a
pre-set timeout enter a deeper sleep mode to lower the consumption to much lower levels, but will take a few
milliseconds to wake up from and needs an interrupt to wake up.
In applications where small amounts of data are transferred often, consumption can be optimized by collecting
data into bigger packages and transferring it in a single burst. As every data transfer is followed by a timeout
before sleep modes are entered, reducing the number of individual transfers will reduce average consumption.
Keeping the WF121 associated with an access point with the power saving modes enabled will allow relatively
fast response times with a low power consumption, but in some applications the consumption can be reduced
further. Unassociating the Wi-Fi will allow fast re-association with lower idle consumption in applications where
the module needs to transfer data only occasionally, while for applications where the absolute minimum
consumption is desired and the communication intervals are long, the Wi-Fi section of the module can be fully
powered off by disabling the module internal switch mode converter feeding the Wi-Fi core. Powering the Wi-
Fi down fully will require a full reinitialization of the Wi-Fi core, and will take several seconds before
associating with an access point.
The power saving modes are user configurable and controllable. For more information see the firmware
documentation.
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4.3 Reset
WF121 can be reset by the MCLR-pin (active low), system power up, the internal brown-out detector or the
internal watchdog timer.
4.4 Microcontroller
WF121 contains a Microchip PIC32-series 32 bit microcontroller with a MIPS M4K core. At a maximum clock
frequency of 80 MHz the core can reach a performance of 125 DMIPS while keeping low power consumption.
The microcontroller used in WF121 contains 512kB of Flash memory and 128kB of SRAM.
Most peripheral features are directly provided by the microcontroller and for low level information and detailed
descriptions please refer to the material and datasheets of the PIC32MX695F512H.
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5 Interfaces
5.1 General Purpose I/O pins
To see which GPIOs are multiplexed with which features, please refer to Table 2.
WF121 contains a number of pads that can be configured to be used as general purpose digital IO’s, analog
inputs or for various built-in functions. Provided functions include a Full Speed USB-OTG port, three I2C-ports,
two SPI-ports, two to four UART’s, Ethernet MAC with RMII connection and various timer functions. Some of
the pads are 5V tolerant. All GPIO pads can drive currents of up to +/- 25 mA.
Four pins are available for implementing a coexistence scheme with a Bluetooth device. The exact order and
function as well as the coexistence system desired is software configurable, with the default pad bindings
shown in Table 3 for a Unity-3e coexistence scheme. If the pads are bound to WiFi chip pins, the CPU pins
associated with the pads must be set to inputs.
Note: In any application, GPIO pins not reserved for a certain function and not driven to some known state by
outside circuitry should be set up as outputs by the application software. Only the Change Notice (CN)
capable pins have pullup capability, and if the rest of the pins are left as inputs, they will be floating at a
voltage between ground and supply voltage, causing increased module power consumption due to leakages.
5.2 Serial ports
Pad number
UART 1
UART 2
UART 4
UART 5
17
nCTS
RX
19
nRTS
TX
29
TX (output)
32
RX (input)
35
RX
36
TX
44
nCTS (input)
RX
47
nRTS (output)
TX
Table 3: Serial port pads
Two UART’s are provided with RTS/CTS-handshaking. If handshaking is not needed, up to four UART’s can
be implemented. Speeds up to 20 Mbps are possible, but the higher bit rates (above 115200 bps) might
require the use of an external crystal for sufficient clock accuracy. The serial ports can also be used as host
connections when using an external microcontroller.
To see what other functions are present on the same pins, please refer to Table 2.
.
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5.3 I2C/SPI
Pad number
I2C
SPI
17
SS4 – Slave select SPI 4
19
SCK4 - Clock SPI 4
29
SCL3 – Clock I2C 3
SDO3 – Data out SPI 3
32
SDA3 – Data I2C 3
SDI3 – Data in SPI 3
35
SDA5 – Data I2C 5
SDI4 – Data in SPI 4
36
SCL5 – Clock I2C 5
SDO4 – Data out SPI 4
44
SDA1 – Data I2C 1
SS3 – Slave select SPI 3
46
SCL1 – Clock I2C 1
47
SCK3 – Clock SPI 3
Table 4: Pads for I2C and SPI
Up to three I2C-ports and up to two SPI ports can be implemented, mostly multiplexed on the same pins
together and with the UART signals. The I2C ports support 100 kHz and 400 kHz speed specifications
including automatic clock stretching, while the SPI can be operated at up to 25 Mbps. The SPI ports are also
available for use as a host connection for use with an external microcontroller. The SPI bus can be configured
for any clock phase combination.
For details on the SPI/I2C hardware, please refer to Microchip documentation on SPI and I2C.
To see what other functions are present on the same pins, please refer to Table 2.
5.4 USB On-The-Go
Pad number
Function
Description
18
OTG_ID
USB-OTG mode identify line
25
VBUS
USB bus supply input
27
D-
Data -
28
D+
Data +
24
VBUSON
USB bus supply switch enable in host mode
Table 5: USB pads
The module contains a USB-OTG system with an integrated transceiver. Full Speed (12 Mbps) USB 2.0
profile is supported in device mode, while the host system can operate in Low Speed and Full Speed modes.
For host use an external switch can be implemented to provide switched power for the connected device. Pad
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number 24 can be dedicated to control this switch. The USB device can be used as a host connection,
although the embedded (simplified) USB-OTG may not be able to support every kind of USB system, like
hubs. The current firmware has no support for the host mode.
Using the USB connection requires an external crystal for sufficient clock accuracy.
Other functions are present on the same pins; please refer to Table 2 for details.
5.5 Ethernet
Pad number
Function
Description
2
EMDC
Management bus clock
3
ERXD1
Receive data 1
4
ERXD0
Receive data 0
5
ECRSDV
Receive data valid
6
EREFCLK
Reference clock
7
ERXERR
Receive error
10
ETXEN
Transmit enable
11
ETXD0
Transmit data 0
12
ETXD1
Transmit data 1
42
ETXERR
Transmit error
47
EMDIO
Management bus data
Table 6: Ethernet pads
An RMII interface to an external Ethernet PHY is available. The PHY should supply EREFCLK with a 50 MHz
RMII reference clock. Other functions are present on the same pads; please refer to Table 2 for details.
The current firmware contains support for using a Micrel PHY type KSZ8081RNA (the evaluation board
schematic shows the fully compatible but now obsolete KSZ8031RNL) to implement a 10/100Mbps Ethernet
connection and using it as an endpoint, allowing data to be streamed from and to the Wi-Fi interface or other
end points.
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5.6 Analog inputs
Pad number
Function
2
AN15
14
AN1
15
AN0
17
AN8
19
AN14
20
AN13
21
AN12
22
AN11
23
AN10
24
AN5
Table 7: ADC pads
The microcontroller provides a 10-bit Analog to digital converter (ADC) with sampling speeds up to 1MSps.
The measurement can be done on any of the input pins listed in the table above.
5.7 Microcontroller programming interface
Pad number
Pad function
Description
13
MCLR
Reset
14
PGEC1
Programming Clock
15
PGED1
Programming Data
20
TDI
JTAG Test Data In
21
TCK
JTAG Test Clock
22
TDO
JTAG Test Data out
23
TMS
JTAG Test Machine State
Table 8: Programming and JTAG pads
An ICSP (In-Circuit Serial Programming) interface (PGEC1, PGED1, MCLR) is provided to allow device re-
flashing using a Microchip tool. A JTAG connection is also provided which can be used for system debugging
purposes or device programming. For information on JTAG operation, please refer to Microchip
documentation.
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5.8 RF Debug Interface
Pad number
Pad function
Description
52
SPI_MISO
RF Debug data out
53
SPI_CLK
RF Debug clock
54
SPI_MOSI
RF Debug data in
55
SPI_CS
RF Debug chip select
Table 9: RF Debug SPI pads
Four pads are provided for the debug interface of the WiFi chipset in the module bottom. This is meant for RF
calibration and testing during module production and product certification measurements. These should in
most applications be left unconnected, but should be taken into account when doing the application board
layout. Avoid placing vias or signals without a solder mask under these pads. If separate radiated emission
compliance measurements need to made for the application, these should be connected to a header. More
information on the certification measurements can be obtained from Bluegiga support via www.bluegiga.com.
5.9 Bluetooth co-existence
Bluetooth coexistence systems allow co-located WiFi and Bluetooth devices to be aware of each other and to
avoid simultaneous transfers that would degrade link performance. The most common coexistence schemes
combine host driver-side prioritizing with hardware connections between the different radio devices where the
hardware interface is used to communicate the exact timings for driver pre-defined events.
WF121 has up to 4 pins available for implementing the hardware connection, but as the internal host
processor is not running the Bluetooth stack too, it is not possible to implement any priorities for the separate
radio devices. The hardware connections by themselves will still enable a crude form of coexistence, with the
Wi-Fi side controlling the communications.
Wi-Fi data will always have priority over Bluetooth data, and with high duty cycle Wi-Fi transfers (low bit rate,
high throughput) the Bluetooth might not be able to transfer any data. Mostly however the Wi-Fi duty cycle will
be less than 100% and the Bluetooth device may be able to transfer significant amounts of data. A long
Bluetooth scan may cause the Wi-Fi connection to time out when sharing the same antenna.
5.10 Antenna switch for Bluetooth coexistence
WF121 supports sharing the integrated antenna or antenna connector with a Bluetooth device through the
BT_RF pad. The module contains a bypass switch to route the Bluetooth signal directly to the antenna, and
supports using the internal LNA for Bluetooth reception. The switch is controlled through the coexistence
interface. Use of the antenna switch requires the use of Unity-3e scheme, as there are not enough pins
available to implement a separate antenna control which requires two extra signals.
While antenna sharing will ease antenna placement and general application design, it will also cause a
number of problems.
There will be additional losses on the Bluetooth path due to the switch, reducing range.
Throughput reductions due to the coexistence operation will be increased and there may occur Wi-Fi
timeouts due to Bluetooth scans reserving the full use of the antenna.
Wi-Fi power-off may also cause poor ranges for the Bluetooth device.
Sharing a single antenna will require a re-certification for at least FCC of both modules as the RF
paths will have changed significantly from the scheme specified in the original certification setups.
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For use with CSR-based Bluetooth (BC4 to BC6 with firmware version 21 or later, BC7 and onwards with all
versions), Unity-3e is recommended as the coexistence scheme. Unity-3e is an enhanced version of the
traditional 3-wire Unity-3 –scheme that uses tighter timings and uses the three control lines also for antenna
switch control, removing the need for the two separate switch control signals.
The BT_PERIODIC signal is related to the Unity+ -standard, which allows more reliable audio throughputs,
but it is not currently supported for WF121.
Pad number
Function
37
BT_PERIODIC
38
WLAN_DENY
39
BT_STATUS
41
BT_ACTIVE
Table 10: Bluetooth co-existence interface
Industry standard 3-wire and 4-wire, as well as Unity-3, Unity-4, and Unity-3e coexistence schemes are
supported and the associated signals can be assigned to the GPIO pads. In default mode these pins are tied
to CPU GPIO functions. Antenna sharing is possible with the Unity-3e scheme.
For more detailed information about implementing co-existence, see WF111 datasheet.
5.11 CPU Clock
Pad number
Function
Description
30
OSC1
External crystal input
31
OSC2
External crystal output
Table 11: Clocking pads
WF121 uses an internal 26 MHz crystal as the WiFi reference clock. The internal processor uses an
integrated 8MHz RC oscillator and associated phase locked loop (PLL) to create its clock signals, but cannot
share the internal crystal-stabilized WiFi clock. The internal CPU uses a PLL to create an 80MHz core clock.
To use the USB functionality an external crystal and the associated capacitors must be implemented on the
application board to provide a sufficiently accurate clock. A crystal with its associated capacitors can be
connected to pads OSC1 and OSC2. If an external crystal is not needed, these pads are available for GPIO
use. The USB clock synthesizer requires an internal reference frequency of 4MHz, so the crystal for USB use
must be a multiple of 4MHz.
An external oscillator can also be used to generate the CPU clock frequency. The voltage levels should be
3.3V logic level.
Note: The present WF121 default firmware only supports 8MHz crystals or oscillators.
The internal clock divider generating the reference frequency for the internal PLL’s cannot be changed by the
firmware, and to support automatic switchover between the internal RC oscillator and the external crystal, the
default firmware needs an 8MHz clock. A custom firmware can be ordered with support for desired
frequencies for easier crystal availability, for achieving desired UART baud rates and other applications.
The Ethernet connection requires the external PHY to provide the 50MHz RMII reference clock. A crystal is
not required for the module CPU for Ethernet operation.
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5.12 32.768 kHz External Reference Clock
Pad number
Function
Description
33
SOSCI
External 32.768 kHz crystal input
34
SOSCO
External 32.768 kHz crystal output
Table 12: Slow clock
The module contains integrated RC oscillators for sleep timing, one in the WiFi chipset, one in the CPU. The
sleep clocks are used to periodically wake up the module while in power save modes. If more accurate timing
is required, an external 32.768 kHz crystal and the associated capacitors can be placed to pads SOSCI and
SOSCO. If an accurate sleep clock is not needed, the pads are available for GPIO use.
An external oscillator can also be used to generate the sleep clock. The voltage levels should be 3.3V logic
level.
This low frequency clock is shared for both the CPU and the WiFi chipset. The default WiFi configuration uses
only the internal oscillator, if support for a crystal stabilized WiFi sleep clock is required, please contact
Bluegiga technical support.
The Wi-Fi packet timing during active data transfer is derived from the internal 26MHz crystal and so is
unaffected by the tolerances of the sleep clock.
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6 Example schematic
Figure 2: Minimal system required for UART host connection
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7 802.11 Radio
7.1 Wi-Fi Receiver
The receiver features direct conversion architecture. Sufficient out-of-band blocking specification at the Low
Noise Amplifier (LNA) input allows the receiver to be used in close proximity to GSM and WCDMA cellular
phone transmitters without being desensitized. High-order baseband filters ensure good performance against
in-band interference.
7.2 Wi-Fi Transmitter
The transmitter features a direct IQ modulator. Digital baseband transmit circuitry provides the required
spectral shaping and on-chip trims are used to reduce IQ modulator distortion. Transmitter gain can be
controlled on a per-packet basis, allowing the optimization of the transmit power as a function of modulation
scheme.
The internal Power Amplifier (PA) has a maximum output power of +15dBm for IEEE 802.11g/n and +17dBm
for IEEE 802.11b. The module internally compensates for PA gain and reference oscillator frequency drifts
with varying temperature and supply voltage.
7.3 Regulatory domains
WF121 uses the IEEE 802.11d standard to select the available channels based on the regulatory domain
setting of the access point.
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8 Firmware
WF121 incorporates firmware which implements a full TCP/IP stack and Wi-Fi management. Exact features
will depend on the firmware version used. Please see the documentation of the firmware for exact details.
There are three main ways to use the module: Host controlled, script controlled or native application
controlled.
Host controlled means an external host is physically connected to the module and it sends simple commands
to the module and one of several different host interfaces can be used. The module provides high level APIs
for managing Wi-Fi as well as data connections. Bluegiga provides a thin API layer (BGLib) written in ANSI C
for the host which can take care of creating and parsing the messages sent over the transport. For evaluation
purposes GUI tools and a library for python are also provided.
IP
BGAPI
802.2 LLC
802.11 MAC
UART / USB / SPI
Host
UDPTCP
BGLib
(implements BGAPI)
Application
MLME
802.11 PHY
HTTP, FTP,
SMTP etc.
DHCP, TFTP,
DNS etc.
Figure 3: WF121 software
Data can be routed either through the API or through another physical interface. For example if the first UART
is used for sending and receiving command events, a TCP/IP socket can be bound to the second UART and
data written to the UART will seamlessly be passed to the TCP/IP socket. For information about the latest
capabilities of the firmware, please refer to the WF121 API reference documentation accompanying it.
The module can also be controlled by a script running on the module. This is especially useful for simple
applications as it eliminates the need for a host controller and can drastically cut development time. In
combination with a host it can also be used automate certain features such as the serial to TCP/IP
functionality described above.
Native application development is also possible as the stack will not require all of the available flash or
memory. Please see the material accompanying the firmware release about more details of this option.
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9 Host interfaces
9.1 UART
The module can be controlled over the UART interface. In order for the communication to be reliable,
hardware flow control signals (RTS and CTS) must be present between the host and the module. When using
high UART transfer speeds (between 1 and 20Mbps) an external crystal is required for sufficient clock
accuracy.
9.2 USB
When using the USB host interface, the module will appear as a USB CDC/ACM device enumerating as
virtual COM port. The same protocol can be used as with the UART interface.
9.3 SPI
Please refer to the Bluegiga WF121 API reference documentation supplied with the firmware regarding using
SPI as the Host interface.
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10 Electrical characteristics
10.1 Absolute maximum ratings
Rating
Min
Max
Unit
Storage Temperature
-40
85
°C
VDD_PA
-0.3
6
V
VDD_3.3V
-0.3
3.6
5V tolerant GPIO Voltages
-0.3
5.5
V
Other Terminal Voltages
VSS-0.3
VDD_3.3V+0.3
V
Maximum output current sourced or sunk by any GPIO pad
25
mA
Maximum current on all GPIO pads combined
200
mA
Table 13: Absolute maximum ratings
10.2 Recommended operating conditions
Rating
Min
Max
Unit
Operating Temperature Range *
-40
85
°C
VDD_3.3V
2.3
3.6
V
VDD_3.3V while capable of writing internal flash
3.0
3.6
V
VDD_PA
2.7
4.8
V
Table 14: Recommended operating conditions
*Note: The module may heat up depending on use, at high constant transmit duty cycles (high throughput,
low bitrate for more than a few seconds) the maximum operating temperature may need to be derated to keep
below the maximum ratings.
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10.3 Input/output terminal characteristics
10.4 Digital
Digital terminals
Min
Typ
Max
Unit
Input voltage levels
VIL input logic level low 1.7V ≤ VDD ≤ 3.6V
VSS-0.3V
-
0.15VDD
V
VIH input logic level high 1.7V ≤ VDD ≤ 3.6V
0.8VDD
-
VDD+0.3V
V
Output voltage levels
VOL output logic level low, Vdd = 3.6 V, Iol = 7 mA
-
-
0.4
V
VOH output logic level high Vdd = 3.6 V, Ioh = -12 mA
2.4
-
VDD
V
Table 15: Digital terminal electrical characteristics
Min
Typ
max
Frequency
32.748
32.768
32.788
kHz
Deviation @25oC
-20
+20
ppm
Deviation over temperature
-150
+150
ppm
Duty cycle
30
50
70
%
Rise time
50
ns
Input high level
0.625Vdd
Vdd+0.3
V
Input low level
-0.3
0.25Vdd
V
Table 16: External Wi-Fi sleep clock specifications
10.5 Reset
Power-on Reset
Min
Typ
Max
Unit
Power on reset threshold
1.75
-
2.1
V
VDD rise rate to ensure reset
0.05
-
115
V/ms
Table 17: Power on reset characteristics
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10.6 Power consumption
Consumption
type
Current
Unit
Supply
domain
Description
Total maximum
400
mA
both
Absolute peak current during packet transmission (<5µs)
CPU average
100
mA
VDD_3.3V
Typical average program execution consumption
CPU idle
35
mA
VDD_3.3V
Idle mode, instant wakeup
CPU sleep
60
µA
VDD_3.3V
Sleep mode, clocks off, WDT on, wakeup in milliseconds
Wi-Fi core
active
68
mA
VDD_PA
Receiving, transmitting, idle out of deep sleep, AP mode
Wi-Fi core idle
110
µA
VDD_PA
Idle, between packet transfers, automatic deep sleep
enabled (in client mode)
Wi-Fi PA
240
mA
VDD_PA
Peak during packet transmission
Wi-Fi LNA
12
mA
VDD_PA
Peak during packet reception
Wi-Fi total sleep
10
µA
VDD_PA
Leakage when fully powered off
Table 18: Power consumption for different operating modes
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Consumption type
Curre
nt
Unit
Description
Transmit consumption
143
mA
Typical average module consumption during full rate data
transfer, system does not enter deep sleep due to constant data
traffic (Ethernet MAC enabled for testing)
Receive consumption
127
mA
Typical average module consumption during full rate data
transfer, system does not enter deep sleep due to constant data
traffic
Access point mode
108
mA
Typical average idle current when configured as an AP, does
not enter deep sleep due to AP mode requirements
Idle, associated
1.7-10
mA
Typical average with DTIM=1, beacon interval=100ms,
including keep-alive traffic and CPU timed wakeups, power
saving enabled (typically 1.7mA when no broadcast traffic is
present)
Idle, associated
37
mA
Typical average with DTIM=1, beacon interval=100ms,
including keep-alive traffic and CPU timed wakeups, power
saving disabled
Idle, unassociated
226
µA
Typical sleep current with Wi-Fi chip on and initialized but
unassociated. Associating to an access point from this state
usually happens in less than a second, depending on
DHCP/static IP settings and security options. Peripherals
disabled.
Deep Sleep
70
µA
Deep sleep (Wi-Fi power supply disabled internally, CPU
sleeping, all peripherals except watchdog and GPIO interrupts
off). Waking the Wi-Fi from this state requires reinitialization of
the Wi-Fi core and the time from wakeup to access point
association can take up to 10 seconds
Table 19: Typical power consumption, module total
All average readings are made with a 3.3V power supply, using the DKWF121 board and comparing Fluke
289 True RMS multimeter average readings with oscilloscope derived mode-specific consumption profiles.
Measuring currents varying several orders of magnitude within microseconds may give varying results with
different instruments and the measurement method should be considered carefully.
Associated idle consumption is heavily dependent on the access point used, the local broadcast traffic, power
save timeouts set by the user and enabled peripherals. Transmit and receive consumptions are heavily
dependent on the RF field strength and thus the over-air bitrate, which determines the time taken to transfer
the required data. WF121 automatically enters power saving modes when not actively transferring data, and
the shorter the time taken to transfer data over the Wi-Fi, the more time it can spend in power saving modes.
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11 RF Characteristics
min
max
Channel
1
11 (default), 13 (ETSI)
Frequency
2412
2472
MHz
Table 20: Supported frequencies
Standard
Supported bit rates
802.11b
1, 2, 5.5, 11Mbps
802.11g
6, 9, 12, 18, 24, 36, 48, 54Mbps
802.11n, HT, 20MHz, 800ns
6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
802.11n, HT, 20MHz, 400ns
7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65, 72.2Mbps
Table 21: Supported modulations
802.11b
Typ
802.11g
Typ
802.11n short GI
Typ
802.11n long GI
Typ
1 Mbps
-97 dBm
6 Mbps
-92 dBm
6.5 Mbps
-91 dBm
7.2 Mbps
-92 dBm
2 Mbps
-95 dBm
9 Mbps
-91 dBm
13 Mbps
-87 dBm
14.4 Mbps
-90 dBm
5.5 Mbps
-93 dBm
12 Mbps
-89 dBm
19.5 Mbps
-85 dBm
21.7 Mbps
-87 dBm
11 Mbps
-89 dBm
18 Mbps
-87 dBm
26 Mbps
-82 dBm
28.9 Mbps
-84 dBm
24 Mbps
-84 dBm
39 Mbps
-78 dBm
43.3 Mbps
-80 dBm
36 Mbps
-80 dBm
52 Mbps
-74 dBm
57.8 Mbps
-75 dBm
48 Mbps
-75 dBm
58.5 Mbps
-71 dBm
65 Mbps
-72 dBm
54 Mbps
-73 dBm
65 Mbps
-68 dBm
72.2 Mbps
-69 dBm
Table 22: Typical receiver sensitivity
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Modulation type
Min
Typ
Max
802.11b
+16
+17
+17.6
dBm
802.11g
+14
+15
+15.6
dBm
802.11n
+14
+15
+15.6
dBm
Table 23: Transmitter output power at maximum setting
Modulation type
Min
Typ
Max
TX loss
-2.5
-3
-3.5
dB
RX gain (using internal LNA)
8
10
12
dB
Internal LNA noise figure
2.0
2.5
dB
Table 24: BT antenna sharing interface properties
Typ
Max
802.11 limit (total error)
Variation between individual units
+/-5
+/-10
+/-25
ppm
Variation with temperature
+/-3
+/-10
+/-25
ppm
Table 25: Carrier frequency accuracy
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12 Physical dimensions
Figure 4: Physical dimensions
Figure 5: WF121-A recommended PCB land pattern
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13 Layout guidelines
13.1 WF121-E
RF output can be taken directly from the U.FL connector of the module, and no antenna clearances need to
be made for the module.
13.2 WF121-N
The RF output is taken from the ANT pin at the end of the device. In other variants this pin is not connected.
The antenna trace should be properly impedance controlled and kept short. Figure 6 shows a typical trace
from the RF pin to a SMA connector. A transmission line impedance calculator, such as TX-Line made by
AWR, can be used to approximate the dimensions for the 50 ohm transmission line. Figure 7 show cross
sections of two 50 ohm transmission lines.
Figure 6: Typical 50 ohm trace from the RF pin to an antenna connector
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FR4, εr= 4.6
Prepreg, εr= 3.7
W = 0.15 mm
h = 0.076 mm
G = 0.25 mm
GND stitching vias
RF GROUND
RF GROUND RF GROUND
RF GROUND
FR4, εr= 4.6 h = 1 mm
W = 1.8 mm
MICROSTRIP
CPW Ground
Figure 7: Example cross section of two different 50 ohm transmission line
13.3 WF121-A
Figure 8: Example layouts, board edge placement on left, board corner on right
The impedance matching of the antenna is designed for a layout similar to the module evaluation board. For
an optimal performance of the antenna the layout should strictly follow the layout example shown in the above
figures and the thickness of FR4 should be between 1 and 2 mm, preferably 1.6mm.
Any dielectric material close to the antenna will change the resonant frequency and it is recommended not to
place a plastic case or any other dielectric closer than 5 mm from the antenna. Close proximity of a plastic
case can be somewhat compensated by using a thinner PCB.
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ANY metal in close proximity of the antenna will prevent the antenna from radiating freely. It is recommended
not to place any metal or other conductive objects closer than 20 mm to the antenna except in the directions
of the ground planes of the module itself.
For optimal performance, place the antenna end of the module outside any metal surfaces and objects in the
application, preferably on the device corner. The larger the angle in which no metallic object obstructs the
antenna radiation, the better the antenna will work.
The ANT pad on the antenna end of the WF121-A can be connected to the ground or left unsoldered.
13.4 Thermal considerations
The WF121 module may at continuous full power transmit consume up to 1.3 W of DC power, most of which
is drawn by the power amplifier. Most of this will be dissipated as heat. In any application where high ambient
temperatures and constant transmissions for more than a few seconds can occur, it is important that a
sufficient cooling surface is provided to dissipate the heat.
The thermal pad in the bottom of the module must be connected to the application board ground
planes by soldering. The application board should provide a number of vias under and around the pad to
conduct the produced heat to the board ground planes, and preferably to a copper surface on the other side of
the board in order to dissipate the heat into air.
The module internal thermal resistance should in most cases be negligible compared to the thermal resistance
from the module into air, and common equations for surface area required for cooling can be used to estimate
the temperature rise of the module. Only copper planes on the circuit board surfaces with a solid thermal
connection to the module ground pad will dissipate heat. For an application with high transmit duty cycles
(low bit rate, high throughput, long bursts or constant streaming) the maximum allowed ambient temperature
should be reduced due to inherent heating of the module, especially with small fully plastic enclosed
applications where heat transfer to ambient air is low due to low thermal conductivity of plastic.
The module measured on the evaluation board exhibits a temperature rise of about 25oC above ambient
temperature when continuously transmitting IEEE 802.11b at full power with minimal off-times and no collision
detection (a worst case scenario regarding power dissipation). An insufficiently cooled module will rapidly heat
beyond operating range in ambient room temperature.
13.5 EMC considerations
Following recommendations helps to avoid EMC problems arising in the design. Note that each design is
unique and the following list do not consider all basic design rules such as avoiding capacitive coupling
between signal lines. Following list is aimed to avoid EMC problems caused by RF part of the module.
Do not remove copper from the PCB more than needed. For proper operation the antenna requires a
solid ground plane with as much surface area as possible. Use ground filling as much as possible.
Connect all grounds together with multiple vias. Do not leave small floating unconnected copper areas
or areas connected by just one via, these will act as additional antennas and raise the risk of
unwanted radiations.
Do not place a ground plane underneath the antenna. The grounding areas under the module should
be designed as shown in Figure 4.
When using overlapping ground areas use conductive vias separated max. 3 mm apart at the edge of
the ground areas. This prevents RF from penetrating inside the PCB. Use ground vias extensively all
over the PCB. All the traces in (and on) the PCB are potential antennas. Especially board edges
should have grounds connected together at short intervals to avoid resonances.
Avoid current loops. Keep the traces with sensitive, high current or fast signals short, and mind the
return current path, having a short signal path is not much use if the associated ground path between
the ends of the signal trace is long. Remember, ground is also a signal trace. The ground will conduct
the same current as the signal path and at the same frequency, power and sensitivity.
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Split a ground plane ONLY if you know exactly what you are doing. Splitting the plane may cause
more harm than good if applied incorrectly. The ground plane acts as a part of the antenna system.
Insufficient ground planes or large separate sensitive signal ground planes will easily cause the
coupled transmitted pulses to be AM-demodulated by semiconductor junctions around the board,
degrading system performance.
Overlapping GND layers without
GND stitching vias Overlapping GND layers with
GND stitching vias shielding the
RF energy
Figure 9: Use of stitching vias to avoid emissions from the edges of the PCB
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14 Soldering recommendations
WF121 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is
dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and
particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.
Bluegiga Technologies will give following recommendations for soldering the module to ensure reliable solder
joint and operation of the module after soldering. Since the profile used is process and layout dependent, the
optimum profile should be studied case by case. Thus following recommendation should be taken as a
starting point guide.
Refer to technical documentations of particular solder paste for profile configurations
Avoid using more than one flow.
Reliability of the solder joint and self-alignment of the component are dependent on the solder
volume. Minimum of 150m stencil thickness is recommended.
Aperture size of the stencil should be 1:1 with the pad size.
A low residue, “no clean” solder paste should be used due to low mounted height of the component.
If the vias used on the application board have a diameter larger than 0.3mm, it is recommended to
mask the via holes at the module side to prevent solder wicking through the via holes. Solders have a
habit of filling holes and leaving voids in the thermal pad solder junction, as well as forming solder
balls on the other side of the application board which can in some cases be problematic.
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15 Certifications
WF121 is compliant to the following specifications:
15.1 CE
WF121 is in conformity with the essential requirements and other relevant requirements of the R&TTE
Directive (1999/5/EC). The official DoC is available at www.bluegiga.com
15.2 FCC and IC
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may
cause undesired operation.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End
users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter
must not be co-located or operating in conjunction with any other antenna or transmitter. This transmitter is
considered as mobile device and should not be used closer than 20 cm from a human body. To allow portable
use in a known host class 2 permissive change is required. Please contact Bluegiga support at
www.bluegiga.com for detailed information.
IC Statements:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and
maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically
radiated power (e.i.r.p.) is not more than that necessary for successful communication.
If detachable antennas are used:
This radio transmitter (identify the device by certification number, or model number if Category II) has been
approved by Industry Canada to operate with the antenna types listed below with the maximum permissible
gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list,
having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this
device. See table 25 for the approved antennas for WF121-E and WF121-N.
OEM Responsibilities to comply with FCC and Industry Canada Regulations
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The WF121 Module has been certified for integration into products only by OEM integrators under the
following conditions:
The antenna(s) must be installed such that a minimum separation distance of 20cm is maintained
between the radiator (antenna) and all persons at all times.
The transmitter module must not be co-located or operating in conjunction with any other antenna or
transmitter.
As long as the two conditions above are met, further transmitter testing will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location
with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid
and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the
OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate FCC and Industry Canada authorization.
End Product Labeling
The WF121 Module is labeled with its own FCC ID and IC Certification Number. If the FCC ID and IC
Certification Number are not visible when the module is installed inside another device, then the outside of the
device into which the module is installed must also display a label referring to the enclosed module. In that
case, the final end product must be labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: QOQWF121”
“Contains Transmitter Module IC: 5123A-BGTWF121”
or
“Contains FCC ID: QOQWF121
“Contains IC: 5123A-BGTWF121”
The OEM of the WF121 Module must only use the approved antenna(s) described in table 25, which have
been certified with this module.
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module or change RF related parameters in the user manual of the end product.
To comply with FCC and Industry Canada RF radiation exposure limits for general population, the
antenna(s) used for this transmitter must be installed such that a minimum separation distance of
20cm is maintained between the radiator (antenna) and all persons at all times and must not be co-
located or operating in conjunction with any other antenna or transmitter.
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15.2.1 FCC et IC
Cet appareil est conforme à l’alinéa 15 des règles de la FCC. Deux conditions sont à respecter lors de
son utilisation :
(1) cet appareil ne doit pas créer d’interférence susceptible de causer un quelconque dommage et,
(2) cet appareil doit accepter toute interférence, quelle qu’elle soit, y compris les interférences
susceptibles d’entraîner un fonctionnement non requis.
Déclaration de conformité FCC d’exposition aux radiofréquences (RF):
Ce matériel respecte les limites d’exposition aux radiofréquences fixées par la FCC dans un environnement
non contrôlé. Les utilisateurs finaux doivent se conformer aux instructions d’utilisation spécifiées afin de
satisfaire aux normes d’exposition en matière de radiofréquence. Ce transmetteur ne doit pas être installé ni
utilisé en concomitance avec une autre antenne ou un autre transmetteur. Ce transmetteur est assimilé à un
appareil mobile et ne doit pas être utilisé à moins de 20 cm du corps humain. Afin de permettre un usage
mobile dans le cadre d’un matériel de catégorie 2, il est nécessaire de procéder à quelques adaptations. Pour
des informations détaillées, veuillez contacter le support technique Bluegiga : www.bluegiga.com.
Déclaration de conformité IC :
Ce matériel respecte les standards RSS exempt de licence d’Industrie Canada. Son utilisation est soumise
aux deux conditions suivantes :
(1) l’appareil ne doit causer aucune interférence, et
(2) l’appareil doit accepter toute interférence, quelle qu’elle soit, y compris les interférences
susceptibles d’entraîner un fonctionnement non requis de l’appareil.
Selon la réglementation d’Industrie Canada, ce radio-transmetteur ne peut utiliser qu’un seul type d’antenne
et ne doit pas dépasser la limite de gain autorisée par Industrie Canada pour les transmetteurs. Afin de
réduire les interférences potentielles avec d’autres utilisateurs, le type d’antenne et son gain devront être
définis de telle façon que la puissance isotrope rayonnante équivalente (EIRP) soit juste suffisante pour
permettre une bonne communication.
Lors de l’utilisation d’antennes amovibles :
Ce radio-transmetteur (identifié par un numéro certifié ou un numéro de modèle dans le cas de la catégorie II)
a été approuvé par Industrie Canada pour fonctionner avec les antennes référencées ci-dessous dans la
limite de gain acceptable et l’impédance requise pour chaque type d’antenne cité. Les antennes non
référencées possédant un gain supérieur au gain maximum autorisé pour le type d’antenne auquel elles
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appartiennent sont strictement interdites d’utilisation avec ce matériel. Veuillez vous référer au tableau 25
concernant les antennes approuvées pour les WF121.
Les responsabilités de l’intégrateur afin de satisfaire aux réglementations de la FCC et d’Industrie
Canada :
Les modules WF121 ont été certifiés pour entrer dans la fabrication de produits exclusivement réalisés par
des intégrateurs dans les conditions suivantes :
L’antenne (ou les antennes) doit être installée de façon à maintenir à tout instant une distance
minimum de 20cm entre la source de radiation (l’antenne) et toute personne physique.
Le module transmetteur ne doit pas être installé ou utilisé en concomitance avec une autre antenne
ou un autre transmetteur.
Tant que ces deux conditions sont réunies, il n’est pas nécessaire de procéder à des tests supplémentaires
sur le transmetteur. Cependant, l’intégrateur est responsable des tests effectués sur le produit final afin de se
mettre en conformité avec d’éventuelles exigences complémentaires lorsque le module est installé (exemple :
émissions provenant d’appareils numériques, exigences vis-à-vis de périphériques informatiques, etc.) ;
IMPORTANT : Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou
installation avec un autre transmetteur), les autorisations fournies par la FCC et Industrie Canada ne sont plus
valables et les numéros d’identification de la FCC et de certification d’Industrie Canada ne peuvent servir pour
le produit final. Dans ces circonstances, il incombera à l’intégrateur de faire réévaluer le produit final
(comprenant le transmetteur) et d’obtenir une autorisation séparée de la part de la FCC et d’Industrie Canada.
Etiquetage du produit final
Chaque module WF121 possède sa propre identification FCC et son propre numéro de certification IC. Si
l’identification FCC et le numéro de certification IC ne sont pas visibles lorsqu’un module est installé à
l’intérieur d’un autre appareil, alors l’appareil en question devra lui aussi présenter une étiquette faisant
référence au module inclus. Dans ce cas, le produit final doit comporter une étiquette placée de façon visible
affichant les mentions suivantes :
« Contient un module transmetteur certifié FCC QOQWF121 »
« Contient un module transmetteur certifié IC 5123A-BGTWF121 »
ou
« Inclut la certification FCC QOQWF121 »
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« Inclut la certification IC 5123A-BGTWF121 »
L’intégrateur du module WF121 ne doit utiliser que les antennes répertoriées dans le tableau 25 certifiées
pour ce module.
L’intégrateur est tenu de ne fournir aucune information à l’utilisateur final autorisant ce dernier à installer ou
retirer le module RF, ou bien changer les paramètres RF du module, dans le manuel d’utilisation du produit
final.
Afin de se conformer aux limites de radiation imposées par la FCC et Industry Canada, l’antenne (ou
les antennes) utilisée pour ce transmetteur doit être installée de telle sorte à maintenir une distance
minimum de 20cm à tout instant entre la source de radiation (l’antenne) et les personnes physiques.
En outre, cette antenne ne devra en aucun cas être installée ou utilisée en concomitance avec une
autre antenne ou un autre transmetteur.
Bluegiga Technologies Oy
Page 41 of 42
16 Qualified Antenna Types for WF121-E
This device has been designed to operate with the antennas listed below, and having a maximum gain of 2.14
dB. Antennas not included in this list or having a gain greater than 2.14 dB are strictly prohibited for use with
this device. The required antenna impedance is 50 ohms.
Qualified Antenna Types for WT121-E
Antenna Type
Maximum Gain
Dipole
2.14 dBi
Table 26: Qualified Antenna Types for WF121-E
Any antenna that is of the same type and of equal or less directional gain as listed in table 29 can be used
without a need for retesting. To reduce potential radio interference to other users, the antenna type and its
gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
permitted for successful communication. Using an antenna of a different type or gain more than 2.14 dBi will
require additional testing for FCC, CE and IC. Please, contact Bluegiga support at www.bluegiga.com for
more information.
Bluegiga Technologies Oy
Page 42 of 42
17 Contact information
Inquiries/ Support: www.bluegiga.com
Head office, Finland
Phone: +358-9-4355 060
Fax: +358-9-4355 0660
Bluegiga Technologies Oy
Sinikalliontie 5A, 5th floor
02630 Espoo, FINLAND
USA office
Phone: +1 770 291 2181
Fax: +1 770 291 2183
Bluegiga Technologies, Inc.
3235 Satellite Boulevard, Building 400, Suite 300,
Duluth, GA, 30096, USA
Hong Kong office
Phone: +852 3972 2186
Bluegiga Technologies Ltd.
Unit 10-18,
32/F, Tower 1, Millennium City 1,
388 Kwun Tong Road,
Kwun Tong,
Kowloon,
Hong Kong